TM

October 2013

2 TM

1990 2020 2010 2000

1T

100B

10B

1B

10M

Computers People Everything

$100

Past Today Future

$1

1¢

50B Connected Nodes by 2020*

Cloud Wireless Enterprise

Factory

Automation

Smart

Energy Transportation

1.0 2.0 3.0

2

1 2 3

1 3

*Source Ericsson

3 TM

Hardware

Development Tools

Software

Development Tools

Application Stacks

Middleware

Scalable SOC

Customer Differentiation

Operating

Systems

SDOS

Application Software

Reference Solutions

Middleware

Commercial OS

Embedded

Board

Solutions

Silicon

Processor

Expert

Clo

se

r to

Cu

sto

me

r S

olu

tio

n

4 TM

Accelerate Integrate Innovate

• Scalable Roadmap

• Datapath Acceleration

• 64-bit Processing

• Core Agnostic

• Software Enabled

• Best Price/Performance/

per Watt

• I/O Flexibility

• Integrated Switch

• Altivec Processing

• Time-to-Market Advantage

• Software Development Kits

• Turn-Key Reference

Solutions

• Embedded Board Solutions

• Third Party Ecosystem

• Full Development

Environment

5 TM

Target Applications Portfolio Product Overview

1-6 heterogeneous

cores

5 family members in 2013

1-8 cores, data path acceleration , security and

pattern matching, hardware-assisted hypervisor

25 family members

in production

General purpose MPU

75 family members

in production

1-24 cores, 64-bit,

AltiVec technology

6 family members in 2013

Core-agnostic approach

to hardware

Freescale’s unrivaled networking

expertise with Arm’s expansive

ecosystem

QorIQ

T Series

QorIQ

Qonverge

Platform

QorIQ

P Series

QorIQ

LS Series

PowerQUICC

•Networking

•Aerospace and

Defense

•Factory Automation

•Aerospace and Defense

• Industrial

•Wireless Access

•Networking

• Industrial Automation

•Smart Grid

•Data Center

•Aerospace and

Defense

•High-End Networking

• Industrial

•Smart Grid

•Networking

6 TM

2012 2013 2Q 3Q 4Q Existing 1Q 4Q

P3041

P2041/40

P1023/17

P1010/14

T4160

T4240

P1021/12

P1022/13

P2020/10

MPC8569

P4080/40

P5040

P5020/10

P5021

P1020//11

2014 2Q 3Q 4Q 1Q 2Q 1Q

LS1xxx

T1040/42

T2080

T2081

T1020/22

SDK 1.6 SDK 1.7 SDK 1.5 SDK 1.4 SDKs

SDK 1.3 Biannual

releases

LS1 Family

Next generation

Production Proposal Planning Execution

High Performance

Mid Performance

Value Performance

LS3xxx

LS2xxx

Sample

Production

8 TM

P1010 P1014

P1024, P1015

P1025, P1016

P1020, P1011

P1021, P1012

P2020

P2010

P1022

P1013

P1023

P1017

CPU

e500v2 e500v2 1 to 2 e500v2 1 to 2 e500v2 1 to 2 e500v2 1 to 2 e500v2 1 to 2 e500v2

Up to 800 MHz Up to 800 MHz Up to 667 MHz Up to 800 MHz Up to 1200 MHz Up to 1200 MHz Up to 800 MHz

32K I/D 32K I/D 32K I/D 32K I/D 32K I/D 32K I/D 32K I/D

L2 Cache 256 KB 256 KB 256 KB 256 KB 512 KB 256 KB 256 KB

DDR I/F

Type/Width

DDR3/3L DDR3/3L DDR3 DDR2/3 DDR2/3 DDR2/3 DDR3/3L

32/16-bit 16-bit 32-bit 32-bit 32/64-bit 32/64-bit 32-bit

10/100/1000

Ethernet (with

IEEE 1588v2) 3 w/(2) SGMII 2 w/(2) SGMII 3 w/(2) SGMII 3 w/(2) SGMII 3 w/(2) SGMII 2 w/(2) SGMII 2 w/(2) SGMII

TDM Yes Yes Yes Yes - Yes -

ATM UTOPIA - - In P1025/16 In P1021/12 - - -

SERDES 6 lanes 4 lanes 4 lanes 4 lanes 4 lanes 6 lanes 4 lanes

PCI-Exp 1.0a 2 controllers 2 controllers 2 controllers 2 controllers 3 controllers 3 controllers 3 controllers

sRIO 1.2 - - - - 2 controllers - -

SATA

2 controllers 2 controllers

- - -

2 controllers

- 1.5 or 3 Gbaud

1.5 or

3 Gbaud 1.5 or 3 Gbaud

USB2.0 1 w/ PHY 1 w/ PHY 2 2 1 2 1

Memory Card SD/MMC SD/MMC SD/MMC SD/MMC SD/MMC SD/MMC -

Other Interfaces SPI, 2xI2C,

DUART, 2xeCAN

SPI, 2xI2C,

DUART

SPI,

2xI2C, DUART

SPI,

2xI2C, DUART

SPI, 2xI2C,

DUART

SPI,

2xI2C, DUART

SPI,

2xI2C, DUART

Accelerators SEC4.0 w/

trusted boot SEC4.0 SEC3.3 SEC3.3 SEC3.1 SEC3.2

DPAA,

SEC 4.2

Package

425 TePBGA

19x19mm 0.8mm

561 TePBGA

23x23mm, 0.8mm

689 TePBGAII

31x31mm

689 TePBGAII

31x31mm

457 TePBGA

19x19mm, 0.8mm

Pin-compatible Pin-compatible Pin-compatible Pin-compatible Pin-compatible Audio I2S Audio

Video LCD (DIU)

RAID XOR

9 TM

P5040/P5021 P5020/P5010 P4080 P4040 P2040 P3041

CPU

Quad and Dual e5500

to 2200 MHz

Dual and Single

e5500 to 2000 MHz

Octal core e500MC to

1500 MHz

Quad core e500MC

to 1500 MHz

Quad e500MC to

1200 MHz

Quad e500MC to

1500 MHz

Cache

L1: 32K I/D

L2: 512 KB BS

L3: 2MB FS

L1: 32K I/D

L2: 512 KB BS

L3: 1MB

L1: 32K I/D

L2: 128 KB BS

L3: 2 MB -FS

L1: 32K I/D

L2: 128 KB BS L3: 2

MB -FS

L1: 32K I/D

CoreNet Cache: 1

MB -FS

L1: 32K I/D

L2: 128 KB BS

L3: 1 MB -FS

10/100/1000

Ethernet (with

IEEE®1588v2) 10x GbE, 2 10 GbE 5x GbE, 1 10 GbE

(2) Frame managers w/

4 x1 GbE (SGMII) & 1

10 GbE (XAUI)

(2) Frame managers

w/ 4 x 1 GbE (SGMII)

& 1 10 GbE (XAUI) 5x GbE

4x GbE, 1

10 GbE

PCI-Exp X3 gen 2.0 x4 gen 2.0 X3 gen 2.0 X3 gen 2.0 X3 gen 2.0 X3 gen 2.0

sRIO 2 2 2 2 2

USB 2.0 2 2 2 2 2 with PHY -

SerDes

20 lanes

@ 5 GHz

18 lanes

@ 5 GHz

18 lanes

@ 5 GHz

18 lanes

@ 5 GHz

10 lanes

@ 5 GHz

12 lanes

@ 5 GHz

Memory

DUAL

DDR3/3L to 1.6 GHz DDR2/3 to 1.3 GHz

DUAL

DDR2/3 to 1.3 GHz

DUAL

DDR2/3 to 1.3 GHz

DDR2/3 to 1.067

GHz

DDR2/3 to 1.3

GHz

Other interfaces

SPI, 4x I2C, 2x

DUART, CoreNet

SATA

SPI, 2xI2C, 2x

DUART, CoreNet

SATA

SPI, 4x I2C, 4x UART,

CoreNet

SPI, 4x I2C, 4x

UART, CoreNet

SPI, 2xI2C, 4x

UART, CoreNet,

SATA

SPI, 2xI2C, 4x

UART, CoreNet,

SATA

Accelerators

Data path: SEC 5.2,

RAID 5/6

Data path: SEC 4.0,

RAID 5/6, PME

Data path: SEC 4.0, 10

Gbps IP forwarding,

PME

Data path: SEC 4.0,

10 Gbps IP

forwarding, PME

Data path: SEC 4.0,

5 Gbps IP

forwarding, PME

Data path: SEC

4.0, 5 Gbps IP

forwarding, PME

Package 1295-pin package 1295-pin package 1295 FCPBGA 1295 FCPBGA 783-pin package

1295 FCPBGA

(pin compatible

P4040)

10 TM

P1020, P1011 P1021, P1012

P2020 P2010 T1020 T1022 T1040 T1042

CPU

1 to 2 e500 1 to 2 e500 2 e5500 2 e5500 4 e5500 4 e5500

Up to 800MHz Up to

1200MHz 800-1400MHz 800-1400MHz 800-1400MHz 800-1400MHz

32K I/D 32K I/D 32K I/D 32K I/D 32K I/D 32K I/D

L2 Cache 256KB 512KB 256KB/Core 256KB/Core 256KB/Core 256KB/Core

Platform Cache 256KB 256KB 256KB 256KB

DDR I/F Type/Width

DDR2/3 DDR2/3 DDR3L/4 DDR3L/4 DDR3L/4 DDR3L/4

16/32-bit , 800MHz

32/64-bit, 800MHz 32/64-bit, 1333MHz 32/64-bit, 1333MHz 32/64-bit, 1333MHz 32/64-bit, 1333MHz

10/100/1000 Ethernet (with IEEE1588v2) 3 x 10/100/1000

3 x 10/100/1000

8-Port GE Switch & 3 x 10/100/1000 4 x 10/100/1000

8-Port GE Switch & 3 x 10/100/1000 5 x 10/100/1000

TDM Yes - Yes Yes Yes Yes

QUICC Engine In P1021/12 - TDM and HDLC TDM and HDLC TDM and HDLC TDM and HDLC

SERDES 4 lanes 4 lanes 8 lanes 8 lanes 8 lanes 8 lanes

PCI-Exp 2 (Gen-1) 3 (Gen-1) 4 (Gen-2) 4 (Gen-2) 4 (Gen-2) 4 (Gen-2)

DIU - - Yes Yes Yes Yes

SATA - -

2 controller 2 controller 2 controller 2 controller

1.5 or 3Gbaud 1.5 or 3Gbaud 1.5 or 3Gbaud 1.5 or 3Gbaud

USB2.0 2 1 2 with PHY 2 with PHY 2 with PHY 2 with PHY

Memory Card SD/MMC SD/MMC SD/MMC SD/MMC SD/MMC SD/MMC

Accelerators

SEC3.3 SEC3.1

DPAA, PME SEC5.x with Trust

Architecture

DPAA, PME SEC5.x with Trust

Architecture

DPAA, PME SEC5.x with Trust

Architecture

DPAA, PME SEC5.x with Trust

Architecture

Power Management <5.0W <8.0W

Packet Lossles Deepsleep

Packet Lossles Deepsleep

Packet Lossles Deepsleep

Packet Lossles Deepsleep

Package Pin Compatible

11 TM

P4080 T4160 T4240

Physical Cores 8 8 12

Threads/virtual core 8 16 24

Max Core Freq (MHz) 1500 1800 1800

SoC DMIPS 30K 73K 117K

Vector Engine AltiVec Engine AltiVec Engine

L2 Cache 128 KB/core 2M/cluster

2x cluster

2M/cluster

3x cluster

Corenet Platform Cache 2 MB 2x 512 KB 3x 512 KB

Main Memory

Type/Speed

DDR2 / DDR3 to

1333 MT/s

DDR3 and DDR3L to

1867 MT/s

DDR3 and DDR3L to

1867 MT/s

Main Memory Dual x72-bit Dual x72-bit Triple x72-bit

Ethernet 2x XAUI + 8x SGMII 2 x XFI/XAUI + 12x GE 4 x XFI + 16x GE

HiGig Yes Yes

SerDes lanes/max

frequency 18 Lanes; 5 GHz 24 Lanes; to 10 GHz 32 Lanes; to 10 GHz

Serial RapidIO® Dual Dual (+RMAN) Dual (+RMAN)

PCI Express® 3x Gen 2 3x Gen 2/3 + SRIOV 4x Gen 2/3 + SRIOV

SATA Dual Dual

Acceleration Engines SEC, PME SEC, PME, DCE, Prefetch SEC, PME, DCE, Prefetch

TM

13 TM

• First 64-bit embedded processor with an integrated GbE switch

− Reduces system cost, design complexity and power

• One of the industry’s most scalable, pin-compatible family of devices

− Performance scalability with a common architecture

• Energy efficiency and low power

− Designed to be compliant to European Code of Conduct, and EnergyStar energy consumption standards

• Ideal for low- to mid-range networking and industrial connectivity applications

QorIQ Processors:

Accelerating the

Network’s IQ

14 TM

Perf

orm

ance

Power

T2081

NEW

- Dual-Core up to 1.4GHz T1020

NEW

T1022

NEW

T1042

T1040

NEW

- Dual-Core up to 1.4GHz

- Integrated GbE Switch

- Quad-Core up to 1.4GHz

- Quad-Core up to 1.4GHz

- Integrated GbE Switch

- Eight Virtual Cores up to 1.8GHz

Scale from dual, quad to

eight virtual cores with

QorIQ T1/T2 devices

15 TM

New

• 64-bit architecture

• AltiVec Technology: 240 GFLOPS

• 1TB physical address

• Accelerate Hypervisor performance with LRAT

• New process and e6500 core allowing increased frequency

• Dual Thread

• Each with separate front end, branch unit and LSU

• Larger amount of onboard cache per core

• Up to 24 virtual cores

• Large 2 MB shared L2 cache within a cluster of 1 to 4 cores

• CoreNet Cache-coherent fabric with multiple clusters to scale from 1 to 8 clusters

• Virtualization

Up to 4x Performance Improvement

over Previous Generation

IPC

Improvements Multithreading

Frequency

Improvements Multicore

2.4x 1.3x 1.5x

Frequency Dual thread Efficiency

Number of Cores

Improvement of DMIPs per Thread X X X

16 TM

• Highest performance CPU cores within a power envelope

• Advanced integration with multilayer Gigabit Ethernet switch to reduce system cost and design complexity

• Offload engines – encryption/decryption for high performance security

• Deep packet inspection offload engine enabling UTM services

• Data path acceleration architecture (DPAA) – for QoS and balanced networking performance

• Virtualization to support customers and 3rd party software

• Small form factor, fanless and convection-cooled designs

Enterprise

Routers/Switches

Industrial Computing

and Networking

UTM Security

Appliances

The T1/T2 communications processors

are architected to provide maximum

performance per watt

17 TM

Freescale Multicore Platform

Power Architecture® Cores

On-Demand Acceleration CoreNet™ Fabric

Pattern Matching

Crypto Security

Table Lookups

Data Path Acceleration Architecture

e500mc

Core

L2 Cache

e500mc

Core

L2 Cache

e500mc

Core

L2 Cache

e500mc

Core

L2 Cache

CoreNet Fabric

Decompression / Compression

Data Path Resource Management

System Functions

Real-Time Debug

Trace Advanced Trace

512 KB 512 KB 512 KB

64-bit DDR3/3L/4

QUICC Engine

Ethernet eTSEC

PCI Express®

Connectivity

RapidIO® SATA USB

Platform Cache

Up to 1024 KB L3

32/64-bit DDR2/3/3L

• SCALE for Performance and Power

− The Right Cores

Processing / watt

Vector acceleration

Advanced threading

− The Right SoC Infrastructure

− The Right Balance Memories

• Enhanced Virtualization Support

− Hypervisor with three tier privilege modes

SoC memory

Interrupts

I/O virtualization

• Advanced Process Technology

• Multicore Debug

• Advanced Trace

• Trust Architecture

• Customer Driven Features

18 TM

Necessary feature if a system is to operate as multiple independent subsystems

• Application consolidation

• Customer consolidation

• Secure applications (e.g. policy modules, rights management)

• Untrusted software (third party; Sandbox application)

System is divided into “logical” partitions (a virtually independent sub-system)

• A sub-system each with its own operating system

Resources of the system are apportioned among logical partitions

• Processors, storage, devices, I/O, event mechanisms, etc.

Typically, individual operating systems want to “own” their resources

• Expect to map the resources into own address space (OWN = ACCESS) − Expect to initialize them

− Expect to have “unrestricted” access

Interpartition protection

• Subsystems must be protected from each other

• Computational state − Error: Required

− Performance: Best effort

TM

23 TM

•kvm

• Freescale hypervisor

• Linux containers (lxc)

• Linux GRO/GSO

sofware offloads

• SEC XOR DMA

Fastpath modules:

• NAPT/firewall,

Ipfwd, IPsec (P3041,

P204x, P102x)

Power management:

• system sleep

• CPU idle

• CPU clock freq.

• thermal monitor

• Huge pages

• Egress TM

• Multi-threading

•Kernel 3.0

•U-Boot 2012-10

•Gcc 4.6.2

•Yocto 1.2

kvm

• vfio device assignment

• vhost net

• kernel MPIC

• libvirt management

• USB 2.0

• IP reassembly offload

Fastpath modules:

• IPv6

Power management:

• 64 bit hibernation

• CPU nap modes

• DPAA cascading power

management reference

• DPAA storage profiles

• Linux realtime – B4,

P1025

• T4 / B4 support

•Kernel 3.8

•U-Boot 2012-10+

•Gcc 4.7

•Yocto 1.4

kvm

• virtual time

• hotplug

• direct interrupts

• vcpu enhancements

• Unified Control Path

integration API (FP-API)

• Kernel FP-API

• Linux CP

integration

Fastpath modules:

• QoS

Power management:

• system deep sleep

• deep sleep proxy

•Hardware Table-walk

kvm

Fastpath modules:

• new features

Power management:

• new features

•Yocto 1.5

Fastpath modules

•

Available Now Target Date: May 2013

Virtualization Partitioning

Virtual Machines

Performance

Applications

Offloads

Fastpath

Power Efficiency

Power Mgt

Platform Power Architecture

ARM

SDK 1.3.2 SDK 1.7

Target Date: Nov 2013

SDK 1.5 SDK 1.6 SDK 1.4

2013 2014 4Q 2Q 3Q 4Q 1Q 1Q Available Now Future

25 TM

Enterprise AP-WLAN

Multiservice Gateway

(Media & Voice Gateway)

Security Appliance

Wireless

Media Gateway

NAS

Network

Attached Storage Networked Smart Gateway

Smart Energy Gateway

DLNA VOD Video-on-Demand

NVR – Network Video Recorder

(Video Surveillance)

Industrial Gateway

26 TM

Runtime Software HW and SW Engineering Services Training SW Dev Tools

HW Dev Tools

Application Specific

Middleware

Operating Systems

Training

Partners

Embedded Board Solutions

IDH/ODM

Com

mo

n

Occa

sio

na

l

Software and

Solution

Integrators (SSI)

Communities

Semiconductors/Companion Modules

For more partner options, visit freescale.com/partners

© 2012 Freescale Semiconductor, Inc.

Qonverge

Layerscape

P series

T series

Processor Expert

TM

28 TM

e6500 / 1.8GHz

512KB L2

e5501/ 1.4GHz

256KB L2

2 – 4 cores

2 – 8 cores

A53 / 1.4GHz

256K L2

A57 / 1.8GHz

1MB L2

4 – 12 cores

6 – 32 cores

Leverage increase

in number of threads

for 2x performance

Leverage optimizations

In memory subsystem

& number of cores

Today 1st Wave Layerscape

SoC Solutions

Value

Tier

High

Tier

Mid

Tier

e500/ 800MHz

256KB L2 shared

1 – 2 cores

e500/ 1.5GHz

128KB L2

4 – 8 cores

29 TM

1- Core Agnostic (ARM, Power Arch)

• ARM V8 Product Roadmap

• Small / Large footprints

2- Scalable Acceleration Elements

• Sized to Application Needs

• Turn key or C-programmable

• Wire rate I/O switching & TM

3- Ease of Use

• Real Time Monitoring / Debug

• SW Management utility

• I/O virtualization

4- Turn-key Software

• Fast path modules

• Linux / BSP

• Hypervisor: KVM

• Eclipse-based Tools

Ethernet 100/40/10/1G

SERDES

Switching

& TM

PCI-

Express

C-prog Accelerated Packet Processor

Security

Engine

Pattern

Match

Engine

Load

Balance

Engine

Task

Scheduler

Re-

assembly

Table

Look Up

CPU 64b

CPU 64b

CPU 64b

CPU 64b

CPU 64b

CPU 64b

CPU 64b

DSP

DSP

DSP

Ease of Use (EoU) Facilities

Turn Key Software Linux SMP, KVM, Fast Path Module, Eclipse Tools

Layerscape: Networking 64b Multicore SoC Platform a) Industry standard Tools & C-programmability b) Abstracts I/O and Acceleration c) Turn-key / Production-quality SW

30 TM

1 2 Processing Elements Overview Scalable Acceleration Elements

3 4 Ease of Use Turn Key / Production-Quality SW

• Advanced 64b Power ISA: e6500 & e5500

• Fastest time to market with ARM A53 and A57

• Continue to leverage 64b Power and Starcore

• Scalable packet processing up to 100Gbps

• Ethernet L2 Switching for system optimization

• High speed interfaces & SERDES innovation

• Production quality SW - key differentiation enabler

• Modules and complete stacks for time to market

• Support for Software Services model

• Remote debug and real time trace innovation

• 3rd generation of H/W and S/W virtualization

• Fabric / interconnect innovation

TM 31

• Freescale continues performance innovation and leadership

− T4240 offers leadership compute density multicore processor

− T-Series offers widest range pin compatible portfolio

• Qonverge is the leading basestation SoC architecture

− B4860 is the highest performance basestation-on-a-chip available

− From femto to macro BTS

• The Layerscape architecture enables performance roadmap for the future

− Leadership in multicore for the next 10 years

TM