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2016-05-12 1
2016-05-12
High Power Infrared Emitter (850 nm)
Version 1.5
SFH 4235
Ordering Information
Features:
• IR lightsource with high efficiency
• Double Stack emitter
• Low thermal resistance (Max. 9 K/W)
• Centroid wavelength 850 nm
• Superior Corrosion Robustness (see chapter package outlines)
• The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification
for Automotive Grade Discrete Semiconductors.
Applications
• Infrared Illumination for cameras
• Surveillance systems
• Machine vision systems
Notes
Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which
can be hazardous to the human eye. Products which incorporate these devices have to follow the safety
precautions given in IEC 60825-1 and IEC 62471.
Type: Total Radiant Flux Ordering Code
Φe [mW]
IF = 1A, tp = 10 ms
SFH 4235 950 (≥630) Q65110A8900
Note: Measured with integrating sphere.
2016-05-12 2
Version 1.5 SFH 4235
Maximum Ratings (TA = 25 °C)
Characteristics (TA = 25 °C)
Parameter Symbol Values Unit
Operation and storage temperature range Top; Tstg -40 ... 125 °C
Junction temperature Tj 145 °C
Reverse voltage VR 1 V
Forward current IF 1000 mA
Surge current
(tp ≤ 200 µs, D = 0)
IFSM 5 A
Power consumption Ptot 3400 mW
ESD withstand voltage
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD 2 kV
Thermal resistance junction - soldering point RthJS 9 K / W
Parameter Symbol Values Unit
Peak wavelength
(IF = 1 A, tp = 10 ms)
(typ) λpeak 860 nm
Centroid wavelength
(IF = 1 A, tp = 10 ms)
(typ) λcentroid 850 nm
Spectral bandwidth at 50% of Imax
(IF = 1 A, tp = 10 ms)
(typ) ∆λ 30 nm
Half angle (typ) ϕ ± 60 °
Dimensions of active chip area (typ) L x W 1 x 1 mm x
mm
Rise and fall times of Ie ( 10% and 90% of Ie max)
(IF = 5 A, RL = 50 Ω)
(typ) tr / tf 7 / 14 ns
Forward voltage
(IF = 1 A, tp = 100 µs)
(typ (max)) VF 3 (≤ 3.4) V
Forward voltage
(IF = 5 A, tp = 100 µs)
(typ (max)) VF 3.5 (≤ 4.5) V
Radiant intensity
(IF = 1 A, tp = 100 µs)
Ie, typ 320 mW/sr
Temperature coefficient of Ie or Φe
(IF = 1 A, tp = 10 ms)
(typ) TCI -0.3 % / K
Temperature coefficient of VF
(IF = 1 A, tp = 10 ms)
(typ) TCV -2 mV / K
Temperature coefficient of wavelength
(IF = 1 A, tp = 10 ms)
(typ) TCλ,
centroid
0.3 nm / K
Version 1.5 SFH 4235
2016-05-12 3
Grouping (TA = 25 °C)
Group Min Total Radiant Flux Max Total Radiant Flux
IF = 1A, tp = 10 ms IF = 1A, tp = 10 ms
Φe min [mW] Φe max [mW]
SFH4235 - EA 630 1000
SFH4235 - EB 800 1250
Note: Measured with integrating sphere.
Only one group in one package unit ( variation lower 1.6:1)
Relative Spectral Emission 1) page 12
Irel = f(λ), TA = 25°CRelative Total Radiant Flux 1) page 12
Φe / Φe (1 A) = f(IF), TA = 25°C, Single pulse, tp= 100μs
7000
nm
%
OHF04132
20
40
60
80
100
950750 800 850
Irel
λ
OHF04187
IF
A10-15 10 05 10 1
110
-210
-310
5
10
10
5
-1
5
0
e
Φ(1 A)Φ
e
10-2
2016-05-12 4
Version 1.5 SFH 4235
Max. Permissible Forward Current
IF = f(TS), RthJS = 9 K/WForward Current 1) page 12
IF = f(VF), single pulse, tp = 100 µs, TA= 25°C
Permissible Pulse Handling Capability
IF = f(tp), TS = 85 °C, duty cycle D = parameter
00
FI
TS
OHF041901.1
0.1
0.2
0.4
0.3
0.5
0.7
0.6
0.8
0.9
A
13010060 80 ˚C20 40
OHF04188
FI
V
A
2
FV
10-1
5
100
5
101
10-2
2.5 3 3.5 4
-5
FIA
tp
s
OHF04189
-410 -310 -210 -110 010 110 21010
Pt=D TT
tP
IF
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.5
0.5
0.20.33
0.1
0.020.05
D =
0.010.005
1
Version 1.5 SFH 4235
2016-05-12 5
Radiation Characteristics 1) page 12
Irel = f(ϕ), TA= 25°C
Package Outline
Dimensions in mm (inch).
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚ OHL01660
50˚
60˚
70˚
80˚
90˚
100˚0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
2016-05-12 6
Version 1.5 SFH 4235
Note:
Corrosion robustness better than EN 60068-2-60 (method 4): with enhanced corrosion test: 40°C / 90%rh / 15ppm H2S / 336h
Type:
SFH 4235
Package
Platinum Dragon
Approximate Weight:
0.2 g
Note:
Cathode mark an the bottom side.
Recommended Solder Pad
Dimensions in mm (inch).
Attention
Anode and Heatsink are electrically connected
Solder resist
Freies KupferBare Copper
Lötpasten SchabloneSolder paste stencil
Lötstopplack
OHAY0681
0.3
(0.0
12)
KupferCopper
1.6 (0.063)
11.6 (0.457)
12.0 (0.472)
2.3
(0.0
91)
2.3
(0.0
91)
10 (0
.394
)
1.6 (0.063)
11.6 (0.457)
3 Lötstellen3 solder points
Thermal enhanced PCBThermisch optimiertes PCB
ø4.0 (0.157)Heatsink attachø4.0 (0.157)
ø2.5 (0.098)
Version 1.5 SFH 4235
2016-05-12 7
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
OHA04612
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*)
25 °C to 150 °C2 3 K/s
Time tS TSmin to TSmax
tS
tL
tP
TL
TP
100 12060
10 20 30
80 100
217
2 3
245 260
3 6
Time25 °C to TP
Time within 5 °C of the specified peaktemperature TP - 5 K
Ramp-down rate*TP to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
Peak temperature
Time above liquidus temperature
Symbol
Symbol
Unit
Einheit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480
2016-05-12 8
Version 1.5 SFH 4235
Taping
Dimensions in mm (inch).
Tape and Reel
24 mm tape with 800 pcs. on ∅ 180 mm reel
OHAY0508
1.55 (0.061) 2 (0.079)
4 (0.157)
6.35 (0.250)
8 (0.315)
1.75
(0.0
69)
11.5
(0.4
53)
12.4
(0.4
88)
24 (0
.945
)
0.3 (0.012)
0.3 (0.012)
1.9 (0.075)
7.35
(0.2
89)
Cathode/Collector Side
D0
2P
P0
1P
WFE
Direction of unreeling
N
W1
2W
A
OHAY0324
Label
Leader:Trailer:
13.0
Direction of unreeling
±0.2
5
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Version 1.5 SFH 4235
2016-05-12 9
Tape dimensions [mm]Tape dimensions in mm
Reel dimensions [mm]Reel dimensions in mm
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
W P0 P1 P2 D0 E F
24 + 0.3 / - 0.1 4 ± 0.1 8 ± 0.1
or
12 ± 0.1
2 ± 0.1 1.5 ± 0.1 1.75 ± 0.1 11.5 ± 0.05
A W Nmin W1 W2max
180 24 60 / 100 24.4 + 2 30.4
OHA04563
(G) GROUP:
1234567890(1T) LOT NO: (9D) D/C: 1234
(X) PROD NO: 123456789
(6P) BATCH NO: 1234567890
LX XXXX
RoHS Compliant
BIN1: XX-XX-X-XXX-X
MLX
Temp STXXX °C X
Pack: RXX
DEMY XXX
X_X123_1234.1234 X
9999(Q)QTY:
SemiconductorsOSRAM Opto
XX-XX-X-X
EXAMPLE
X_X123_1234.1234 XX_X123_1234.1234 X
EXAMPLE
EXAMPLE
EXAMPLE
XXXXXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-XXX-XX-X-X
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
XXXXXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-XXX-XX-X-X
EXAMPLE
Pack: RXX
XXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-X
EXAMPLE
Pack: RXXPack: RXX
DEMY DEMY
EXAMPLE
12341234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:(9D) D/C: 12341234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
12341234
EXAMPLE
Pack: RXXPack: RXX
DEMY
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:(9D) D/C:
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C: 1234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
12345678901234567890EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(6P) BATCH NO:(6P) BATCH NO: 12345678901234567890
SemiconductorsSemiconductors
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(6P) BATCH NO:(6P) BATCH NO: 12345678901234567890EXAMPLE
SemiconductorsSemiconductorsOSRAM OptoOSRAM Opto
EXAMPLE
EXAMPLE
1234567890
X_X123_1234.1234 X
Pack: RXX
DEMY
X_X123_1234.1234 X
(9D) D/C: 1234(9D) D/C:
1234567890(6P) BATCH NO: 1234567890
OSRAM Opto
XXX
X_X123_1234.1234 X
XX-XX-X-X
Pack: RXX
DEMY
Semiconductors
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
2016-05-12 10
Version 1.5 SFH 4235
Transportation Packing and Materials
Dimensions of transportation box in mm
Width Length Height
195 ± 5 195 ± 5 42 ± 5
OHA02044
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Barcode label
Version 1.5 SFH 4235
2016-05-12 11
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2016-05-12 12
Version 1.5 SFH 4235
Glossary
1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2016-05-12 13
Version 1.5 SFH 4235
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
