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HPC
x:a
Wor
ld-C
lass
Ser
vice
for
the
UK
Dr
Ala
n D
Sim
pson
HPC
x Pr
ojec
t Di
rect
orEP
CC T
echn
ical
Dir
ecto
r
EPCC
and
CCL
RC h
ave
a sh
ared
vis
ion
to c
reat
e a
worl
d-cl
ass
orga
nisa
tion
pro
mot
ing
high
-end
com
puti
ng a
nd g
rid
tech
nolo
gies
to
expa
nd s
cien
tific
and
bus
ines
s ca
pabi
litie
s
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
Ove
rview
•Ba
ckgr
ound
•H
PCx
Part
ners
•Cu
rren
t St
atus
•Te
chno
logy
Tra
nsfe
r
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
Engine
ering
and
Phys
ical S
cien
ces
Rese
arch
Cou
ncil
•In
vest
s ov
er £
400
mill
ion
a ye
ar t
o en
sure
UK
rese
arch
is a
t th
e fo
refr
ont
of t
echn
olog
ical
chan
ge
•A
ssig
ned
the
resp
onsi
bilit
y fo
r pr
ocur
ing
the
UK’
sne
xt g
ener
atio
n of
Hig
h Pe
rfor
man
ce C
ompu
ters
:
•
is t
he U
K’s
mai
n ag
ency
for
the
fun
ding
of
engi
neer
ing
and
phys
ical
sci
ence
s re
sear
ch
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
HPC
x Pr
ocur
emen
t
•U
K re
sear
ch is
incr
easi
ngly
dep
ende
nt u
pon
high
-en
d co
mpu
te f
acili
ties
•Ra
pid
tech
nolo
gica
l and
Gri
d ad
vanc
es h
ighl
ight
the
need
to
upgr
ade
UK
reso
urce
s on
a r
egul
ar b
asis
•EP
SRC’
s ob
ject
ives
for
the
pro
cure
men
t we
re t
o–
aim
“to
deliv
er t
he o
ptim
um s
ervi
ce r
esul
ting
inwo
rld-
lead
ing
scie
nce”
–ad
dres
s “t
he p
robl
ems
invo
lved
in s
calin
gex
isti
ng c
odes
to
the
capa
bilit
y le
vels
req
uire
d”–
Capa
bilit
y Co
mpu
ting
–jo
bs w
hich
use
a s
igni
fica
nt f
ract
ion
of t
he r
esou
rce,
eg, a
t le
ast
512
CPU
s
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
Wha
t is H
PCx?
•Co
nsor
tium
of
lead
ing
UK
orga
nisa
tion
s co
mm
itte
dto
cre
atin
g an
d m
anag
ing
the
new
UK
HPC
res
ourc
efo
r th
e ne
xt 6
yea
rs
•£
53M
/$85
M b
udge
t
•Gr
id-e
nabl
ed, a
key
com
pone
nt in
the
UK
e-Sc
ienc
e pr
ogra
m
•M
ulti
-sta
ge p
roje
ct t
o de
liver
a w
orld
cla
ssac
adem
ic c
ompu
ting
res
ourc
e, t
he la
rges
t in
Eur
ope,
with
an
ulti
mat
e pe
ak p
erfo
rman
ce o
f 22
TFl
op/s
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
The
HPC
x Co
nsor
tium
: M
embe
rs
•Ce
ntra
l Lab
orat
ory
of t
he R
esea
rch
Coun
cils
: Dar
esbu
ry L
abor
ator
y
•IB
M
•Ed
inbu
rgh
Para
llel C
ompu
ting
Cen
tre
•U
nive
rsit
y of
Edi
nbur
gh
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
Unive
rsity
of E
dinb
urgh
•Le
ad c
ontr
acto
r of
the
HPC
x Co
nsor
tium
•In
tern
atio
nal c
entr
e of
aca
dem
ic e
xcel
lenc
e•
One
of
the
larg
est
and
mos
t su
cces
sful
univ
ersi
ties
in t
he U
K•
A p
artn
er in
the
Nat
iona
l e-S
cien
ceCe
ntre
(NeS
C)
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
•Le
adin
g co
mpu
ter
cent
re in
Eur
ope,
bri
dgin
g th
ega
p be
twee
n ac
adem
ia a
nd in
dust
ry
•Pr
ovid
es H
PC a
nd n
ovel
com
puti
ng s
olut
ions
to
awi
de r
ange
of
acad
emic
and
indu
stri
al u
sers
•Lo
ng e
xper
ienc
e of
pro
vidi
ng n
atio
nal H
PC s
ervi
ces
incl
udin
g:–
Mei
ko C
ompu
ting
Sur
face
s–
Thin
king
Mac
hine
s CM
200
–Cr
ay T
3D/T
3E (1
994
to 2
001)
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
Dar
esbu
ry L
abor
ator
y
•A
mul
ti d
isci
plin
ary
rese
arch
lab
with
ove
r 50
0 pe
ople
•Pr
ovid
es la
rge-
scal
e re
sear
chfa
cilit
ies
both
for
UK
acad
emic
and
indu
stri
alre
sear
ch c
omm
unit
ies
•Ru
ns t
he U
K’s
Colla
bora
tive
Com
puta
tion
al P
roje
cts
•D
ares
bury
hos
ts t
heH
PCx
hard
ware
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
Part
ners
hip
•EP
CC a
nd C
CLRC
–ar
e pa
rtne
rs in
C3 E
S (C
onso
rtiu
m f
or C
apab
ility
Com
puti
ng a
nd e
-Sci
ence
)–
com
bine
s Eu
rope
’s fo
rem
ost
HPC
, e-S
cien
ce a
ndte
chno
logy
tra
nsfe
r ce
ntre
s–
with
sig
nifi
cant
exp
erie
nce
of o
pera
ting
nat
iona
lca
pabi
lity
serv
ices
on
nove
l arc
hite
ctur
es–
deve
lope
d an
d su
ppor
ted
capa
bilit
y co
mpu
ting
acr
oss
wide
ran
ge o
f ap
plic
atio
n ar
eas
–th
e st
rong
est
UK p
artn
ersh
ip e
ver
to s
uppo
rtsc
ient
ific
com
puti
ng
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
•IB
M p
rovi
des
the
tech
nolo
gy f
or H
PCx
•IB
M h
as t
he lo
ng t
erm
tec
hnol
ogy
road
map
ess
enti
al t
o a
6 ye
arpr
ojec
t su
ch a
s H
PCx
•Lo
ng s
tand
ing
invo
lvem
ent
in H
PC in
clud
ing
the
deve
lopm
ent
of a
num
ber
of A
SCI
mac
hine
s an
d 4
ofth
e to
p do
zen
mac
hine
s in
the
21s
t TO
P500
list
:–
No
4: A
SCI
Whi
te: R
max
= 7
.3 T
Flop
/s–
No
5: S
P Po
wer3
(665
6 Pr
oces
sors
): R m
ax =
7.3
TFl
op/s
–N
o 6:
xSe
ries
(19
20 P
roce
ssor
s): R
max
= 6
.6 T
Flop
/s–
No
12: H
PCx
(128
0 pr
oces
sors
): R m
ax =
3.2
TFl
op/s
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
HPC
x is
hou
sed
in a
ded
icat
ed m
achi
ne
hall
at D
ares
bury
Lab
orat
ory
HPC
x Har
dwar
e: I
n Plac
e
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
HPC
x Ope
ration
al P
hase
s
•Sy
stem
will
be
com
mis
sion
ed in
thr
ee m
ain
stag
es–
Phas
e 1
(200
2-20
04) c
onsi
sts
of:
•40
Reg
atta
-H S
MP
node
s, 1
280
proc
esso
rs•
Peak
of
6.6
TFlo
p/s,
wit
h 3.
4 Tf
lop/
s su
stai
ned
on L
inpa
ck
–Ph
ase
2 (2
004-
2006
)•
Aim
ing
for
6 TF
lop/
s su
stai
ned
on L
inpa
ck•
O(4
8) R
egat
ta-H
+ SM
P no
des;
1.5
Tby
tes
of m
emor
y•
Inte
rcon
nect
upg
rade
d to
Hig
h Pe
rfor
man
ce s
witc
h•
Dou
blin
g of
I/O
and
sto
rage
–al
read
y ha
ve e
arly
use
rs o
n a
clus
ter
with
20
Rega
tta-
H+
fram
es a
nd a
pre
-rel
ease
Fed
erat
ion
swit
ch–
will
evol
ve in
to p
rodu
ctio
n sy
stem
dur
ing
2Q20
04
–Ph
ase
3 (2
006-
2008
)•
Targ
et o
f 12
TFl
op/s
sus
tain
ed o
n Li
npac
k
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
HPC
x St
atus
: Sc
ienc
e Su
ppor
t
Out
reac
hLi
fe s
cien
ces
New
app
licat
ions
App
licat
ions
Sup
port
Hel
pdes
k
T
rain
ing
Li
aisi
ng w
ith
user
s
Use
rs
Tech
nolo
gy
Soft
ware
Eng
inee
ring
Unde
rpin
ning
tec
hnol
ogy
G
rid/
e-Sc
ienc
e
Syst
ems
& N
etwo
rkin
gFl
exib
le a
nd r
espo
nsiv
e ca
pabi
lity
com
puti
ng s
ervi
ce
Sm
ooth
tra
nsit
ions
bet
ween
pha
ses
Tera
scal
ing
Ca
pabi
lity
appl
icat
ions
Scal
able
alg
orit
hms
P
erfo
rman
ce o
ptim
isat
ion
• 18
staf
f in
5 d
ual-c
entr
e fu
ncti
onal
sup
port
tea
ms
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
HPC
x St
atus
: Usa
ge
•U
sage
ave
rage
s m
ore
than
our
tar
get
of 7
5%•
Capa
bilit
y us
age
has
incr
ease
d up
to
35%
CPU
Usa
ge b
y Jo
b Si
ze
0
5000
00
1000
000
1500
000
2000
000
Jan-03
Feb-03
Mar-03
Apr-03
May-03
Jun-03
Jul-03
Aug-03
Sep-03
Oct-03
Nov-03
Dec-03
AUs
>102
410
2451
225
612
864 32 16 8
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
HPC
x St
atus
: Q
ualit
y M
etrics
•Re
spon
sive
and
acc
urat
e he
lpde
sk–
>99%
of
quer
ies
succ
essf
ully
sol
ved
with
in 7
2 ho
urs
•H
igh
serv
icea
bilit
y–
99%
dur
ing
firs
t ye
ar•
Exte
nsiv
e tr
aini
ng p
rogr
amm
e–
15 d
iffe
rent
cou
rses
ove
r 50
tra
inin
g da
ys•
Expe
rien
ced
staf
f–
13 F
TEs
for
scie
nce
supp
ort
–5.
75 F
TEs
for
syst
ems
supp
ort
•H
igh
qual
ity
docu
men
tati
on–
mor
e th
an a
doz
en t
echn
ical
rep
orts
per
yea
r
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
Summar
y
•H
PCx
is t
he n
ew U
K H
PC r
esou
rce
–ca
pabi
lity
com
puti
ng f
or w
orld
-lead
ing
scie
nce
–on
e of
larg
est
com
pute
rs in
Eur
ope
–m
ajor
opp
ortu
nity
for
UK
acad
emia
and
indu
stry
•Se
ries
of
IBM
pSe
ries
clu
ster
s–
rem
aini
ng v
ery
com
peti
tive
unt
il 20
08•
Very
suc
cess
ful f
irst
yea
r•
For
furt
her
info
rmat
ion:
htt
p://
www.
hpcx
.ac.
uk
HPC
x: S
uppo
rting
the
Futu
re o
f UK
Rese
arch
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
Tech
nology
Tra
nsfe
r
•EP
SRC
are
nego
tiat
ing
with
pos
sibl
e in
dust
rial
part
ners
for
nex
t pr
ocur
emen
t (H
ECTo
R)
•5%
of
HPC
x ca
paci
ty is
ava
ilabl
e to
indu
stri
al u
sers
–m
ay b
e po
ssib
le t
o in
crea
se t
his
furt
her
•Bo
th E
PCC
and
DL
have
sig
nifi
cant
exp
erie
nce
inte
chno
logy
tra
nsfe
r–
be-s
poke
sof
twar
e de
velo
pmen
t–
serv
ices
pro
vidi
ng c
ycle
s an
d ac
cess
to
pack
ages
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
Wha
t Ca
n HPC
x Do
For
You?
• Co
des
–co
mm
erci
al s
oftw
are
runn
ing
on h
ighe
st p
erfo
rman
ce s
yste
ms
–st
ate-
of-t
he a
rt c
omm
unit
y co
des
–pa
ralle
lise
besp
oke
code
• Fa
cilit
ies
–ac
cess
to
high
est
perf
orm
ance
com
puti
ng f
acili
ties
for
eval
uati
on, a
pplic
atio
ns d
evel
opm
ent
or p
rodu
ctio
n
• Ex
pert
ise
to d
evel
op n
ew m
odel
ling
capa
bilit
ies
–H
PC s
imul
atio
ns f
or c
hem
istr
y, M
D, m
ater
ials
and
eng
inee
ring
–ne
twor
k of
aca
dem
ic c
olla
bora
tors
wit
h co
mpl
emen
tary
expe
rtis
e
Com
preh
ensi
ve s
imul
atio
n an
d m
odel
ling
capa
bilit
ies
- int
egra
ted
to s
olve
rea
l wor
ld p
robl
ems
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
Rece
nt A
pplic
ations
Zeol
ite a
nd e
nzym
es
Gas
sen
sors
Mol
ecul
arcr
ysta
ls
Fric
tion
Parti
cula
te d
ynam
ics
Diff
usio
nin
sol
ids
DN
Asu
rfact
ants
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
Tech
nology
Tra
nsfe
r: C
LRC
Cons
ulta
ncy
- H
PC t
echn
olog
y, s
cien
tifi
c de
velo
pmen
ts a
ndop
port
unit
ies,
qua
ntif
y H
PC r
equi
rem
ents
, pro
cure
men
t su
ppor
t,bu
sine
ss c
ases
, mod
ellin
g te
chno
logy
Educ
ation
- hpc
har
dwar
e an
d so
ftwa
re t
echn
olog
y, u
nder
stan
d th
egr
owin
g po
tent
ial o
f co
mpu
tati
onal
sci
ence
Facilit
ies
- cos
t-ef
fect
ive,
sec
ure,
low-
risk
acc
ess
to m
ediu
m a
ndla
rge
scal
e hp
c fa
cilit
ies,
wel
l sup
port
ed b
y a
qual
ity
user
-ser
vice
runn
ing
in-h
ouse
, com
mer
cial
or
end-
user
cod
esTr
aining
- in
the
use
of
code
s an
d fa
cilit
ies
and
impl
emen
tati
on o
nad
vanc
ed t
echn
olog
y -
tran
siti
on f
rom
wor
ksta
tion
to
HPC
capa
bilit
yTe
chno
logy
implem
enta
tion
- in
cus
tom
er, a
cade
mic
or
com
mer
cial
code
sDe
mon
stra
tion
s -
prot
otyp
e ca
lcul
atio
ns d
emon
stra
ting
tec
hnol
ogy
or t
o so
lve
hith
erto
intr
acta
ble
prob
lem
s
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
CLR
C In
dust
rial P
artn
ers
•In
dust
rial
End
-Use
rs–
ICI,
Eut
ech,
CA
PS–
Zene
ca–
BAe,
DER
A F
arnb
orou
gh–
RR, B
riti
sh S
teel
, GEC
Als
thom
–Fa
rsid
e Te
chno
logi
es–
Para
s, B
erti
n, L
abei
n–
Elec
tric
idad
e de
Por
tuga
l–
Mit
sui B
abco
ck E
nerg
y Li
mit
ed–
Phill
ips,
Sie
men
s, I
nco
Allo
ys L
td–
Ther
mot
ech
Ltd
–U
nile
ver,
She
ll, C
ourt
auld
s, B
P, D
uPon
t–
ABB
Ltd
–N
orsk
Hyd
ro, B
ASF
, BN
FL, P
ilkin
gton
•Co
mpu
ter
Vend
ors
–IB
M -
mar
keti
ng, c
lust
erco
mpu
ting
, HPC
97
–Fu
jitsu
– H
PC 9
7–
HP
- cl
uste
r co
mpu
ting
–Cr
ay -
Res
earc
h Fe
llows
hips
–N
EC -
opt
imis
atio
n–
Inte
l -
benc
hmar
king
•So
ftwa
re C
ompa
nies
–A
ccel
rys,
Oxf
ord
Mat
eria
ls–
Rock
fiel
d So
ftwa
re–
FEGS
Ltd
–N
AG
Ltd
–PA
LLA
S
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
Tech
nology
Tra
nsfe
r: E
PCC
•Pr
ojec
t-ba
sed
cons
ulta
ncy
to in
dust
ry–
£1.4
mill
ion
indu
stry
pro
ject
tur
nove
r th
is y
ear
–re
pres
ents
aro
und
40%
of
EPCC
’s tu
rnov
er–
fund
s gr
oup
of >2
0 ex
peri
ence
d pr
ogra
mm
ers
•O
ver
30 c
lient
s in
pas
t 3
year
s•
Larg
e en
terp
rise
s...
–eg
, UKM
O, S
un, C
&G, A
EA, C
isco
, Mic
roso
ft•
...to
loca
l SM
Es–
eg, W
eidl
inge
r, D
igit
al B
ridg
es, A
rran
Aro
mat
ics,
…•
Fund
ed b
y di
rect
con
trac
ts w
ith
busi
ness
, Sco
ttis
hEn
terp
rise
, Eur
opea
n Co
mm
issi
on a
nd D
TI
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
EPCC
Clie
nts
USA
:o
Cis
co S
yste
ms
Inc
o Su
n M
icro
syst
ems
Inc
o IB
M C
orpo
ratio
no
Ora
cle
Cor
pora
tion
o H
ewle
tt Pa
ckar
do
Mic
roso
ft
Japa
n:o
Hita
chi
Euro
pe:
o C
entro
Ric
erch
e Am
bien
tali
SpA
o Eu
rope
an C
omm
issi
ono
Foam
tex
A/S
o Kj
aerg
aard
Indu
stri
Auto
mat
ic A
/So
QSW
SpA
o U
mw
elts
chut
z N
ord
Gm
bHo
Oy
Eksp
ansi
o
+ m
any
othe
r EU
pro
ject
par
tner
s
UK
:o
Alm
ond
Engi
neer
ing
Ltd
o Al
tam
ira L
tdo
Arra
n Ar
omat
ics
Ltd
o C
alla
nder
s Sa
wm
ills L
tdo
Cal
man
Ltd
o C
B Te
chno
logy
Ltd
o C
entre
for C
usto
mer
Aw
aren
ess
Ltd
o C
ERN
o C
helte
nham
& G
louc
este
r plc
o D
TIo
Dig
ital B
ridge
s Lt
do
Elek
trobi
t Ltd
o Fi
rst G
roup
plc
o G
olde
n C
rum
b Lt
do
Hig
h Sp
eed
Prod
uctio
ns L
tdo
Inte
griti
Sol
utio
ns L
tdo
IP T
echn
olog
y Lt
do
Irons
ide
Farra
r Ltd
o Ja
rdin
e Te
chno
logy
Ltd
o Pe
pper
’s G
host
Pro
duct
ions
Ltd
o R
adar
Wor
ld L
tdo
Red
Lem
on L
tdo
Ros
ti (S
cotla
nd) L
tdo
Qua
dsto
ne L
tdo
SCI L
tdo
Scot
tish
Ente
rpris
eo
The
Cro
wn
Offi
ceo
TSB
Bank
Sco
tland
Ltd
o U
K M
eteo
rolo
gica
l Offi
ceo
Ups
tream
Sys
tem
s Lt
d
1999
- 20
03
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
EPCC
Bus
ines
s St
rate
gy
•To
sol
ve b
usin
ess
prob
lem
s NOT
sell
tech
nolo
gy•
… in
divi
dual
sol
utio
ns f
or c
lient
s
Tech
nolo
gy P
ush
Dow
n
OG
SA-D
AI
IPO
Firs
t Gro
upPGPG
ridSu
nDC
G
Mic
roso
ftC
&GAu
tosc
reen
CC
A£
X,00
0
£ X0
0,00
0
£ X,
000,
000
Acad
emic
Res
earc
h
Proj
ect s
ize
5 Ap
ril 2
004
HPC
x In
dust
ry D
ay
EPCC
: M
aking
the
Diffe
renc
e
•N
ovel
sof
twar
e so
luti
ons
are
key
to–
enab
ling
mor
e co
mpe
titi
ve U
K co
mpa
nies
–in
crea
sing
pro
fits
–he
lpin
g co
mpa
nies
gro
w in
the
glo
bal m
arke
tpla
ce•
But
–so
ftwa
re s
olut
ions
are
sti
ll of
ten
unde
r-va
lued
–la
ck o
f tr
ust/
unde
rsta
ndin
g of
wha
t is
pos
sibl
e•
EPCC
hav
e a
uniq
ue c
ombi
nati
on o
f st
reng
ths
–fo
cus
on p
rofe
ssio
nal s
oftw
are
deve
lopm
ent
tech
niqu
es–
expe
rien
ce in
app
lyin
g ac
adem
ic r
esea
rch
to s
olve
busi
ness
cha
lleng
es