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Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair
Professor in ECE & MSEDirector, 3D Microsystems Packaging Research Center
Georgia Institute of Technology – Atlanta, GA [email protected]
System Scaling – A New Fundamental Electronics Frontier Technology
MEPTEC - November 10, 2015
Greetings fromGeorgia Tech PRC
1 | MEPTEC 2015 Prof. Rao R. Tummala
Executive Summary
System Scaling is a New Strategic Frontier
Fundamentals of System Scaling Benefits all Systems
Ultra-thin & Large Panel Glass Seems Best as System Scaling Platform
Panel Glass Superior over Si and Organic Interposers
• Over Si for cost & performance
• Over Organic for I/Os, bandwidth and warpage
Georgia Tech and its Industry Partners Demonstrated Panel Glass, Almost Ready for Mfg.
Panel Glass can be Chip-first or Chip-last Platform
System Scaling Leads to 3D System Package Architecture with TSV-like Vias at System Level
2 | MEPTEC 2015 Prof. Rao R. Tummala
Outline
1. What is System Scaling and Why?
2. Fundamentals of System Scaling
3. Applications of System Scaling:
Smartphones
Automotive Electronics
4. Georgia Tech’s Vision, Strategy and Industry Consortium in Automotive Electronics
5. Summary
3 | MEPTEC 2015 Prof. Rao R. Tummala
Outline
1. What is System Scaling and Why?
2. Fundamentals of System Scaling
3. Application to Automotive Electronics
4. Georgia Tech’s Vision, Strategy and Industry Consortium in Automotive Electronics
5. Summary
4 | MEPTEC 2015 Prof. Rao R. Tummala
What is System Scaling and Why?
1. What is System Scaling?
2. Why System Scaling?
To achieve highest performance & functional density in smallest size at lowest cost and highest reliability at system level
Logic
Memory
RF ICs
Analog
Power
Etc.
Transistor- Based System- Based
Substrates
Boards
Passive Components
Thermal
Interconnections
Batteries
5 | MEPTEC 2015 Prof. Rao R. Tummala
System Scaling Addresses Changing Electronics Landscape
Systems
Emerging trend to small to ultra-small systems with heterogeneous functionality
New era of automotive electronics, ultimate heterogeneous systems
ICs
IC integration beyond 14nm: No cost reduction
SOC split necessary in future
Device Pkg.
Bulky, costly, and low I/Os and high thickness
Trend to fanout pkg.
Systems Pkg.
Bulky, costly, and low I/Os and high thickness
No systematic roadmap approach
6 | MEPTEC 2015 Prof. Rao R. Tummala
IC and System Packaging Evolution
Panel Packaging
Wafer Packaging
Package on BoardInterposer on Package
on Board???
Systems Packaging
Plastic Ceramic Organic ???
WLP WLFO Panel Fan Out ???
7 | MEPTEC 2015 Prof. Rao R. Tummala
An example of System Scaling Need:
Smartphones
Wireless Electronics
Sensor Electronics
Camera Electronics
4G-5G RF / mm-Wave
All are Applicable to
Automotive Electronics
Digital Electronics
MEMS and Sensors
Analog Electronics
Power Electronics
8 | MEPTEC 2015 Prof. Rao R. Tummala
An Example of Large System Need:
New Era Automotive Electronics
Ultimate Heterogeneous System Scaling Opportunity
• Smartphone Electronics
Digital, RF, Power, MEMS and sensors, camera, audio and videoAnd
• High energy-density batteries
• High-power electronics
• High-frequency electronics
• High-temperature electronics
• Sensor electronics
• Radar electronics
• Laser electronics
9 | MEPTEC 2015 Prof. Rao R. Tummala
Gap in System Scaling vs.Transistor Scaling
Courtesy: S.S. Iyer, IBM
No
de d
imen
sio
n (
nm
)
100
10,000
1,000
0
bu
mp
pit
ch
(um
)
100
1,000
10
Gap
System Scaling (I/O Pitch)
Transistor Scaling (Node)
Year1970 20001980 1990 20101960 2020
10 | MEPTEC 2015 Prof. Rao R. Tummala
Outline
1. What is System Scaling and Why?
2. Fundamentals of System Scaling
3. Application to Automotive Electronics
4. Georgia Tech’s Vision, Strategy and Industry Consortium in Automotive Electronics
5. Summary
11 | MEPTEC 2015 Prof. Rao R. Tummala
Fundamentals of System Scaling
7. High Throughput
PanelMfg.
5. Balanced Fine-pitch
RDL4. Ultra-low
LossSystem
Materials
2. Ultra-shortTSV-like
Interconnects
6. High-temp & High-power
Cu-CuInterconnects
1. Ultra-thin High-temp. Low CTE
Substrates
3. High HeatTransfer
System Scaling
12 | MEPTEC 2015 Prof. Rao R. Tummala
What is System Scaling Platform?Ultra-thin Panel Glass with Ultra-fine Pitch TPV & RDL
Good Fair Poor
Ideal Properties
Materials
Glass SC Si Organic Metal CeramicPoly SiCharacteristic
Electrical
Physical
Thermal
Mechanical
Chemical
TPV and RDL Cost
Reliability
Cost/mm2
High resistivity Low loss and low k
Smooth surface finish Large area availability Ultra thin
High Conductivity
High strength & modulus Low warpage
Resistance to process chemicals
Low cost Via formation and metallization
CTE matched to Si and PWB
At 25µm I/O pitch
13 | MEPTEC 2015 Prof. Rao R. Tummala
Two Platform Approaches
Chip-Last
Chip-First
14 | MEPTEC 2015 Prof. Rao R. Tummala
Why Panel Fan Out at GT?
Challenges in Fan Out
• Cost
• Board-level reliability
• Molding compound-driven issues
Ground rules and pitch
Package thickness
Warpage
Dimensional stability
Thermal & repairability
1st Gen
Wafer Fan Out
2nd Gen
Organic Panel Fan Out
3rd Gen R&D
Inorganic Panel Fan Out
15 | MEPTEC 2015 Prof. Rao R. Tummala
Objectives of GPF GT Program
Improved Ground Rules and Pitch
Ultra-thin Without Grinding
Embedding for Low Cost Components
Chip Last (Chip Exposed) for Expensive Components
High-temp, Thermally Stable Package
Panel-scalable for Low Cost
Improved Board-level Reliability
16 | MEPTEC 2015 Prof. Rao R. Tummala
Two Approaches to Glass Panel Fan Out
Chip First for Lower Profile & Bump-less Structure without molding compound
Glass
Via Landing
17 | MEPTEC 2015 Prof. Rao R. Tummala
Chip-Last For Higher Value Chips to Prevent Die Loss
Glass Glass
* Patent Pending
uBump or bumpless Bonding
18 | MEPTEC 2015 Prof. Rao R. Tummala
Through Vias like TSVsHigh Density on Ultra-thin Large Panels Leading to Low Cost
Demonstrated >1000 TCTReliability of Cu-Filled TPVs
60
70
80
90
100
110
120
initia
l
afte
r reflo
w
332
Cyc
501
Cyc
104
4 C
yc
200
5 C
yc
Sputtered Seed Direct Metallizationof TPV in Glass by Asahi Discharge
and Corning Methods
30µm DiaTPV in 100µmThin Glassby Corning
2µm Cu Wiring
19 | MEPTEC 2015 Prof. Rao R. Tummala
Glass Panel is Almost Ready for Mfg.
Lower cost and higher performance than Si
Higher performance and Higher Bandwidth than Organic interposers
20 | MEPTEC 2015 Prof. Rao R. Tummala
Shinko & Unimicron, GT Partners Demonstrate Glass Interposer, Ready for Mfg.
配線層がZ方向へ変動し、熱膨張を吸収
Memory Logic Si Chips
Glass Interposer
Laminated Substrate
Fully Assembled Glass Interposer
Large DieSmall Die
Small Die
Small Die
Small Die
35.0mm
35
.0m
m
Wiring: 2/2µm # of 2µm Lines : 6,600/unit # of TGVs : 18,945 Die Size
‒ Large : 24 x 20mm‒ Small : 5.5 x 7.3mm
Glass Interposer Design
2µm
Line
TGV
2µm Wirings
L/S : 2µm / 2µm # of 2µm Line : 6,600/unit
Source: Shinko
21 | MEPTEC 2015 Prof. Rao R. Tummala
Glass Interposer from Glass Panel by Shinko
Shinko Panel – 250mm x 250mm
22 | MEPTEC 2015 Prof. Rao R. Tummala
Component Scaling to Nanoscale @ GT PRC
Antennas
EMI Shields
PowerInductors & Capacitors
WirelessPower
Filters andDiplexers
Batteries
System Scaling to Nanoscale @GT PRC
23 | MEPTEC 2015 Prof. Rao R. Tummala
GT PRC Industry Consortia
24 | MEPTEC 2015 Prof. Rao R. Tummala
Outline
1. What is System Scaling and Why?
2. Fundamentals of System Scaling
3. Application to Automotive Electronics
4. Georgia Tech’s Vision, Strategy and Industry Consortium in Automotive Electronics
5. Summary
25 | MEPTEC 2015 Prof. Rao R. Tummala
New Era of Automotive Electronics
Market: 80M Cars x $10K
Ultimate System Scaling Opportunity
• Smartphone Electronics
Digital, RF, Power, MEMS and sensors, camera, audio and video
• Automotive Electronics
High-density batteries
High power electronics
High-temperature electronics
Sensor electronics
Radar electronics
Laser Electronics
Photonics
26 | MEPTEC 2015 Prof. Rao R. Tummala
Higher Levels of Driving Automation call for
an Increasing Number of Sensors
Source: Infineon
27 | MEPTEC 2015 Prof. Rao R. Tummala
Semiconductor Enables Innovation to Achieve the
Necessary Function as well as the Required Cost
Source: Infineon
28 | MEPTEC 2015 Prof. Rao R. Tummala
System Cost for Radar Have Been Significantly
Reduced with Innovative Packaging and SiGe/CMOS
Source: Infineon
29 | MEPTEC 2015 Prof. Rao R. Tummala
Outline
1. What is System Scaling and Why?
2. Fundamentals of System Scaling
3. Application to Automotive Electronics
4. Georgia Tech’s Vision, Strategy and Industry Consortium in Automotive Electronics
5. Summary
30 | MEPTEC 2015 Prof. Rao R. Tummala
GTAE StrategyAutonomous Driving
Electric Vehicles
Infotaiment(Apple CarPlay, Android)
Integrated functions
o Phone, music, maps,
messages, email
Major manufacturers committed to CarPlay
Connectivity and Safety
Dedicated short-range communications
(DSRC)
V2V and V2I
communications
31 | MEPTEC 2015 Prof. Rao R. Tummala
Core Technologies of GTAE @GT
Design
Materials
Processes
I&A
Components
Devices
32 | MEPTEC 2015 Prof. Rao R. Tummala
GTAE System Integration Strategy
C&C Modules
Sensor Modules
GaN and Sic Power Modules
System Reliability and Test
Mixed Function
Integration
High-temp Modules
33 | MEPTEC 2015 Prof. Rao R. Tummala
Large-scale Industry Collaboration
Academic Faculty
Research Faculty
Graduate Students
Industry Partners
• On-campus Engineers
• Supply Chain• Manufacturers• Supply tools• Users
State-of-the-Art
Laboratories
Admin, Financial & Facilities
Maintenance
34 | MEPTEC 2015 Prof. Rao R. Tummala
Graduate Students
Research Faculty
GT Faculty Expertise in GTAE
Academic Faculty
Admin, Financial & Facilities
Maintenance
Industry Partners
• On-campus Engineers
• Supply Chain• Developers• Users• Manufacturers
State-of-the-Art
Laboratories
Prof. AntoniouMaterials
Prof. BrandMEMS & Sensors
Dr. CasinoviMEMS & Sensors
Prof. TummalaSystem Integration
Prof. WolterMEMS & Sensors
Prof. WongMaterials
Prof. SaeedifardReliability
Prof. ShenDevices
Prof. SitaramanMechanical Design
Prof. GrahamThermal
Prof. HeskethSensors
Prof. JoshiThermal
Prof. LeamyReliability
Prof. OugazzadenMEMS & Sensors
Prof. ChangOptical
Prof. CresslerDevices
Prof. DivanPower
Prof. DupuisDevices
Prof. SwaminathanRF
35 | MEPTEC 2015 Prof. Rao R. Tummala
Computing & Communication ElectronicsC1:Digital
Lowest power per unit of bandwidth
3D Glass Interposer Package
2.5D Glass Interposer Pkg
C2:PhotonicLow power, low loss optical
Minioptical
transceiver module
30 um
Low loss optical via
in glass
C3: mm-wave5G & RADAR Glass Module
Ring Resonators
for mm-wave
Low loss up to 50GHz & Beyond
C4: RFMulti-band 3D Packages
LTE modulewith High Q
passives
Board-level reliability
C5: IPDsEMI filters, built-in ESD
30um Thin Glass Panel Interposer
Ultra-Thin Low Loss Diplexers
C6: ShieldingIntegrated internal/external
Nano-Magnetic Ultra-Thin Shields
36 | MEPTEC 2015 Prof. Rao R. Tummala
Sensing Electronics
S4: 3D Glass Package for Image Sensors
S1: Miniaturized wireless sensor interface S2: 3D Sensor Array Packaging
S3: Vibration Sensing, Monitoring
37 | MEPTEC 2015 Prof. Rao R. Tummala
High-temperature Electronics
T1. High-temp/High-power Inductors & Capacitors
Capacitors and inductors and their integration in 3D IPDs to
handle 1 W/mm3 power at 200-250 C
T3. High-temp & High-power Interconnections
High-temp Cu interconnections; porous copper layers for low-
temp all-Cu interconnections
T4. High-Temperature Substrates
High-temperature substrates with glass core, build-up layers
and Cu interconnections
T2. High-temp Encapsulants & Mold Compounds
Meet thermal,
mechanical, electrical,
and humidity
requirements;
compatible with standard
molding manufacturing
infrastructure
38 | MEPTEC 2015 Prof. Rao R. Tummala
High-power Electronics
P1: 3D Integrated Gate Driver Glass Package
Drivers and condition monitoring actives and passives integrated
on ultra-thin, high-density, high-temperature glass substrates
P2: Integrated Power Module (1-100kW)
Integrated power and microelectronics, low pkg inductance,
CTE-matched pkg, modular design, integrated cooling
P3:Self-Contained Liquid-cooled ModuleHAADFimage(white=Cu,Black=Carbon)
Local heat spreading from individual sources, heat dissipation at
module level with module co-design for thermal management
P4: Reliability Monitoring of Smart Power Modules
Reliability of high-temp., WBG fully-integrated power modules:
failure modes, reliability testing, and monitoring
39 | MEPTEC 2015 Prof. Rao R. Tummala
Outline
1. What is System Scaling and Why?
2. Fundamentals of System Scaling
3. Application to Automotive Electronics
4. Georgia Tech’s Vision, Strategy and Industry Consortium in Automotive Electronics
5. Summary
40 | MEPTEC 2015 Prof. Rao R. Tummala
Summary
System components and integration are fundamental barriers to all heterogeneous systems including small and automotive electronic systems
Georgia Tech sees a need for
• Systematic system scaling approach like ITRS
• With a System Scaling 3D architecture
Georgia Tech proposes system scaling to develop and integrate heterogeneous system functions: digital, RF, mm-wave, sensors, radar, laser and power components
It proposes 3D system package architecture with fine-pitch small TPVs for signal and large vias for power
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair
Professor in ECE & MSEDirector, 3D Microsystems Packaging Research Center
Georgia Institute of Technology – Atlanta, GA [email protected]
Thank [email protected]
+1 404 894-9097