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HOTFLOW 3: Best in Class ReflowBest Process Control, Highest Throughput, Highest Machine Availability & Optimized Energy Balance
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VISION & MISSION
Print & AOI Reflow
Wave
Our competitive lead in technology optimizes quality, costs and delivery service in our customers‘ production process.
Our Vision
Our Mission
Handling Systems
Periphery Systems
We develop and produce high quality machines and systems for the
production of electronics.
We offer services and complete solutions designed to optimize our
customers‘ production processes.
We think globally and act locally.
As a company with tradition, we strive for long-term relationships with our
customers, partners and employees.
Our core focus is to business areas where we can prove to be
“Best in Class” as compared to third parties.
We strive for above average economic success in order to guarantee the
continuing development and innovative strength of our company.
SMD
THT
3
Touch up
Rework
Selective
Inspection
Now responsible for 100 % of the process related
steps in the SMT line, as well as the majority of
steps which follow the line, ERSA is re-defining
the role of a strategic supplier.
The name ERSA has been synonymous with
soldering for over 8 decades. We have maintained
a strategic commitment to keep all aspects of
the electronic PCB manufacturing process at the
forefront of our Research & Development.
A revolutionary print solution with integrated post
print AOI; Best in Class reflow, selective and wave
soldering machines; handling & periphery systems;
BGA optical inspection; patented rework & repair
systems including a completely new Hybrid heating
technology and innovative hand soldering tools for
touch up –
All from One Source!
Your SMT Process – Our Responsibility!BEST in ClASS Reflow Technology
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Value added reflOw TechNOlOgy
BEST in CLASS Heat Transfer
BEST in CLASS Throughput
BEST in CLASS Cross Sectional ∆T
BEST in CLASS Oven Stability
BEST in CLASS Process Control
BEST in CLASS Energy Balance
BEST in CLASS Energy Consumption
BEST in CLASS Machine Availability
BEST in CLASS Serviceability
ERSA HOTFLOW 3BEST in ClASS Reflow Technology
With the lead free implementation now behind most
of us, today’s concerns in the PCB manufacturing
industry are moving in a very exciting direction.
Market demands are forcing the OEM and EMS global
players to look beyond the soldering process alone in
order to optimize the manufacturing process from a
total economic efficiency standpoint.
Maintaining the competitive edge will go to those stra-
tegic manufacturers who maximize production output
per m² of floor space, who minimize the defect rate
and minimize the total cost of production per PCB:
better said, who maximize the total profit per PCB.
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ERSA is one of the world’s leading suppliers of quality
machines and equipment for the highly competitive
PCB manufacturing industry.
We have made one of our customer’s main production
challenges our own:
guaranteeing the highest productivity with the
lowest manufacturing cost.
It was precisely for this reason that ERSA invested in
a new reflow machine concept which places the reflow
process safety, throughput and running costs at the
forefront of the R & D.
The days of investing in just any reflow oven that
has the number of heating zones required are over.
Today, the economical aspects and true performance
of the oven must play a major role in the decision
making process. Only via a Total Cost of Ownership
analysis is it possible to determine the economic
efficiency of a machine with respect to profitability.
The completely re-engineered HOTFlOW series of
reflow ovens from ERSA have been designed to
deliver the BEST in CLASS results for All AREAS
that ultimately affect the bottom line profit per PCB.
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Newly designed nozzle system
Improved heat transfer with
high density multijets
Best in Class Heat Transfer with Best in Class ∆T
In a reflow oven, the efficiency of the heat transfer
has a primary effect on all aspects of quality, pro-
ductivity and running costs which directly influence
profitability. Best in Class heat transfer guarantees a
minimum ∆T which translates into maximum profile
flexibility.
The proven ERSA Multijet heating technology has
been re-designed and improved to achieve a com-
pletely new level of reflow performance. A value
added and measurable result of this innovative
heating technology is one of the smallest machine
cross sectional ∆T of ANY reflow oven in the world
while consuming less energy as is required by some
competitive heating technologies.
Cross sectional ∆T below 1 °C!
FR4 Test board: 1.6 mm thick; 500 x 350 mm
Cross section ∆T:
± 0.75 °C
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MulTIjeTS
Revolutionary ERSA Process Control – EPC
The heating process in a reflow oven is designed to
transfer heat to the PCB in order to bring All com-
ponents and materials into a prescribed temperature
process window. The actual temperature of the PCB
during the process is the result of the heat transfer
rate to the PCB. Two factors affect heat transfer in a
reflow oven: the temperature of the air and the ve-
locity of the air. Closed loop temperature control in a
reflow oven is a state of the art requirement, but one
that only shows part of the picture.
For the first time in the history of reflow technology,
the ERSA HOTFlOW series uses the revolutionary
ERSA Process Control (EPC) heat transfer process
control system to monitor not only the temperature
of the air but also the air velocity. In this manner, the
system regularly monitors the actual reflow process
by monitoring the rate of heat transfer.
The bottom line result is the most stabile reflow tech-
nology which optimizes heat transfer in the process
tunnel independent of the load, thermal mass and
running time of the machine.
EPC (patent pending) opens the door to a completely
new level of improved reflow process control.
ERSA Process Control EPC
Heat transfer control system
of air temp. & velocity
Multijet Heating Cassette TechnologyBest Coefficient of Heat Transfer with smallest ∆T on the market
Main-PLC EPC-PLC
Reflow-Oven
Zone 1 Zone 2 Zone n Zone n+1
Valve
ThermocouplesVisualization
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Best in Class Process Stability under all load
conditions & between machines
The most efficient reflow heating system allows for
the most flexibility in the loading conditions. The
improved Multijet heating technology requires almost
no distance between PCBs regardless of type, size
and mass. The HOTFlOW series oven guarantees
absolute process stability when running at “Board
on Board” maximum capacity. Intermittent and/or
continual loading does not affect the long term pro-
cess stability of the machine even in a “24/7” 3 shift
production environment. Finally, ERSA offers “Copy
Exact” machines meaning that all machines have
similar process & temperature stability. It is normally
not necessary to re-profile an ERSA oven when a
product is moved from one machine to another.
Improved Reflow Process Tunnel
Hermetically sealed process tunnel
guarantees long term stability
Highest Quality, long life sealing materials
guarantees optimal energy balance & process stability
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Best in Class Energy Balance with lowest energy
& nitrogen consumption
The most efficient heat transfer system requires
the least amount of energy for running the heating
elements and blower motors. The newly designed
Multijet technology in combination with “intelligently”
regulated, low energy blower motors, allows for the
minimum energy consumption requirement while
guaranteeing the maximum process stability. Highest
quality insulation materials keep the heat energy in
the process tunnel and avoids heat radiation into the
environment around the machine.
Optimized Reflow Process TunnelBest in Class Process Stability under all load conditions
Low energy, long life blower motors
“Intelligent” control guarantees
lowest energy consumption
ERSAsoft machine software
monitors & records oven stability
PrOceSS TuNNel
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“Power Cool”
Advanced Active Cooling Technology
The demands on an efficient cooling system in a
reflow oven are higher than often expected. In the
first instance, the cooling gradient plays an important
role in determining solder joint stability. For lead free
applications, JEDEC recommends a cooling gradient
between 2 to 6° C/sec in order to achieve an optimal
solder joint microstructure and in order to prevent
component damage. In addition to joint integrity, one
major demand on cooling has to due with the exit
temperature of the PCB for further handling. Post
reflow AOI systems require the PCB to be near room
temperature. Unwanted fluctuations in the exit tem-
perature of the PCB surface can result in unwanted
false calls.
Maximum Flexibility by Cooling
Cooling gradient can be set at fast or slow
Advanced Active Cooling
Top & bottom side cooling
available on demand
Slow Cool: -2,5 °C/sec
Fast Cool: -5 °C/sec
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cOOlINg
ERSAsoft Machine Software
allows for easy programming
of cooling variations
“POWER COOL” Active Cooling TechnologyBest in Class Cooling – PCB exits “Cool to Touch”!
Best in Class Active Cooling
with Best in Class Zone Separation
The newly designed “Power Cool” system offers
additional cooling capabilities. If desired, it is even
possible to achieve a cooling gradient as high as
10° C/sec! PCB exit temperatures BElOW 40 °C
are now possible for high volume applications.
This translates into DIRECT SAVINGS: no space
and invest requirements for additional cooling and
a significant decrease in the AOI false calls.
Additionally, the closed loop temperature controlled
cooling with optional “controlled zone separation”
allows for maximum profile flexibility with respect to
the desired preheat gradient.
Maximum Flexibility by Cooling
Cooling gradient can be set at fast or slow
Improved Accessibility for Servicing
Rapid maintenance of cooling system
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Multiple Track Capability
The running demands on a reflow oven and the
calculated ROI depend on the expected utilization
requirements. Strictly from a profit per PCB stand-
point, it is the highest volume “24/7” applications
which put the most demands on a reflow system and
which push the ROI calculation to the limit.
As a German manufacturer, it remains our primary
focus to offer top quality and highly innovative ma-
chine technology which adds measurable value to
our customer’s PCB manufacturing process. For this
reason, the R&D behind the new HOTFlOW series
was designed to offer the fastest ROI under the most
demanding production conditions.
Multiple Track ovens for multiple Placer lines.
Dual, triple and quad transport
machines available
Multiple Tracks can be set
for different PCB widths
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Revolutionary Multiple Track CapacityBest in Class Productivity with Highest Throughput
Best in Class Machine Output/m² of Floor Space
Defining our primary customer target group as hav-
ing the most challenging demands, ERSA engineers
realized that multiple track capability represents the
future for high volume reflow.
Multitrack reflow also opens the door to new SMT
line planning as multiple SMT placer lines can be
funnelled into one reflow oven. It must be said here,
however, that only a highly efficient and utterly sta-
bile heating technology is a necessity when consid-
ering dual or multiple track transport. A lower quality,
single track reflow oven that cannot run a stable
3 shift operation at “board on board” fully loaded
capacity will most probably not be able to handle the
increased thermal load of additional tracks in the
reflow machine. The additional thermal load of the
tracks will push an inefficient system over the edge
of its thermal recovery capacity.
The ERSA heating technology has been successfully
running high volume, dual track reflow applications
for several years. This allows us to put even more
multiple tracks into the process tunnel WITHOUT
decreasing the efficiency and stability of the heat
transfer – even at “board on board” fully loaded
capacity.
A true pioneer in dual track reflow, ERSA is now
proud to announce the new HOTFlOW’s expanded
multiple track capabilities which can increase
productivity as much as 400 %.
Different products can be run at different board
widths and at different speeds offering not only the
highest reflow output/m² of floor space but also of-
fering the greatest flexibility.
Multiple Transport Tracks can be set
at different product speeds for
maximum flexibility
TraNSPOrT
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Best in Class Flux Management
keeps the PCB & oven clean
Keeping the oven clean from flux residues, remains
to be a major concern during a reflow process.
Unwanted particles “raining” down on the PCB in a
“dirty” machine leads to undesired quality problems
and add-on costs for inspection and cleaning.
ERSA’s proven multistage flux management system
has been completely re-designed to offer new DUAl
capability. The two independent systems can run
either separately or side by side depending on the
application and can now offer increased machine
availability. “On the Fly” means that the machine
continues to run - it is no longer required to stop
production in order to clean and maintain the flux
management system.
The HOTFlOW Maintenance “On the Fly” saves this
downtime which translates into NO lOST PROFITS!
Dual Flux Management System
can be run combined or separate
for “On the Fly” maintenance
ERSAsoft Machine Software
affords user friendly
gas purification settings
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fluX MaNageMeNT
Maintenance “On the fly”Best in Class Machine Availability
“On the Fly” Maintenance System
Machine continues to run
during cleaning
More and more, the ROI (Return of Invest) and TCO
(Total Cost of Ownership) analysis are playing an
important role in the decision making process for
the purchase of manufacturing equipment. While
the ROI and TCO aspects must be considered, they
do not cover one potentially significant factor - lost
Profitability.
Downtime for maintenance, servicing and cleaning
of the machine results in a production stop. When
a machine is not running than it cannot be making
money.
The HOTFLOW series is designed for maximum
machine availability and thus minimize lost profits.
Improved Accessibility for Servicing
Rapid maintenance of flux management system
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The HOTFlOW has been engineered to offer
Advanced Serviceability. This means that all main
parts can be changed and/or removed for main-
tenance purposes in less than 15 minutes. “Quick
Change” heating and cooling cassettes can be
removed by hand in seconds without any additional
tools required.
Offering best in class machine availability must be
one of the primary goals for an innovative production
machine Made in Germany. Minimizing downtime
leads to maximizing profits – it’s just that simple!
All Heating & Cooling Cassettes
can be removed in seconds
for rapid cleaning
“Quick disconnect” Maintenance Design
decreases service downtime
Advanced Serviceabilityfor Minimum Downtime
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SerVIce & ParTS
Hardened Transport Profile
Maintains linear stability
over its entire length
“Quick disconnect” Maintenance Design
decreases service downtime
New Ultra Low Mass Center Support
Precision support even for flex prints
long term process stability puts high demands on a
reflow machine’s transport and center support sys-
tems. Although a transport system is required to move
the PCB through the process tunnel, in theory the
transport should be “thermally invisible” so that it does
not adversely affect the PCB heating process. The low
mass transport profile assembly in the HOTFlOW is
of highly stable construction. The special material was
chosen for its precise CTE (Coefficient of Thermal
Expansion) and long life and thus guarantees a highly
stable working condition.
The HOTFlOW conveyor chain is of the highest quality
and is 100 % vibration free. A small radius at the chain
in-feed section ensures safe handling of even short
PCB‘s. The automatic chain lubrication option is pro-
grammable & guarantees smooth running and longest
life. lower condensation, lower energy costs, higher
stability and longer life of the conveyor are the measur-
able customer benefits of this added value technology.
The HOTFlOW uses a new technology which of-
fers many advantages – mechanical stability, low
mass for reduced shadow effect and minimum space
requirement. The ultra low mass center support
(German utility patent granted) offers continuous
support especially for very thin PCB substrates and
guarantees linear precision over the entire length of
the oven. The specially designed supports automati-
cally fold down flat to allow for bottom side Multijets
to remain as close as possible to PCB.
Ultra low massPCB Center SupportMaintains linear Stability
Highest Quality Transport Conveyorlong Term Process Stability
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The AutoProfiler is an ERSA specific software tool
that tremendously reduces the time required to find
the right profile. A comprehensive library has been
created which documents the precise thermal
behaviour of how typical components heat in an
ERSA HOTFlOW oven. In this manner, it is possible
to create a “virtual PCB” and send it through a
“virtual oven” - all off line. The success rate for the
first trial run on the actual machine is over 90 %,
thereby reducing the downtime of the machine for
profiling by as much as 1 hour per profile. Maximum
machine availability is the value added benefit of
this unique software package.
ERSA AutoProfiler with Library
Off line profiling saves time
& moneyERSA AutoProfilerOff line Profiling increases Productivity
A “Virtual PCB” is created and sent through
the “Vir tual oven” – first run success > 90 %
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SOfTware
The advantages of using nitrogen for soldering are
clear, however, the cost of nitrogen must be kept
to a minimum. The new HOTFlOW process tunnel
is hermetically sealed, pressure tested and every
tunnel receives an official certification guaranteeing
a gas-proof seal. The highest quality sealing and
gasket materials offer the longest life and yet can be
changed very rapidly. Most important is that they are
dependable – meaning they will not break before the
expected time to change.
Additionally, an improved nitrogen measurement and
control system now includes a N2 consumption moni-
tor with display and alarm function. Finally, the highly
efficient multijets technology guarantees the most
efficient flow of hot air and hot gas which translates
into the lowest consumption of nitrogen.
The user friendly machine software platform includes
a new Process Control Software, a Process Data
Recorder and the ERSA AutoProfiler for rapid offline
profiling. The design goals behind this advanced ma-
chine software package include the simplest possi-
ble operation of the machine, total process monitor-
ing and visualization, reduction in the time required
for configuring parameters and searching for profiles,
complete process and data management as well
as documentation and archiving of all process and
machine relevant information for traceability.
Residual O2 & N2 Monitoring System
Displays actual consumption
of nitrogen
Nitrogen Controlwith N2 Consumption Display
Machine SoftwareProcess Visualization & Data Management
ERSAsoft allows for total process
monitoring & visualization
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The ERSA Sensor Shuttle PTP® is an ideal & flexible
instrument for evaluating and monitoring processes.
When it comes to measuring temperature, speed and
evaluating solder wetting profiles, this system can be
used in any mass soldering process including reflow,
wave and selective soldering. The system lets the
user monitor the processes online and evaluate the
reported parameters in real-time.
The wireless data transmission uses Bluetooth tech-
nology which makes the ERSA Sensor Shuttle PTP®
especially easy and convenient to use. The system is
equipped with 8 measurement channels that can be
connected to commercially available Ni/CrNi thermo-
couples.
Integrated Bluetooth wireless module;
Data transmission and display
in real-time
8 channel recorder with 12 bit resolution;
Power management with Li-Io battery
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TeMPeraTure recOrdINg
ERSA Sensor Shuttle PTP®
Professional Temperature Measuring System
The appropriate measurement boards fulfilling the
various requirements are available for all solder-
ing processes. If measurements are performed on
actual PCBs in a reflow system, a flexible transport
carrier is provided for conveying the Shuttle system.
This carrier is easily adapted to the transport width
required by the reflow oven.
The ERSA Sensor Shuttle Software PTP® uses a
graphical display to aid in optimally evaluating,
documenting and archiving the measurement data.
PTP® runs on Windows 2000/XP thereby providing
a simple and user-friendly menu control and offer-
ing all the advantages of Windows technology.
Advanced profile evaluation offers the following
capabilities: temperature evaluation at any given
moment, maximum temperatures, temperature
gradients, differential temperatures, min./max.
solder wetting times, conveyer speeds and envelope
curves with automatic report generation. An overlay
function allows current profiles to be compared with
saved reference profiles.
Auto. profile evaluation with 6 parameters;
Display of the continuous gradients;
and up to 17 profiles
8 channel recorder with 12 bit resolution;
Power management with Li-Io battery
Complete system includes Sensor Shuttle, heat insulating box,
ERSA PTP Windows™-Software in a practical transport case
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ERSA HOTFLOWReflow Product line
Most important standard features:
• Pinandchainconveyorwith3mmpinlength
• Workingwidthfrom60mmupto525mm
• Topsideactivecooling;integratedwatercooling
• NewMultijetheatingcassettesinallheatingzones
• AdjustableRPMblowermotorsinreflowzones
• Automaticprogrammablechainlubricationsystem
• Multistagesinglefluxmanagementsystem
• MachineSoftware;PCwith17”TFTMonitor
Most important machine options:
• Nitrogensupply&controlsystemwithanalyser
• Bottomsideactivecooling
• DualfluxmanagementMaintenance“OntheFly”
• UltralowmassPCBcentersupport
• Multipletracktransportsystems
• ERSAProcessControlSoftwaremodule
• Switchableinternal/externalactivecooling
• SensorShuttleTemperaturemeasuringsystem
BeST IN claSS reflOw TechNOlOgy
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HOTFLOW Series
The new HOTFlOW series remains to be a “Best
seller” from an investment payback standpoint. The
complete line consists of machine configurations,
differing mainly by the total process length which is
dimensioned individually subject to the customer‘s
process specifications. Whatever your demands:
high throughput, easy parameter settings, clean
process tunnel, conveyor system flexibility or easy
maintenance –
the HOTFLOW line has the perfect system to
meet your demands!
Machine type Heating zones Cooling zones Length
top bottom bottom opt. top bottom opt. Process zone
HOTFLOW 3/20 10 3 7 4 4 5.2 m
HOTFLOW 3/14 7 2 5 3 3 3.8 m
HOTFLOW 2/12 6 2 4 2 - 2.5 m
Different configurations of heating and cooling zones
HOTFlOW 3/20
HOTFlOW 3/14
HOTFlOW 2/12
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Europe (HQ)ERSA GmbHleonhard-Karl-Str. 2497877 Wertheim / GermanyTel.: +49 (0) 9342 / [email protected]
AmericaERSA North Americaa division of KURTz North America Inc.1779, Pilgrim RoadPlymouth, WI 53073, USATel.: [email protected]
AsiaERSA Asia Pacifica division ofKURTz Far East ltd. Suite 3505, 35/F.,China Resources Building26 Harbour Rd, Wan ChaiHong KongTel.: +852 / 2331 [email protected]
ChinaERSA Shanghaia division ofKURTz Shanghai ltd.Room 601 Green landBusiness MansionNo.1258,Yu Yuan Rd.Shanghai 200050, ChinaTel.: +86 (21) 3126 [email protected]
KoreaERSA Koreaabranchof k•mc1305 Ho, High-Tech City 2 Dong,54-66 Mullae-dong 3 Ga,Yeongdeungpu-Gu, Seoul, 150-834, KoreaTel.: [email protected]
Contact us for complete information:
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The World is Kurtz – Present in 135 countries
ERSA Production Equipment & Servicesfor Manufacturing & Repair of Electronic Assemblies
www.ersa.comwww.ersa-versaprint.com • www.ersa-i-tool.com
Production plants / subsidiarieslocal agentsOther presence
Screen Printing
Reflow Soldering
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Rework & Repair
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