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Act like someone’s life depends on what we do.
UNPARALLELED
COMMITMENT
&SOLUTIONS
UNCLASSIFIED
UNCLASSIFIED
U.S. ARMY ARMAMENT
RESEARCH, DEVELOPMENT
& ENGINEERING CENTER
Nanomaterials and Additive Manufacturing for Munitions Power Sources
Giuseppe L. Di Benedetto, Ph.D.Advanced Materials Technology Branch
U.S. Army ARDEC
Picatinny Arsenal, NJ, USA, 07806
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KEY CONTRIBUTORS
R. Carpenter – US Army ARDEC
D. Swanson – EnerSys Advanced Systems
B. Wightman – EnerSys Advanced
Systems
E. Handy – SI2 Technologies, Inc.
K. Maleski – Drexel University
T. Mathis – Drexel University
K. Van Aken – Drexel University
Y. Gogotsi – Drexel University
D. Sabanosh – US Army ARDEC
J. Zunino – US Army ARDEC
D. Schmidt – US Army ARDEC
J. Kraft – US Army ARDEC
L. Zunino – US Army ARDEC
B. Fuchs – US Army ARDEC
L. Holmes – US Army Research Labs
K. Duncan – US Army CERDEC
C. Haines – US Army ARDEC
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Army S&T Performing Organizations
Materiel
AMCArmy Materiel
Command
Personnel
G-1HQDA, G-1
Personnel
Medical
MEDCOMArmy Medical
Command
Infrastructure/Environmental
USACEArmy Corps of
Engineers
Strategic Missile Defense
SMDCArmy Space &
Missile Defense
Command
ATECArmy Test &
Evaluation Command
Test &Evaluation
RDECOMResearch,
Development &
Engineering
Command
AMRDEC
Aviation & Missile
Research,
Development &
Engineering
Command
ARL
Army Research
Laboratory
Armaments
Research,
Development &
Engineering
Command
Communications-
Electronics
Research,
Development &
Engineering
Command
Edgewood
Chemical Biological
Center
Natick Soldier
Research,
Development &
Engineering
Command
Tank-Automotive
Research,
Development &
Engineering
Command
ECBC NSRDECCERDEC TARDECARDEC
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S&T IN RDECOM
XM25
Counter Defilade Target
Engagement System
Discovery Innovation Advanced
Development
Translational
Neuroscience
ARL
RDECs
PMs/PEOS
Engineering &
Production
Support to
Warfighter
Face-Gear
Technology for
Block III Apache
MRAP Armor
MEMS TBI
Sensor
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INTRODUCTION
Why is the Army looking at thermal batteries?:
Thermal batteries remain a key primary power source for critical military
applications, such as precision munitions and missiles.
Competitive technologies have yet to achieve the performance and reliability of
thermal batteries for these applications.
A more compact & powerful thermal battery will lead to increased lethality and
precision.
What does this study aim to accomplish?:
Use a fully scalable high energy milling method to produce kilogram quantities of
nanoscale FeS2, CoS2, NiS2 powders for thermal battery cathodes.
Understand the effect of process parameters on the resulting nanoscale powders.
Theory behind work being done:
Nanomaterials offer an opportunity to produce batteries with improved
performance, such as higher voltages and increased current densities.
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MATERIAL PROCESSING AND MIXING
Micron sized FeS2, CoS2, NiS2 powder are currently used in thermal battery
cathodes.
Through mechanical attrition, powder particle size is reduced to the nanoscale
High energy horizontal attritors used to impart nanostructure.
Provide extremely high amounts of kinetic energy
Processing carried out in inert atmosphere to minimize oxygen pickup.
RPM, Powder-Ball-Ratio (PBR), Processing time, and Media type all important
variables in tailoring material properties
Multiple experiments were performed with different processing times to achieve
desired powder properties
High Energy Mill Size reduction through particle
collisions with grinding media
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NiS2:
PROCESSED POWDERS
CoS2:
As-Received [Micron FeS2 (right)]
Processed [Nano FeS2 (left)]
FeS2:
As-Received [Micron CoS2 (right)]
Processed [Nano CoS2 (left)]
As-Received
[Micron NiS2 (right)]
Processed [Nano NiS2 (left)]
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CHARACTERIZATION TECHNIQUES
Scanning Electron Microscopy:
Zeiss Supra V40
X-Ray Diffraction
Rigaku Ultima
X-Ray Fluorescence
Rigaku ZSX Primus II
B.E.T.
Quantachrome Nova 4000e
ICP
Perkin Elmer Optima 5300V
LECO Sulfur Analysis
LECO SC632
Single Cell Thermal Battery Testing
from a Proven SANDIA design
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SCANNING ELECTRON MICROSCOPY – FES2
Scanning Electron Microscopy:
SEM was performed in order to estimate particle size.
Clear size reduction can be seen from top row (as-received) and the lower rows
(processed)
Magnifications (left to right) 500x,
2kx, 15kx, 25kx
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SCANNING ELECTRON MICROSCOPY – COS2
Scanning Electron Microscopy:
SEM was performed in order to estimate particle size.
Clear size reduction can be seen from top row (as-received) and the lower row
(processed)
Agglomeration of ultrafine particles was evident at low magnifications of processed
powder.
Magnifications (left to right) 500x,
2kx, 15kx, 30kx
As-Is
10h
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SCANNING ELECTRON MICROSCOPY – NIS2
Scanning Electron Microscopy:
SEM was performed in order to estimate particle size.
Clear size reduction can be seen from top row (as-received) and the lower row
(processed).
Agglomeration of ultrafine particles was evident at low magnifications of processed
powder.
Magnifications (left to right) 500x,
2kx, 15kx, 30kx
As-Is
10h
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PARTICLE SIZE & SURFACE AREA
COMPARISON
BET 0h 1h 2h 4h 6h 8h 10h
FeS2 2313 nm - 130 nm - 62 nm - -
CoS2 1165 nm 102 nm 78 nm 86 nm 150 nm 105 nm 124 nm
NiS2 1194 nm 218 nm 266 nm 150 nm 227 nm 123 nm 154 nm
BET 0h 1h 2h 4h 6h 8h 10h
FeS2 0.552 m2/g - 9.814 m2/g - 20.637 m2/g - -
CoS2 0.945 m2/g 10.854 m2/g 14.048 m2/g 12.791 m2/g 7.37 m2/g 10.474 m2/g 8.909 m2/g
NiS2 0.856 m2/g 4.698 m2/g 3.84 m2/g 6.798 m2/g 4.498 m2/g 8.325 m2/g 6.617 m2/g
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Pellet Fabrication:
Electrolyte and binding agent were
added to Nano-sized Iron Disulfide in
an argon atmosphere
Mixture processed , ground, and
sieved
After drying in vacuum, pellets were
pressed at 1000 psi (see photo)
Pellets were uniform and robust
Upon visual inspection, the Nano
Cathode pellets were darker than the
Micron Cathode pellets
PELLET FABRICATION
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SCTB TEST RESULTS
Single Cell Testing:
Comparison of SCTB test results for cells made up with standard Micron Catholyte
and with Nano Catholyte.
Each Nano Catholyte cell showed higher voltage output and longer run time.
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.00
0.50
1.00
1.50
2.00
2.50
0 500 1,000 1,500 2,000
Cu
rre
nt,
Am
ps
Vo
lta
ge
, V
olt
s
Time, Seconds
Cell 1A (Nano)
Cell 1C (Nano)
Cell 1B (Nano)
Cell 1D (Micron)
Current, Amps
G3190B2 sized pellets
Furnace = 500C
C/A = 1.85 - 1.90
Current = 0.35A
(50mA/cm2)Capacity to 1.46 Volt cutoff
Pressure 9.44 PSI
Figure 1: Comparison of SCTB test results
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SCTB TEST RESULTS
Single Cell Testing:
The average run time for Nano Catholyte cells were nearly twice that of the Micron
Catholyte cells.
Table 1: Single Cell Testing Data @ 0.35A @ 500C
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SCTB TEST RESULTS
Figure 2: Correlation of current density with cell capacity
Single Cell Testing:
An enhanced cell capacity is seen at all current densities used. At higher current
densities, the difference between Micron and Nano Catholyte cells starts to diminish.
0
50
100
150
200
250
300
0 100 200 300
Sin
gle
Ce
ll C
ap
ac
ity p
er
Gra
m o
fA
cti
ve
C
ath
od
e M
ate
rial, m
Ah
Current Density, mA/cm2
Micron Catholyte
Nano Catholyte
G3190B2 sized Pellets
Temperature: 500C
1.86 < C/A < 2.16
Capacity to 1.46V cutoff
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CONCLUSION
Conclusions:
Nano-sized Iron Disulfide particles were produced by high energy milling of Micron-
sized particles for use in Thermal Batteries.
The processing time and RPM required for the size reduction was determined, and
the particle size and purity were optimized.
Catholyte was produced with Nano-sized Iron Disulfide, and Thermal Battery
electrode pellets from this material were fabricated.
Single cell Thermal Batteries were assembled and tested with these pellets, and
they have been characterized for voltage, capacity, and rate performance.
Single cell Nano Catholyte cells have shown a significant performance
enhancement over single cell Micron Catholyte cell performance.
Future Work:
Build and test full Thermal Batteries using Nano Catholyte cells.
Investigate nanostructuring of alternative thermal battery materials.
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CONCLUSIONS
Nanoscale FeS2, CoS2, and NiS2 particles were produced via high energy milling of
Micron-sized particles for use in Thermal Batteries.
For NiS2, the particle size tended to decrease as a function of milling time up to 10h.
For CoS2, the material tended to reach its smallest size at 2h processing time and
then slightly increase after.
CoS2 tended to have smaller particle sizes as compared to NiS2
Both CoS2 and NiS2 were still larger than previous work done with FeS2
FeS2 [44 mm (325 mesh) 62 nm]
CoS2 [74 mm (200 mesh) 78 nm]
NiS2 [180 mm (80 mesh) 123 nm]
The powders’ tendency for moisture pickup and agglomeration is an issue which
appeared while characterizing the materials.
TGA results displayed a lower onset temperature for nanostructured materials than
their micron counterparts.
More significantly for FeS2 and NiS2 than CoS2.
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FUTURE WORK
Future Work:
Conduct more thorough investigation with new TGA-DSC-Mass Spectrometry
arriving Summer 2016.
Fabricate Thermal Battery electrode pellets from these nanostructured materials.
Validate CoS2 and NiS2 cathode performance through single cell testing, and
characterize them for voltage, capacity, and rate performance.
Build and test full Thermal Batteries using Nanostructured Cathode cells.
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ACKNOWLEDGEMENTS
Lauren Morris and Dr. Rajendra Sadangi
(U.S. Army ARDEC) for help with portions of
characterization and analysis.
Dr. David Swanson and Brian Wightman
(EnerSys Advanced Systems) for providing
Iron Disulfide powder.
This work was partially funded through:
Life Cycle Pilot Process (LCPP) of
Project Director for Joint Services (PD JS).
In-House Laboratory Independent Research (ILIR)
program of U.S. Army ARDEC.
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OPPORTUNITY SPACE
There are opportunities for AM & PE to impact all Army Systems
UAVs, UGVs
Individual Soldier
Protection
Repair Parts
Weapons
Components
Missiles/Munitions:
Warheads, Fuzes
Logistics
Communications
Command & Controls
Vehicles & Sub-
Systems
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Applied
Research
Technology
Development
Demo &
PrototypingTransition to
Production Systems
Surveillance
PolymersMetals Energetics
• Design
• Materials Development
- Inks, Coatings, Substrates
• Process Development
• Characterization
• Flex Hybrid Electronics
• Integration
• Manufacturing Scale-Up
• Testing
• Design
• Formulation
• Materials Development
• Characterization
• Testing
• Qual. & Cert. Support
• Design
• Powder Synthesis
• Metals 3DP
• Machining
• Mechanical Testing
• Characterization
• Post Processing
• Prototyping / Mfg
• Design
• Synthesis
• Formulation
• Characterization
• Pilot Manufacturing
• Munitions Integration
• Qualification Testing
• Integration
• Surveillance
ARDEC AM COMPETENCIES
Demilitarization
Technologies
Printed Electronics
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The M3Platform is a part of the
concepts being developed at ARDEC
looking at new and innovative
production methods to better meet
future Army needs. By combining
multiple manufacturing techniques
with direct write and additive
manufacturing capabilities, ARDEC’s
goal is to have flexible and low cost
capabilities for prototyping and
production. Just-in-Time
Manufacturing and Fab-in-the-Field
concepts are being explored.
MULTI-AXIS MULTIFUNCTIONAL MANUFACTURING
PLATFORM M3P
FDM extruder tool module Router tool moduleSyringe deposition
tool module
Camera/inspection
tool module4-point robe/inspection
tool module
Spray/encapsulant
tool module
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UNIQUE AM TECHNOLOGY
SuperScrypt
With Scan-to-print capability, the SuperScrypt can deposit on complex curves,
or build 3D shapes from scan data.
Inverse kinematics enabled 6-axis motion control allows for true 3D printing
instead of stacking 2D layers. Robust hardware allows for +/- 200nm precision.
Dubbed the SuperScrypt, this multi-technology printing
system is the only one of its kind. The systems is
based on nScrypt processing controls and software,
which are fully open for manipulation (variation of
processing parameters). This system includes:
•Line Scanning
•Thermoplastic Extrusion (up to 400)
•Thermoset Deposition
•Ink Deposition
•6-Axis Motion Control
•Tool Switching
•Pick-n-Place
To be added:
•Micro-Sprayer
•Micro-Milling
•Laser Sintering
•Aerosol Jet Deposition
•Micro Cold Spray Deposition
•Materials Hopper
•Auger
Tools can be
added as needed
Conformal
Printing
Fabricate a
functioning
device
(0 to 2,000,000cP,
with pico-liter control)
Scan-to-Print
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HYBRIDIZATION
Dissimilar materials
Conventional AMDirect WriteConformal Printing
Part Scanning
Pick and Place
Print what you can, place what you can’t !!!
Source: Zunino, Holmes, Church
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Conventional PCB - RBIS Flex Hybrid Integration ~ 60% COTS Components
Hybrid Printed Iteration – Direct
Write & Inkjet Components
Integrated with COTS
RESERVE BATTERY INITIATION SYSTEM (RBIS)
Hybrid Printed Flex RBIS < 30% COTS
Integrated Thermal Reserve
Battery with RBIS Hybrid Circuitry
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RESERVE BATTERY INITIATION SYSTEM (RBIS)
• Initial Conversion from PCB to Flex
Hybrid Designs (80mm x 80mm)
• 4 Layer Design
– 80mm x 80mm
– 1st: Silver Traces/Contact Pads
(Drop-on-Demand; Dimatix)
– 2nd: Silver Resistors (Direct Write,
nScrypt)
– 3rd: Pyralin Dielectric for Capacitor
(Direct Write, nScrypt)
– 4th: Silver Conductive Paste (Direct
Write, nScrypt)
• Interconnects to Interface with
Standard Components
• 4-Layer approach
• Minimizes traces to decrease
chance of trace impedance to
Ground.
• Smaller Form Factor
(60mm x 70mm)
• Common Interconnects to
interface with standard
Components.
• Hybrid Circuit
• Smaller Form Factor < 40mm
• Including Printed Passives
with COTS Active
Components
• Utilizes an automated Pick-n-
Place system to adhere Active
Components to Substrate.
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Giuseppe L. Di Benedetto, Ph.D.Armaments Engineering Analysis & Manufacturing Directorate
US Army ▪ ARDEC ▪ RDAR-MEA-P
973-724-1977
Thoughts