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In situ stress measurements during MOCVD growth of thick N-polar InGaN
Zakaria Y. Al Balushi1 and Joan M. Redwing1,2
1Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, USA2Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, USA
Supplementary information:
Supplementary Figure S1. Low magnification Nomarski DIC optical micrographs of the
surface of III-polar InGaN (a), and N-polar InGaN (b).
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Supplementary Figure S2. Low magnification scanning electron micrographs (SEM) of the
surface of III-polar InGaN that exhibit a high density of V-pits (a), and N-polar InGaN that is
free of hexagonal hillocks (b).
Supplementary Figure S3. Energy dispersive x-ray (EDX) line scans from cross-section
specimens of III-polar and N-polar InGaN films using a SuperX EDX detector at 300 kV in a
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FEI Titan transmission electron microscope, revealing higher indium incorporation in N-polar
InGaN.
Supplementary Figure S4. (a-c) Additional TEM analysis of the III-polar InGaN (a-b) and N-
polar InGaN (c) dislocation microstructure using weak beam dark field mode. (Color online).
Supplementary Figure S5. Stacked overall curvature data (a) and stress-thickness versus
thickness curves (b) highlighting the incremental stress in the N-polar InGaN on different N-
polar GaN base layers, where the initial low temperature (LT) N-polar GaN layers in the two-
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step temperature growth varied in growth temperature (875°C top-green, 900°C middle-blue and
925°C bottom-red). Note: the vertical curvature axis in (a) are in 0.5 m -1 increments. (Color
online)
Incremental stress of N-polar GaN base layer (GPa)
Incremental stress of N-polar InGaN (GPa)
N-polar InGaN peak position (nm)
A B
+ 0.21 - 6.10 ~ 434.61 ~ 454.08
+ 0.04 - 6.37 ~ 431.32 ~ 452.93
- 0.04 - 6.82 ~ 428.02 ~ 443.02
Supplementary Table S1. PL peak positions of N-polar InGaN with corresponding constant
incremental stress values of N-polar InGaN and the N-polar GaN base layers.
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