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1June 2000
Probe Card On-line Cleaning
Gene HumphreyInternational Test Solutions, Inc.
Livermore, CA 94550SWTW 2000
2June 2000
Contributors
• John Reynolds Motorola APRDL
• Bill Fulton Wentworth Laboratories
• Monte Laskosky Gel-Pak
• Sadafumi Tamakoshi Tokyo Seimitsu Co., Ltd.
• J. D. Ross FormFactor, Inc.
3June 2000
Off-line Cleaning
• Abrasive or Destructive cleaning• Alcohol, Air, Q-Tips, Lapping Film
• Debris Removal and Collection• Increased Handling and Damage• Downtime/Reduced Throughput
4June 2000
On-Line Cleaning
• Remove Loose Debris• Remove Embedded or Bonded Debris• Tip conditioning/Reshaping• Minimize handling and damage• Increase Throughput• Stable and Accurate Test Results
5June 2000
Industry Needs
• Cost Effective On-Line Cleaning• Effectiveness of Abrasive Cleaning• Characteristic of Non Abrasive Cleaning• Non-Abrasive Debris Collection• Wide Temperature Applications –40°C to
150°C• Easy to Use Products• Environmentally Safe Products
6June 2000
Product Families
• FormFactor Cleaning Wafer - 1997• Probe Clean – Non-Abrasive Debris Collection
– Recommended for all Probe Types• Probe Scrub – Light Scrub
– Reduces CRES for flat tip• Probe Polish – Removes and Collects
Embedded or Bonded Debris– Reduces CRES for flat, radius, round tips and Cobra
7June 2000
Probe Clean
• Basic Material for all Products• Non-Abrasive Highly Crossed Linked Polymer
– Collects Debris– Reduces CRES by Removing Loose Debris– Extends Probe Card Life– Leaves No Residue on Probes or in Prober– -50°C to 200°C Operating Temperature
• Use with all Probe Materials and Tips
8June 2000
Before Probe Clean
Contact 5000 times(Mag: 1500�
Pictures Courtesy TSK
9June 2000
After Probe Clean
After Cleaning (Mag: 1500�
Pictures Courtesy TSK
10June 2000
Probe Clean Results
Motorola APRDL
27 SEP 99
0.00
1.00
2.003.00
4.005.00
6.007.00
8.009.00
10.0011.00
12.0013.00
14.0015.00
16.0017.00
18.0019.00
20.0021.00
22.00
CRE
S O
HMS
2 3 4 5 6 7 8 9 10 11 12
RANDOM FLAT Re W PROBES
PROBE CLEAN TEST RESULTS
Before Ohms
After Ohms
11June 2000
PROBE CLEAN vs SANDPAPER
65
70
75
80
85
90
95
100
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
WAFER LOT NUMBER (25 WAFERS PER LOT)
YIEL
D
PROBE CLEANSANDPAPER
Probe Clean Yield Improvement
12June 2000
Need for Aggressive Cleaning
Contact 5000 times
Contamination
Clean Probe Before Test
Pictures Courtesy TSK
13June 2000
Need for Aggressive Cleaning
Cleaning 100 times Probe CleanCleaning 50Times Probe Clean
Pictures Courtesy TSK
14June 2000
Debris Collection
Picture Courtesy TSK
15June 2000
Probe Scrub
• Light Abrasion• Traps Debris
– Reduces CRES for flat tip – Environmentally Safe
• Use with Flat Tip Probes
16June 2000
Probe Scrub
17June 2000
Probe Scrub Results
SV PROBE
API ANALYZER
20 OCT 99
PROBE SCRUB TEST RESULTS
0.000
1.000
2.000
3.000
4.000
5.000
6.000
7.000
8.000
9.000
10.000
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49
RANDOM PROBE MEASUREMENTS
CRE
S O
HMS
Before
After
18June 2000
Probe Polish
• Reduces CRES by Lightly Polishing Probes• Use with Flat, Rounded, Radius, Sharp Tip or
Cobra Probes• Removes Loose, Embedded and Bonded Debris• Environmentally Safe
– Collects Heavy Metal Residue– Traps Debris for Disposal
19June 2000
Probe Polish
20June 2000
Probe Polish Results
CUSTOMER DATA
21June 2000
Complete Cleaning Solution
• Several Cleaning Options• Several Backing Materials
– Polyester– Silicon Wafer– Ceramic
• Installs on Prober Abrasion Plate• All Wafer Sizes for Prober Cleaning Trays
22June 2000
On-line Cleaning Benefits
• Increases Revenue– Increases Yield
• Proven on Production Floors– Cuts Cycle Time – Increases Throughput
• Reduces Off-Line Cleaning – Cost Effective
• Cleaning is In-Line• Less Abrasive Cleaning Required• Extends Probe Card Life