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B.C. Hein, assignor to Henkel Corp.,Plymouth Meeting, Pa.
In a process comprising operatinga continuous solvent extractioncircuit wherein an aqueous metalcontaining solution is contacted inan extraction stage with an organic phase of a water-immiscibleorganic diluent having dissolvedtherein an extractant for themetal, and the aqueous phase isseparated from the organic phaseproviding an aqueous effluentcontaining entrained organicphase, the improvement whereinthe extractant in the entrainedorganic phase comprised of extractant and water-immiscible organic diluent is recovered fromthe aqueous effluent exiting thecontinuous solvent extraction circuit, by the method comprisingthe steps of contacting the effluent with the same diluent employed in the extraction stage ofthe circuit for a time sufficient toallow the extractant in the entrained organic containing extractant to dissolve in the diluent; andseparating the effluent from thediluent, now containing an increased level of extractant; andwherein the extractant is selectedfrom the group consisting of orthophenolic oximes; primary, secondary, and tertiary amines; quaternary ammonium compoundssubstituted guanidines; phosphine oxides; esters ofphosphoric,phosphonic, and phosphinic acids;aliphatic carboxylic acids and esters; sulfonic acids; and esters ofpyridine carboxylic esters; andthe diluent is a water-immiscibleliquid solvent capable of dissolving the extractant and the associated complex of extractant andextracted solute, selected fromthe group consisting of toluene,xylene, ethylene dichloride, andkerosene.
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u.s. Patent 5,879,564. Mar. 9, 1999R. Farinato, assignor to CytecTechnoLogy Corp., Stamford, Conn.
A method of dewatering a dispersion of suspended solids, comprising adding to the dispersion aneffective amount of a cationic, water-soluble, or water-swellablepolymer to form a mixture of thedispersion and the polymer,wherein the polymer has a bulkviscosity to standard viscosity ratio of 300 to 500, a sedimentationvalue of 10% or less, and containsrecurring (methlacrylamide unitsand recurring diallyldimethylammonium chloride, dialkylaminoalky1(alklacrylate, or dialkylaminoalkyHalklacrylamide units; anddewatering the mixture.
MULnLAYIR PRINTED CIRCUITBOARD FOR WIRE BONDINGU.S. Patent 5,879,568. Mar. 9, 1999N. Urasaki et aL., assignors toHitachi Ltd., Tokyo
A process for producing a multilayer printed circuit board comprising compounding electricallyinsulating ceramic whiskers in athermosetting resin varnish, dispersing the whiskers in the varnish uniformly by stirring, coating the resulting mixture on aroughened side of a copper foil,semicuring the resin by heating toform a thermosetting resin layer,placing this layer on an interlayercircuit board in which platedthrough-holes and conductor circuits have been formed, and hot
pressing them to form an integrallaminate; forming an etching resist on the copper foil, and etchingthe copper foil portions exposedfrom the etching resist into theshape of holes for forming interstitial via holes; removing theetching resist; applying laserbeams to the cured thermosettingresin layer exposed from the fineholes of the copper foil etched intothe shape of holes for forming interstitial via holes to remove theresin layer to an extent that thecircuit conductors of the interlayer board are to be exposed,thereby forming via holes; roughening the cured thermosettingresin layer on the walls of said viaholes by using a roughening
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December 1999 77