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From Ashcroft andMermin, Solid State Physics.
NEMS: TOWARD PHONON COUNTING: Quantum Limit of Heat Flow.
RoukesGroupCal TechTito
Biological Nanomotor
Gene chips, proteomics arrays.
Silicon wafer fabrication• Taken from www.egg.or.jp/MSIL/english/index-
e.html
Silicon wafer fabrication – slicing and polishing
• Taken from www.egg.or.jp/MSIL/english/index-e.html
Wee
k 1
Wee
k 2
N -type Si wafer <100>
Pre-diffusion cleanPad oxidation
Deposit LPCVD nitride
Spin photoresist
PR
Si N3 4
SiO 2
O 2
SiH ClNH
2 2
3
ECE 1233 PMOS Fabrication Sequence
Spin developer
We
ek 2
Wee
k 3
Expose PR with active area maskand develop
Reactive ion etch nitride layerStrip PR
Pre-diffusion cleanField oxidation
Strip nitride and pad oxideSacrific ial oxidation
OH O
2
2
O 2
CHFO
3
2
Plasma EtchersTaken from http://www-bsac.EECS.Berkeley.EDU/~pister/245/
Wee
k 3
Wee
k 4
Strip sac ox
Gate oxidation
Deposit LPCVD polysilicon
Poly
PR/etch gate m askStrip PR
O 2
SiH 4
SFO
6
2
LPCVD SystemsTaken from http://www-bsac.EECS.Berkeley.EDU/~pister/245/
Wee
k 5
Wee
k 6
Ion im plant BF 2
+
Pre-diffusion cleanDrive-in/oxidation
PR/etch contact m askStrip PR
CleanSputter deposit A l/1% Si
Al/Si
P doped areas
OH O
2
2
Ar
Wee
k 6
PR /etch metal m askStrip PRAnneal
Source
DrainGate (contact not shown)
IBM 7-Level Cu Metallization
Micromachining Ink Jet Nozzles
Microtechnology group, TU Berlin
Bulk micromachined cavities
• Anisotropic KOH etch (Upperleft)
• Isotropic plasma etch (upper right)
• Isotropic BrF3 etch with compressive oxide still showing (lower right)
Taken from http://www-bsac.EECS.Berkeley.EDU/~pister/245/
Surface Micromachining
Deposit sacrificial layer Pattern contacts
Deposit/pattern structural layer Etch sacrificial layer
Taken from http://www-bsac.EECS.Berkeley.EDU/~pister/245/
so urc e
so urc e
so urc e
g a te
g a te
g a te
d ra in
d ra in
d ra in
NUMEM Microrelay Process
so urc e
so urc e
g a te
g a te
d ra in
d ra in
NUMEM Microrelay Process
Residual stress gradients
More tensile on top
More compressive on top
Just right! The bottom line: anneal poly between oxides with similar phosphorous content. ~1000C for ~60 seconds is enough.
Taken from http://www-bsac.EECS.Berkeley.EDU/~pister/245/
Residual stress gradients
A bad day at MCNC (1996).
Taken from http://www-bsac.EECS.Berkeley.EDU/~pister/245/
1 µm
Scalloping and Footing issues of DRIE
Scalloped sid
ewall
Top wafer surface
cathode Top wafer surface
anode
Tip precursors
Scalloped sid
ewall
Top wafer surface
cathode Top wafer surface
anode
Tip precursors
<100 nm silicon nanowire over >10 micron gap
microgridFooting at the bottom of
device layerMilanovic et al, IEEE TED, Jan. 2001.
DRIE structures
• Increased capacitance for actuation and sensing
• Low-stress structures– single-crystal Si only
structural material
• Highly stiff in vertical direction– isolation of motion to
wafer plane– flat, robust structures
2DoF Electrostatic actuator
Thermal Actuator
Comb-drive Actuator
Taken from http://www-bsac.EECS.Berkeley.EDU/~pister/245/
Sub-Micron Stereo Lithography
Micro Electro Mechanical SystemsJan., 1998 Heidelberg, Germany
New Micro Stereo Lithography for Freely Movable 3D Micro Structure-Super IH Process with Submicron Resolution-
Koji Ikuta, Shoji Maruo, and Syunsuke KojimaDepartment of Micro System Engineering, school of Engineering, Nagoya University
Furocho, Chikusa-ku, Nagonya 464-01, JapanTel: +81 52 789 5024, Fax: +81 52 789 5027 E-mail: [email protected]
Fig. 1 Schematic diagram of IH Process
Fig. 5 Process to make movable gear and shaft (a) conventional micro stereo lithography needs base layer (b) new super IH process needs no base
Fig. 6 Schematic diagram of the super IH process
Sub-Micron Stereo Lithography
Micro Electro Mechanical SystemsJan., 1998 Heidelberg, Germany
New Micro Stereo Lithography for Freely Movable 3D Micro Structure-Super IH Process with Submicron Resolution-
Koji Ikuta, Shoji Maruo, and Syunsuke KojimaDepartment of Micro System Engineering, school of Engineering, Nagoya University
Furocho, Chikusa-ku, Nagonya 464-01, JapanTel: +81 52 789 5024, Fax: +81 52 789 5027 E-mail: [email protected]
Fig. 10 Micro gear and shaft make of solidified polymer(b) side view of the gear of four teeth(d) side view of the gear of eight teeth
Taken from: http://www.imm-mainz.de/english/sk_a_tec/basic_te/liga.html
