FULLAUTOMATIC DPSS LASER LIFT OFF SOLUTION122.146.69.137/images/fckfile/File/DISCO_FULL AUTOMATIC...2015/05/28 · DGP8761 DAG810 DFL7560 DFS8910 DFD6341 DFL7160 DFD6341EAD6750 DFG8830

2012 DISCO CORPORATION All rights reservedDISCO CONFIDENTIAL only for Seoul Opto Device

Laser Grooving and Cutting TechnologyLaser Grooving and Cutting Technology

The enclosed information is confidential (based on NDA).Both parties are responsible for insuring that the informationis protected and not released to other parties.

2015 DISCO CORPORATION All rights reservedDISCO CONFIDENTIAL

FULLAUTOMATICDPSS LASER LIFT OFF

SOLUTION

DISCO HI-TEC TaiwanEddie Liu

[email protected]/5/26

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2012 DISCO CORPORATION All rights reservedDISCO CONFIDENTIAL only for Seoul Opto Device 2015 DISCO CORPORATION All rights reservedDISCO CONFIDENTIAL

Content

1. DISCO Introduction

2. Laser Liftoff Application

3. VLED Laser Liftoff

4. Advantage of DISCO’s Laser Liftoff Solution

5. DISCO Laser Liftoff Equipment’s Features

6. DISCO’s Global Service

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DISCO Introduction 1/3

KiruPrecision cutting

Blade dicing Water jet saw

Laser dicing Dicing before grinding

KezuruGrinding even thinner than paper

Surface grinding TAIKO grinding

Back grinding Dicing before grinding

Surface planing

MigakuAdding value though polishing

Dry polishing

Plasma etching

CMP

Since 1937

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Dicing blade Grinding wheel Dry polishing wheel

Grinder Grinder/Polisher

DISCO

70~75%

Precision Processing Tools (Consumables)

Grinders

DISCO

60~70%

Major Competitors

6 Companies(includes Laser Saws)

Major Competitors

3 Companies

Major Competitors

Approx.

10-15 Companies

Dominant position in all three product segments

Dicing Saws

DISCO

70~80%

DISCO

70~80%

As of mid, 2014

DISCO Introduction 2/3

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AMERICA(53)

EUROPE(53)

JAPAN(132)

TAIWAN(335)

▼

As of March, 2014

PHILIPPINES(20)

写真

CHINA(188)

SINGAPORE(86)

KOREA(152)

Ablation73%

silicon(SD)6%

Others(SD)4%

LED(SD)17%

730

171

63 42

DISCO Introduction lasers 3/3

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Content







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Laser Lift Off Applications 1/1

• Laser Lift off Applications

• What is laser lift off

Bonded substrate

Carrier

Laser Absorption layer

Carrier removalLaser energy densityachieves decomposedthreshold

3DIC carrier removalHEMT device OLED process V-LEDs

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Content







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Why Vertical for UV LED?

Improvinglight extraction

efficiencyHigh heat sinking

Bettercurrent spreading

Source: Yoshihiko Muramoto, Masahiro Kimura and Suguru Nouda, (2014)

● Strength of Vertical LED

ITO layer absorbs UVlights and causesbrightness loss

10/8


VLED Laser Lift off 1/1

Laser Lift off of V-LED process

Sapphire

GaN epi

Conductive Carrier

Sapphire

GaN epi

Conductive Carrier Conductive Carrier

Lift off Washing

GaN epi

LASER

Carrier

GaN epi

EpitaxyProcess

-Heat sink-Hi-current-High brightness-Others

Sapphire

Conventional structure

Backendprocess

Difficulty of Yield by LLO process

- Power Stability- Heat side-affection- Gas Explosion 2GaN -> 2Ga + N2

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Content







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• Wafer Recycling

Advantage of DISCO’s Laser Liftoff Solution 1/3

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Less defection

Large Process Window

High Throughput

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△○Processing time

○○Fully automaticProductivity

△○No damage

Epi damage

Quality

△○±500μm

Capability forheight variation

Maintenance

○Long term

○

DISCO（DPSS）

△Gas exchange

every week

ConsumableReplacement

△Adjustment

everyday

Laser beamStability

Other solution（Excimer ）


Overall comparison

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Content







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DISCO’s solutions of LEDs

For Polishing DG P8761/DAG 810/DFG8830

為了Laser lift off，利用乾式拋光技術使藍寶石基板背面鏡面化

For Laser lift off DFL7560L包含剝離、洗淨的全自動製程高產出率維修簡易

For PlanarizationDFS8910藉由螢光粉平坦化穩定色度利於電極顯露

For Dicing DFD6341/DFL7160基板（Si/M etal等）的全切割技術(Blade or LASER)

For Package dicing DFD6341/EAD6750/DAD3650各種LED封裝體（樹脂・陶瓷）的全切割技術

or

MOCVD

Polishing

Laser lift off

Planarization

Dicing

Package dicing

Metallization

Bonding

Bumping

Phosphor coating

Packaging

DGP8761 DAG810

DFL7560

DFS8910

DFD6341 DFL7160

DFD6341 EAD6750

DFG8830

DAD3650

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Content







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DISCO’s global service 1/2

AMERICA

EUROPE

JAPAN

Sales, service and Applications SupportSales and serviceAgent office

TAIWAN

▼ Affiliated company

▼

As of March, 2014

KOREA

PHILIPPINES

SINGAPORE

写真

CHINA

60 sites60 sites

Affiliate / Agent

4,1464,146

Employees

Cumulative sales overCumulative sales over 38,38038,380 unitsunits

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DISCO’s global service 2/2◎ DFL7560 雷射剥離機◎DISCO HI-TEC TAIW AN

◎自有無塵室

• Test Cut• R&D support

10,000等級/267平方公尺

成立於2008年，現有員工220人，其中包含２２名

應用工程師。

設備包含切割機、研磨機、雷射切割機、雷射剥

離機、高倍顯微鏡、厚度測定器等

April, 2015 安裝完成

20/8


Thank you very much

Documents

FULLAUTOMATIC DPSS LASER LIFT OFF SOLUTION122.146.69.137/images/fckfile/File/DISCO_FULL AUTOMATIC...2015/05/28 · DGP8761 DAG810 DFL7560 DFS8910 DFD6341 DFL7160 DFD6341EAD6750 DFG8830