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Please register:
www.trumpf.com/s/PE2
Questions? Please contact us:
Phone +49 761 8971-2169
May 14 – 17, 2018 Freiburg, Germany
generating productivity
This year‘s PE2 2018 conference will showcase even more practical and relevant information for your day-to-day work!„Generating productivity” is the theme of the 2018 conference and as in previous years, PE² consists of a multi-faceted program. Lectures on new applications in the fi eld of plasma technology as well as product trends will inspire attendees and inform them on recent trends in research and development.
Focus topicsMarket and application trends in glass, PV, decorative and industrial coating.
PE² – International Conference on Power Electronics for Plasma Engineering
Dear Sir or Madam,
Till KüppersPresidentTRUMPF Hüttinger GmbH + Co. KG
Dr. Rafal BugyiPresidentTRUMPF Huettinger Sp. z o.o.
New networking platformInspiring poster session.
Our aim is to inspire and provide true added value. That is why we are putting the spotlight on practical application: Experience exciting technology insights through presentations from leading industrial and R&D plasma experts that coordinate the latest in theory and practice.
NEW 2018: PE² Semi special
This year we will have a further
event which focuses exclusively
on the semiconductor market
Short agenda
11:30 - 12:00
Conference registration
12:00 - 14:00
Session 1 – Advances in photovoltaic industry
14:00 - 14:30
Time2Network
14:30 - 17:00
Session 2 – Large area coating
19:00 Evening event
Day 2, May 15th: Conference
Technology development
08:15 - 08:30
Welcome
08:30 - 10:15
Session 3 – New trends of industrial processing
10:15 - 10:45
Time2Network
10:45 - 12:50
Session 4 – New trends of industrial processing (cont.)
13:00 - 14:00
Lunch break
14:00 - 15:00
Company tour
15:00 - 15:45
Time2Network @ Poster session
15:45 - 17:45
Session 5 – Beyond plasma technology
Day 3, May 16th: Workshop
HandsOn
08:30 - 09:00
Welcome Health and safety briefi ng
09:00 - 11:00
Session 1 – MF RF
11:00 - 11:30
Time2Network
11:30 - 12:30
Session 2 – Bipolar DC
12:30 - 13:30
Lunch break
13:30 - 14:30
Session 2 (cont.) – Bipolar DC
14:30 - 15:00
Time2Network
15:00 - 17:00
Session 3 – IoT servicesBi-HiPIMS
Day 4, May 17th: Conference
Semi special
08:30 - 09:00
Welcome
09:00 - 10:40
Session 1 – Semiconductor industry: current status and trends
10:40 - 11:10
Time2Network
11:10 - 12:50
Session 2 – Thin layer depostion and processing
13:00 - 14:00
Lunch break
14:00 - 15:40
Session 3 – Advances in plasma technology for SEMI manufacturing
15:40 - 17:00
Company tour &Get together
For further information and conference fee please visitwww.trumpf.com/s/PE2
Day 1, May 14th: Conference
PV & LAC
Conference registration 11:30 - 12:00
Welcome speech 12:00 - 12:15Till Küppers, TRUMPF Hüttinger, DE
1 Advanced materials enabled by plasma technologies 12:15 - 12:45*Prof. Bernd Szyszka, TU Berlin, DE
Session 1 – Advances in photovoltaic industry
2Magnetron sputtered thin fi lms for photovoltaic applications
12:45 - 13:10*Dr. Ronald Korn, Singulus Technologies AG, DE
3Analysis of ICP plasma processes for crystalline silicon solar cell surface passivation
13:10 - 13:35*Marc Hofmann, Fraunhofer Institute for Solar Energy Systems ISE, DE
4Hardware functionality driven PVD process optimization: a dual-output pulsed-DC plasma source utilization in CIGS photovoltaic cell production
13:35 - 14:00*Paweł Lesiuk, TRUMPF Huettinger, PL
Get together: Time2Network 14:00 - 14:30
Session 2 – Large area coating
5Effi ciency and yield enhancing optical monitoring system for inline coaters
14:30 - 14:55*Wilmert De Bosscher, Soleras, BE
6Simulation study on input power effects in magnetron discharges
14:55 - 15:20*Michael Siemers, Fraunhofer Institute for Surface Engineering and Thin Films IST, DE
7Basic study on ZrOx rotatable sputtering – target development
15:20 - 15:45*Christoph Simons, Materion, DE
Agenda Day 1, May 14th | Conference
generating productivity
8 Success factors in ZrOx target MF sputtering 15:45 - 16:10*Dr. Moritz Heintze, TRUMPF Hüttinger, DE
9 Large area industrial PVD coatings 16:10 - 16:35*Dr. Andriy Kharchenko, Saint Gobain Recherche, FR
10Understanding crazing effect in large area coating – critical factors and mitigation methods
16:35 - 17:00*Dr. Wojciech Gajewski, TRUMPF Huettinger, PL
Conclusion day 1 ~ 17:00Michael Ehinger,TRUMPF Hüttinger, DE
Evening event 19:00 * incl. 5 mins discussion
Agenda Day 2, May 15th | Conference
Welcome 08:15 - 08:30Dr. Rafal Bugyi, TRUMPF Huettinger, PL
Session 3 – Technology development I: New trends of industrial processing
11Smooth, highly adherent HiPIMS coatings for friction stir welding of aluminium
08:30 - 09:00*Prof. Arutiun Ehiasarian, Sheffi eld Hallam University, UK
12 Challenges of HiPIMS for directional deposition 09:00 - 09:25*Dr. Jürgen Weichart, Evatec AG, CH
13A comprehensive tutorial for successful HiPIMS application in mass production: a case of C-based optical and decorative coatings
09:25 - 09:50*Dr. Anna W. Oniszczuk, TRUMPF Huettinger, PL
14Recent progress in pulse magnetron sputtering at Fraunhofer FEP
09:50 - 10:15*Dr. Matthias Fahland, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP, DE
Get together: Time2Network 10:15 - 10:45
Session 4 – Technology development I: New trends of industrial processing (cont.)
15Next generation of power supplies for plasma diffusion treatment
10:45 - 11:10*Dr. Peter Kästner, Fraunhofer Institute for SurfaceEngineering and Thin Films IST, DE
16Multiple plasma source synchronization for improved process optimization: a Ti-Cr-based anticorrosion coating case study
11:10 - 11:35*Krzysztof Ruda, TRUMPF Huettinger, PL
17 E-beam evaporation for packaging and security applications 11:35 - 12:00*Roland Trassl, Applied Materials, DE
generating productivity
18 Ultra-clean and high performance substrates for plasma treatment technologies
Laser based rapid thermal processing
12:00 - 12:25*
12:25 - 12:50*
Valentijn von Morgen, DuPont Teijin Films, UK
19Jan Wieduwilt, TRUMPF Laser, DE
Lunch break 13:00 - 14:00
Company tour & Group picture 14:00 - 15:00
Time2Network @ Poster session 15:00 - 15:45
20 Defects and doping in oxides: case of doped TiO2 films 15:45 - 16:15*Dr. Nadhira Laidani, Fondazione Bruno Kessler, IT
Session 5 – Technology development II: Beyond plasma technology
21Synthesis of electrochromic thin films by reactive co-sputtering
16:15 - 16:40*Oliver Kappertz, Fraunhofer Institute for Surface Engineering and Thin Films IST, DE
22The road to predictability for industrial plasma coating: data-based process and up-time optimization
16:40 - 17:05*Dr. Ioana Luciu, TRUMPF Hüttinger, DE
23 Silicon layers for application in lithium ion batteries 17:05 - 17:30*Dr. Andreas Georg, Fraunhofer Institute for Solar Energy Systems ISE, DE
Conclusion of conference ~ 17:45Michael Ehinger,TRUMPF Hüttinger, DE
City Tour and free time for your own exploration of the town.
19:00* incl. 5 mins discussion
Agenda Day 3, May 16th | Workshop
Welcome Health and safety briefi ng
08:30 - 09:00Dr. Jan Peter Engelstädter, TRUMPF Hüttinger, DE
Group 1 Group 2
Session 1 Session 1
1Electrical measurement techniques for process characterization in MF dual magnetron sputtering
09:00 - 10:00 Multi frequency plasma systems for etch applications
2 Multi frequency plasma systems for etch applications 10:00 - 11:00Electrical measurement techniques for process characterization in MF dual magnetron sputtering
Get together: Time2Network 11:00 - 11:30
Session 2 Session 2
3Gentle approach for sensitive materials – step mode in Bipolar power supply
11:30 - 12:30 Dual output pulsed DC – application fl exibility
Lunch break 12:30 - 13:30
4 Dual output pulsed DC – application fl exibility 13:30 - 14:30Gentle approach for sensitive materials – step mode in Bipolar power supply
Get together: Time2Network 14:30 - 15:00
Session 3 Session 3
5 IoT services 15:00 - 16:00 Bi-HiPIMS – HiPIMS in Bipolar operation
6 Bi-HiPIMS – HiPIMS in Bipolar operation 16:00 - 17:00 IoT services
Conclusion of workshop ~ 17:00Dr. Jan Peter Engelstädter, TRUMPF Hüttinger, DE
generating productivity
Agenda Day 4, May 17th | Conference Semi special
Welcome – Start of the conference 08:30 - 09:00Dr.-Ing. Daniel Krausse, TRUMPF Hüttinger, DE
Session 1 – Semiconductor industry: current status and trends
1Enhancing the EU Semiconductor Industry in the Digital Economy
09:00 - 09:25*Emir Demircan,Semi Europa, BE
2“Dr. Production” and predictive maintenance: lessons learned from semiconductor manufacturing
09:25 - 09:50*Dr.-Ing. Martin Schellenberger, Fraunhofer Institute for Integrated Systems and Device Technology IISB, DE
3Gallium nitride power devices for MHz-switching applica-tions
09:50 - 10:15*Dr.-Ing. Richard ReinerFraunhofer Institute for Applied Solid State Physics
4Design for reliability and availability challenges in the development of plasma processing power supply
10:15 - 10:40*Jacek Kałowski, TRUMPF Huettinger, PL
Get together: Time2Network 10:40 - 11:10
Session 2 – Thin layer depostion and processing
5RF plasma enhanced methods (@13.56 MHz) for the applications in modern semiconductor structures and devices
11:10 - 11:35*Prof. Robert Mroczyński, Warsaw University of Technology, PL
6Controlled reactive HiPIMS – effective technique for low-temperature deposition of functional oxide films
11:35 - 12:00*Prof. Jaroslav Vlcek, University of West Bohemia, CZ
7High Voltage (HV) technology for ion energy management: current status and development trends
12:00 - 12:25*Dr. Paweł Ozimek, TRUMPF Huettinger, PL
* incl. 5 mins discussion
Agenda Day 4, May 17th | Conference Semi special
generating productivity
8RhySearch – the new research and innovation center in the heart of the Alpine Rhine Valley – applied research in optical coating and precision manufacturing
12:25 - 12:50*Dr. Richard Quaderer, RhySearch, CH
Lunch break 13:00 - 14:00
Session 3 – Advances in plasma technology for SEMI manufacturing
9 Effi cient PECVD chamber cleaning with F2-based chemistry 14:00 - 14:25*Robert Wieland, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, DE
10Requirements for modern semiconductor PECVD / Etch applications
14:25 - 14:50*Dr.-Ing. Daniel Krausse, TRUMPF Hüttinger, DE
11 Multi frequency plasma systems for etch applications 14:50 - 15:15*Wojciech Głazek, TRUMPF Huettinger, PL
12How small solution provider can help to improve your bottom line
15:15 - 15:40*Philipp Quaderer, SPM, DE
Conclusion of conference 15:40 - 16:00Dr.-Ing. Daniel Krausse, TRUMPF Hüttinger, DE
Company tour & Get together 16:00 - 17:00
* incl. 5 mins discussion
Conference venue and impressions of past conferences
TRUMPF Hüttinger GmbH + Co. KG
Bötzinger Straße 8079111 FreiburgGermanyPhone +49 761 8971-2169Fax +49 761 8971-1150
Conference venue
Scan GPS data for your navigation system
Impressions of past conferences
TRUMPF Hüttinger GmbH + Co. KG
Bötzinger Straße 80 79111 FreiburgGermanyPhone +49 761 [email protected]
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