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ng
ngin
eeri
nspla
yEn
Thin Film Transistor
on t
oD
isnfo
rmatio
In
TFT-LCD DRAM ng TFT-LCD DRAM
ngin
eeri
n TFT LCD DRAM
Substrate c-Si
spla
yEn
TFT, Cs, Transistor, Capacitor
Gate & Data Bit & Word Line
on t
oD
is
Line-by-Line Random access
nfo
rmatio
,
Design Rule ( 4m) (nano scale)
In
Chip /
TFT-array ng
35 chip/ 100 chip/
ngin
eeri
nspla
yEn
Chip
on t
oD
isnfo
rmatio
=91.4% (32/35) =97.0% (97/100)
Chip
In
Chip
Chip Chip
LCD: chip .
TFT-array ng 12 panel/
(A)
(b)
ngin
eeri
n
6 panel/
1 panel/
G4 G5 a)
spla
yEn
(B
)
(a
TFT-array ng
1 6
1.8
2.0
(m)
G72200x1870
1800x1500
ngin
eeri
n
1.0
1.2
1.41.6
G5
G6 1.48
1800x1500
1300x1100
spla
yEn
0.2
0.4
0.60.8
G1
G3G4
G5
G2
1.89
2.13
830x650720x60 3.5th
920x730650x550
370x470300x250
on t
oD
is
0.2 0.60.4 1.00.8 1.41.2 1.81.6 2.0 2.42.2 (m)
G1
720x600
3.5th
nfo
rmatio
3 3.5 4 5 6 7
650x550 720x600 920x730 1300x1100 1800x1500 2200x1870
In 12.1x615.0x4
14.1x6
17.0x4
14.1x9
15.4Wx8
17.0x6
21.3x4
15.0x16
17.0x12
19.0x9
23Wx8
17.0x24
26Wx12
32Wx8
37Wx6
23Wx24
26Wx18
32Wx12
40Wx8
26Wx6 46Wx6
(:mm, )
LCD LCD
< Segment dot Matrix >
of
LC
s
- direct (static ): -
- multiplex
Phys
ics
Matrix Display
< Passive Matrix LCD & Active Matrix LCD >
Memory mode
of
LC
s
- dot matrix display passive matrix active matrix multiplex
Phys
ics active matrix multiplex .
- multiplex (Scanning electrode) (signal electrode) .`
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
Structure of TFT
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
Silicon (Si) Energy Band
ng < > < >
ngin
eeri
nspla
yEn
Conductionband
Ed
Dangling bondsTerminated byhydrogen atoms
5.43
on t
oD
is band Eg
Donor level
Fermi level
Acceptor level
Ea
Localized states5.43
nfo
rmatio
Valenceband
0Acceptor level
(a) c-Si (b) a-Si (c) a-Si:H
- - - 4 nearest neighbor &12 next nearest neighborband gap energy : 1 1 eV at 300KIn
(Hydrogenated Amorphous Silicon (a-Si:H)
- band gap energy : 1.1 eV at 300K
Dangling bond Localized State a-Si:H : (1979 Lecomber a-Si:H TFT )
Si H TFT ( TFT 1979)
ng
a-Si:H TFT ( TFT, 1979)
ngin
eeri
n -
-
spla
yEn
-
(TFT/ )
on t
oD
is (TFT/, , )
-
tt (
< (a-Si:H) >
ng
< (a Si:H) >
- PECVD a-Si:H
ngin
eeri
n
Physical parameters Typical values
Dark conductivity 310-10 S/
spla
yEn Activation energy 0.76 eV
Photoconductivity 110-4 S/
Optical band gap ~1.8 eV
on t
oD
is
Electron mobility 0.5 ~ 1.0 /V-sec
Hole mobility 1 ~ 510-3 /V-sec
Electron affinity 3.93 eV
nfo
rmatio
Refraction index 4.3
Density 2.2 g/
Hydrogen content 10 ~ 15 wt %
In
Hydrogen content 10 15 wt.%
Crystallization temperature 675
Valence band tail slope ~ 45 meV
Conduction band tail slope 25 meVConduction band tail slope ~ 25 meV
< MOSFET TFT >
ng
ngin
eeri
n Planar vs. Staggered TFT
spla
yEn
on t
oD
isnfo
rmatio
In
- C-Si wafer - Gate & Source-Drain
- glass a-Si:H - Gate & Source-DrainGate & Source Drain
Gate & Source Drain
< Top Gate Bottom Gate TFT >ng
Staggered vs. Inverted Staggered TFT
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
PECVD SiNx a Si:H n+ a si:H In - PECVD - Subcutaneous reaction: Si rich SiNx SiNx a-Si:H TFT (TFT )Backlight
- SiNx, a-Si:H, n+ a-si:H PECVD
- a-Si:H/SiNx - Backlight
- Backlight
< Etch Back Type TFT Etch Stopper Type TFT >
ng
< Etch Back Type TFT Etch Stopper Type TFT >
ngin
eeri
nspla
yEn
on t
oD
is
n+ a-Si:H
a-Si:H PECVD(1) SiNx(E/S)
n+ a-Si:H PECVD(2nd)
nfo
rmatio
- n+ a-Si:H a-Si:H
a Si:HSiNx
PECVD(1) SiNx(E/S)
a-Si:HSiNx
PECVD(1st)
- Channel a-Si:H
In
n+ a Si:H a Si:H Active layer
- a-Si:H 200~300 : .
- n+ a-Si:H
Channel a Si:H a-Si:H
- PECVD , (50)
- ( ) n a Si:H .
( ) - PECVD
< Self-Align E/S Type TFT TFT >
ng
< Self Align E/S Type TFT TFT >
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
Etch-Stopper Gate a-Si
(a) Self-Align E/S (b) Self-Align E/S Type TFT
In
- TFT array Source-Drain overlap TFT Gate mask - TFT Gate mask
TFT
ng TFT -
active layer Gate
- Gate a-Si:H layer threshold voltage TFT off
ngin
eeri
n - active layer Gate - Gate - Ohomic ( Source-Drain )- W/L
mobility
- threshold voltage TFT off- threshold voltage free electron
(mobile carrier) , Source-Drain TFT on a Si:H
spla
yEn - mobility
< a-Si:H TFT >V I
- a-Si:H , band-gap trap ,
- Source carrierinjection . (Source-Drain )
on t
oD
is
carrier injectionn+ a-Si:H(ohmic )
VDS IDS )
nfo
rmatio
carrier accumulationn a Si:H(ohmic )
a-Si:H( )
In
carrier moving SiNx()
GateVG
< TFT - (I-V) >< TFT (I V) >
of
LC
s
Gate Source (hole) TFT off TFT off -5V Gate
[MOSFET -(I-V) ]VG 20V VD 10V Vth 5V (VG > VD +Vth) TFT on
Phys
ics
TFT off .
< TFT I-V >
of
LC
s
- K: TFT - TFT (VG > VD +Vth)
Phys
ics
- Source-Drain Id Gate VG plot K, x TFT Vth
ng
ngin
eeri
nspla
yEn
TFT-LCD
on t
oD
isnfo
rmatio
In
TFT-array ng
B di P d D (3 072)
< XGA Color TFT-array >
ngin
eeri
n Bonding Pad Data (3,072)
spla
yEn Data Unit Pixel
on t
oD
is (ITO, Cs)
TFT
nfo
rmatio
Gate
TFTGate (768)
In
TFT Array Panel
ng
ngin
eeri
n
- - Cs on gate
spla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
Gate pulse width = (mf)-1p ( )where m: # of gate line
f : frame rate
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
Unit cell ng
RED GREEN BLUE
t -V21 -V22 -V23+V11
V
-V12
V
-V13
V
ngin
eeri
n
+VCOM
t V21 22 23-V31 -V32 -V33
D1 D2 D3
V Vt
spla
yEn -
VCOM
(VCOM : CF )
-5V VOFFG1
off offoff+V11 -V12 +V13
on t
oD
is )
20V VON
Selected Gate
G2
onon on-V21 +V22 -V23
nfo
rmatio
VOFFG3
off off off+V31 -V32 +V33
(ITO) (Cs)
-5V
In
Li b Li dd i
(3 x 3) Active Matrix LCD
(ITO) (Cs)
Line-by-Line addressing
Gate refresh Data write
Unit cell ng
Source LDI
ngin
eeri
nspla
yEn
+
on t
oD
is
-
nfo
rmatio
In
(a) Dot (c) V-Line (b) (2X1)
S LDI C t l Source LDI Control
LCD panel ng Source LDI (S/H & D/A)Serial Data
010001010
ngin
eeri
n
0 0 0 0 0 00 0 0
5 555 5 588 8 Volt
010001010
spla
yEn 0 0 0 0 0 00 0 0
0 0 0 0 0 00 0 0
0 0 1 1 1 00 0 0
0 0 0 1 1 01 1 1
on t
oD
is 0 0 1 1 1 00 0 00 1 0 0 1 00 0 1
1 1 1 0 1 01 1 0
1 0 0 1 0 00 0 0 Selecte
nfo
rmatio 1 0 0 1 0 00 0 0
1 0 0 0 0 00 1 1
1 1 1 0 0 01 1 0
ScanSelected Line
(I LCD )In (Bit image in Graphic memory) (Image on LCD screen )
S LDI C t l Source LDI Control
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
R: 8 level, G: 8 level, B: 8 level # of Colors : 8 x 8 x 8 = 512
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
dotColor
ng
G R G
dot
pixel
ngin
eeri
n
R BG
R BG
R BG R G
R B G
R BG R BG
R
R G
G
B
R RG GB
spla
yEn R BG R BG
R BG R BG
R
B
G
R G
R BG R BG
R BG R BG
R G
R
R
R
R
RG
G
G
GB
B
B
RB G
on t
oD
is
BR BGR BG R G R BGBG R G R RG
B R G B
B G
( ) S i (b) M i ( ) D lt
nfo
rmatio
(a) Stripe (b) Mosaic (c) Delta
(3 x 3) Active Matrix LCD
In Stripe
CF
TFT-array
RGB
Line-by-Line RGB
Mosaic
RGB
Image
Delta
TFT-LCD
Line by Line RGB scan line
Image
OA
Data line
Color ng 12 1XGA : 0 080 mm x 0 240mm (106ppi)
dot-0.1mm(Unit Pixel )
ngin
eeri
n
R BG12.1 XGA : 0.080 mm x 0.240mm (106ppi)
14.1XGA : 0.09325 mm x 0.27975mm (91ppi)
17 0SXGA : 0 090 mm x 0 270mm (94ppi)
-0.3mm
spla
yEn 17.0 SXGA : 0.090 mm x 0.270mm (94ppi)
21.3UXGA : 0.090 mm x 0.270mm (94ppi)
Sub-pixel
on t
oD
is
~ 0.014
~40cm
ppi: pixel per inch
Retina
nfo
rmatio Retina
In < 0.03 Mixed color
RGB color mix
Color ng
Backlight Spectra
Transmitted Lights
ngin
eeri
n
Color Filter Spectra
TFT-Array Color-Filter
spla
yEn
Transmitted Lights
on t
oD
isnfo
rmatio
Backlight
LCD LCD RGB primary color In LCD
RGB
LCD RGB primary color
RGB spectrum BacklightLC layer Color filter RGB primary color Color filter B kli ht t
TFT-LCD Color Generation
Backlight spectrum
Color ng
Color A = rR + gG +bB
r = R /(R + G + B)
ngin
eeri
n
(a) Display A(b)
g = G/(R + G + B)
b = B /(R + G + B)
With r + g+ b = 1
spla
yEn (b)
Display B
on t
oD
isnfo
rmatio
3-D Color Space 2-D Color Corrdinate CIE 1931 x-y NTSC
In
Color Balance
Color Reproducibility or Color Saturation
Color Reproducibility of Display (a) =
Area of (a)Saturation
Color TemperatureArea of (a)
Area of (NTSC)X 100%
ng
ngin
eeri
nspla
yEn
TFT
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
TFT
ng
< TFT Gate Source Drain Overlap >
TFT
TFT-array
ngin
eeri
n < TFT Gate Source-Drain Overlap >
: W/L
*Kickback - TFT
spla
yEn W/L .
W/L , TFT
.
- TFT-LCD Gate
on t
oD
is
Source Drain
TFT .
nfo
rmatio
LIn LL L overlap capacitance .Vp kick back
Staggered TFT 1~2 . kick back (photolithography overlap)
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
-Gate TFT Gate RC-delay
ngin
eeri
n
< TFT-LCD >
TFT LCD Gate
y Gate
spla
yEn
Etch
()
Al ITO
< TFT LCD >
on t
oD
is Cu Wet 2.1
Al Wet or Dry 3.5 -
Al-Nd Wet or Dry ~5 -
nfo
rmatio Al Nd Wet or Dry 5
Mo Wet or Dry 12
MoW Dry 15
In -Ta Dry 25
Cr Wet 25
MoTa Dry 36 MoTa Dry 36
< TFT Gate >ng
ngin
eeri
nspla
yEn
Photo Gate
on t
oD
is Gate .
Photo
nfo
rmatio Photo
.
In .
ng
- ITO Gate Ioverlap) (Cs) .
ngin
eeri
n
< >
Ioverlap) (Cs) . - Cs overlap
spla
yEn < >
Storage-on-Common
on t
oD
isnfo
rmatio
In
TFT
ng
< Cst-on-Gate >
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
TFT
In
- Gate Cs Cs .
- Gate DC Gate
< ITO Cs TFT-array >ng
- (Cs) .
ngin
eeri
n
Source Drain
Cs(Gate )
spla
yEn
Gate
on t
oD
is
Backlight
nfo
rmatio
Source Drain
Cs( ITO)
In
GateGate
Backlight
TFT-array ng
Cs
Line Defects
Pixel Defects
ngin
eeri
n Cs short
Data-ITO short
Pixel Defects (Point Defects)
spla
yEn
open
Cross- TFT
short
on t
oD
is Crossover short
ITO
short
ITO-ITO short
nfo
rmatio
TFT
In
open
TFT-array
open
TFT-array ng
LCD
ngin
eeri
nspla
yEn
Pattern
on t
oD
is Pattern TFT Patterned
Open cross-over short
nfo
rmatio
Dual-TFTDual-Pixel
In
Dual PixelLaser cutting Laser Repair
TFT TFT-array
TFT-array ng
Gate Data
ngin
eeri
n
i i
spla
yEn
CsCst
on t
oD
is
L C t (ITO)
nfo
rmatio
TFT TFT shortLaser Cut
Dual TFT redundancy
In
redundancy
2 TFT
TFT TFT
Laser cutting TFT
TFT-array ng
Data
(1)Data (2)
ngin
eeri
n
(Cs)
(Cs)
spla
yEn
(ITO)
(ITO)
on t
oD
is
TFT
nfo
rmatio
TFT
TFT-array dual-pixel redundancy TFT redundancy
Data In
2 TFT, ,
Data
Data short
Short laser cutting
TFT-array ng
Gate open (Fault-Tolerant)
Data
ngin
eeri
n
Gate (1)
Tolerant)
spla
yEn Gate (1)
Gate (2)
on t
oD
isnfo
rmatio
In
Cross-Over Shot (Laser cut )
Fault-Tolerant
TFT-array ng Laser (welding) Data Display
ngin
eeri
n Laser (welding) Data area
spla
yEn
Laser welding cross-
on t
oD
is Laser welding cross-over short Data
nfo
rmatio
Open
, RC-delay
In
ng
ngin
eeri
n
TFT-LCD
spla
yEn TFT-LCD
on t
oD
isnfo
rmatio
In
TFT-Array ng
TFT-Array
-
ngin
eeri
n
- (ex. Bottom gate E/B type TFT )
spla
yEn
Gate Pattern
a Si:H Pattern
Gate Pattern
a Si:H & S/D Pattern
on t
oD
is a-Si:H Pattern
S/D Pattern
a-Si:H & S/D Pattern
Contact Etch
nfo
rmatio
Contact Etch
ITO Pattern
ITO Pattern
In
* Other steps are same
(a) Conventional 5-mask (b) 4-mask
TFT-Array ng
UV exposure Slit MASK
ngin
eeri
n
under exposure
Slit
spla
yEn
n+ a-Si
S/D
PR
(under exposure)
on t
oD
is
Glass Gate SiNx
a-Si (under exposure)
(a) slit
nfo
rmatio
PR
PR
In
G SiN
a-Si
n+ a-Si
S/D
PR
11 photolithographyphotolithography Glass Gate SiNx
11 photolithography photolithography PR PR
(b) PR
PR
S/D a-Si:H
ng
Gl SiN
a-Si
n+ a-Si
S/D
PR
S/D, a-Si:H
ngin
eeri
n
PR Etch-Back
Glass Gate SiNx
(c) S/D active
spla
yEn
S/D
PR
on t
oD
is
Glass Gate SiNx
a-Si
n+ a-Si
nfo
rmatio
S/D n+ a-Si:H Etch Back
(d) PR Etch-Back Define
In
a Si
n+ a-Si
S/D
PR
Glass Gate SiNx
a-Si
4-mask TFT
(e) S/D n+ a-Si:H Etch Back
ng
ngin
eeri
n
Glass GlassGate Gate
(f) SiNx contact window open (g) ITO
spla
yEn (f) SiNx contact window open (g) ITO
on t
oD
is Slit Mask
- Photolithography
nfo
rmatio
- TFT-Array
In
ng
TFT backlight
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
TFT-LCD
ngin
eeri
n = Backlight LCD (cf. TFT-LCD < 10% )
spla
yEn
=
on t
oD
is
- BLU
nfo
rmatio BLU
- BLU
In
= =
ng (Aperture)
ngin
eeri
nspla
yEn
on t
oD
is
R G B
nfo
rmatio
In
(a) TFT-Array (b) Color filter y
Cell Aperture Area
ng
< Unit Pixel Opaque area Aperture area >
Gate
ngin
eeri
n
Cs
Gate
spla
yEn
Data
BM BM(CF)
on t
oD
is
(ITO)
TFTAperture
CF
nfo
rmatio
Data
TFT
In Data
- TFT, , (opaque area)TFT-array TFT array .
- BM overlap
< BM-on-TFT array >ng
Aperture
BM
ngin
eeri
n Aperture
CF
(~10)
- CF BM 5 &
gap
spla
yEn
BM
TFT
( 10) Fringe-Field
CF BM 10
on t
oD
is
Data
Aperture
- BM-on-TFT array TFT-array
photolithography
nfo
rmatio
CF
(~1)
1~2 .
In BM
D t
TFT
( 1)
Data BM-on-TFT array
ng
(BM)CF
ngin
eeri
n (BM)
spla
yEn
on t
oD
is
nfo
rmatio
coupling In - coupling .
- BM .
-
: coupling .
: BM TFT-Array
Color Filter on Array (COA)ng
yngin
eeri
n
(ITO)
spla
yEn
on t
oD
is
(TFT+C/F)
nfo
rmatio
PR
PR In - PR
-
: PR TFT-Array fringe field
: BM => .
:
Color Filter on Array (COA)ng
ngin
eeri
nspla
yEn
60%
78%
on t
oD
is
27m 12m
nfo
rmatio
In
BM CF COA
ng
ngin
eeri
nspla
yEn
What is Next ?
on t
oD
isnfo
rmatio
In
ng
TFT
A-Si TFT Poly-Si TFT X-Si TFT
ngin
eeri
n A-Si TFT Poly-Si TFT X-Si TFT
spla
yEn
on t
oD
isnfo
rmatio
In
ng
Excimer Laser Annealing of a-Si (XeCl, 308nm, 30~45ns, line beam)
ngin
eeri
nspla
yEn
on t
oD
isnfo
rmatio
In
ng
ngin
eeri
n
Gate Driving IC
S/H
Gate Driving IC Gate Driving IC
spla
yEn a-Si
TFT-LCD Timing
Controller p-SiTFT-LCD
S/H
ControlIC
SLS-SiTFT-LCD
x-Si
on t
oD
is
aa--Si TFTSi TFT xx--Si TFTSi TFTpp--Si TFTSi TFTData Driving IC Control IC Data Driving IC
nfo
rmatio
Mobility : 0.5cm2/VsHighly Uniform TFTsSimple Process
Mobility > 600cm2/ /VsSystem on GlassGlass Semiconductor
Mobility : 50~200cm2 /Vs Integrated Driver 200 ppi High ResolutionIn Simple Process Glass Semiconductor200 ppi High Resolution