HUAWEI Tecal E9000 Blade Server Pre-sales … · 1 1 Market Overview and PositioningClick to add Title 2 Product Specifications and HighlightsClick to add Title 4 Product Comparison

Version: V1.0(2014-3-21)

HUAWEI Tecal E9000 Blade Server

Pre-sales Specialist Training

1

1 Click to add Title Market Overview and Positioning

Click to add Title 2 Product Specifications and Highlights

4 Product Comparison

Click to add Title 3 Application Scenarios

Agenda

5 Ordering Guide

6 How to Get Resources

2

X86 Blade Server Market Overview

In 2011, the total server market revenue reached $52.8 billion, among which Unix server revenue reached $17.2 billion (32.6%) and x86 server revenue

$35.6 billion (67.4%).

In 2011, the shipment of x86 blade servers took 12.8% (1.195 million PCS) of that of all x86 servers, with the revenue share reaching 21% ($7.53 billion).

In 2014, the total server market revenue will reach $56 billion, among which, the market revenue of x86 servers will be $42 billion (75%), and the

shipment of blade servers will take 26% of that of all x86 servers, with the revenue reaching $10.92 billion.

HP, IBM, Dell, and Cisco take 82.2% global market share of blade servers.

Blade servers are accepted by more and more customers. The market share of Cisco blade server burgeons and

encroaches the market shares of other server vendors.

43.9%

20.5%

12.5%

9.6%

8.2% 1.8%

1.7% 0.9% 0.9% Global market share of blade servers in 2011 HP Total

IBM Total

others

HP 47%

IBM 25%

Dell 10%

Other Vendors

6% Cisco 3% Oracle

2% Fujitsu 2%

NEC 1%

Hitachi 1%

SGI 1%

Dawning 1%

Groupe Bull 1%

Inspur Electronics

1%

Global market share of blade server s in 2010

3

1st-generation carrier-grade

blade server T8000 (out of

production)

Keep step with the industry

and applies to China's

Internet industry.

2003 2005 2006 2009 2012

T8000 (out of production)

widely substitute the

midrange computer platform

in the telecom industry and

applies to China's Internet

industry.

1st-generation enterprise-

level blade server E6000

Provide an efficient, unified

computing platform for

telecom operation,

enterprise applications, and

midrange and high-end

applications in the Internet

industry.

Converged architecture blade server

E9000

Consolidate storage, computing,

and network resources to meet

cloud computing, HPC, and high-

end enterprise application

requirements.

Huawei Blade Server Development History

2nd-generation enterprise-level

blade server E6000H

Provide superior computing

performance and density, and

meet requirements for high-

density and cluster deployments.

4

E9000 Positioning

Market positioning System Structure Features

Provide comprehensive high

performance computing

support for IT large-scale

and high-density deployment

industries such as cloud

computing, high-end

enterprise applications,

Internet service platform,

and HPC.

Adopt the fully redundant design

for power supply, heat

dissipation, management, and

switching subsystems based on

the 12 U/16 blades architecture;

use the latest Intel E5 series

CPUs; achieve best balance

between performance, density,

and energy consumption.

High performance, supporting

service development

High reliability, ensuring

proper running

Low power consumption,

reducing the OPEX.

Easy management,

simplifying the O&M

5





Agenda

5 Ordering Guide


6

E9000 Product Panorama

c

hassis

E9000 chassis

chassis

Com

putin

g n

ode

CH121

Sw

itch m

odule

Switch module

CH220 CH221 CH140

HW 2S Node

High density

Large memory

• Adopts the modular design for compute nodes, storage nodes, switch modules, fan

modules, and power supply modules

• 12U high chassis, providing 8 full width or 16 half width slots

• Support next 3 generation Intel processors

• Support evolution of next decade network technology

Computing node

CH222 CH240 CH242

HW 2*2P Twin Node

Ultra high density

high performance

FW IO Expansion Node

Large memory

Strong expansion

FW IO Expansion Node

Large memory

Strong expansion

FW Storage Node

Large memory

Ultra large storage

FW 4P Node

High performance

Ultra large memory

FW 4P Node

High performance

Large memory

CX110 CX310 CX311 CX116

GE switch module

CX317 CX611 CX911/CX912

GE pass-thru module 10GE converged

switch module

10GE/FCoE converged

switch module 10GE pass-thru module QDR/FDR

switch module

10GE/FC Multiplane

switch module

CH242 V3

FW 4P E7 v2 Node

High performance

Strong Expansion

7

E9000 Chassis

E9000 c

hassis

specific

atio

n

• Installed in a standard 19-inch rack, the E9000 is 12 U high. Its dimensions are: 530.2 mm x 442 mm x 840 mm (H x W x D)

• An E9000 chassis houses 16 half-width slots or 8 full-width slots

• Management modules support 1+1 redundancy and management protocols and interfaces such as IPMI 2.0, SOL, SSL,

SSH, and web

• Supports up to 6 Platinum PSMs (AC 3000 W/DC 2500 W) in N+N/N+1 redundancy with up to 95% efficiency under 50%

load and supports dynamic management for PSMs in the hibernation state

• Provides 14 fan modules(3 groups) and every group supports single-fan failures

Half width slot

Full width slot

Management

module

Switch

module

Power

supply module

Fan

module

Front view Rear view

Chassis specification

2X

3X

4E

E4

E1

X3

X2

Half width half

hight slot

8

Form factor Half-width 2-socket computing node

Number of CPUs 1 or 2

Processor model Intel Xeon E5-2600 or E5-2600 v2 Series CPU

Number of DIMMs 24 DDR3 DIMMs, providing a maximum capacity of 768G

Number of HDDs 2 2.5 inch SSDs or SAS/SATA HDDs

RAID support Support RAID 0 and 1

PCIe expansion 2 PCIe x16 MEZZ modules

1 standard PCIe x8 full-height half-length card

Operating systems

supported

Microsoft Windows Sever 2008/2012

Red Hat Enterprise Linux

SUSE Linux Enterprise Server

Citrix XenServer

VMware ESX

……

Operating temperatures 5℃-40℃

Dimensions 215 mm(8.46 in.)*525mm(20.67 in.)*60.46mm(2.38 in.)

CH

121 p

roduct v

iew

CH121 Half Width Computing Node Front view

Isometric view

• High performance: Half slot provides a dissipation capacity of 700W, supporting 2 E5-2690 processors • Cost-effective large-memory: Provides 24 DIMMs at 1.5 times the usual height that apply mainstream granules to double capacity with a total of

up to 768 GB DDR3 memory capacity (most cost-effective for large-memory applications) • Flexible PCIe expansion: support 1 standard FHHL PCIe card，users can choose proper PCIe acceleration solution for service optimization

Hig

hlig

hts

9

CH

140 p

roduct v

iew

CH140 Half Width Twin Computing Node

• High performance : CH140 support 4 maximum 130W E5-2600 processors(E5-2680, 8 cores at 2.7GHz)

• Ultra-high computing density: One chassis supports 32*2P notes、64*Romley EP 130W CPU, industry highest density

• Single node maintenance

Hig

hlig

hts

4DIMMs

1*2

.5in

ch

HD

D S

SD

4DIMMs

Front view

Top view

Form factor Half-width 2*2-socket computing node

Number of CPUs 2*（1 or 2 ）


Number of DIMMs Each 2S node provides 8 DDR3 DIMMs

Number of HDDs 1 2.5 inch SSD/SAS/SATA

PCIe expansion Each node provides 2 PCIe x8 MEZZ modules

Operating systems

supported Microsoft Windows Sever 2008 /2012



Citrix XenServer

VMware ESX

……


Dimensions 215 mm(8.46 in.)*525mm(20.67 in.)*60.46mm(2.38 in.)

10

CH

220/C

H221 p

roduct v

iew

CH220/CH221 Full Width IO Expansion Node Front view

Isometric view

• Strong expansion capability: support standard PCIe card, a maximum of 4 PCIe cards are supported in one full width slot, industry No.1 PCIe expansion capability

• High performance: full width slot provides a dissipation capacity of 1400W, adoption of FHFL GPU cards can greatly improve HPC application performance

• Cost-effective large-memory: Provides 24 DIMMs at 1.5 times the usual height, most cost-effective for large-memory applications

Hig

hlig

hts

Form factor Full-width 2-socket computing node





RAID support Support RAID 0 and 1


4 PCIe x8 FHHL(CH220)or 2 PCIe x6FHHL(CH221)

Operating systems

supported

Microsoft Windows Sever 2008 /2012



Citrix XenServer

VMware ESX

……


Dimensions 423 mm(16.65in.)*525mm(20.67 in.)*60.46mm(2.38 in.)

11

CH

222 p

roduct v

iew

CH222 Full Width Storage Expansion Node

• Ultra-Large storage: Full width slot provides 15 2.5 inch HDD bays, providing a maximum capacity of 15T, very suitable for applications of big data and distributed computing

• Flexible PCIe expansion: support 1 standard FHHL PCIe card，users can choose proper PCIe acceleration solution for service optimization • Cost-effective large-memory: Provides 24 DIMMs at 1.5 times the usual height, most cost-effective for large-memory applications

Hig

hlig

hts






RAID support Support RAID 0,1,10,5,50,6,60, 1GB RAID cache


1 PCIe x8 FHHL card

Operating systems

supported

Microsoft Windows Sever 2008 / 2012



Citrix XenServer

VMware ESX

……



Front view

Isometric view

12

CH

240 p

roduct v

iew

CH240 Full Width Computing Node

• High performance: full width slot supports 4 E5-4600 processors and 48 DDR3 DIMMs, providing a maximum memory capacity of 1.5TB • Large storage: full slot provides 8 2.5 inch HDDs bays, suitable for database applications requiring both computing performance and local

storage capacity • Cost-effective large-memory: Provides 48 DIMMs at 1.5 times the usual height, most cost-effective for large-memory applications

Hig

hlig

hts



Processor model Intel Xeon E5-4600/core options: 4,6 or 8

Number of DIMMs 48 DDR3 DIMMs, providing a maximum capacity of 1.5TB


RAID support Support RAID 0,1,10,5,50,6,60, 512MB/1GB RAID cache

PCIe expansion 2 PCIe x16 mezz modules

Operating systems

supported

Microsoft Windows Sever 2008 /2012



Citrix XenServer

VMware ESX

……



Front view

Isometric view

13

CH

242 p

roduct v

iew

CH242 Full Width Computing Node

•High performance: full width slot supports 4 E7-4800 processors and 32 DDR3 DIMMs, providing a maximum memory capacity of 1TB •Large storage: full slot provides 8 2.5 inch HDDs bays, suitable for database applications requiring both computing performance and local storage capacity •Flexible PCIe expansion: support 1 standard FHHL PCIe card，users can choose proper PCIe acceleration solution for service optimization

Hig

hlig

hts



Processor model Intel Xeon E7-4800/core options: 6,8 or 10

Number of DIMMs 32 DDR3 DIMMs, providing a maximum capacity of 1TB


RAID support Support RAID 0,1,10,5,50,6,60, 1GB RAID cache

PCIe expansion 4 PCIe x8 mezz modules, 1 PCIe x16 FHHL standard card

Operating systems

supported




Citrix XenServer

VMware ESX

……



Front view

Isometric view

14

CH

242 V

3 p

roduct v

iew

CH242 V3 Full Width Computing Node

•High performance: full width slot supports 4 E7-4800 v2 processors and 32 DDR3 DIMMs, supporting Max. Intel memory buffer width •Large storage: provides 8 2.5 inch HDDs bays, suitable for database applications requiring both computing performance and local storage capacity •Flexible PCIe expansion: support Max. 3 standard PCIe card，supporting GPU and PCIe SSD cards, suitable for large data sets and transaction-intensive database like HANA, Oracle DB etc. .

Hig

hlig

hts



Processor model Full series of Intel Xeon E7-4800/core options: 8 ,10 or 15

Number of DIMMs 32 DDR3 DIMMs, support Intel Max. memory buffer width

Number of HDDs 8(8 HDDs version) or 4(4HDDs version) 2.5 inch SSDs or

SAS/SATA HDDs

RAID support Support RAID 0,1,10,5,50,6,60

PCIe expansion 4 PCIe x16 mezz modules

2 PCIe x16 FHHL PCIe cards, 8HDDs version support 1 PCIe

x16 FH ¾ L PCIe card additionaly

Operating systems

supported




Citrix XenServer

VMware ESX



Front view

Top view

15

E9000 Switch Modules

Enables data center TRILL large layer 2 network construction

Supports DCB lossless Ethernet to bear FCoE and iSCSI

Supports a converged network, virtual paths, and flexible Ethernet and FC configuration

Hig

hlig

hts

Sw

itch M

odule

s

Switch Modules

CX110 CX310 CX311 CX116 CX317 CX611 CX911/CX912

Uplink :

12*GE and 4*10GE

Downlink:

32*GE

Uplink:

32*GE

Downlink:

32*GE

Uplink:

16*10GE

Downlink:

32*10GE

Uplink:

16*10GE and 8*8GFC

Downlink:

32*10GE

Uplink:

32*10GE

Downlink:

32*10GE

Uplink:

18*QDR/FDR IB

Downlink:

16*QDR/FDR IB

Uplink:

16*10GE and 8*8GFC

Downlink:

32*10GE and 16*8GFC

GE switch module GE pass-thru module 10GE converged

switch module

10GE/FCoE converged

switch module

10GE pass-thru

module

QDR/FDR switch

module

10GE/FC Multi plane

switch module

16

MEZZ Modules

ME

ZZ

Module

s

Models

Front view Isometric view

Mainboard connecter

Backplane

highspeed connecter

Model Description Specification

GE MZ110 MEZZ1/2 NIC mezz module with 4 x GE ports

10GE MZ510 MEZZ1/2 CNA mezz module with 2 x 10GE ports Supports FCoE, and FCoE supports NPIV and NPAR. A physical port can be split up to 4 NPARs.

MZ512 MEZZ1/2 CNA mezz module with 4 x 10GE ports Supports FCoE, and FCoE supports NPIV and NPAR. A physical port can be split up to 4 NPARs.

MZ311 ROCE mezz module with 4 x 10GE ports Support ROCE.

Multi-IO MZ910 MEZZ1/2 FC mezz module with 2 x 10GE and 2 x 8G FC ports FC ports support NPIV.

InfiniBand MZ610 MEZZ1/2 HCA mezz module with 2 x 4X InfiniBand QDR ports

MZ611 MEZZ1/2 HCA mezz module with 2 x 4X InfiniBand FDR ports

Type Available slot

17

E9000 High Backplane Connections

I/O C

on

necto

rs Sp

ecifica

tion

• The three I/O connectors on the backplane for each half-width compute node are A, B, and C.

• LAN on motherboard (LOM) uses connector A.

• The upper mezz module in slot MEZZ1 uses connector B.

• The lower mezz module in slot MEZZ2 uses connector C • The reserved LOM is fixedly connected to slots 2X and 3X. The backplane reserves two SerDes lanes for LOM signals to each slot. • MEZZ1 is fixedly connected to slots 2X and 3X The backplane reserves eight SerDes lanes for MEZZ1 signals to each slot. • MEZZ2 is fixedly connected to slots 1E and 4E The backplane reserves 8 SerDes lanes for MEZZ2 signals to each slot.

I/O Connections Specification

Backplane

半宽刀片

A

B C

A

B C

A: LOM

B: MEZZ1

C: MEZZ2

2X

3X

1E

4E

8x

A

B C

Half-width Node Mezz2

Mezz1 B

C

8x

8x

8x Half-width Node

Full-width Node

Backplane

I/O Connections from MEZZ card to switch slot

18

Blade Type GE Mezz Module 10GE Mezz Module

Multi-IO Mezz

Module InfiniBand Mezz Module

MZ110 MZ510 MZ311/MZ512 MZ910 MZ610① MZ611①

CH121 Mezz1 /2 Mezz1 /2 Mezz1 /2 Mezz1 /2 Mezz 2 Mezz 2

CH220 Only Mezz1② Only Mezz1② Only Mezz1② Only Mezz1② Not Support② Not Support②

CH221 Only Mezz1③ Only Mezz1③ Only Mezz1③ Only Mezz1③

Mezz 2④

【Only customized in

HPC projects】

Mezz 2④

【Only customized

in HPC projects】



CH242 Mezz1 /2/3/4 Mezz1 /2/3/4 Only Mezz1⑤ Mezz1 /2/3/4 Mezz 2/4 Mezz 2/4

Mezz Card and Blade Compatibility Matrix

Matrix

R

em

ark

Compatibility Matrix

① You are advised to install the InfiniBand mezz modules in Mezz2/Mezz4 (Releated to slots 1E and 4E), for cabling convenience because of the high

port density and thick InfiniBand cables.

②By default configuration, the Mezz2 slot of CH220 is already occupied (By the signal connector for standard PCIe card expansion slot) , so only

Mezz1 of CH220 can be used to deploy network mezz module.

③By default configuration, the Mezz2 slot of CH221 is already occupied (By the signal connector for standard PCIe card expansion slot) , so only

Mezz1 of CH221 can be used to deploy network mezz module by default.

④ But in HPC projects, when used CH221 to support GPGPU/co-processors, customized -configuration by PO of CH221 can be provided, the

customized-CH221 can use Mezz2 to deploy IB card. (Note: Customized CH221 need to be tracked by R&D now)

⑤ The new CH242 delivered from 2014.1 can support 1*MZ512 or*MZ311 mezz card(Must be deployed on Mezz1.Old version CH242 don't support

MZ512/MZ311).The special feature provided by MZ311 is ROCE, and since that the OS drivers of MZ311 are limit to only few new OS

versions,MZ311 is not recommend to deploy when no requirement with ROCE.

19

com

patib

ility

MEZZ and Switch Module Compatibility -1 Application

Scenarios

Customer Requirements on

Network Planes

Switch Module Recommended

Slots for Switch

Modules

Mezz

Module

Remarks

1. Conventional

Ethernet Networking

(Web service

deployment, big data

clusters, etc)

GE network 2 x CX110 2X/3X 1 x MZ110

10GE network 2 x CX310 2X/3X 1 x MZ510

2. Ethernet and FC

storage network

(Enterprise DC

consolidation,

virtualization,

database cluster, etc)

Ethernet and FC switching

network

2 x CX911

Or CX912

2X/3X 1 x MZ910 Configure GE or 10GE transceiver modules based

on customer requirements. If GE electrical ports are

required, Huawei provides GE RJ45 electric

transceiver modules for option.

Ethernet and FC network with

ultra-high reliability, requiring

physical redundancy on Ethernet

cards and HBA cards)

4 x CX911

Or CX912

2X/3X

1E/4E

2 x MZ910 Configure GE or 10GE transceiver modules based

on customer requirements. If GE electrical ports are

required, Huawei provides GE RJ45 electric

transceiver modules for option.

Network with three physically

isolated switching planes: the GE

switching plane for management,

the 10GE switching plane for

services, and the FC switching

plane for storage

2 x CX911

Or CX912

2X/3X 1 x MZ910 The 10GE and FC switching planes are provided.

2 x CX110 1E/4E 1 x MZ110 The GE switching planes are provided.

20

com

patib

ility

MEZZ and Switch Module Compatibility -2

3. Converged Ethernet

(VDI, enterprise DC

consolidation,

virtualization, etc)

Converged Ethernet networking

with IP SAN

2 x CX310 2X/3X 1 x MZ510 Multiple-plane communications can be implemented

by VLAN.

Converged Ethernet networking

with FC SAN

2 x CX311 2X/3X 1 x MZ510 Multiple-plane communications can be implemented

by VLAN.

4. InfiniBand network

(HPC)

HPC network: GE + InfiniBand

network, non-redundancy plane

1 x CX110 2X/3X 1 x MZ110 If Ethernet redundancy is required, configure one

more CX110.

1 x CX610 1E/4E 1 x

MZ610/MZ611

Choose the MZ610 (QDR) or MZ611 (FDR) based

on customer requirements.

Application

Scenarios

Customer Requirements on

Network Planes

Switch Module Recommended

Slots for Switch

Modules

Mezz

Module

Remarks

21

E9000 MM910 Management Module

Managem

ent M

odule

descrip

tion

Main parts and ports

• The MM910 manages the E9000, complies with IPMI 2.0, and provides management functions such as remote startup,

shutdown, reset, logging, hardware monitoring, SOL, KVM over IP, virtual media, fan monitoring, and PSM monitoring.

• The MM910 supports 1+1 redundancy, and provides a local KVM port for server management.

Description

CPU

FPGA DSP

Management GE port

Management serial port

Local KVM port

22

E9000 Converged Infrastructure Blade Server

• Computing 7 kinds of computing nodes，fully support E5-2600/E5-4600/E7-

4800 processors

• Storage Distributed storage solution provides cost-effective solution for

applications of big data

• Network 8 kinds of switch modules support GE/10GE/FCoE/FC/IB

QDR/FDR

• Management Esight unified management improves management efficiency over

70%

5 No.1

Energy

Efficiency

6 Convenient

O&M

No.1

Reliability

Support running at 40°C

The failure rate is 15% lower than competitors 4

1 No.1

Computing

Density

32*2P notes and 64*Romley EP 130W CPU per chassis Maximum floating point performance 16.5TFlops / chassis

2 No.1

Storage

Density

CH222（Full width）support 15*2.5 inch HDDs

Single-frame support 120*2.5 inch HDDs

3 No.1

Switch Performance

E9000 switch module base on advanced Huawei DataCenter

Switch Technology

15.6T backplane switch capacity，support maximum 128*10GE

ports and evolution to 40GE and 100GE

Support Ethernet，IB，FC ports, flexible networking

Rank first in China Mobile and China Unicom competition

testing

Chinese green energy certification

Plug and Play

Automatic configuration and transmission data, including

BIOS, RAID, network card

23

No.1 Computing Density

HUAWEI CH140

HUAWEI E9000

DELL M1000e

IBM FlexSystem

Quantity of CPUs / E5-2600 64/12U 32/10U 28/10U

Single node maintenance Yes Yes No

Quantity of memory channel 8 6 6

E900 Highest Computing Density

Half width slot support 2*2P nodes, E5-2600

CPU，every node support 8 memory

channels, support single node maintenance

IBM FlexSystem X222

DELL Power420

full width slot 4 nodes support E5-2400 CPU，every node only support 6 memory

channels

One chassis supports 32*2P notes、64*Romley EP 130W

CPU

Maximum floating point performance 16.5TFlops

Every node supports 8 memory channels, leading

memory bandwidth

Full hight 4 nodes support E5-2400 CPU,

every node only support 6 memory

channels. Not support single node

maintenance

24

No.1 Storage Density

HUAWEI CH222

IBM FlexSystem storage node

DELL internal SAN PS-M4110x

HUAWEI E9000

DELL M1000e

IBM FlexSystem

Quantity of HDDs per slot 15 7 14

Quantity of HDDs per chassis 120 56 98

E9000 Highest Storage Density

E9000 CH222：Support 15*2.5’ HDDs，SAS,

SATA, NL-SAS, 120 HDDs in one chassis Dell SAN PS-M4110x occupies double slots，support 14 HDDs， 56 HDDs in one

chassis

IBM Flexsystem storage note, support 14*2.5’

HDDs， 98 HDDs in one chassis

Note: E9000 chassis supports 8 CH222 computing nodes

E9000 CH222（Full width）support 15*2.5 inch HDDs

Single-frame support 120*2.5 inch HDDs，the biggest memory

capacity in one chassis

25

No.1 Switch Performance

E9000 Switch Module

Other Manufacture

HUAWEI

E9000

DELL

M1000e

IBM

FlexSystem

HP

C7000

Backplane bandwidth 15.6T 7.292T 7.168T 6.144T

Quantity of 10GE 128 48 88 64

E9000 switch performance overall leading

Switch slot uplink 32 ports，single-frame maximum 128*10GE ports，support more than 3 plane network

CX116 GE pass-thru: 32ports CX317 10GEpass-thru: 32ports

CX911 multi-plane switch board

IBM: single-frame max 88*10GE ports，only 2 network plane

HP/DELL：switch module uplink 16*10GE ports

E9000 switch module base on advanced Huawei DataCenter Switch

Technology

15.6T backplane switch capacity，support maximum 128*10GE

ports and evolution to 40GE and 100GE

Support Ethernet，IB，FC ports, flexible networking

EN4091 10Gb Board：

14 ports

EN4093 10Gb switch board：

14*10G+2*40G

HP 6120XG

10G switch board:

8 ports

10G switch board ：8 ports

IB switch board ：8ports

26

No.1 Reliability

Independent air-duct, improving

system heat dissipation

Quality control throughout the whole

process

The most stringent standards of

reliability testing for components

Passive backplanes avoid single

points of failure

• Front and rear independent

air-duct

• Duct design optimization

• High and low temperature test,

HALT

• 3000 times Power cycle test

• Continuous 30 days stress test

• Supplier Certification

• Component selection and

control

• IPD process from module to

system

• 150 reliability patents

• EMC testing, safety testing

HUAWEI Others

Failure Rate(According to the statistical result from customer T)

0.87% 1.12% Support stable operation at 40°C high temperature, ensuring business continuity

The failure rate is 15% lower than competitors

Ensure Reliability by Advanced Design and Strict Testing

• The passive backplanes contain

no active components such as

resistors, capacitors, and ICs,

except PCBs and connectors

27

No.1 Energy Efficiency

80PLUS Platinum Power

efficiency 94.6%

DEMT--Dynamic Energy

Management Technology

Power Capping Technology

Chinese Green Energy Certification

• Non-toxic design, Energy saving

• Green energy, to meet customer

requirements of environmental

protection

• Improve power utilization of the

equipment room and cabinet

• Improve equipment room

density, reduced rental costs;

• Improve energy efficiency over

13% by DEMT

• Range of energy saving cover

idle～100％ load

Leading Energy Efficiency, Energy Saving

• 80PLUS Platinum power, 94.6%

conversion efficiency

• onboard DC/DC 94% conversion

efficiency

Rank No.1 in SEPC power testing

Rank No.1 in in China Mobile and China Unicom competition testing

Chinese green energy certification

http://www.spec.org/

28

Configuration

Migration

Offline

Configuration

Configuration

Remains

• Deployment, changing

or migration of blades

or switch modules

• Plug and play

• Parameters automatically configured and migrated (including

configurations of BIOS，network card，RAID etc.)

Initial deployment

Equipment migration

Mass deployment

Plug and play

Configuration migration with

equipment location

• Time-saving, changing

equipment would only

cost 2 minutes instead

of 20 minutes

Convenient O&M

Equipment changing

29

Technical Innovation: Accelerating Service Development

Huawei 4T financial data query test

Hardware acceleration solutions greatly accelerate services.

Use the PCIe SSD card to improve the IOPS by 100 times.

Use the compression card to improve the Hadoop performance by 40%.

Use the coprocessor to provide an acceleration ratio of 300%.

Use the iNIC to improve the Vswitch performance by 200%.

CH221

I/O expansion compute node

E9000 chassis

SSD card

iNIC

Intel Phi

coprocessor

Top 17

Financial

Ledger SQL

Query

Exadata Huawei

SQL17 Timeout 320s

SQL13 905s 319s

SQL12 737s 124s

SQL7 85s 15s

30

DIM

Ms a

t 1.5

times th

e u

sual h

eig

ht

Differential Advantage: Huawei Large-Capacity DIMMs at

1.5 Times the Usual Height

1.5 times the usual

height

42 mm to 46 mm

(1.65 in. to 1.81 in.)

VLP

19 mm (0.75 in.)

Standard height

30 mm (1.18 in.)

Universal

DIMMs in

the

industry

Huawei

IBM

• The RH2288H V2 supports DDR3 DIMMs at 1.5 times

the usual height, reducing costs by 20% to 30%

compared with DIMMs at the usual height (in the case of

32 GB memory).

• All E9000 compute nodes, except for the CH140 and

CH242, support DIMMs at 1.5 times the usual height.

DIMMs at 1.5 times the usual height are used in virtualization solutions, reducing memory investment by 20% to 30%.

31

Differential Advantage: DEMT

Energ

y savin

g s

tatis

tics

Descrip

tion

Energy saving statistics of the RH2288 V2 using the dynamic energy management technology (DEMT)

The DEMT is a dynamic energy-saving technology developed by Huawei. The technology automatically monitors server resource usage based on

service loads, dynamically adjusts server running status based on resource utilization, provides minimum power based on service requirements, and

minimizes server power consumption.

• Slashes system power consumption in various load scenarios without affecting service performance.

• Automatically triggers and monitors energy saving in closed-loop mode without manual intervention.

• Lowers power consumption for PSUs, processors, and fans based on service requirements.

DEMT

Remarks:

The data is obtained for the RH2288 V2

server in the integer computing benchmark

test. The effect varies depending on server

configurations.

32

Differential Advantage: Power Capping Technology

Backgro

und a

nd

benefits

T

est d

ata

Background

A rack can house more devices after the power capping technology is used.

Benefits

• The power supply and heat dissipation costs for data

centers dramatically increase and even exceed device

costs.

• The power supply and heat dissipation capabilities of data

centers do not meet requirements for service expansion.

• The power supply and heat dissipation equipment of data

centers is underused.

• Assigns power supply and heat dissipation resources based

on actual device power, improving energy usage.

• Increases reliability without affecting service performance.

• Eliminates the risks of insufficient heat dissipation and power

supply if air conditioners are faulty or service loads increase.

• Supports more devices in a rack.

Value

33

Differential Advantage: Huawei Proprietary Heat

Dissipation Design

E9000 compute node

E9000 chassis

Key

technolo

gie

s

Descrip

tion

System vector

airflow

management

Double-faced

cellular board

Aluminum board

embedded with

copper heat sink:

MIMO

Benefits • Ranks No. 1 in the SPECpower test.

• Supports smooth product evolution and expansion

and supports architecture evolution in 10 years and

processor evolution based on three generations.

• Supports operating temperature 40°C (104°F), which

is higher than the normal operating temperature 35°C

(95°F).

Huawei proprietary heat dissipation design

Key technologies

• Vector airflow management: ensures heat dissipation for high-power processors (95 W/130 W/135 W) with efficient utilization of limited airflow.

• Double-faced cellular board: increases the amount of system airflow input by achieving the open porosity of 43%, an increase of 115% compared with HP servers.

• Multiple-input multiple-output (MIMO) dynamic energy control: reduces energy consumption by 4.22%, raising the ranking from No.6 to No.1.

• Aluminum board embedded with copper heat sink: reduces the heat sink weight by 45%, cutting the cost by 40%.

The excellent heat dissipation design of the E9000 supports long-term stable operating at 40°C

(104°F) and technology evolution in 10 years and processor evolution based on three generations.

34

Differential Advantage: MIMO

Dia

gra

ms

Descrip

tion

MIMO principles and test data

MIMO heat dissipation and energy saving technology

Fan control

Temperature (chips,

Ta) CPU states

Fan speed

Fan speed

Target temperature

Noise limitation

Temperature limitation

CPU states

Input Output

Relationship between the processor

leakage current and temperature

Fan speed S

yste

m p

ow

er CPU high utilization

CPU low utilization

Relationship between the optimal energy saving

point and fan speed

• When the traditional fan speed adjustment technology is used, the fan speed is minimized when the device is operating at the normal temperature, ensuring lowest

noise while implementing heat dissipation. As the x86 manufacturing process develops, the leakage current of processors increases with the temperature. For

example, when the temperature of a processor increases by 1°C (33.8°F), the power consumption of the processor increases by about 0.7 W. The fan power

consumption is proportional to the fan speed by cube.

• The MIMO technology dynamically controls the fan speed in real time, balances the fan power consumption and hardware power consumption, and optimizes the

system energy consumption based on parameter value changes.

• Input parameters for energy saving control include the temperature (chip temperature and ambient temperature), processor running status, fan speed, and thresholds

(noise/temperature). Output parameters include the component target temperature, fan speed, and processor status.

• The MIMO technology saves energy by 5%, which is higher than the traditional fan speed adjustment technology.

35

Differential Advantage: Double-faced Cellular Board

Dia

gra

ms

Descrip

tion

Diagrams

Double-faced cellular board

• Compared with other structure, closed equilateral hexagonal honeycomb structure achieves the maximum force with the minimal materials and

maximizes the porosity area to ensure the maximum cooling area with the proper strength.

• Large-area bionic cellular heat dissipation holes ensure proper panel strength, maximize the cooling area, and ensure high air intake efficiency. The

most air intake volumes in unit time bring most cool air, which ensures excellent cooling performance for servers.

• Huawei servers use double-faced cellular board design, which adopts cellular heat dissipation holes on both sides of disk trays and provides lower

air resistance than competitors' products.

Porosity rate 58.9% Porosity rate 75%

36

Differential Advantage: Shock Absorption Design

Dia

gra

ms

Descrip

tion

Diagrams

Shock absorption design

• Shock risks in expected application environments are assessed during system design. Proper shock absorption is designed to prevent shock failures.

• Packaging buffer design ensures safe device transportation.

• Reasonable fan speed adjustment and fan component shock isolation are designed to avoid HDD-sensitive frequencies and to decrease risks of HDD performance

deterioration caused by rotating components.

37

Differential Advantage: High-Standard EMC Design

Descrip

tion

Pic

ture

s a

nd d

ata

Huawei EMC competitiveness comparison

Advantages of Huawei EMC design

• 20-year experience in electromagnetic immunity designs for Huawei network products in complex application environments

• General-purpose, high-reliability surge protection design

• Strict RE control based on global standards

EMC Competitiveness Comparison

Huawei Competitor Conducted

susceptibility 10 V 3 V

Signal port EFT 1 kV 0.5 kV

Power supply port

EFT 2 kV 1 kV

Radiated

susceptibility 10 V/M 3 V/M

ESD susceptibility Contact discharge 6 kV

Air discharge 8 kV

Contact discharge 4 kV

Air discharge 8 kV

Anti-surge

capability ITU 2.5/2.5 kV IEC 2 kV/2 kV

Radiation

emission (RE) CE/FCC Class A CE/FCC Class A

Huawei servers provide higher anti-interference and surge-protection

capabilities than competitors' products, supporting high adaptability.

38

Differential Advantage: Huawei-developed Technologies

and Optimization Capability

Descrip

tion

Huawei-developed technologies and optimization capability

• Architecture and solution design

• Component selection

• Schematic diagram

• PCB

• Heat dissipation

simulation

• Signal integrity simulation

• BIOS and BMC

• CPLD and FPGA logic

• iMana (management

software) - substitute for

USM

• Most competitors in China do not have comprehensive R&D systems. Most of them provide ODM servers purchased from Taiwan and United States.

• Competitors such as HP, IBM, Dell, and Cisco design architecture and management software and partner with ODM vendors such as Foxconn,

Inventec, Quanta for design, test, and production.

http://www.mentor.com/mentor2/images/screenshots/vbdcbrowser.gif

39

Smooth Evolution: Supporting Network Evolution

in 10 Years

Dia

gra

ms

Descrip

tion

Technology development trend

Network development trend and E9000 architecture planning

With the emergence and popularization of 100GE, InfiniBand EDR, and 32G FC technologies in the next

few years, support for signals at a rate higher than 25 Gbit/s is essential for smooth network evolution. The

HUAWEI E9000 high-speed chassis is designed to support 100GE and InfiniBand EDR evolution. To help

customers maximize return on investment (ROI) in the future 10 years, proper architecture planning is

implemented to ensure that the E9000 supports high-speed signals and high-speed backplane signal links.

This meets requirements for network evolution in the future 10 years and provides competitive advantages for

customers in the big data analysis market by delivering high performance, high bandwidth, and low latency.

40

Smooth Evolution: Supporting Processor

Evolution in 10 Years

Pic

ture

s

Descrip

tion

Independent air channel design and Intel processor planning

E9000 heat dissipation specifications and design for processor evolution based on three generations

• Separated air channels of the server blades,

switching subsystem, and power supply

subsystem

• Intelligent fan speed adjustment and high

efficiency heat dissipation

• Air vents in the backplane ensuring the shortest

air channels for nodes

• 1.5U space allowing for large air intake space

Processor (Tock) Processor Processor Type Processor with the

Highest Power

Release Date MAX TDP

Romley Ivy-Bridge IVB-EP 2S E5-26XX V2 2013 Q3 135 W (plan)

IVB-EP 4S E5-46XX V2 2013 Q4 130 W (plan)

IVB-EX E7-48XX V2

E7-88XX V2

2013 Q3 155 W (plan)

Grantly Haswell HSW-EP 2S E5-26XX V3 2014 145 W (plan)

HSW-EP 4S E5-46XX V3 2014 135 W (plan)

HSW-EX 2S E7-48XX V3

E7-88XX V3

2014 165 W (plan)

Next Generation > 165 W?

More cores need to be integrated into a processor due to

virtualization applications of data centers and competition

requirements, especially competition between the RISCtolA and the

midrange computer. As a result, processor power consumption is still

on the rise. From the released Intel road map, the maximum power

consumption of processors for servers increases to 155 W and 165

W. The HUAWEI Tecal E9000 meets the predicted requirements by

providing excellent heat dissipation design for compute nodes, which

facilitates applications of processors of 165 W or higher.

• Wide operating temperature range: Compute nodes' long-

term operating temperature ranges from 0°C to 40°C (32°F to

104°F).

• 700 W heat dissipation for a half-width compute node slot

• 1400 W heat dissipation for a full-width compute node slot

• 280 W heat dissipation for a switch module slot

• Compute nodes supporting the Intel E5/E7 processor family

work efficiently when DIMMs are fully configured.

41

Why the Huawei E9000 Uses a 12U Chassis?

Descrip

tion

Advantages of a 12U chassis

12U is the optimum height designed based on computing density, computing and storage capabilities, and long-term

evolution. 12U helps customers maximize ROI and minimize TCO by providing a wide range of hardware expansion

resources. 12U has the following advantages:

• With 12U height, the E9000 chassis has sufficient heat dissipation capabilities, can operate properly for a long term at 40°C

(104°F) to adapt to more severe environments, and follows the processor development trend and overall component power

consumption development trend of the next six or eight years to help customers maximize ROI.

• 12U provides 2.4-inch height per slot so that each slot can house 2.5-inch hard disks in three drawers and 3.5-inch hard disks

in two drawers. This greatly expands system storage capacity to better support integration with distributed storage and big

data applications.

• 12U space can house 16 half-width slots and 8 full-width slots. Each node supports DIMMs at 1.5 times the usual height.

Conventional blade server vendors reduce the chassis height to increase computing density per unit space. Such design

leads to the use of standard-height DIMMs and VLP DIMMs, which are less cost-effective than DIMMs at 1.5 times the usual

height.

Note：

Note: If a competitor promotes 10U height with four chassis in a rack during bidding, attempt to purchase the customer as

follows:

The three chassis in an E9000 rack provide higher computing density (CH140) than the four chassis in the competitor' rack, and reserve 4U space for placing storage devices, switches, rack servers, and other devices.

42





Agenda

5 Ordering Guide


43

Application Scenarios

IO Acceleration components

PCIe SSD, GPU

Network GE, 10GE, 8GFC, FCoE, Infiniband switch, TRILL large layer 2 data center switches

Storage IPSAN, FC-SAN, FCoE, distributed storage

Computing 2S, 4S computing nodes, storage expansion, IO expansion computing nodes

The modular converged architecture meets various workload requirements

Enterprise Datacenter

Virtual Desktop

Appliance

HPC

Key Application

Physical machine, VM, and infrastructure with converged computing, storage, and networking resources

VDI in a BOX

Application performance acceleration， High-speed Fabric interconnection， Business intelligence/DW, memory database, big data

Four-socket compute nodes supported in half-width slots,

InfiniBand switching RISC to IA

44

Enterprise Data Center Application Physical and Virtual Servers

Enterprise Datacenter Application

LAN

GE

10GE

8*8G FC

FC SAN

iSCSi

FCOE

8G FC

SAN

10GE

LAN

IPSAN

FCSAN

Typical Configuration

• E9000 chassis

• CH121 2-socket compute node (for web, middleware, and application VM

deployment)

• CH220 resource expansion 2-socket compute node

• CH222 storage expansion 2-socket compute node

• CH240 4-socket compute node (database physical machine deployment)

• Large-capacity SSD cards with application acceleration for email, ERP, CRM,

databases, and BI

• CX110 and CX311 switch modules

• GE, 10GE, FCoE, and FC switching, providing a converged network to

improve management convenience, flexibility, and scalability.

45

VDI in a Box Computing and Storage Convergence Without SAN

VDI in a box

GE/10GE

LAN

Typical Configuration

• E9000 chassis


• CX110 switch module

• PCIe SSD card

Features

• Supports 128 processor cores, 6 TB memory capacity, and up to 128 TB

raw storage capacity.

• Supports 500 (heavy) to 1000 (light) virtual desktop infrastructure (VDI)

users.

• Supports deployment of an OS and hot applications on PCIe SSD cards,

which reduces the VDI startup peak, increases IOPS by 800%, and reduces

costs by 20%.

• Supports the disk drawer and hot-swappable disks to reduce the time

required to rebuild data during disk replacement.

• Supports the virtual block storage (VBS) distributed harsh table (DHT) ring

to protect shared disk storage in cross-server mode.

46

MPP Architecture OLAP for BI, DW, and In-memory Database

MPP Architecture Typical Configuration

• E9000 chassis


• CH240 4-socket compute node (1.5 TB memory capacity)

• PCIe SSD card


Features

• Provides 2-socket 24-DIMM computing capability per node. Supports 15

disks per node.

• A 4-socket 48-DIMM analysis node provides 1.5 TB memory capacity to

support the memory database and real-time analysis.

• Each node provides service bandwidth of 20GE. The switch latency is in ns,

which removes the IO bottleneck during the ETL process.

• The large-capacity PCIe SSD card is used for the index and hot data cache,

which greatly improves the IOPS of the parallel database.

56G IB

10GE LAN

47

Unstructured Database Application Hadoop, Hbase Application

Unstructured Database Application Typical Configuration

• E9000 chassis

• CH121 2-socket compute node

• CH222 2-socket storage expansion compute node (for web, middleware,

application VM deployment)

• Hadoop hardware compression card


Features

• A NameNode 2-socket compute node can provide a cost-effective large

memory with up to 768 GB memory capacity.

• A DataNode 2-socket compute node supports 15 x 2.5" disks, and provides

40GE service bandwidth (4GE per node).

• The compression card improves Hadoop performance by 20%, and reduces

network traffic by more than 60%, CPU usage by over 80%, used disk space

by more than 50%, and disk I/O data read and write operations by over 50%.

GE LAN

10GE

48

Key Applications RISC to IA, Unix Migration

Key Applications Typical Configuration

• E9000 chassis

• CH121 2-socket compute node (for web, middleware, and application VM

deployment)

• CH240 4-socket compute node (database physical machine deployment)

• CH280 8-socket compute node (2013)

• PCIe SSD card

• CX110 and CX311 switch modules

Features

• Supports the VM resource pool for web, application, and middleware layers

and virtual NICs to increase network throughput, which ensures VM security.

• The OLTP database is deployed on physical machines, which supports

stateless computing and migration, and use FC SAN for shared storage.

• Supports a large-capacity cache by using PCIe SSD cards to improve I/O

performance for databases.

• Supports highly reliable redundancy for PSMs (N+1/N+N) and fan modules.

12 x GE

uplink ports

16 x 10GE

uplink ports

8 x GE

downlink

ports FC

8 x GE

downlink

ports

32 x 10GE

uplink ports

LAN

8G FC

SAN

49

High Performance Computing HPC Application

HPC Feature

• CH140 Twin Computing Node: High-density computing

• Supports 2*2-socket compute nodes in half-width slots

• Supports 64 Intel Xeon E5-2600 processors in a chassis.

• Supports 192 E5-2600 processors in a rack(3 chassises).

• Supports 12 TB memory capacity

• Supports InfiniBand QDR/FDR

• Supports InfiniBand EDR evolution

• Supports GPU and SSD resource expansion

CH140 4S high density computing node

CH221 IO expansion 2S computing node

50

Customer requirements

As the dispatching and directing management system is closely related to

production security, the China Railway Engineering Corporation (CREC) requires a

system with high reliability and security.

The dispatching and directing management system frequently transmits data,

which imposes a high requirement on the data transmission latency.

The system must be easy to maintain.

Highlights

Reliability: The E9000 uses a passive backplane and fully redundant key

components, which greatly improves system reliability.

Real-time capability: The E9000 backplane provides a switching capability of up

to 15.6 Tbit/s, ensuring high-speed data switching for internal service modules.

Maintainability: The E9000 provides unified eSight management interfaces for

configuring, monitoring, and managing the chassis, PSUs, fan modules, switch

modules, and compute nodes.

Case: Dispatching and directing management

system for CREC

51

Customer requirements

• Storage: The distributed storage solution is used to allow all compute nodes to

share the storage space.

• Computing: The system supports the next-generation Intel CPUs with the data

processing capability of 8 TFLOPS at peak values.

• Network: The multiple-plane networking is used to isolate the computing, storage,

and management networks.

Solution

• The Lustre distributed storage solution is used, and compute nodes and storage

nodes are selected for the Lustre networking.

• The existing platform can be smoothly upgraded to Ivy Bridge, which meets

requirements for the architecture and computing performance.

• The GE, 10GE, and IB networking solutions are provided, and physical planes are

isolated, which ensures stable service operating.

Case: HPC for UK XX University

52




5 Ordering Guide


Agenda


53

E9000 Chassis Advantages

Ad

va

nta

ge

s

E9000 chassis advantages

Switching Industry-leading backplane switching capability of 15.6 Tbit/s

Storage 8 CH222 storage nodes, configured with 120 x 2.5" internal

hard disks in a chassis for providing the largest internal

storage capacity in a chassis.

Computing 64 Romely EP 130 W CPUs in a chassis, with the highest

density in the industry

Heat

dissipation

Support for stable operating at 40°C

Note:

A.Only IBM servers support the 40°C specifications among

competitors.

B.The CH140 twin compute nodes support the temperature

range from 5°C to 35°C, and therefore the CH140 twin

compute nodes support CPUs of up to 130 W.

PSU 80 Plus Platinum PSUs with power efficiency of 94.6%, which

is 5% higher than the industry level

54

E9000 Compute Node Advantages A

dva

nta

ge

s

Form Factor

Half-width CH121 N/A

DIMMs at 1.5 times the

usual height

One PCIe x8 FH HL SSD on

each compute node

Half-width CH140 twin

compute nodes Independent

node

maintenance

64 x 130 W E5-2600

CPUs in a chassis, with

the highest density in

the industry

N/A N/A N/A

Full-width CH220 I/O

expansion node N/A N/A


usual height N/A

4 PCIe x8 FH HL slots for

installing 4 GPU or PCIe SSDs

per compute node

Full-width CH221 I/O

expansion node N/A N/A


usual height N/A N/A

Full-width CH222 storage

node N/A N/A


usual height

15 x 2.5" hard disk slots in a full-width

slot of 1.5U One PCIe x8 FH HL SSD on

each compute node

Full-width, 4-socket E5-

4600 CH240 compute node N/A N/A


usual height

8 x 2.5" hard disk slots (The number of

hard disks supported on a 4-socket

compute node is twice that of a

conventional 4-socket compute node.)

N/A

Full-width, 4-socket E7-

4800 CH242 compute node N/A N/A N/A

8 x 2.5" hard disk slots (The number of

hard disks supported on a 4-socket

compute node is twice that of a

conventional 4-socket compute node.)

One PCIe x8/x16 FH HL slot

CPU Memory Storage PCIe Expansion Compute Node

55

Competitiveness Comparison Between the E9000

and Products from Tier 1 Competitors Key

Competitiveness Key Feature HP C7000 G8 IBM FlexSystem Cisco UCS G3 Dell M1000e HUAWEI E9000

Engineering capability Power supply and heat dissipation for

front and rear slots 1200 W/100 W 1200 W/100 W 1200 W/100 W 1400 W/280 W 1400 W/280 W

Computing capability Computing capability per chassis 32 56 16 64 (E5-2400) 64

Memory capacity Memory capacity per chassis

(mainstream chips) 8.2 TB 10.8 TB 6.14 TB 12.3 TB 12.3 TB

Storage capability

2.5" disk quantity per slot 12 12 12 4 15

Convergence of computing and storage

resources External SAN

External SAN

Internal SAN External SAN External SAN

External SAN

Internal distributed storage

Network switching

backplane capability 6.144 Tbit/s 7.168 Tbit/s 1.28 Tbit/s ? 15.6 Tbit/s

Number of 10GE ports per chassis 120 64 16 ? 128

Maximum plane quantity 4 2 1 3 5

Multi-plane networking Y Y N Y Y

10GE/FCoE converged switch module Y Y Y Y Y

40GE Y N Y Y Y

RoCE N Y N N Y

16G FC N Y N Y N

PCIe expansion Maximum number of standard PCIe slots

per compute node N 2 PCIe x8 + 2 x PCIe x16 slots N N

4 PCIe x8 or

2 PCIe x16 slots

Operating environment Ambient temperature 5°C to 35°C 5°C to 40°C 5°C to 35°C 5°C to 35°C 5°C to 40°C

56

HUAWEI E9000 IBM Flexsystem HP c7000 Cisco UCS 5108 Dell M1000e

Target field HPC, virtualization, and high-end enterprise

applications

Converged architecture Large enterprise data center Enterprise data center Universal compute node

Dimensions 12U, 20.9" (530.2 mm) H

17.4" (442 mm) W

33.1" (840 mm) D

10U, 17.3" (440 mm) H

17.4" (442 mm) W

31.5" (800 mm) D

10U, 17.4" (442 mm) H

17.6" (447.04 mm) W

32.0" (813 mm) D

6U, 10.5" (267 mm) H

17.5" (445 mm) W

32" (812 mm) D

10U, 17.3" (440 mm) H

17.6" (447 mm) W

29.7" (754 mm) D

Maximum number

of supported

compute nodes

10U/16 FH or 8 FH server blades (vertical)

blades (horizontal)


blades (horizontal)


blades (vertical)

10U/8 FH or 8 FH server blades

(vertical)

blades (horizontal)


blades (vertical)

PSU Max 6 x 3000 W AC or

6 x 2500 W DC

Max 6 x 2500 W AC Up to 6 x 960 W/2250 W Output

Up to 6 x 2400 W Output

Single-phase AC or -48 V DC

4 x 2500 W

220 V single-phase AC

6 x 2700 W hot-plug PSUs

110 V to 120 V or 208 V to 240 V AC

Fan module 14 hot-swappable fan modules 10 hot-swappable fan modules 10 fan modules 8 hot-swappable fan modules 9 hot-swappable fan modules

Switch module ≤ 4

GE, 10GE, 8G FC, FCoE, and InfiniBand

QDR/FDR

≤ 4

GE, 10GE (40GE ports available), 8G/16 G

FC, FDR InfiniBand, SR-IOV, and FCoE

≤ 8

GE, 10 GE, 8 GFC, QDR InfiniBand, and SAS

≤ 2

Each switch module providing 4 x

10GE SFP+ ports (FCoE)

≤ 6

GE, 10GE, 8G FC, and InfiniBand QDR/FDR

Other features Most hard disks supported on a compute

node

Support for DIMMs at 1.5 times the usual

height

IBM new-generation blade server, planned

for replacing the BladeCenter products

Widely deployed enterprise-level blade

server

released in 2007

Released in 2009

Important part of the UCS

Similar architecture with the HP c7000

64 server blades supported in four chassis in

40U

2-socket compute

node

CH121/CH140 (twin node)/CH221/CH222 X86: X220/X222 (twin node)/X240

Power: p24L/p260

BL460c Gen8, BL420c Gen7, BL620c G7,

BL465c Gen8…

B200 M2/B250 M2/B230

uiM2/B200M3/B22 M3

M420 (twin node), M520, M620…

4-socket compute

node

CH240/CH242 X86:x440

Power:p460

BL680c G7 (4 blades), BL685c G7 (8

blades), and BL660c Gen8 (8 blades)

B440 M2/B420 M3 M820, M910, M905

Weight Empty chassis: 70 kg (154.32 lb)

Fully configured with 2-socket compute

nodes: 212 kg (467.38 lb)

Fully configured with 4-socket compute

nodes: 223 kg (491.63 lb)

Empty chassis: 99 kg (218 lb)

Fully configured: 224 kg (493 lb)

68.5 kg (DC PSUs, compute nodes only in the

chassis)

87 kg (single-phase AC)

100.7 kg (three-phase AC)

Configured with compute nodes

only in the chassis: 40.8 kg (89.95

lb)

Full configuration: 115.7 kg (255.07

lb)

Max fully loaded with server blades and rear

modules: 178 kg

Chassis Specifications Comparison--E9000 vs. Tier 1 Competitive Products

57

Compute Node Comparison--E9000 vs. IBM Flexsystem

X222 Flexsystem

Half-width 2 x 2-socket twin

compute nodes

X240

Half-width 2-socket compute

node

Full-width 2-socket + I/O

expansion node

CH121 CH220 CH221 CH140

E9000 Compute Node CH222 CH240 CH242

Half-width 2-socket

compute node

Half-width 2 x 2-socket twin

compute nodes

Full-width I/O

expansion node Full-width I/O

expansion node

Full-width storage

expansion node

Full-width 4-socket E5-4600

compute node


compute node

D

A

A A

A DIMMs at 1.5

times the

usual height

B More standard PCIe cards

supported

C Larger local storage

capacity

D CPUs of later series E Independent

maintenance

F Long-term stable operating at

40°C

G More DIMMs

supported

H Flexible configuration

of RAID controller

cards

I Others

X240 + I/O

expansion node

58

Compute Node Comparison--E9000 vs. IBM

Flexsystem

Flexsystem

CH121 CH220 CH221 CH140


Half-width 2-socket

compute node

Half-width 2 x 2-socket

twin compute nodes

Full-width I/O expansion

node

Full-width I/O expansion node Full-width storage

expansion node

Full-width 4-socket E5-

4600 compute node


4800 compute node

A DIMMs at 1.5

times the

usual height


supported


capacity


maintenance

F Long-term stable operating at

40°C

G More DIMMs

supported

H Flexible configuration

of RAID controller

cards

I Others


compute node

X440

A/C/H B/C/D/H

• The CPU with the highest performance in the Intel E5-2600 series is the E5-2690 CPU (20 MB cache, 8 cores, 2.90 GHz, and 135 W).


A/C

X240 + storage

expansion node

Full-width 2-socket +storage

expansion node

59

How to Defend Against IBM Flexsystem

How to defend against the Flexsystem?

• The Flexsystem supports the internal storage device V7000.

The V7000 occupies 3U space and has limited expansion capability. The Huawei external storage device S2600T or S5500T provides

the same storage capacity as the V7000 in a just 2U space and higher expansion capability than the V7000.

• A Flexsystem I/O expansion node provides more PCIe slots than the E9000 CH221.

The Flexsystem I/O expansion node uses a PCIe switch to provide PCIe slots. However, the communication bandwidth between the

switch and the CPU is the bottleneck. The E9000 CH221 provides two PCIe x16 slots directly from the CPU, supporting a higher

bandwidth.

• The Flexsystem provides 16G FC ports.

The mainstream products provide 8G FC ports because the 16G FC specification has poor cost effectiveness.

• The E9000 provides the 4-socket E7-4800 CH242 compute node, while IBM does not provide any similar product.

Persuade customers to use the high-end E7-4800 compute node to beat IBM.

60

Compute Node Comparison--E9000 vs. HP C7000 CH121 CH220 CH221 CH140


Half-width 2-socket

compute node


twin compute nodes


node

Full-width I/O expansion node Full-width storage expansion

node


compute node


compute node

BL460c Gen8

C7000 Compute Node

Half-height 2-socket E5-

2600 compute node

BL660c Gen8

Full-height 4-socket E5-

4600 compute node

BL680c Gen7


4800 compute node

A/B/F/G/I

I: The 460c has to use

four fewer DIMMs

when E5-2690 series

CPUs are configured.

A/C/F/G B/C/D/F

B/C/F/I

I: The 680c occupies four

slots. A chassis supports

only four 4-socket E7

compute nodes.

A DIMMs at 1.5 times

the usual height

B More standard PCIe

cards supported


capacity


maintenance

F Long-term stable

operating at 40°C

G More DIMMs supported H Flexible configuration

of RAID controller

cards

I Others



61

How to Defend Against the HP C7000

How to defend against the C7000?

• The BL680 supports 64 DIMMs.

A chassis supports four BL680s, and each BL680 is configured with 64 DIMMs. This configuration provides low density and supports a

complex stacking structure, which induces a high failure rate. The E9000 CH242 supports 32 DIMMs. A chassis supports eight CH242s,

which provides higher density and supports more hard disks and PCIe cards than the BL680.

• GE + FC networking

The E9000 currently does not support GE and FC networking. Persuade customers to use the 10GE and FC networking. If GE or FC

networking is required, recommend the E6000 GE and FC, or E9000 10GE and FC networking to customers. Currently, the E9000 GE

and FC solutions are under development and will be released in April of 2014.

• Brocade FC switch

The E9000 that supports the Brocade FC switch was on sales in October of 2013.

62

Compute Node Comparison--E9000 vs. Cisco UCS

B200M3

UCS

Half-width 2-socket

compute node

B420M3


4600 compute node

B440M2


4800 compute node

A/B/F

A/C/F

C/B/F/I I: supports E7-4870 (130

W). The server blades that use the 130 W E7-

4870 CPUs were recalled due to the

overtemperature.

CH121 CH220 CH221 CH140


Half-width 2-socket

compute node


twin compute nodes


node

Full-width I/O

expansion node Full-width storage

expansion node


compute node


compute node


the usual height


supported


capacity


maintenance

F Long-term stable

operating at 40°C

G More DIMMs supported H Flexible configuration

of RAID controller

cards

I Others



63

How to Defend Against the Cisco UCS

How to defend against the Cisco UCS?

• Storage or PCIe expansion computing nodes

UCS does not provides blades such as storage expansion node(E9000 CH222) or PCIe expansion node(E9000 CH220/221 alike);

• Open protocol and different network type

UCS only supports 10GE FCoE, and the network environment is not open to regular equipment because of its private protocol, so it

can not meet the demand of interconnection availability of blades and third party’s TOR switches, besides, it also can not compliant to

the features of supporting different network type such as FC, GE, or physically isolated multi-plane networking;

64

Compute Node Comparison--E9000 vs. Dell M1000e CH121 CH220 CH221 CH140


Half-width 2-socket

compute node


twin compute nodes


node

Full-width I/O

expansion node Full-width storage

expansion node


4600 compute node


4800 compute node

C/D/G

A/B/F/I

I: The M620 cannot

support the E5-2690

CPUs. The M620

supports four fewer

DIMMs when the E5-

2667 CPUs are

configured.

A/C/F

M420 M1000e

1/4-height, high-density node

M620

Half-height 2-socket

compute node

M820


4600 compute node


4800 compute node

M910

B/C/F/I

I: The M910 supports

the E7-4830 CPUs of

up to 105 W.

A DIMMs at 1.5 times the usual height B More standard PCIe cards supported C Larger local storage

capacity


maintenance

F Long-term stable

operating at 40°C

G More DIMMs supported H Flexible configuration of RAID

controller cards

I Others

65

How to Defend Against the Dell M1000e

How to defend against the Dell M1000e?

• Six I/O switch modules

The E9000 provides four physical I/O switch slots to implement five switching planes. The Dell M1000e supports only three switching

planes.

The E9000 provides more ports on switch modules than the Dell M1000e.

• GE + FC networking

The E9000 currently does not support GE and FC networking. Persuade customers to use the 10GE and FC networking. If GE or FC

networking is required, recommend the E6000 GE and FC, or E9000 10GE and FC networking to customers. Currently, the E9000 GE

and FC solutions are under development and will be released in April of 2014.

• Brocade FC switch

The E9000 that supports the Brocade FC switch was on sales in October of 2013.

66

Compute Node Comparison--E9000 vs. IBM BladeCenter

CH121 CH220 CH221 CH140


Half-width 2-socket

compute node


twin compute nodes


node


node Full-width storage

expansion node


4600 compute node


4800 compute node

A/B//F/G/I

I: I: The HS23 does

not support the E5-

2690 CPUs but

supports only the high-

cost VLP DIMMs.

HS23 BladeCenter

Full-height 2-socket

compute node


the usual height


supported

C Larger local

storage capacity


maintenance

F Long-term stable

operating at 40°C

G More DIMMs supported H Flexible configuration of

RAID controller cards

I Others

• The BladeCenter is gradually replaced by the Flexsystem.



67


5 Ordering Guide

Agenda 1 Click to add Title Market Overview and Positioning




68

集群NAS引擎

服务

存储单元

Type of the server blade

One server need base parts

Mezz Card

Blade Type

Base Parts

Mezz Parts

Opt Parts

Quotation Elements for the Blade System

Server Blade

Optional parts on demands

Blade Chassis

Chassis Type

Base Parts

Switch Module

Opt Parts

Server blade

Chassis need base parts

Network switch

Optional parts on demands

69

Blade System Product Configuration Procedure Start the

UniSTAR tool.

Select Fibre

Channel modems.

Select optional parts.

Select a model of

Server blade.

Determine if the

riser card need.

Determine the PCIe card quantity.

Select PCIe card

type in the PCIe

slots.

(optional)

Select a blade from the E6000 or E9000

Select base parts.

CPU quantity

Memory quantity

CPU type

Memory type

Hard Disk quantity Hard Disk type

RAID card type

Determine if the

DVD need

Determine if

the OS need Select OS type.

Select OS

version

Determine if the

insert card need

Select network internet card Select mezz card.

Start the

UniSTAR tool.

Select Fibre

Channel modems.

Select optional parts.

Select a model of

blade chassid.

Select the chassis according to blade

Select base parts. Fan module quantity

Power quantity Power type

Determine if the

DVD need

Select network switch according to blade Select switch.

Determine if the

rail need

Management module quantity

70

What Is SCT?

SCT: a swift, smart, and simple online

configuration quotation tool

SCT: simplifying configuration quotation

The SCT comprehensively shows

the latest and hot Huawei

products, updates data in real

time, and enables quick product

selection, helping you learn about

Huawei products conveniently.

Easy quotation order creation,

specific discount settings,

automatic price verification,

and convenient quotation

order management help you

comprehensively create and

manage quotation orders.

Intelligent product

configuration, automatic

configuration verification, and

configuration sharing simplify

product configuration, ensure

configuration accuracy, and

help you complete

configuration easily.

Quick learning about

Huawei products Intelligent product configuration Easy quotation order creation

Product Configuration Quotation

Back to the Agenda

71

How to Obtain SCT Access Permission

SCT login

Use your Huawei account to log in to the following website:

http://app.huawei.com/unistar/sct

NOTE:

You can log in to the SCT as user Guest to view and configure products. Enter the verification code to directly log in to the SCT.

The recommended resolution is 1280 x 1024. Supported browsers include Internet Explorer 8.0, Firefox 11.0+, Safari 5.12+, and

Chrome 19.0+.

If you already have the eCFG permission, use your W3

account for login.

If you do not have the eCFG permission, use the

permission application e-Flow to apply for data package

permission of the corresponding product line.

For a Huawei product manager For a dealer

If you do not have a Huawei account, register

an account at Huawei's official website.

If you already have a Huawei account, send

your account to the channel manager to apply

for the SCT permission.

Account/Permission application



http://w3.huawei.com/dominoapp/it/isr/unistarcfg/unistarappflow.nsf/fmMain?Openform



https://uniportal.huawei.com/uniportal/

72

SCT functions

Product

Enables you to select a product for

configuration.

Configuration

Enables you to create a configuration item,

view the configuration list, add or delete a

product, and modify product configuration.

Quotation

Enables you to create a quotation item,

view the quotation list, and add, delete, or

modify product configuration.

1

2

3

73






Agenda

5 Ordering Guide

74

How to Get Huawei Document Resource

Policy

– Learn about the channel partner policy.

Query and Application

– Query or apply for partners.

Documents and Tools

– Query pre-sales documents and tools of partners.

Solutions

– Obtain solution cooperation information.

Method 1: enterprise website

http://enterprise.huawei.com/en/

Method 2: email

[email protected]

Method 3: Document User Guide

How can I obtain

pre-sales

documents?

http://www.huawei.com/enterprise/


75

How to Get Pre-sale Help

[email protected]

http://enterprise.huawei.com

/en/about/contact

Support Center

Huawei Experts Team

Partners

Partners

7*24 hours presales email and

telephone support

Products and solutions consulting



http://enterprise.huawei.com/en/about/contact/index.htm

http://enterprise.huawei.com/en/about/contact/index.htm

Copyright©2012 Huawei Technologies Co., Ltd. All Rights Reserved.

The information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product

portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive

statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time

without notice.

HUAWEI ENTERPRISE ICT SOLUTIONS A BETTER WAY