HybridPack 1

System Engineer ing

Appl icat ion Note V2.0, 2010-04

Hybr id Ki t for Hybr idPACK™1

Evaluat ion Ki t for Appl icat ions wi th Hybr idPACK™1 Module

Hybr idPACK™

Edition 2010-04Published byInfineon Technologies AG81726 Munich, Germany© 2010 Infineon Technologies AGAll Rights Reserved.

Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.

InformationFor further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com).

WarningsDue to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office.Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

http://www.infineon.com

Hybrid Kit for HybridPACK™1Evaluation Kit for Applications with HybridPACK™1 Module

Application Note 3 V2.0, 2010-04

Trademarks of Infineon Technologies AGA-GOLD™, BlueMoon™, COMNEON™, CONVERGATE™, COSIC™, C166™, CROSSAVE™, CanPAK™,CIPOS™, CoolMOS™, CoolSET™, CONVERPATH™, CORECONTROL™, DAVE™, DUALFALC™, DUSLIC™,EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, E-GOLD™, EiceDRIVER™,EUPEC™, ELIC™, EPIC™, FALC™, FCOS™, FLEXISLIC™, GEMINAX™, GOLDMOS™, HITFET™,HybridPACK™, INCA™, ISAC™, ISOFACE™, IsoPACK™, IWORX™, M-GOLD™, MIPAQ™, ModSTACK™,MUSLIC™, my-d™, NovalithIC™, OCTALFALC™, OCTAT™, OmniTune™, OmniVia™, OptiMOS™,OPTIVERSE™, ORIGA™, PROFET™, PRO-SIL™, PrimePACK™, QUADFALC™, RASIC™, ReverSave™,SatRIC™, SCEPTRE™, SCOUT™, S-GOLD™, SensoNor™, SEROCCO™, SICOFI™, SIEGET™,SINDRION™, SLIC™, SMARTi™, SmartLEWIS™, SMINT™, SOCRATES™, TEMPFET™, thinQ!™,TrueNTRY™, TriCore™, TRENCHSTOP™, VINAX™, VINETIC™, VIONTIC™, WildPass™, X-GOLD™, XMM™,X-PMU™, XPOSYS™, XWAY™.

Other TrademarksAMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ islicensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum.COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ ofEpcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium.HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ ofInfrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION.MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ ofMentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc.,USA. muRata™ of MURATA MANUFACTURING CO. OmniVision™ of OmniVision Technologies, Inc.Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ ofSirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™,PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™,WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.Last Trademarks Update 2009-10-19

Hybrid Kit for HybridPACK™1 Revision History: 2010-04, V2.0Previous Revision: V1.1Page Subjects (major changes since last revision)All Many editorial changes due to next generation Hybrid Kit for HybridPACK™1


Table of Contents


Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91.1 How to Order Hybrid Kit for HybridPACK™1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91.2 Support for Hybrid Kit for HybridPACK™1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2 Design Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112.1 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112.2 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122.3 Key Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132.3.1 Driver Board (6ED100HP1-FA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132.3.2 Logic Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132.3.3 HybridPACK™1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132.3.4 DC-Link Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142.3.5 Cooling Element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3 Evaluation Driver Board for the HybridPACK™1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.1 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.2 Key Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183.3 External Connector Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183.4 Mechanical Dimensions of the Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193.5 Operation of the Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203.5.1 Switching Mode Power Supply (SMPS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213.5.2 Input Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213.5.3 IGBT Switch-off Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213.5.4 Maximum Switching Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223.5.5 Booster . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233.5.6 Short Circuit Protection and Clamp Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233.5.7 Fault Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253.5.8 Temperature Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263.5.9 DC Voltage Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273.6 Switching Losses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283.7 Definition of Layers of Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283.8 Schematics, Layout and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293.8.1 Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293.8.2 Assembly Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333.8.3 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353.8.4 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

4 Logic Board for Hybrid Kit for HybridPACK™1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424.1 External Connector (X1-SIG1) Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424.2 Connector to the Driver Board (K1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454.3 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454.4 Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454.4.1 Configuration of TC1767 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454.4.1.1 Boot Configuration of TC1767 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 464.4.1.2 Selecting Serial/Parallel Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 464.5 Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Table of Contents


Table of Contents


4.6 Phase Current Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 474.7 Temperature Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 474.8 Resolver Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 474.9 Encoder Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484.10 Hall Sensor Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484.11 GMR Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484.11.1 GMR SSC Interface Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 494.11.2 GMR Encoder Interface Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504.11.3 GMR Hall Sensor Interface Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504.12 Definition of Layers for the Logic Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504.13 Schematics, Layout and Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 514.13.1 Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 514.13.2 Assembly Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 594.13.3 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 604.13.4 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64


List of Figures


Figure 1 The Hybrid Kit for HybridPACK™1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Figure 2 Serial number in the suitcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Figure 3 Block Diagram of Hybrid Kit for HybridPACK™1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 4 Dimensions of the Hybrid Kit for HybridPACK™1 - front view (all dimensions are in mm). . . . . . . 12Figure 5 Dimensions of the Hybrid Kit for HybridPACK™1 - side view (all dimensions are in mm) . . . . . . . 12Figure 6 HybridPACK™1 IGBT Six-Pack Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 7 DC-Link Capacitor for HybridPACK™1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Figure 8 Technical drawing of the DC-Link Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Figure 9 Example of Water Cooling Element for HybridPACK™1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Figure 10 Water Cooling System Technical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Figure 11 Driver Board Mounted on the Top of the HybridPACK™1 Module. . . . . . . . . . . . . . . . . . . . . . . . . 17Figure 12 External Connector on the Driver Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Figure 13 Dimensions of the Driver Board (in mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Figure 14 PCB Mounting Stand-offs of HybridPACK™1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Figure 15 Hybrid Kit for the HybridPACK™1 Evaluation Driver Board Block Diagram. . . . . . . . . . . . . . . . . . 20Figure 16 Schematic of the Input Logic Block of the Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Figure 17 Maximal Switch-off Current at Different DC-Link Voltages (Gate Resistance as a Parameter) . . . 22Figure 18 Temperature of Gate Resistors vs. Switching Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Figure 19 Desaturation Protection and Active Clamping Diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Figure 20 a) Short Circuit without Active Clamp (DC Voltage=71V, Voltage Overshoot=612V)

b) With Active Clamp Function (DC Voltage=280V, Voltage Overshoot=596V) 25Figure 21 Fault Output of a Single Driver IC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Figure 22 Fault Output During: a) Normal Operation b) Operation under Short Circuit . . . . . . . . . . . . . . . . . 26Figure 23 Characteristics of the Temperature Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27Figure 24 Characteristics of the DC Voltage Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28Figure 25 Copper and Isolation for Layers of Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28Figure 26 Schematics Block Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Figure 27 SMPS - Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30Figure 28 External Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30Figure 29 Fault Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Figure 30 Input Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Figure 31 IGBT Driver - Bottom Transistor of Phase U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32Figure 32 IGBT Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32Figure 33 DC Voltage & Temperature Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Figure 34 Assembly Drawing of the Driver Board (Top) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Figure 35 Assembly Drawing of the Driver Board (Bottom) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Figure 36 Driver Board - Top Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Figure 37 Driver Board - Layer-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Figure 38 Driver Board - Layer-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Figure 39 Driver Board - Layer-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Figure 40 Driver Board - Layer-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38Figure 41 Driver Board - Bottom Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38Figure 42 Logic Board for Hybrid Kit for the HybridPACK™1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Figure 43 Block Diagram of the Logic Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Figure 44 External Connector Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Figure 45 Overvoltage and Wrong Polarity Protection Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Figure 46 HW Boot Configuration of TC1767 DIP-Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46Figure 47 The Boot Configuration Switch (SW1) and Serial/Parallel Interface Select Switch (SW2) . . . . . . . 47Figure 48 GMR SSC Interface - Proposal Using TLE5012. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

List of Figures


List of Figures


Figure 49 Picture of Possible Physical Implementation of the GMR Sensor . . . . . . . . . . . . . . . . . . . . . . . . . 49Figure 50 Definition of the Layers for the Logic Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50Figure 51 Schematics Block Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51Figure 52 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Figure 53 JTAG Debug Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Figure 54 Connector (external) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53Figure 55 Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53Figure 56 Resolver Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54Figure 57 Level Shifter for Adapting Logic Levels for Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54Figure 58 Level Shifter for Adapting Logic Levels for Resolver IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55Figure 59 Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55Figure 60 Input Filter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56Figure 61 Microcontroller TC1767 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57Figure 62 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58Figure 63 GMR SSC Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58Figure 64 Temperature Sense of the Logic Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58Figure 65 Connector to the Driver Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59Figure 66 Assembly Drawing of the Logic Board (Top) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59Figure 67 Assembly Drawing of the Logic Board (Bottom) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60Figure 68 Logic Board - Top Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61Figure 69 Logic Board - Layer-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61Figure 70 Logic Board - Layer-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62Figure 71 Logic Board - Layer-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62Figure 72 Logic Board - Layer-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63Figure 73 Logic Board - Bottom Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63


List of Tables


Table 1 Key Data of DC-Link Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Table 2 Key Data and Characteristic Values (Typical Values) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Table 3 Bill of Materials for Hybrid Kit for the HybridPACK™1 Evaluation Driver Board . . . . . . . . . . . . . . 39Table 4 External Connector Pin Assignment Logic Board v1.3b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Table 5 User Startup Modes for TC1767 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46Table 6 Selecting Serial/Parallel Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46Table 7 Bill of Materials for Logic Board for Hybrid Kit for HybridPACK™1 . . . . . . . . . . . . . . . . . . . . . . . . 64

List of Tables


Introduction


1 IntroductionThe Hybrid Kit for HybridPACK™1 shown in Figure 1 was developed to support customers during their first stepsin designing applications with HybridPACK™1 IGBT module. The following chapters provide a detailed descriptionof the main components and their functionality. This information is intended to enable the customers to copy,modify and qualify the design for production, according to their specific requirements.The boards Hybrid Kit for HybridPACK™1 Evaluation Driver Board (further refered as “Driver Board” ) andHybrid Kit for HybridPACK™1 Logic Board (further refered as “Logic Board”) provided by InfineonTechnologies are subjected to functional testing only.Due to their purpose the system is not subjected to the same procedures regarding Returned Material Analysis(RMA), Process Change Notification (PCN) and Product Withdraw (PWD) as regular products.See Legal Disclaimer and Warnings for further restrictions on Infineons warranty and liability.

1.1 How to Order Hybrid Kit for HybridPACK™1Hybrid Kit for HybridPACK™1 and Hybrid Kit for HybridPACK™1 Evaluation Driver Board (that can beordered separately) have Infineon Technologies SAP numbers and can be ordered via Infineon Sales Partners.• SAP ordering number for Hybrid Kit for HybridPACK™1 : SP000806996Information can also be found at the Infineon Technologies web page: www.infineon.com

Figure 1 The Hybrid Kit for HybridPACK™1


Introduction


1.2 Support for Hybrid Kit for HybridPACK™1The new Hybrid Kits for HybridPACK™1 are labeled with a serial number inside the suitcase. That providesbetter support for you and a better issue tracking for us. If you need any support with the hardware or software justlet us known your issue and your serial number and we will try to help you as best we can. Where you can find theserial number inside the suitcase is shown on Figure 2.

Figure 2 Serial number in the suitcase


Design Features


2 Design FeaturesThe Hybrid Kit for HybridPACK™1 is made up of two PCBs (Driver Board and Logic Board) mechanically andelectrically suitable to be used with an IGBT Module HybridPACK™1 (included), a DC-link capacitor and a cooler.All these components build a complete main inverter for (H)EV applications up to 20kW.

Figure 3 Block Diagram of Hybrid Kit for HybridPACK™1

Figure 3 show the complete block diagram for the system and the following sections provide an overview of thesingle components including main features, key data, pin assignments and mechanical dimensions.

2.1 Main FeaturesComplete main inverter for (H)EV applications up to 20kW.• Automotive qualified IGBT module HybridPACK™1

– 650V/400A IGBT & Diode chip set• Automotive qualified Driver IC 1ED020I12-FA

– Based on coreless transformer technology– Up to 1200 V and 2A driving capability– VCE sat - detection

• TriCore™ family 32-bit microcontroller TC1767: member of the AUDO FUTURE product family designed for automotive applications

• Possibility of different motor position interfaces: encoder, resolver and GMR (Giant Magneto resistance))

IGBT module HybridPACK™1

6ED100HP1-FA Driver Board

IGBT driver 1ED020I12-FA

SMPS

Logic

IGBT temp mesurement

DC-voltage measurement

(isolated)

PWM

TempIGBT

FAULTSignals

RST

Vdc meas.

Logic Board

Supply

Connector

Supply

Debug Connector

MicrocontrollerTC1767

Resolver interface

Encoder / Sensor

Resolver

A/D IO

CAN / RS232

I, U, V currentmeasurement

EEPROM

Supply

Watchdog

LevelShifter

Vdc, Temp

Sensor






ResolverEncoder

RS232CAN

Current W

Current V

Current U

Co

nn

ec

to

r

Co

nn

ec

to

r

Motor3~


Design Features


2.2 DimensionsFigure 4 and Figure 5 shows the dimensions of a complete Hybrid Kit for HybridPACK™1.

Figure 4 Dimensions of the Hybrid Kit for HybridPACK™1 - front view (all dimensions are in mm)

Figure 5 Dimensions of the Hybrid Kit for HybridPACK™1 - side view (all dimensions are in mm)


Design Features


2.3 Key ComponentsFor detailed technical information about the different components please refer to the different web pages on theInfineon Internet.

2.3.1 Driver Board (6ED100HP1-FA)The 6ED100HP1-FA is a six channel IGBT driver board, specially designed for the HybridPACK™1 IGBT module.The main features and a detailed description of the board, including schematics and layout, can be found inChapter 3.

2.3.2 Logic BoardThe Logic Board contains all necessary components for the control of the system. Furthermore it offers theconnections to the motor positioning system (encoder, resolver or GMR) and to the current measurement system.For a detailed description of the board please refer to Chapter 3.

2.3.3 HybridPACK™1(see Figure 6) is a power module designed for mild Hybrid Electrical Vehicle (HEV) applicationswith a maximumsupply voltage of 450 V and a power range up to 20kW. Designed for a junction operation temperature at 175°C,the module accommodates a six-pack configuration of 3rd generation Trench-Field-Stop IGBT and matchingemitter controlled diodes and is rated up to 400A/650V. It is based on Infineon Technologies leadingTRENCHSTOP™ IGBT Technology, which offers lowest conduction and switching losses.

HybridPACK™1 is a baseplate module and can be screwed directly to a water- or air-cooled heat sink. For acompact inverter design the driver stage PCB can easily be soldered on top of the module. All power connectionsare realized with screw terminals. For detailed technical information of the module refer to the datasheet.

Figure 6 HybridPACK™1 IGBT Six-Pack Module


Design Features


2.3.4 DC-Link CapacitorThe power electronic capacitor B25655J4307K from the company Epcos AG (see Figure 7) is stronglyrecommended (included). Table 1 shows the main features of the capacitor. For dimensions of the DC-LinkCapacitor have a look on Figure 8. Please refer to the Epcos datasheet for further details.

Figure 7 DC-Link Capacitor for HybridPACK™1

Table 1 Key Data of DC-Link CapacitorCharacteristics Maximum ratings Test DataCR 300 µF ±10% Vs 600 V VTT 675V DC, 10 sVR 450 V DC î 1.2 kA Rins ·C ≥ 10000 sWR 30 Ws Is 4.8 kA tan δ (50 Hz) ≤ 8 · 10-4

Imax 80 A (dV/dt)max 4 V/µsLself 25 nH (dV/dt)s 16 V/µstan δ0 2 · 10-4

Rs 0.8 mΩ

Climatic Category 0/110/21(IEC 68-1/2)

Design Data Mean Life Expentancy

Tmin - 40 °C Dimensions l × w × h 140 × 72 × 50 mm tLD 15000hTmax + 110 °C Approx. weight 750 g αFQ 300fitMax. Rel. Humidity ≤ 95% Impregnation Resin FilledTstg - 45 … +110°C Terminals Flat Copper

Clearance 9 mmValues after Test Ca, IEC 68-2 (21 days, 40°C, 93% rel. humidity)

Creepage distance 9 mm

ΔC/C ≤ 5% Plastic CaseΔtanδ ≤ 4 ·10-4

Rins ·C ≥ 3000s


Design Features


Figure 8 Technical drawing of the DC-Link Capacitor


Design Features


2.3.5 Cooling ElementFor applications requiring higher power or higher operation temperature a usage of cooling element isrecommended. Figure 9 shows the low cost water cooling system that is included in the Hybrid Kit forHybridPACK™1 which is screwed directly to HybridPACK™1 - Figure 10 shows the technical drawings of it. Aheat sink for air cooling is also a possible solution, but it will be larger than this water heat sink.

Figure 9 Example of Water Cooling Element for HybridPACK™1

Figure 10 Water Cooling System Technical Drawings


Evaluation Driver Board for the HybridPACK™1


3 Evaluation Driver Board for the HybridPACK™1

Figure 11 Driver Board Mounted on the Top of the HybridPACK™1 Module

3.1 Main FeaturesThe Hybrid Kit for HybridPACK™1 Evaluation Driver Board offers the following features:• Six channel IGBT driver• Electrically and mechanically suitable for 600 V IGBT Module HybridPACK™1• Includes DC/DC power supply• Isolated voltage measurement• Short circuit protection with toff < 6 µs• Under Voltage Lockout of IGBT driver IC• Positive logic with 5 V CMOS level for PWM and Fault signals• One fault signal for each driver (LED signaling) and their combination for each leg• Design according to IEC-60664-1




3.2 Key DataAll values given in the Table 2 (bellow) are typical values, measured at TA = 25 °C

3.3 External Connector Pin AssignmentFigure 12 shows the pin assignment for the external connector (K1) on the Driver Board. The connector is aMMS-112-01-L-DV from Samtec, proper matching parts are the TW series for PCB connection or the TCMD seriesfor cable connection. It includes all necessary signals to get the board into operation, that is, supply, control andmonitoring.

Table 2 Key Data and Characteristic Values (Typical Values)Parameter Value UnitVSUPPLY – Voltage Supply +[8..18] VVPWM – PWM Signals for Top and Bottom IGBT (Active High) 0 / +5 VVFAULT – /FAULT Detection Output (Active Low) 0 / +5 VIFAULT – Max. /FAULT Detection Output Load Current 10 mAVRST – /RST Input (Active Low) 0 / +5 VISUPPLY – Supply Current Consumption (Idle Mode) (VSUPPLY=12V) 260 mAVOUT – Drive Voltage Level 15/-8 VIG – Maximum Peak Output Current ±10 APDC/DC – Maximum DC/DC Output Power of SMPS unit 30 WfS – Maximum PWM Signal Frequency 1)

1) The max. switching frequency for the HybridPACK™1module should be calculated separately. Limiting factors are: max. DC/DC output power of 4.6W per channel and max. PCB board temperature measured around gate resistors of 75°C for used FR4 material. For detailed information see Chapter 3.5.3

20 kHztPDELAY – Propagation Delay Time 200 nstPDISTO – Input to Output Propagation Distortion 15 nstMININ – Minimum Pulse Suppression for Turn-on and Turn-off2)

2) Minimum value tMININ given in 1ED020I12-FA IGBT driver datasheet

30 nsVDESAT – Desaturation Reference Level 9 Vdmax – Maximum Duty Cycle 100 %VCES – Maximum Collector – Emitter Voltage on IGBT 600 VTOP – Operating Temperature (Design Target)3)

3) Maximum ambient temperature strictly depends on load and cooling conditions

-40…+125 °CTSTO – Storage Temperature (Design Target) -40…+125 °CVIORM – Maximum Repetitive Insulation Voltage 4) (1ED020I12-FA Driver IC)

4) 1ED020I12-FA datasheet - complies with DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01.Basic Insulation

1420 VPEAKVISODRIVER – Maximum Insulation Test Voltage5) (1ED020I12-FA Driver IC)

5) 1ED020I12-FA datasheet - complies with UL 1577

4500 VrmsVISOBOARD – Maximum Insulation Test Voltage (Evaluation Board) 2500 Vrms




Figure 12 External Connector on the Driver Board

Pins 1 to 6 provide the power supply. The Driver Board must be supplied with an external regulated DC powersupply. The input voltage must be kept between 8 V and 18 V and the current consumption will depend on differentfactors (Logic Board, PWM frequency, etc.). Pins 7-8 provide 5 V analogue power supply which can be used tosupply different devices in case of using the Hybrid Kit for HybridPACK™1 as driver board in an inverter such ascurrent measurement, ADC or the motor interface.To pins 9, 10, 15 and 19 are connected monitoring signals: DC-link voltage measurement and temperature of thethree different phases inside of the IGBT module.Pins 12, 13, 14, 16, 17, 18, 20, 21, 22 and 23 contain the logic signals for controlling the 6 drivers on the board,that are the PWM signals, Fault detection and Reset signal.

3.4 Mechanical Dimensions of the Driver BoardThe Driver Board has placed components on both sides of the PCB. The maximum height of the Parts and thedimensions of the PCB is shown in Figure 13

Figure 13 Dimensions of the Driver Board (in mm)

RST _INnFLT Wn

FLT UnFLT n

PWM VB

PWM WTPWM WB

PWM UTPWM UB

12V

GND_DIG

T EM P_IGBTVDC

K1

M MS-112-01-L-DV

11

22

33

44

55

66

77

88

99

1010

1111

1212

1313

1414

1515

1616

1717

1818

1919

2020

2121

2222

2323

2424

GND_DIGGND_DIG

PWM VTFLT Vn

VANA50+5.0V

GND_ANA1

12V




The Driver Boards should be fastened by self taping screws and soldered to the auxiliary connectors on top of theIGBT module. The contact joints (solder points) between PCB and module auxiliary contacts should bemechanically relieved in order to disburden the solder connection as far as possible. Relieve of the contact pointsis carried out by mounting the PCB directly onto the module at the ten mounting stand-offs (see Figure 14) usingself-tapping screws (thread forming with 2.5mm diameter) or similar assembly material. The screws should bemounted in the sequence showed in Figure 14.

Figure 14 PCB Mounting Stand-offs of HybridPACK™1

3.5 Operation of the Driver BoardFigure 15 shows the block structure of the Driver Board. The following chapter describes these blocks in detail.

Figure 15 Hybrid Kit for the HybridPACK™1 Evaluation Driver Board Block Diagram

IGBT Driver

UT

IGBT Driver

UB

IGBT Driver

VT

IGBT Driver

VB

IGBT Driver

WT

IGBT Driver WB

SMPS 15V/-8V

15V/-8V15V/-8V

15V/-8V (x3)

5V5V 5V 5V

5V 5V 5V

Connector

LOGIC FAULT UFAULT V

FAULT W

RESET

FAULT W

FAU

LT VFAU

LT UFAU

LTR

ES

ET

INPUTLOGIC(PWM)

DC LINK VOLTAGE MEASUREMENT

IGBT MODULTEMP

IGBT MODUL TEMPERATURE

12V

DC LINKVOLTAGE

MEASUREMENT




3.5.1 Switching Mode Power Supply (SMPS)The Driver Board has an integrated DC/DC converter which generates the required secondary isolatedunsymmetrical supply voltage of +15/-8V. Top and bottom driver voltages are independently generated by usingone unipolar input voltage of 12 V.An additional supply voltage (5V) is generated and forwarded to the external connector (K1) so it can be used tosupply external components in the system (current measurement, motor interface, etc.)For circuit details please refer to Figure 27.

3.5.2 Input LogicThe Driver Board is a dedicated system for a six-pack HybridPACK™1 IGBT configuration - therefore it isnecessary to use 6 separated PWM signals. The schematics on Figure 16 shows the input logic block with +5Vpositive logic. The block is made up of RC filters for each PWM signal in order to reduce noise. Additionally thesesignals are pulled-down in order to avoid unwanted switching-on of the drivers. Please have in mind that the HybridKit for HybridPACK™1 does not provide dead time automatically (meaning that hardware alone provides no deadtime) - it is up to the user to generate the PWM signals with the correct dead time (by means of software).

Figure 16 Schematic of the Input Logic Block of the Driver Board

3.5.3 IGBT Switch-off BehaviorDue to the stray inductances of the system a voltage overshoots occur during the switching-off the IGBT. Suchovershoots are added to the DC-link voltage, so that the maximum blocking voltage of the IGBT or capacitor mightbe exceeded causing damages in both components (DC link capacitor and IGBT module). In order to avoid suchrisks an active clamping circuit is used (see Chapter 3.5.6).Without such protection methods the maximum current would be limited by the DC-link voltage and the voltageovershoots at switching-off. The voltage overshoots can be minimized by increasing the gate resistor, which willreduce the di/dt value. Figure 17 shows the maximal switch-off current at different DC-link voltages for a differentvalues of the gate resistor. These results were obtained with the DC-link capacitor described in Chapter 2.3.4.

C85100pF/100V/COG

R88

100R

GND_DIG1

R8915k

GND_DIG1

C86100pF/100V/COG

R90

100R

GND_DIG1

R9115k

GND_DIG1

C87100pF/100V/COG

R92

100R

GND_DIG1

R9315k

GND_DIG1

C88100pF/100V/COG

R94

100R

GND_DIG1

R9515k

GND_DIG1

C89100pF/100V/COG

R96

100R

GND_DIG1

R9715k

GND_DIG1

C90100pF/100V/COG

GND_DIG1

R98

100R R9915k

GND_DIG1

PWM _WT

PWM _WB

PWM _VT

PWM _VB

PWM _UT

PWM _UB

PWM WT

PWM WB

PWM VT

PWM VB

PWM UT

PWM UB




Figure 17 Maximal Switch-off Current at Different DC-Link Voltages (Gate Resistance as a Parameter)

3.5.4 Maximum Switching FrequencyThe IGBT switching frequency is limited by the available power and by PCB temperature. According to theory thepower losses generated in the gate resistors are a function of a gate charge, voltage step at the driver output andswitching frequency. The energy is dissipated mainly through the PCB and raises the temperature around the gateresistors. When the available power of the DC/DC converter is not exceeded, the limiting factor for the switchingfrequency is the absolute maximum temperature for the FR4 material. The allowed operation temperature is105 °C.Generally the power losses generated in the gate resistors can be calculated according to Equation (1):

(1)

In Equation (1) represents the switching frequency, represents the voltage step at the driver output, is the dissipated power, is the IGBT gate charge value corresponding to +15V/-8V switching operation.

This value can be approximately calculated from the datasheet value by multiplying it by 0.77, that is. Therefore the maximum frequency limited by the available power will be:

Figure 18 shows experimentally determined board temperature dependencies with switching frequency (at 25 °Cambient temperature). From Figure 18 it can be concluded that the maximum switching frequency is limited byPCB temperature.

0

100

200

300

400

500

600

700

800

900

0 50 100 150 200 250 300 350 400 450

Rgoff=2.2Ohm Rgoff=3.8Ohm Rgoff=5.6Ohm Icnom

Ic (A

)

DC-Link voltage (V)

Ic nominal

Pdis PRGextPRGint

Vout fS Qge⋅ ⋅Δ=+=

fS VoutΔPdis Qge

Qge 3.31μC=

fSmax 4.6 W 23V 3.31μC⋅( )⁄ 60.4 kHz= =




Figure 18 Temperature of Gate Resistors vs. Switching Frequency

3.5.5 BoosterTwo transistors per driver IC are used to amplify the driver ICs signals. On this way the driving IGBTs are suppliedwith sufficient current even if driver ICs alone can’t deliver enough current. One NPN transistor is used forswitching the IGBT on and another PNP transistor for switching the IGBT off.

The transistors are dimensioned to have enough peak current to drive HybridPACK™1 modules. Peak current canbe calculated like in Equation (2):

(2)

For circuit details please refer to Figure 31.

3.5.6 Short Circuit Protection and Clamp FunctionThe short circuit protection of the Driver Board basically relies on the detection of a voltage level higher as 9 V onthe DESAT pin of the 1ED020I12-FA driver IC and the implemented active clamp function. Thanks to this operationmode, the collector-emitter overvoltage, which is a result of the stray inductance and the collector current slope,is limited. Depending on the stray inductance, the current and the DC voltage the voltage overshoot during turnoff changes. Figure 19 shows the parts of the circuit needed for the desaturation function and the active clampingfunction.

35,0

40,0

45,0

50,0

55,0

60,0

65,0

70,0

75,0

1,0 5,0 9,0 13,0 17,0 21,0 25,0 29,0 33,0 37,0 41,0 45,0 49,0

gate

resi

stor

tem

pera

ture

(°C

)

switching frequency (kHz)

IpeakVΔ out

RGintRGext

RDriver+ +-----------------------------------------------------=




Figure 19 Desaturation Protection and Active Clamping Diodes

In the case of a short circuit the collector-emitter saturation voltage will rise and the driver detects the short circuitoccurrence - to protect the IGBT it has to be turned off. As a consequence of IGBT turn-off process there will occuran voltage overshoot due to the stray inductance of the module and the DC-link. This voltage overshoot has to belower than the maximum IGBT blocking voltage. Therefore the Driver Board has an active clamping functionwhereby the clamping will increase the voltage for the booster and also increase the voltage directly on the gate.The typical turn-off waveform under short circuit condition and room temperature of a HybridPACK™1 modulewithout any additional protective functions is shown in Figure 20 a). Typical waveform under short circuit conditionwith active clamp function at room temperature is shown in Figure 20 b). As it can be seen, the voltage overshootwithout active clamping at a DC voltage of 71 V is close to the maximum IGBT blocking voltage of HybridPACK™1(650V), which could damage the devices. With active clamping the voltage overshoot can be reduced and the DCvoltage increased without damaging the IGBT module (at 280 V DC voltage can be observed voltage overshootof approximately 596 V, Figure 20 b). In design are implemented 440 V clamping diodes. The level of theclamping voltage must be adjusted depending on the application.

D5_UB

ZLLS1000

C15_UB4u7/25V/X7R

C19_UB33pF/100V/COG

C16_UB4u7/25V/X7R

D3_UBSMCJ440A

C23_UB100n/50V/X7R

D4_UB

ZLLS1000

D1_UBES1D

D10_UBMM 3Z9V1T 1G

VN

GND

VP

R31_UB47R_0805_T K100_1%_0.125W

D9_UBZLLS1000

R33_UB

1R0 / SM P-1R00-1.0

R35_UB 0R

R30_UB1R0 / SM P-1R00-1.0

C20_UB4u7/25V/X7R

C21_UB4u7/25V/X7RGND

R36_UB

1R0 / SM P-1R00-1.0

R32_UB

1R0 / SM P-1R00-1.0

R37_UB

0R22 / SMP-R220-1.0

R38_UB0R22 / SMP-R220-1.0

T 1_UB

ZXT N2010Z

1

2

3

GND

GND

COL

C13_UB100pF/100V/COG

GND

T 2_UB

ZXT P2012Z

1

3

2

COL

G

GND

VN

R28_UB

1K

C17_UB100n/50V/X7R

U4

1ED020I12FTA

VEE21

DESAT3

GND24

T LSET5

VCC26

OUT7

CLAMP8

VEE22

GND119

IN+13

IN-14

RDY15

/FLT16 /RST17

VCC118

GND120 VEE2

9

VEE210

GND111 GND112

D6_UB

GF1M




Figure 20 a) Short Circuit without Active Clamp (DC Voltage=71V, Voltage Overshoot=612V)b) With Active Clamp Function (DC Voltage=280V, Voltage Overshoot=596V)

3.5.7 Fault OutputWhen a short circuit occurs the voltage VCE is detected by the desaturation protection of the 1ED020I12-FA andthe IGBT is switched off. The fault is reported to the primary side of the driver as long as there is no reset signalapplied to the driver. The fault signal (/FLT) is active low - the schematic of design implemented in Driver Boardcan be seen on Figure 21.




Figure 21 Fault Output of a Single Driver IC

Figure 22 Fault Output During: a) Normal Operation b) Operation under Short Circuit

The fault signal (/FLT) will be in low state if a short circuit occurs until /RST signal is pulled down.On the Driver Board each of the drivers has its own fault signal (FAULT_UTn, FAULT_UBn, FAULT_VTn,FAULT_VBn, FAULT_WTn, FAULT_WBn). As it can be seen in Figure 29, a LED will warn in the case of aDESAT-FAULT condition at a IGBT. The fault signals are connected to a logic circuit and the output of this are acombined fault and one fault for each phase, which is forwarded to the external connector (K1).

3.5.8 Temperature MeasurementThe IGBT module HybridPACK™1 includes one integrated NTC (Negative Temperature Coefficient) sensor whichsimplify the thermal measurements in inverters significantly.The NTC is located on the same ceramic substrate together with the IGBT and diode chips for the middle phase.The module is filled with silicon gel for isolation purpose and under normal operation conditions the requirementsfor isolation voltages are met. The NTC isolation capability is tested with 2.5kV AC in final test for 1 minute for100% of module production.

R29_UB4k7

VDIG50+5.0V

C14_UB470pF/50V/X7R

IN+

IN-

FLT n

GND_DIG1

RST n

VDIG50+5.0V

GND_DIG1

C22_UB

100n/50V/X7R

R34_UB4k7

VDIG50+5.0V

U4

1ED020I12FTA

VEE21

DESAT3

GND24

T LSET5

VCC26

OUT7

CLAMP8

VEE22

GND119

IN+13

IN-14

RDY15

/FLT16 /RST17

VCC118

GND120 VEE2

9

VEE210

GND111 GND112

a) b)

Short circuit occurs

UGE

Fault signal

Ready signal




The NTC is connected to the main connector K1 (pin 10) by means of the circuit showed in Figure 33. Figure 23shows the relationship between IGBT module base plate temperature of the three phases and output voltage ofIGBT module temperature block (TEMP_IGBT, K1.10)

Figure 23 Characteristics of the Temperature Measurements

Note: This temperature measurement is not suitable for the short circuit or short term overload detection andshould be used only for the module protection against long term overload or malfunction of the cooling system.

3.5.9 DC Voltage MeasurementOn the Hybrid Kit for HybridPACK™1 the voltage at the DC link is measured by means of a isolation amplifierwhich offers the necessary galvanic isolation (see Figure 33).The output of this circuit is connected to the external connector (Vdc, K1.9). Figure 24 shows the relationshipbetween DC link voltage and Vdc output signal.

2,5

3,0

3,5

4,0

4,5

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

Tem

p_IG

BT

(V)

module temperature (°C)




Figure 24 Characteristics of the DC Voltage Measurement

3.6 Switching LossesSwitching losses can be different comparing to the values given in the HybridPACK™1 IGBT module datasheet.Main reason for this discrepancy is that switching voltages used on the Driver Board (+15V for turn-on and -8V forturn-off) differ from HybridPACK™1 characterisation switching voltages (+15V/-15V).Turn-on losses are expected to be close to the values of the datasheet of HybridPACK™1, but as mentioned, thiswill be different for the turn-off losses. In general the turn-off losses depend on the stray inductances of the DC-link and increase linear with the DC-link voltage. In the case of the Driver Board the turn-off losses do not increaselinearly because of the fact that the active clamping feature increases the turn-off losses due to decrease of thedi/dt.

3.7 Definition of Layers of Driver BoardThe Driver Board was made keeping the following rules for the copper thickness and the space between differentlayers shown in Figure 25.

Figure 25 Copper and Isolation for Layers of Driver Board

y = 7,2171x + 1294,4

0

500

1000

1500

2000

2500

3000

3500

4000

4500

0 50 100 150 200 250 300 350 400

VDC

(mV)

DC-Link Voltage (V)

Copper Isolation

1: 35 µm

2: 35 µm

3: 35 µm

4: 35 µm

5: 35 µm

1

2

3

4

5

6 6: 35 µm

1

2

3

4

5

6

1-2: 0.5 mm 2-3: 0.5 mm 3-4: 0.5 mm 4-5: 0.5 mm 5-6: 0.5 mm




3.8 Schematics, Layout and Bill of MaterialTo meet the individual customer requirements and to make the Driver Board for the HybridPACK™1 module as aplatform for development or modifications, all necessary technical data like schematics, layout and componentsare included in this chapter.

3.8.1 Schematics

Figure 26 Schematics Block Overview

IGBT _M ODULE

IGBT _M ODULE

COLWT

POW

ER_V

CC

COLUT

GNDUT

GNDUB

COLVT

GNDVT

GNDVB

GNDWT

GNDWB

GUT

GVT

GWT

GUB

GVB

GWB

Tem

p0T

emp1

M EASURE

M EASURE

T em p0T em p1

T EM P_IGBT

VDC POWER_VCC

INPUT_LOGIC

INPUT_LOGIC

PWM WTPWM WB

PWM VTPWM VB

PWM UTPWM UB

PWM _WB

PWM _VBPWM _WT

PWM _UBPWM _VT

PWM _UT

FAULT_LOGIC

FAULT_LOGIC

FAULT_UnFAULT_VnFAULT_Wn

RST _INn

RST n

FAULT_n

FAULT_WT n

FAULT_VBnFAULT_WBn

FAULT_UT nFAULT_VT n

FAULT_UBn

VP15_VT+15.0V

VP15_UB+15.0V

IGBT _DRIVER_UT

IGBT _DRIVER

IN+

FLT n

IN-RST n G

COLVP

VNGND

VP15_WT+15.0V

GND_VT

GND_UB

VN8_VT-8.0V

VN8_UB-8.0V

VN8_WT-8.0V

GND_WT

IGBT _DRIVER_UB

IGBT _DRIVER

IN+

FLT n

IN-RST n G

COLVP

VNGND

VP15_UT+15.0V

IGBT _DRIVER_VT

IGBT _DRIVER

IN+

FLT n

IN-RST n G

COLVP

VNGND

GND_UT

VN8_UT-8.0V

IGBT _DRIVER_VB

IGBT _DRIVER

IN+

FLT n

IN-RST n G

COLVP

VNGND

IGBT _DRIVER_WT

IGBT _DRIVER

IN+

FLT n

IN-RST n G

COLVP

VNGND

IGBT _DRIVER_WB

IGBT _DRIVER

IN+

FLT n

IN-RST n G

COLVP

VNGND

SMPS

SMPS

12Vin

CONNECTOR

CONNECTOR

PWM VTPWM VBPWM WTPWM WB

PWM UTPWM UB

RST

_IN

n

FLT

Wn

FLT

Un

FLT

Vn

FLT

n

12V

TEM

P_I

GBT

VD

C

GND_DIG VP15_VB+15.0V

GND_VB

VN8_VB-8.0V

VP15_WB+15.0V

GND_WB

VN8_WB-8.0V

GND_DIG1




Figure 27 SMPS - Power Supply

Figure 28 External Connector

VDIG50+5.0V

C91

61u

F/5

0V/C

1206

F10

5K5R

ACT

U

R197

7R5_0805_T K100_1%_0.125W

GND_DIG1

GND_DIG1

Q5

IPD144N06NG

1

2

3

R1651K5 / 1% / 100ppm

GND_DIG1

GND_DIG1

D32

BZV55-C18

GND_DIG1

GND_DIG1

D31

SL23_30V_2A_SM B

UNDER_VOL_DET ECT ION

UNDER_VOL_DET ECT ION

POWER_UP12V_PROT

1206

R170

R_SMK-R000

GND_DIG1 R169

11K / 1% / 100ppm

D111SM B30AT 3G

R17

468

0R/P

RC

221

1W T

K10

0 1%

+C93622u/16V/X7R

+

C92

3

100u

F/1

2.5V

/A70

0X10

7M12

RA

TE01

5

+

C90

347

uF_2

5V_S

VPD

/AS

VPD

GND_DIG1

C921220nF/C0805F224K5RAC

C92

422

0nF

/220

nF/C

0805

F22

4K5R

AC

D8

BZV55-C13

+

C90

24u

7F/5

0V/X

7R/C

1210

C47

5K5R

ACT

U

UT_

PS

T F1

T rafo_p lanar_sm ps_8W_HP1_opt

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

R17

522

K /

1%

/ 10

0ppm

C91

947

0pF

/10V

/X7R

C92

222

nF/5

0V/X

7R

Q4IPD90P03P4L-04

R15959K

WB_PS

R15

8 19K

6

R16

4 0R02

5

C91

410

n/50

V/X

7R

GND_DIG1 GND_UB

UB_PS

R16

61k

6

R16

71k

6

L1

L_47u_1A_EPCOS_B82472P

Vz=15V

R16

81k

6

+ C91822u/35V/T491

C915

4u7/

25V

/X7R

C920

4u7/

25V/

X7R

VP15_UB+15.0V

GND_UB

D19

1SM B5929BT3G

VN8_UB-8.0V

D18

ES1A

GND_DIG1

12Vin

12V_PROT

C90810n/50V/X7R

R14910K

GND_DIG1

R14

31k

6

Vz=15V

GND_DIG1R

144

1k6

VB_PS

R14

51k

6

GND_DIG1

C926

100n

/50V

/X7R

GND_DIG1

GND_DIG1

+ C89422u/35V/T491

C8934u7/25V/X7R

R15310K

C8954u7/25V/X7R

VT_PS

Vz=15V

WT _PS

R14

71k

6

R14

61k

6

R14

81k

6

C8964u7/25V/X7R

+ C89722u/35V/T491

D7

1SM B5929BT3G

C898

4u7/

25V

/X7R

GND_DIG1R

150

1k6

Vz=15V

R15

21k

6

R15

11k

6

C899

4u7/

25V

/X7R

+ C90022u/35V/T491

C901

4u7/

25V

/X7R

D10

1SM B5929BT3G

R15

61k

6

R15

51k

Vz=15V

R15

71k

6

+ C90622u/35V/T491

D5

1SM B5929BT3G

C904

4u7/

25V

/X7R

+C925

22u/16V/X7R

C907

4u7/

25V

/X7R

D15

1SM B5929BT3G

GND_DIG1

VP15_VT+15.0V

VP15_WB+15.0V

VP15_UT+15.0V

GND_UT

GND_VT

VP15_WT+15.0V

VN8_WB-8.0V

VN8_UT-8.0V

GND_WB

VN8_WT-8.0V

VN8_VT-8.0V

D4

ES1A

D6

ES1A

GND_WT

D9

ES1A

R171

opt

D13

ES1A

Vz=15V

R16

01k

6

R16

11k

6

R16

21k

6

C909

4u7/

25V/

X7R

D21

ES1A

C912

4u7/

25V

/X7R

+ C91022u/35V/T491

D17

1SM B5929BT3G

VP15_VB+15.0V

GND_VB

D16

ES1A

R17

368

0R/P

RC

221

1W T

K100

1%

GND_DIG1

VN8_VB-8.0V

C905100nF/100V/X7R

GND_DIG1

D12ES1A

VDIG50+5.0V

GND_DIG1

+C928

22u/16V/X7R

GND_DIG1D14

1SM B5929BT3G

R154 80K6

R16

34k

75

GND_DIG1

R1720R / SM K-R000

R176 opt

L3

MURAT A_BLM 21P221SN

805

GND_ANA1

C927100n/50V/X7R

VANA50+5.0V

C91

122

n/50

V/X

7R

L2

L_47u_1A_EPCOS_B82472P

C91

31u

F/5

0V/C

1206

F10

5K5R

AC

TU

C91

710

0nF/

50V/

C08

05F1

04K5

RAC

TU

IC1

T LE8366EV

EN7

SYNC1

FB4

COM P3 BDS

5VS8

BUO6

GND2

GN

D_E

P9

T 2BSS138N1

32

IC2

LM3478MM

Isen1

COM P2

FB3

AGND4

PGND5

DR6FA/SD

7Vin

8

GND_DIG1

RST _INnFLT Wn

FLT UnFLT n

PWM VB

PWM WTPWM WB

PWM UTPWM UB

12V

GND_DIG

T EM P_IGBTVDC

K1

M MS-112-01-L-DV

11

22

33

44

55

66

77

88

99

1010

1111

1212

1313

1414

1515

1616

1717

1818

1919

2020

2121

2222

2323

2424

GND_DIGGND_DIG

PWM VTFLT Vn

VANA50+5.0V

GND_ANA1

12V




Figure 29 Fault Logic

Figure 30 Input Logic

FAULT_UBn

FAULT_WBn

FAULT_VBn

R181

1K_0603_T K100_1%_0.063W

10k

10k

T 7A

BCR10PN

2

6

1

10k

10k

T 7B

BCR10PN

5

3

4

GND_DIG1

C93010nF_0402_X7R_50V_CER_opt

C92910nF_0402_X7R_50V_CER_opt

R1781K_0603_T K100_1%_0.063W

R198

4K7_0603_T K100_1%_0.063W

R183

1K_0603_T K100_1%_0.063W C93110nF_0402_X7R_50V_CER_opt

GND_DIG1

VDIG50+5.0V

R188


GND_DIG1

10k

10k

T 6A

BCR10PN

2

6

1

GND_DIG1

10k

10k

T 6B

BCR10PN

5

3

4

VDIG50+5.0V

GND_DIG1

R186


GND_DIG1

R191


GND_DIG1

R192220R_0603_TK100_1%_0.063W

GND_DIG1

R25220R_0603_TK100_1%_0.063W

D22BBAS16S5

2

D22ABAS16S

61

GND_DIG1

D22CBAS16S

43

VDIG50+5.0V

VDIG50+5.0V

10k

10k

T 3ABCR183S

<PACKAGE>

2

1

610k

10k

T3BBCR183S

<PACKAGE>

5

4

3

VDIG50+5.0V

VDIG50+5.0V

R1794K7_0603_T K100_1%_0.063W

FAULT_Wn

D24 D25

GND_DIG1

FAULT_Vn

10k

10k

T 8A

BCR10PN

2

6

1

FAULT_Un

10k

10k

T 8B

BCR10PN

5

3

4

R19015K_0603_TK100_1%_0.063W

D23BBAS16S

52

D23ABAS16S

61

R18715K_0603_T K100_1%_0.063W

FAULT_n

R18215K_0603_T K100_1%_0.063W

D23CBAS16S

43

R1844K7_0603_T K100_1%_0.063W

R1894K7_0603_T K100_1%_0.063

VDIG50+5.0V

VDIG50+5.0V

VDIG50+5.0V

R18515K_0603_T K100_1%_0.063W

VDIG50+5.0V

R194220R_0603_TK100_1%_0.063W

10k

10k

T 4BBCR183S

<PACKAGE>

5

4

3

VDIG50+5.0V

D27

GND_DIG1GND_DIG1

VDIG50+5.0V

R193220R_0603_TK100_1%_0.063W

10k

10k

T 4ABCR183S

<PACKAGE>

2

1

6

D26

RST _INn

GND_DIG1

VDIG50+5.0V

R195220R_0603_TK100_1%_0.063W

10k

10k

T 5ABCR183S

<PACKAGE>

2

1

6

D28

RST n

R196220R_0603_TK100_1%_0.063W

10k

10k

T 5BBCR183S

<PACKAGE>

5

4

3

VDIG50+5.0V

D29

GND_DIG1

D30CBAS16S

43

D30BBAS16S

52

D30ABAS16S

61

FAULT_UT n

FAULT_VT n

FAULT_WT n

R18015K_0603_T K100_1%_0.063W

VDIG50+5.0V

GND_DIG1

R17715K_0603_T K100_1%_0.063W

VDIG50+5.0V

C85100pF/100V/COG

R88

100R

GND_DIG1

R8915k

GND_DIG1

C86100pF/100V/COG

R90

100R

GND_DIG1

R9115k

GND_DIG1

C87100pF/100V/COG

R92

100R

GND_DIG1

R9315k

GND_DIG1

C88100pF/100V/COG

R94

100R

GND_DIG1

R9515k

GND_DIG1

C89100pF/100V/COG

R96

100R

GND_DIG1

R9715k

GND_DIG1

C90100pF/100V/COG

GND_DIG1

R98

100R R9915k

GND_DIG1

PWM _WT

PWM _WB

PWM _VT

PWM _VB

PWM _UT

PWM _UB

PWM WT

PWM WB

PWM VT

PWM VB

PWM UT

PWM UB




Figure 31 IGBT Driver - Bottom Transistor of Phase U

Figure 32 IGBT Module

D5_UB

ZLLS1000

C15_UB4u7/25V/X7R

C19_UB33pF/100V/COG

C16_UB4u7/25V/X7R

D3_UBSMCJ440A

C23_UB100n/50V/X7R

D4_UB

ZLLS1000

D1_UBES1D

D10_UBM M3Z9V1T 1G

VN

GND

VP

R31_UB

D9_UBZLLS1000

R35_UB 0R

R33_UB

1R0 / SM P-1R00-1.0

R30_UB

C20_UB4u7/25V/X7R

C21_UB4u7/25V/X7R

GND

R36_UB

R32_UB

1R0 / SM P-1R00-1 .0

R37_UB

R38_UB0R22 / SMP-R220-1.0

R29_UB4k7

VDIG50+5.0V

C14_UB470pF/50V/X7R

T 1_UB

1

2

3

GND

GND

COL

C13_UB100pF/100V/COG

GND

T 2_UB

1

3

2

IN+

IN-

FLT n

GND_DIG1

COL

G

RST n

GND

VN

GND_DIG1

VDIG50+5.0V

R28_UB

1K

C22_UB

100n/50V/X7R

R34_UB4k7

VDIG50+5.0V

C17_UB100n/50V/X7R

U4

1ED020I12FTA

VEE21

DESAT3

GND24

T LSET5

VCC26

OUT7

CLAMP8

VEE22

GND119

IN+13

IN-14

RDY15

/FLT16 /RST17

VCC118

GND120 VEE2

9

VEE210

GND111 GND112

D6_UB

GF1M

C7910n/50V/X7R

P

R8210K

C8010n/50V/X7R

R8310K

C8110n/50V/X7R

R8410K

C8210n/50V/X7R

R8510K

C8310n/50V/X7R

R8610K

C8410n/50V/X7R

R8710K

Q3A

FS400R06A1E3_opt

PACKAGE = 1

7

8

1

2

3

6

13

14

Q3B

FS400R06A1E3_opt

PACKAGE = 1

9

10

4

25

15

16

N

Q3C

FS400R06A1E3_opt

PACKAGE = 1

11

12

5

22

17

18

19

24

23Phase_W Phase_V Phase_U

POWER_VCC

COLWT COLUTCOLVT

GNDUB

GNDUT

GNDVB

GNDVT

GUT

GNDWB

GNDWT

GUB

GWT GVT

GWB GVB

T em p1

T em p0

N




Figure 33 DC Voltage & Temperature Measurement

3.8.2 Assembly Drawing

GND_ANA1

GND_ANA1

C2100n/50V/X7R

VANA50+5.0V

R129 opt

R122K / 0.1%

C6150p/50V/C0G

GND_ANA1

R152K / 0.1%

R1110K / 0 .1%

R136 0R

T em p1

T em p0

VANA50+5.0V

T EM P_IGBT

GND_ANA1

GND_ANA1

GND_ANA1

VANA50+5.0V

IC4

AD8552ARZ

OUT A1 IN-A

2

IN+A3

V-4

IN+B5

IN-B6

OUT B7

V+8

C116

1u/25V/X7R

C12

110

n/50

V/X7

R

R13

010

K5/1

%

C12210n/50V/X7R

R13710K5/1%

C9354u7_X7R_16V_CER/C1206F475K4RA

GND_VBGND_VB

VP15_VB+15.0V

+5VVB+5V

C891100n/50V/X7R

IC6

T LE4296-2GV50

I3

Q4

GND2

GND5INH

1

VDC

C1 330pF/50V/COG

R4 4K02 / 0 .1%

C11310n/50V/X7R

R1590K

R3590K

R2590K

R6590K

R5590K

R7590K

HV_VB_VD

VB_13

R10158R

R83K9

500V->199mV

GND_VB

POWER_VCC

VB_11

VB_12

R939R

GND_ANA1

IC3ACPL-782T

OUT -6

IN+2

IN-3

GND

14

GND

25

Vdd1

1

OUT +7

Vdd2

8

C510n/50V/X7R

GND_VB

C3100n/50V/X7R

GND_VB

GND_VB

+5VVB+5V




Figure 34 Assembly Drawing of the Driver Board (Top)




Figure 35 Assembly Drawing of the Driver Board (Bottom)

For detail information use the zoom function of your PDF viewer to zoom into the drawings on Figure 34 andFigure 35.

3.8.3 LayoutLayout of the Driver Board is shown on Figure 36 (Top Layer), on Figure 37 (Layer-2), on Figure 38 (Layer-3),on Figure 39 (Layer-4), on Figure 40 (Layer-5) and on Figure 41 (Bottom Layer).




Figure 36 Driver Board - Top Layer

Figure 37 Driver Board - Layer-2










Figure 41 Driver Board - Bottom Layer




3.8.4 Bill of Materials

Table 3 Bill of Materials for Hybrid Kit for the HybridPACK™1 Evaluation Driver BoardReference Value / Device PackageC15_WT,C15_WB,C15_VT,C15_VB,C15_UT, C15_UB,C16_WT,C16_WB,C16_VT,C16_VB, C16_UT,C16_UB,C20_WT,C20_WB,C20_VT, C20_VB,C20_UT,C20_UB,C21_WT,C21_WB, C21_VT,C21_VB,C21_UT,C21_UB,C868,C871,C874,C880,C885,C889

4u7/25V/X7R C1206

C17_WT,C17_WB,C17_VT,C17_VB,C17_UT, C17_UB,C22_WT,C22_WB,C22_VT,C22_VB, C22_UT,C22_UB,C23_WT,C23_WB,C23_VT, C23_VB,C23_UT,C23_UB,C821

100n/50V/X7R C0603

C79,C80,C81,C82,C83,C84 22n/50V/X7R C0603C822 10u/16V/X7R C1206C827,C830,C835,C891 100n/16V/X7R C0402C828,C831 150p/50V/C0G C0402C832 330p/50V/COG C0402C833,C881,C886,C894,C895 10n/50V/X7R C0402C866,C869,C872,C877,C882,C887 4u7/50V/X7R C1210C867,C870,C873,C879,C883,C888 22u/35V DC875,C876 22u/63V C0810C878 100nF/100V/X7R C1206C884 22n/50V/X7R C0402C890,C907 22u/16V/X7R C1210C896,C898,C899 10n/50V/X7R C0603C897,C906 100n/50V/X7R C0805C900,C901,C902,C903,C904,C905 100pF/100V/COG C0603C908,C910,C911,C913,C914,C916 10n/50V/X7R C0603C909,C915 1u/16V/X7R C0603C912 1u/16VV/X7R C0603D3_WT,D3_WB,D3_VT,D3_VB,D3_UT,D3_UB

P6SMB510A SMB

D4,D6,D8,D10,D11,D14,D16,D18 ES1A DO214D4_WT,D4_WB,D4_VT,D4_VB,D4_UT,D4_UB

ES1D DO214

D5,D7,D9,D13,D15,D17 1SMA5929BT3G DO214D6_WT,D6_WB,D6_VT,D6_VB,D6_UT,D6_UB

MURA160T3G DO214

D9_WT,D9_WB,D9_VT,D9_VB,D9_UT,D9_UB

SMBJ14CA SMB




D12 1SMB5935BT3 SMBD19 BZV55/C13 SMDD20 1SMB30AT3 SMBD21,D22,D23 LED_LSM676-MQ D0805K1 MMS-112-01-L-DV 24POLL1 MURATA_BLM21P221SN L0805Q4 FS800R06KE3 HybridPACK™1Q5 IPD144N06NG TO252Q10 IPD90P03P4L-04 TO252Q11,Q12 BCR183S SOT363Q13 BCR10PN SOT363R14_WT,R14_WB,R14_VT,R14_VB,R14_UT, R14_UB,R206,R207,R214

0R R0603

R28_WT,R28_WB,R28_VT,R28_VB,R28_UT, R28_UB

1K R0603

R28 10K R0805R29_WT,R29_WB,R29_VT,R29_VB,R29_UT, R29_UB

4K7 R0603

R31_WT,R31_WB,R31_VT,R31_VB,R31_UT, R31_UB

47R R0805

R32_WT,R32_WB,R32_VT,R32_VB,R32_UT, R32_UB,R33_WT,R33_WB,R33_VT,R33_VB, R33_UT,R33_UB

2R7 R2512

R34_WT,R34_WB,R34_VT,R34_VB,R34_UT, R34_UB,R193

4.75 kΩ R0402

R82,R83,R84,R85,R86,R87,R182 10K R0402R127,R510 2K /0.1% R0603R132 4K / 0.1% R0603R133,R134,R135,R136,R137,R138 590K R1206R139 3K9 R0603R145,R146 10K 0.1% R0603R169,R170,R171,R173,R174,R175,R178,R179,R180,R183,R185,R186,R190,R191,R192,R196,R197,R198

1.6 kΩ R1206

R184 80K6 R0402R187 19K6 R0603R194 0R025 R2010R199,R533 0R R1210R201 59K R0603R203,R205,R208,R209,R211,R213 10K/1% R0603

Table 3 Bill of Materials for Hybrid Kit for the HybridPACK™1 Evaluation Driver Board (cont’d)

Reference Value / Device Package




R204,R210,R212 Opt R0603R408 158R R0603R509 39R R0603R511,R513,R515,R521,R523,R525,R527,R529,R531

15k R0603

R512,R514,R516 1K R0603R517,R518,R519 220R R0603R520,R522,R524,R526,R528,R530 100R R0603R534 Opt R1210R535 226K R0603R536 5K1 R0603R537 47K R0603T1 TRANSFORMER2T1_WT,T1_WB,T1_VT,T1_VB,T1_UT,T1_UB ZXTN2010Z SOT89T2_WT,T2_WB,T2_VT,T2_VB,T2_UT,T2_UB ZXTP2012Z SOT89U4,U5,U6,U7,U8,U9 1ED020I12-FA PG-DSO-20U18,U33,U34 AD8552ARZ SO-8U19 ACPL-782T DIP-8U30 LM3478MM MSOP-8U56 TLE4296GV50 SCT595U57 74LVC1G11GW SOT363U58 MAX6457UKD3A-T SOT23-5

Table 3 Bill of Materials for Hybrid Kit for the HybridPACK™1 Evaluation Driver Board (cont’d)

Reference Value / Device Package


Logic Board for Hybrid Kit for HybridPACK™1


4 Logic Board for Hybrid Kit for HybridPACK™1

Figure 42 Logic Board for Hybrid Kit for the HybridPACK™1

Logic Board (Figure 42) contains all the components for the control of the Hybrid Kit for the HybridPACK™1.Furthermore it offers the interface for all the other elements which build a complete inverter system: motor interface(encoder, resolver, sensors), current sense interface, communication (CAN and RS232) and additional analogue(x3) and digital (x4) inputs/outputs. Figure 43 shows the block structure of the Logic Board and the followingchapters describe these blocks in detail.

Figure 43 Block Diagram of the Logic Board

4.1 External Connector (X1-SIG1) Pin AssignmentConnector X1-SIG1 (Harwin M80-5125042P) provides the interface to all the external systems: motor (encoder,resolver, sensors), current sense, communication (CAN and RS232) and extra analogue and digitalinputs/outputs. Figure 44 shows the pin assignment of the connector X1-SIG1. For the description of the signalssee Table 4.

IGBT module HybridPACK™1

6ED100HP1-FA Driver Board

PWM

TempIGBT

FAULTSignals

RST

Vdc meas.

Logic Board

Supply

Connector

Supply

Debug Connector

MicrocontrollerTC1767

Resolver interface

Encoder / Sensor

Resolver

A/D IO

CAN / RS232

I, U, V currentmeasurement

EEPROM

Supply

Watchdog

LevelShifter

Vdc, Temp

Sensor

ResolverEncoder

RS232CAN

Current W

Current V

Current U

Co

nn

ec

to

r

Co

nn

ec

to

r

Motor3~




Figure 44 External Connector Pin Assignment

Table 4 External Connector Pin Assignment Logic Board v1.3bPin Number Pin Name Type Description1 ADC_IN1 I/O General Purpose Analog I/O2 S2 Input Resolver Sine (high)3 ADC_IN2 I/O General Purpose Analog I/O4 S6 Input Resolver Sine (low)5 ADC_IN3 I/O General Purpose Analog I/O6 S3 Input Resolver Cosine (high)7 StatorTemp Input Motor Temperature Measurement8 S1 Input Resolver Cosine (low)9 GND_ANA1 Supply Analog Ground10 R1 Output Resolver Excitation (high)11 DIO1 I/O General Purpose Digital I/O12 R2 Output Resolver Excitation (low)

2

10

14

18

4

8

12

16

20

StatorTemp

PosA/iGMR_A+

PosA/iGMR_A-

PosB/iGMR_B+

iGMR_CSn+

iGMR_DATA-

iGMR_DATA+

S6

S2

6

1

9

13

17

3

7

11

15

19

5

21

29

33

23

27

31

25

22

30

34

24

28

32

26

S3

S1

R1

R2

DIO_2

DIO_1

I_W

VDIG50

CAN1_L

CAN1_H

ASC_RX

ASC_TX

GND_ANA1

VANA50

GND_ANA1

I_V

I_U

ADC_IN1

ADC_IN2

ADC_IN3

DIO_3

GND_DIG1

Motor Interface (Encoder)

Motor Interface(Resolver)

Phase Current Sense

Communication

General Purpose Ana/Dig IN/OUT

Power Supply

Motor Interface (Hall Sensor)

Harwin M80-5125042P

iGMR_Ren_DE+

iGMR_CSn-

iGMR_Ren_DE-

PosB/iGMR_B-

PosZ/iGMR_Z+

PosZ/iGMR_Z-

PosU/iGMR_U

PosV/iGMR_V

PosW/iGMR_W

37

35

41

39

45

43

GND_DIG1

47

49

VDIG50

iGMR_CLK-

iGMR_CLK+

38

36

40

+12V

GND_DIG1

GND_DIG1

+12V

GND_DIG1

42

46

44

48

50

Motor Interface (iGMR Sensor)

Not Connected




13 DIO2 I/O General Purpose Digital I/O14 VANA50 Supply +5.0V Analog Power Supply15 DIO3 I/O General Purpose Digital I/O16 GND_ANA1 Supply Analog Ground17 VDIG50 Supply +5.0V Digital Power Supply18 I_U Input Current Sense Phase U19 GND_DIG1 Supply Digital Ground20 I_V Input Current Sense Phase V21 iGMR_CSn- Output iGMR Chip Select (differential signal)22 I_W Input Current Sense Phase W23 iGMR_REn_DE+ Output iGMR Read Enable (differential signal)24 iGMR_CSn+ Output iGMR Chip Select (differential signal)25 iGMR_REn_DE- Output iGMR Read Enable (differential signal)26 iGMR_DATA- I/O iGMR Data (differential signal)27 PosA/iGMR_A+ Input Encoder Phase A (differential signal)28 iGMR_DATA+ I/O iGMR Data (differential signal)29 PosA/iGMR_A- Input Encoder Phase A (differential signal)30 iGMR_CLK- Output iGMR SSC Clock (differential signal)31 PosB/iGMR_B+ Input Encoder Phase B (differential signal)32 iGMR_CLK+ Output iGMR SSC Clock (differential signal)33 PosB/iGMR_B- Input Encoder Phase B (differential signal)34 CAN1_L I/O Low line I/O CAN Signal35 PosZ/iGMR_Z+ Input Encoder Phase Z - index (differential signal)36 CAN1_H I/O High line I/O CAN Signal37 PosZ/iGMR_Z- Input Encoder Phase Z - index (differential signal)38 PosZ Output RS-232 Transmitter Output39 PosU/iGMR_U Input Hall Sensor Phase U40 ASC_RX Input RS-232 Receiver Input41 PosV/iGMR_V Input Hall Sensor Phase V42 GND_DIG1 Supply Digital Ground43 PosW/iGMR_W Input Hall Sensor Phase W44 KL_30_IN Supply +12.0V Power Supply45 GND_DIG1 Supply Digital Ground46 KL_30_IN Supply +12.0V Power Supply47 VDIG50 Supply +5.0V Digital Power Supply48 GND_DIG1 Supply Digital Ground49 NC NC Not Connected50 GND_DIG1 Supply Digital Ground

Table 4 External Connector Pin Assignment Logic Board v1.3b (cont’d)

Pin Number Pin Name Type Description




4.2 Connector to the Driver Board (K1)See Chapter 3.3.

4.3 Power SupplyThe complete system (Driver Board and Logic Board) must to be supplied with and external regulated DC powersupply connected to connector X1-SIG1 (+12.0V on pins 44 and 46 and GND_DIG1 on pins 48 and 50) on theLogic Board. The input voltage should be kept between 8 V and 18 V and the current consumption will varydepending on different factors, i.e. PWM frequency.This supply line will be forwarded to the Driver Board through the connector K1. On both boards a protection circuitwill avoid damages in case of overvoltage or wrong polarity (see Figure 45).

Figure 45 Overvoltage and Wrong Polarity Protection Circuit

The supply block (see Figure 52) generates all the necessaries supplies for the components on the logic board(5V, 3.3 V and 1.5 V). Furthermore the 5 V (analogue and digital) are connected to the external connector (X1-SIG1) for supplying external systems (i.e. current sensor).The Logic Board use the Infineon Technologies TLE7368E Micro Controller Power Supply IC. After applying themain power supply the IC13 will be switched-on. As soon as 5 V/3.3V/1.5V power supplies reached their correctvalues the signal POWERrstn (RO_1 and RO_2 outputs of IC12) will be activated waking-up the microcontroller.For further details of the TLE7368E please refer to the datasheet.

4.4 MicrocontrollerThe microcontroller block (uC block in overview given in Figure 51) contains following elements:• TC1767 (Figure 61) is a 32-Bit Microcontroller member of the Infineon Technologies AUDO FUTURE product

family designed for automotive applications. TriCoreTM CPU providing high-end microcontroller performance combined with sophisticated DSP capabilities (please refer to datasheet for further details)

• Input filter (see Figure 60): passive filters for digital and analogue signals and voltage dividers for voltage level adaptation

• EEPROM (Figure 62): 256kB Electrically-Erasable Programmable Read-Only Memory optimized for use in automotive applications where low-power and low-voltage operations are essential (for more details refer to AT25256A-10TQ-2.7 datasheet). The communication with the microcontroller is done through SSC0 interface (high-speed synchronous serial interface, SPI-compatible)

• RS-232 & CAN Transceivers (see Figure 59)

4.4.1 Configuration of TC1767The TC1767 can be configured with the respect to the different boot modes and with the respect to the differentinterfaces (serial/parallel) to the resolver and iGMR position sensors.

Q4IPD90P03P4L-04

KL_30_IN+12.0V

KL_30+12.0V

R12810K

GND_DIG1 GND_DIG1

D2

BZV55/C13 D31SM B30AT 3




4.4.1.1 Boot Configuration of TC1767

Figure 46 HW Boot Configuration of TC1767 DIP-Switch

The picture above (Figure 46) shows the definition of the boot HW configuration switch (DIP-Switch SW1 onFigure 61). The meaning of the switches will be described in the following Table 5.The ON position of the switch is equal to a logical LOW at the dedicated pin.

4.4.1.2 Selecting Serial/Parallel InterfaceDIP-4 switch (SW2 on Figure 59) is used to select serial/parallel interface for the communication with resolver oriGMR position sensor - please refer to Table 6.

Table 5 User Startup Modes for TC1767

CFG[7...0] Type of Boot TC1767 11)

1) 1 to 8 are the DIP-Switch numbers

2 3 4 5 6 7 811XXX11X2)

2) The shadowed line indicates the default settings.

Internal Start from Flash OFF OFF X3)

3) ’x’ represents the don’t care state.

X X OFF OFF X010XX110 Bootstrap Loader Mode, Generic Bootloader at

CAN pinsON OFF ON X X OFF OFF ON

10101110 Bootstrap Loader Mode, ASC Bootloader OFF ON OFF ON OFF OFF OFF ON10100110 Alternate Boot Mode, ASC Bootloader on fail OFF ON OFF ON ON OFF OFF ON1011X11X Alternate Boot Mode, Generic Bootloader at

CAN pins on failOFF ON OFF OFF X OFF OFF X

All others Reserved; don’t use this combination

Table 6 Selecting Serial/Parallel Interface

SW2[4...1] Inetrface to the Resolver/iGMR 41)

1) 1 to 4 are the DIP-Switch numbers

3 2 100002)

2) 0 is equal to open switch, “1” is equal to closed switch

iGMR enabled (SPI and Incremental mode)Resolver in Parallel Mode

OFF3)

3) ’x’ represents the don’t care state.

OFF OFF OFF

1111 Resolver in Serial ModeiGMR disabled

ON ON ON ON

All others Reserved; don’t use this combination

ON

1 2 3 4 5 6 7 8

P0.7 P0.6 P0.5 P0.4 P0.3 P0.2 P0.1 P0.0

HIGH

LOW




Figure 47 The Boot Configuration Switch (SW1) and Serial/Parallel Interface Select Switch (SW2)

4.5 WatchdogThe Logic Board contains a pin-selectable watchdog timer that supervises the microcontroller activity andsignalizes when the system is operating improperly. During normal operation, the microcontroller (GPTA39)should repeatedly toggle the watchdog input (WDI, see Figure 55) before the selected watchdog time-out periodelapses to report that the system is processing code properly. If this does not occurs, the supervisor asserts awatchdog output (WDO) which will reset the microcontroller via PORSTn (external power-on hardware reset).The state of the three logic control pins (SET0, SET1 and SET2) determines watchdog timing characteristics (seetable in Figure 55). The jumper J1 allows disabling the watchdog functionality in a very easy way.

4.6 Phase Current SensingPhase current sensing signals should be connected to the Logic Board connector X1-SIG1 to the pins I_U, I_Vand I_W (Figure 60). The Logic Board is designed to work with current transducers (not provided with the HybridKit) with voltage output proportional to the current (usually deploying Hall effect - like LEM sensors). User can take+5V (analog) available on the X1-SIG1 pins to supply current transducers. The exact type of current transducerwill depend on many parameters in application, but usually the most important is the motor current consumption.Please notice that if you control 3-phase balanced synchronous system it is enough to measure just 2 phases,since the 3rd phase current can be calculated as algebraic combination out of the 2 measured currents. Themicrocontroller is able to convert synchronously two phase currents, it’s recommended to do an accurate currentmeasurement.

4.7 Temperature SenseThe Logic Board includes a temperature sensor (IC54, LM50-CIM3) which is located on the bottoside of the board.With the sensor it is possible to measure the ambient temperature between Logic Board and Driver Board. Forschematics and output voltage values of the circuit see Figure 64. If you need any further information about thedevice please refer to the data sheet.

4.8 Resolver InterfaceThe Logic Board includes a 12-Bit Resolver-to-digital converter (meaning A/D converter) which integrates an on-board programmable sinusoidal oscillator that provides sine wave excitation for resolvers (pins R1 and R2 onconnector X1-SIG1). For more details please refer to the data sheet of the component (AD2S1200YST) and theschematics of the circuit see Figure 56. With resistors (R155, R156, R157, R158, R159 and R160) user can trimthe LMH6672 (dual op-amp) output voltage values (resolver excitation). On the Logic Board is given additionalpossibility to trim the resolver excitation with potentiometers (R483, R484, R485 - not populated, user shouldsolder them if needed). Please refer to data sheet of used resolver to trim this values properly. The resolverresponse should be connected between pins S1 and S3 (sine) and S2 and S6 (cosine) on the connector X1-SIG1.




4.9 Encoder InterfaceIf encoder is used as a sensor for the motor position/speed sensing the following pins on connector X1-SIG1should be connected: the phase A should be connected between pins PosA/iGMR_A+ and PosA/iGMR_A-, thephase B should be connected between pins PosB/iGMR_B+ and PosB/iGMR_B- and phase Z (index or zeromarker) should be connected between pins PosZ/iGMR_Z+ and PosZ/iGMR_Z- .

4.10 Hall Sensor InterfaceIf Hall sensor is used as a sensor for the motor position/speed sensing the following pins on connector X1-SIG1should be connected: the phase U should be connected to pin PosU/iGMR_U, the phase V should be connectedto pin PosV/iGMR_V and phase W should be connected to pin PosW/iGMR_W .

4.11 GMR InterfaceAs mentioned on the beginning of the Chapter 4, the Logic Board supports GMR interface by means of a bi-directional SSC (SPI compatible), encoder (or incremental) and Hall sensor interface. It is explicitly recommendedto use Infineon Technologies TLE5012 GMR-based angular sensor for rotor position sensing. The TLE 5012 is a360° angle sensor that detects the orientation of a magnetic field. This is achieved by measuring sine and cosineangle components with monolithic integrated Giant Magneto Resistance. For more details about TLE5012 pleaserefer to the data sheets on Infineon Technologies internet pages.




4.11.1 GMR SSC Interface Mode

Figure 48 GMR SSC Interface - Proposal Using TLE5012

The schematics of SSC interface on the Logic Board is shown on Figure 63. Signals on connector X1-SIG thatare used for SSC interface are: iGMR_CSn+/iGMR_CSn- (Chip Select, differential signals),iGMR_REn_DE+/iGMR_REn_DE- (Read Enable, differential signals), iGMR_DATA+/iGMR_DATA- (Serial Data,differential signals) and iGMR_CLK+/iGMR_CLK- (SSC Clock, differential signals) - all signals are listed inTable 4. On Figure 48is presented the schematics of possible technical solution (implemented by InfineonTechnologies System Engineering) for usage of TLE5012. The PCB with TLE5012 and a few additionalcomponents is mounted perpendicular to the electric motor shaft - just as shown on Figure 49.

Figure 49 Picture of Possible Physical Implementation of the GMR Sensor

U4

AM26LS31C DR

1A1

1Y2

1Z3

G4

2Z 52Y6

2A7

GN D8

3A9

3Y10

3Z11

G12

4Z134Y14

4A15

VCC16

U1

D S90C 032BTM

R in1- 1

R in1+2

Rout 13

EN4

Rout 25 R in2+

6

R in2-7

GN D8

R in3-9

R in3+10

Rout 311

EN_n12

Rout 413 R in4+

14

R in4-15

VCC16

U 3

DS92LV010ATM

D E1

D in2

R out3

GND4

R E5

D O-6

D O+7

VCC8

U 2

TLE5012

C LK1

SC K2

CSQ3

DATA4

I FA5

VDD6

GND7

I FB8

R63k 30603

R 73k30603

R83k 30603

R93k 30603

R 103k30603

R113k 30603

R 554R 0603

R 41k0603

C1

100n

/16V

/X7R

/EM

K10

7B71

04K

A

0603

C2

10u

/10V

/X7

R/L

MK

316B

710

6KL

120

6

C3

100n

/16

V/X

7R

/EM

K1

07B

710

4KA

060

3

X15

H eader_7x2

1234567891011121314

C4

100

n/1

6V/X

7R/E

MK

107B

710

4K

A

0603

C5

100n

/16

V/X

7R

/EM

K1

07B

710

4KA

060

3

R3100R 0603

R2100R 0603

R1100R 0603

C6

10p

/25V

/X7R

060

3

C7

10p

/25

V/X

7R

0603




4.11.2 GMR Encoder Interface ModeInfineon Technologies iGMR sensor TLE5012 can be used with encoder interface as well. This working mode isreferred as IIF Interface mode in theTLE5012 data sheet. To avoid signal integrity and EMC problems, withinHybrid Kit it is expected that the 2 phase signals (A and B) and zero (index) signal are provided differentially. Onthe connector X1_SIG (Figure 44) encoder inputs are: PosA/iGMR_A+ and PosA/iGMR_A (phase A),PosB/iGMR_B+ and PosB/iGMR_B (phase B) and PosZ/iGMR_Z and PosZ/iGMR_Z (phase Z - index) - pleaserefer to the Table 4. Please refer to the TLE5012 data sheet to get iGMR sensor running in incremental mode.

4.11.3 GMR Hall Sensor Interface ModeTLE5012 supports Hall sensor interface mode as well (iGMR emulates Hall sensor mode). For this purpose to theconnector X1-SIG inputs PosU/iGMR_U (phase U), PosV/iGMR_V (phase V) and PosW/iGMR_W (phase W)should be connected. Please notice (on Figure 60) that the pull-up resistors to 3.3 V (R491, R492 and R493) arealready provided on the Logic Board. For more details on Hall sensor mode please refer to the TLE5012 datasheet.

4.12 Definition of Layers for the Logic BoardThe Logic Board was made keeping the following rules for the copper thickness and the space between differentlayers shown in Figure 50.

Figure 50 Definition of the Layers for the Logic Board

Copper Isolation

1: 35 µm

2: 35 µm

3: 35 µm

4: 35 µm

5: 35 µm

1

2

3

4

5

6

6: 35 µm

1

2

3

4

5

6

1-2: 0.5 mm 2-3: 0.5 mm 3-4: 0.5 mm 4-5: 0.5 mm 5-6: 0.5 mm




4.13 Schematics, Layout and Bill of MaterialsTo meet the individual customer requirements and to make the Logic Board for the HybridPACK™1 module as aplatform for development or modifications, all necessary technical data like schematics, layout and componentsfor the Logic Board are included in this chapter.

4.13.1 Schematics

Figure 51 Schematics Block Overview

PosW/iGMR_W

PosV/iGMR_V

PosU/iGMR_U

T EM P_BOARD

T EM P_BOARD

T em p_Board

SUPPLY

SUPPLY

POWERrstn

AD2S1200_DOS_uCAD2S1200_DOSAD2S1200_LOT _uCAD2S1200_LOT

AD2S1200_DB11_SO

OC

DS1

DEBUG

BRKINnBRKOUT n

T RSTnT CK

T DI

Resetn

T DO

T MS

AD2S1200_DB10_SCLKAD2S1200_DB9

AD2S1200_SOE_uC

AD2S1200_DB8AD2S1200_DB7AD2S1200_DB6

VDC_uC

AD2S1200_DB10_SCLK_uC

SERIAL_PARALLEL_M ODE_uC

AD2S1200_DB4AD2S1200_DB3

LEVEL_SHIFTER

LEVEL_SHIFTER

FLT Wn_uCFLT Vn_uCFLT Un_uC

RST _INn_uC

PWM WT _uCPWM WB_uC

PWM VT _uCPWM VB_uC

PWM UT _uCPWM UB_uC

FLT UnFLT Vn

FLT Wn

PWM WTPWM WB

PWM VTPWM VB

PWM UTPWM UB

RST _INnFLT n_uC FLT n


CONNECTOR

CONNECTOR

I_UI_V

I_W

StatorT emp

S1

R1

S2

R2

S3

S6

ASC_RX

CAN1_LCAN1_HASC_TX

ADC_IN1

DIO_1

ADC_IN2

DIO_2DIO_3

ADC_IN3

iGM R_DAT A+

iGM R_CLK+iGM R_DAT A-

iGM R_CSn-iGM R_REn_DE+iGM R_REn_DE-

iGM R_CSn+iGM R_CLK-

PosW/iGMR_W

PosA/iGMR_A+PosA/iGMR_A-

PosU/iGMR_U

PosZ/iGMR_Z+

PosV/iGMR_V

PosZ/iGMR_Z-

PosB/iGMR_B+PosB/iGMR_B-

Resetn

AD2S1200_DB5

PWM UT _uc

AD2S1200_FS1_uC

PWM UB_ucPWM VT _uc

FLT n_uC

A

AD2S1200_DB11_SO_uC

PWM VB_ucPWM WT _ucPWM WB_uc

B

CAN1_L

AD2S1200_SAM PLEn_uC

CAN1_HASC_TXASC_RX

T MS

T DOT DI

T CKT RSTnBRKINn

S1

AD2S1200_DB0_uC

S3 NM

AD2S1200_RESET n_uC

S2S6

LEVEL_SHIFTER_RESOLVER

LEVEL_SHIFTER_RESOLVER

AD2S1200_DB0_uC

AD2S1200_DB9_uCAD2S1200_DB8_uCAD2S1200_DB7_uCAD2S1200_DB6_uCAD2S1200_DB5_uCAD2S1200_DB4_uCAD2S1200_DB3_uCAD2S1200_DB2_uCAD2S1200_DB1_uC

AD2S1200_DB0AD2S1200_DB1AD2S1200_DB2AD2S1200_DB3AD2S1200_DB4AD2S1200_DB5AD2S1200_DB6AD2S1200_DB7AD2S1200_DB8AD2S1200_DB9

AD2S1200_DB11_SO_uCAD2S1200_DB10_SCLKAD2S1200_DB11_SO


AD2S1200_LOT _uCAD2S1200_DOS AD2S1200_DOS_uCAD2S1200_LOT

SERIAL_PARALLEL_M ODE_uCENn

AD2S1200_RDVELn_uC

R1R2

AD2S1200_DB1_uC

Sta torT emp

BRKOUT n

AD2S1200_DB2_uCAD2S1200_DB3_uCAD2S1200_DB4_uCAD2S1200_DB5_uC

RST n_uc

AD2S1200_DB6_uC

Resolver

Resolver

S2S6

S3S1

R2R1

BA

NM

AD2S1200_CSn


AD2S1200_DB0AD2S1200_DB1AD2S1200_DB2AD2S1200_DB3AD2S1200_DB4AD2S1200_DB5AD2S1200_DB6

AD2S1200_DB10_SCLKAD2S1200_DB11_SO

AD2S1200_DOS

AD2S1200_RDVELn

AD2S1200_LOT

AD2S1200_FS1AD2S1200_FS2

AD2S1200_RESET nAD2S1200_SAM PLEn

AD2S1200_SOE

AD2S1200_DB7_uC

iGM R

iGM R

iGM R_DI_uC

iGM R_CLK_uC

iGM R_DAT A+

iGM R_CLK+iGM R_CLK-

iGM R_DAT A-iGM R_ROUT _uC

iGM R_CS_uCiGM R_RE_uCiGM R_CSn-

iGM R_REn_DE+iGM R_REn_DE-

iGM R_CSn+

iGM R_INDEX_uC

CONNECTOR_DriverBoard

CONNECTOR_DriverBoard

RST _INn

PWM WTPWM WB

PWM VTPWM VB

PWM UTPWM UB

VDC

FLT WnFLT VnFLT Un

FLT n

T EM P_HP2_UT EM P_HP2_W

T EM P_HP2_V

AD2S1200_DB8_uC

I_W

AD2S1200_DB9_uC

I_VI_U

WAT CHDOG

WAT CHDOG

WDO WDI

AD2S1200_CSn_uC

AD2S1200_FS2_uC

uC

uC

T EM P_IGBT _UT EM P_IGBT _V

T EM P_IGBT _W

BRKOUT n

T DIT MS

FLT _Wn

PWM UT n

T CK

FLT _Vn

PWM VT nPWM UBn

FLT _Un

PWM WT nPWM VBn

T RSTn

StatorT emp

PWM WBn

T DO

BRKINn

Resetn

RST n

I_UI_VI_W

ASCTXASCRX

ABNM

CAN1_LCAN1_H

ADC_IN1ADC_IN2

DIO_1DIO_2DIO_3

WDI

VDC_uC

FLT _n

T EM P_Board

ADC_IN3

AD2S1200_DB0_uC

AD2S1200_DB9_uCAD2S1200_DB8_uCAD2S1200_DB7_uCAD2S1200_DB6_uCAD2S1200_DB5_uCAD2S1200_DB4_uCAD2S1200_DB3_uCAD2S1200_DB2_uCAD2S1200_DB1_uC

AD2S1200_LOT _uC

AD2S1200_RDVELn_uC

AD2S1200_DOS_uC

AD2S1200_FS2_uCAD2S1200_FS1_uC

AD2S1200_DB11_SO_uCAD2S1200_DB10_SCLK_uC

AD2S1200_CSn_uC

AD2S1200_RESET n_uCAD2S1200_SAM PLE_uC


iGM R_DI_uC

iGM R_CLK_uCiGM R_ROUT _uC

iGM R_CS_uCiGM R_RE_uC

PosW/iGMR_W


PosU/iGMR_U

PosZ/iGMR_Z+

PosV/iGMR_V

PosZ/iGMR_Z-


AD2S1200_SOE_uC

iGM R_INDEX_uC

FLT Un_ucFLT Vn_uc

PosB/iGMR_B-PosB/iGMR_B+PosA/iGMR_A-PosA/iGMR_A+

PosZ/iGMR_Z-PosZ/iGMR_Z+

FLT Wn_uc




Figure 52 Power Supply

Figure 53 JTAG Debug Connector

Q4IPD90P03P4L-04

L11M URAT A_BLM21PG221SN

VDIG15+1.5V

VANA15+1.5V

KL_30_IN+12.0V

KL_30+12.0V

+

C11

5210

0uF

_35V

_MAL

2140

9700

1E3

R12810K

GND_DIG1

C11

5422

u/16

V/X

7R/F

_146

3575

C11

5522

u/16

V/X

7R/F

_146

3575

GND_DIG1

C11

664.

7u/5

0V/X

7R/C

1210

F47

5K5

+

C93

100u

F_3

5V_M

AL21

4097

001E

3

R474 10K

VDIG50+5.0V

GND_DIG1GND_DIG1

C115810u/10V/X7R

GND_DIG1

C86

22u/

16V/

X7R

/F_1

4635

75

Q_T 1+5.0V

Q_T 2+5.0V

Q_T 1+5.0V

VDIG15+1.5V

C1151100n/50V/X7R

C1153100n/50V/X7R

Q_T 2+5.0V

VDIG33+3.3V

GND_DIG1

Q_STBY+1.0V

C1156220n/25V/X7R/F_1414626

R47610K

VDIG33+3.3V

VDIG50+5.0V

VDIG33+3.3V

C11

464u

7/10

V/X

7R/F

_940

2195

R47310K

Q_STBY+1.0V

VSW+5.4V

Q_STBY+1.0V

D1M BRS340T 3

GND_DIG1

GND_DIG1 VDIG50+5.0V

R113SMK-R000 / Isabel lenhuette

POWERrstn

C11

451u

/25V

/X7R

/F_1

6370

35

KL_30+12.0V

IC13T LE7368E

GND

_A1

1

RT2

RO_13

RO_24

IN_LDO25

Q_LDO26

Q_T 17Q_T 28

EN_uC9

EN_IGN10

SEL_ST BY11

C1-12

C2-13

C1+14

C2+15

CCP16

GND

_P17

GN

D_A

218

GN

D_A

319

IN120

IN221

IN322

SEL_Q223

WDI24

WDO25

SW126

SW227

BST28

FB29

Q_LDO130

FB_EXT31

DRV_EXT32

Q_STBY33

IN_STBY34

M ON_ST BY35

GND

_A4

36

PAD

37

KL_30+12.0V

L3WE_7447709470

T yp XXL

C92

220n

F/1

00V/

C32

16X

7R2A

224K

T5

D5

SS12_1A_If_20V_Vr

VDIG15+1.5V

C11

591n

/16V

/X7R

VDIG33+3.3V

VDIG50+5.0V

GND_DIG1

IC53M AX6143AASA50

I.C._11

IN2

T EM P3

GND

4

T RIM5

OUT6

SHDN7

I.C._88

GND_DIG1

C11

42 4u7/

10V

/X7R

GND_DIG1

GND_DIG1

GND_DIG1

C115710u/10V/X7R

VDIG33+3.3V

C11

6710

0n/5

0V/X

7R/C

0805

F10

4K5

GND_ANA1

GND_DIG1

GND_ANA1

GND_DIG1

D6

SS12_1A_If_20V_Vr

R486 0R / 0.1%

R475 10K

C11

3522

u/16

V/X

7R/F

_146

3575

GND_REF1

Vref50+5.0V

GND_ANA1

VDIG33+3.3V

VANA33+3.3V


GND_ANA1

VANA50+5.0V

C85

100n

/50V

/X7R

GND_DIG1

C11

444u

7/10

V/X

7R/F

_940

2195

Q2BDP949

1

2

3

4


C123100n/16V/X7R

C11

5068

0n/5

0V/F

_141

4702

KL_30+12.0V

GND_DIG1

C11

3622

u/16

V/X

7R/F

_146

3575

D2

BZV55/C13

L10

M URAT A_BLM21PG221SN

D31SM B30AT 3

BRKOUT nT CK

BRKINn

Resetn T DI

VDIG33+3.3V

GND_DIG1

R210K

R310K

R410K

R110K

R610K

R510K

T RSTn

T DOT MS

K3-OCDS

HEADER 8X2

2468

10121416

13579111315




Figure 54 Connector (external)

Figure 55 Watchdog

P20

P12

C1170

1n/5

0V/X

7RC1169

1n/5

0V/X

7R C11711n

/50V

/X7R

C12

081n

/50V

/X7R

_opt

C1172

1n/5

0V/X

7R_o

pt C1175

1n/5

0V/X

7R

GND_DIG1

GND_DIG1

GN

D_A

NA1

K2

Harwin M 80-5125042P

11

33

55

77

99

1111

1313

1515

1717

1919

2121

2323

2525

22

44

66

88

1010

1212

1414

1616

1818

2020

2222

2424

2626

2727

2828

2929

3030

3131

3232

3333

3434

3535

3737

3939

4141

4343

4545

4747

4949

3636

3838

4040

4242

4444

4646

4848

5050

P5P3P1

GND_ANA1

P23P21

P15P13P11

P35P33P31P29P27P25

P43P41P39P37

P46P48

P42

P19P17

P9StatorT emp

iGM R_CSn-

iGM R_DAT A-

I_VI_U

ASC_RXASC_T X

ADC_IN3

I_W

R2R1

S1S3S6S2

VANA50+5.0V

VDIG50+5.0V

CAN1_LCAN1_H

GN

D_D

IG1

KL_30_IN+12.0V

GN

D_A

NA1

ADC_IN2ADC_IN1

DIO_3DIO_2DIO_1

iGM R_DAT A+

iGM R_CSn+iGM R_REn_DE+

iGM R_CLK-iGM R_CLK+

iGM R_REn_DE-

C1183

1n/5

0V/X

7RC1174

1n/5

0V/X

7R

C12

071n

/50V

/X7R

_opt

C1173

1n/5

0V/X

7R C1184

1n/5

0V/X

7R C1185

1n/5

0V/X

7R

C12

091n

/50V

/X7R

_opt

C11

971n

/50V

/X7R

C1177

1n/5

0V/X

7R

GND_DIG1

P28

P2

C11

911n

/50V

/X7R

Capacitors for ESD Protection of uC

C11

921n

/50V

/X7R

P44

C11

931n

/50V

/X7R

P24

C1176

1n/5

0V/X

7R

P26

C1178

1n/5

0V/X

7R C1179

1n/5

0V/X

7R

P30

C1180

1n/5

0V/X

7R C1181

1n/5

0V/X

7R_o

pt

P32

P4

P34P36

C1182

1n/5

0V/X

7R_o

pt

C12

051n

/50V

/X7R

_opt

C12

061n

/50V

/X7R

_opt

C12

031n

/50V

/X7R

_opt

C12

011n

/50V

/X7R

_opt

C12

021n

/50V

/X7R

_opt

C12

041n

/50V

/X7R

_opt

GND_DIG1

P6P8

P50

P14P16

C11

941n

/50V

/X7R

C11

871n

/50V

/X7R

_opt

C11

891n

/50V

/X7R

C11

881n

/50V

/X7R

_opt

C11

901n

/50V

/X7R

C11

951n

/50V

/X7R

P38P40

P22

C11

961n

/50V

/X7R

P7P10

GND_DIG1

PosZ/iGMR_Z-

PosB/iGMR_B-

PosA/iGMR_A-

PosV/iGMR_VPosU/iGMR_U

PosZ/iGMR_Z+

PosB/iGMR_B+

PosA/iGMR_A+

PosW/iGMR_WP47P45P45P45

GN

D_D

IG1

VDIG50+5.0V

P18

IC23

MAX6369KA-T

WDI1

GND2

NC3

SET 04

SET 15

SET 26

WDO7

Vcc8

W\D\O\

WDI

GND_DIG1

J1Jum per

11

22

R1514K7

R1504K7

R149opt

R1534K7

R154opt

GND_DIG1

set2 set1 set0 tdelay,twd0 0 0 1ms 0 0 1 10ms 0 1 0 30ms 0 1 1 Disabled 1 0 0 100ms 1 0 1 1s 1 1 0 10s 1 1 1 60s

C1210100n/16V/X7R

VDIG33+3.3V




Figure 56 Resolver Interface

Figure 57 Level Shifter for Adapting Logic Levels for Driver Board

C1216opt

GND_ANA1

IC30

74LVC2G04GW

1A1

2A3

1Y6

2Y4

VCC

5G

ND

2

GND_ANA1

C1217opt

R1040R

R105opt

GND_ANA1GND_DIG1

R107opt

R1060R

GND_ANA1

T P1T estpad_SM D_EttingerR109

opt

R1080R

GND_ANA1

L8

M URAT A_BLM21PG221SN

T P2T estpad_SM D_Ettinger

C81

10n/

16V

/X7R

C78

10uF

/10V

/X7R

U1

HCM 49 8 .192M ABJ-UT

11

22

C84

20pF

/50V

/CO

G

C79

4u7/

25V/

X7R

C75

4u7/

16V/

X7R

C80

10n/

16V

/X7R

AD2

S120

0_D

B6

C76

10n/

16V

/X7R

C82

4u7/

25V/

X7R


C83

20pF

/50V

/CO

G

C77

10n/

16V

/X7R

AD2S1200_CSn

AD2S1200_RESET n

GND_DIG1

AB

AD2S1200_RDVELn

AD2S1200_FS2AD2S1200_FS1

NM



AD2S1200_DB11_SO

C111122uF/16V/X7R


R1

R2

R156

2K4/0.1%

R155

2K4/0.1%

R1593K3/0.1%

R157390/0 .1%

R160

2K4/0.1%

R158

2K4/0.1%


GND_DIG1


AD2S1200_LOT

VANA50+5.0V

AD2S1200_DOS

AD2

S120

0_D

B5

C1163

100n/16V/X7R

AD2S

1200

_DB4

T P9

T estpad_SM D_Ettin

AD2

S12

00_D

B3

S3

AD2

S12

00_D

B2

VDIG50+5.0V

AD2

S120

0_D

B1

GND_ANA1

AD2

S120

0_D

B0

VDIG50+5.0V

Sin

SinLO

Cos

+

-

V+

V-

IC4ALT1639HS

PACKAGE = 1

3

21

4

11

CosLO

+

-

IC4BLT1639HS

PACKAGE = 1

5

67

+

-

IC4CLT1639HS

PACKAGE = 1

10

98

VANA50+5.0V

GND_ANA1

+

-

IC4DLT1639HS

PACKAGE = 1

12

1314

VANA50+5.0V

GND_ANA1

GND_ANA1

Sin

GND_ANA1


SinL

O

AD2S1200_DB7

S1

IC8

AD2S1200YST

DVdd1

RD2

CS3

SAM PLE4

RDVEL5

SOE6

DB11/SO7

DB10/SCLK8

DB99

DB810

DB711

DB6

12

DB5

13

DB4

14

DB3

15

DG

ND

16

DVd

d17

DB2

18

DB1

19

DB0

20

XTAL

OU

T21

CLK

IN22

DGND23CPO24A25B26NM27DIR28DOS29LOT30FS131FS232RESET33

EXC

34EX

C35

AGN

D36

Sin

37S

inLO

38AV

dd39

Cos

LO40

Cos

41A

GND

42R

EFB

YP43

REF

OUT

44

C1164

100n/16V/X7R

GND_DIG1

R47110K

D2S1200_SOE

GND_DIG1

Cos

LO

GND_DIG1

C14322uF/16V/X7R

C144100n/25V/X7R

GND_DIG1

IC6

LMH6672

OUT 11IN-1

2

IN+13

-Vs

4

IN+25

IN-26

OUT 27

+Vs

8

GND_DIG1

S2

S6

Cos

GND_DIG1

AD2S1200_SOEn

GND_ANA1

VDIG33+3.3V

GND_DIG1

R110

opt

S1200_SAM PLEn

C11

1210

0n/5

0V/X

7R/C

0805

F10

4K5

GND_ANA1

R4855K_pot_0,25W_20%_Bourns_3314J_opt

R48

45K

_pot

_0,2

5W_2

0%_B

ourn

s_33

14J_

opt

KL_30+12.0V

R4835K_pot_0,25W_20%_Bourns_3314J_opt

AD2S1200_DB10_SCLK

IC25T LE4266GSV10

I1

INH2

Q3

GND

4

R1020R

GND_ANA1

R103opt

GND_ANA1

GND_DIG1

FLT n_uC

R951K

R9315K

GND_DIG1

C68100n/16V/X7R

VDIG50+5.0V

GND_DIG1

R1001K

C71100n/16V/X7R

R9915K

GND_DIG1

FLT n

VDIG50+5.0V

GND_DIG1

GND_DIG1

GND_DIG1

GND_DIG1

C70100n/16V/X7R

R981K

R9615K VDIG50+5.0V

R921K

R9015K VDIG50+5.0V

GND_DIG1

C64100n/16V/X7R

VDIG50+5.0V

VDIG50+5.0V

R79

1K

R80

1K

R73 10K

C66100n/16V/X7R

R71

10K

R76

1K

C65100n/16V/X7R

VDIG33+3.3V

R78

1K R88

1K

R74

1K

R77

1K

R75

1K

IC2

74ALVC164245DGG

VCCA31

1DIR1

1A047

1A146

1A244

1A343

1A441

1A540

1A638

1A737

GND4

GND10

VCCB18VCCB7

1OE48

1B02

1B13

1B25

1B36

1B48

1B59

1B611

1B712

GND15

2A036

2A135

2A233

2A332

2A430

2A529

2A627

2A726

2B013

2B114

2B216

2B317

2B419

2B520

2B622

2B723

2DIR24

2OE25

GND21

GND28

GND34

GND39

GND45

VCCA42

FLT Un_uCFLT Vn_uC

FLT Wn_uC

PWM UT _uCPWM VB_uCPWM VT _uC

PWM WB_uCPWM WT _uC

RST _INn_uC

FLT Wn

FLT Vn

FLT Un

PWM UB_uCRST _INn

PWM VT

PWM WB

PWM WT

PWM UB

PWM UT

PWM VB




Figure 58 Level Shifter for Adapting Logic Levels for Resolver IC

Figure 59 Microcontroller

AD2S1200_DB11_SO_uC

AD2S1200_DB0

IC29

74LVCH16T 245DL

VCCA31

1DIR1

1A047

1A146

1A244

1A343

1A441

1A540

1A638

1A737

GND4

GND10

VCCB18VCCB7

1OE48

1B02

1B13

1B25

1B36

1B48

1B59

1B611

1B712

GND15

2A036

2A135

2A233

2A332

2A430

2A529

2A627

2A726

2B013

2B114

2B216

2B317

2B419

2B520

2B622

2B723

2DIR24

2OE25

GND21

GND28

GND34

GND39

GND45

VCCA42

AD2S1200_DB1

GND_DIG1

GND_DIG1

AD2S1200_DB2

GND_DIG1

AD2S1200_DB3

AD2S1200_DB10_SCLK

AD2S1200_DB4

VDIG50+5.0V


C1133100n/16V/X7R

VDIG33+3.3V

C1132100n/16V/X7R

AD2S1200_DB7

AD2S1200_DB0_uC

AD2S1200_DB8


AD2S1200_DB1_uC

AD2S1200_DB9

AD2S1200_DB2_uCAD2S1200_DB3_uC

AD2S1200_DB11_SO


AD2S1200_DB4_uC

AD2S1200_DOS

AD2S1200_DB5_uC

AD2S1200_LOT

AD2S1200_DB6_uCAD2S1200_DB7_uCAD2S1200_DB8_uCAD2S1200_DB9_uC

AD2S1200_DOS_uCAD2S1200_LOT _uC

ENn

R498 0R_opt

R497 0R

GND_DIG1

R456 1K

C10

7

100n

/16V

/X7R

VDIG33+3.3V

GND_DIG1

GND_DIG1

VDIG50+5.0V

GND_DIG1

AD2S1200_DOS_uC

DIO_2

FLT _Wn

DIO_3

FLT _Wn

FLT _Un

T EM P_Board

C11

2

100n

/16V

/X7R

T MST DOT DI

BRKOUT nBRKINn

T MST DO

T CKT DI

BRKOUT nBRKINn

T RSTn C10

6

100n

/16V

/X7R

C10

4

10n/

16V/

X7R

GND_DIG1

IC16EH2645ETT TS-20.000M

T RI1

GND2

OUT3

VDC4

L5M URAT A_BLM21P221SN

VDIG33+3.3V

R1335K1

C10

5

22uF

/6.3

V/X7

R

Resetn

AD2S1200_RDVELn_uC

C113

100n/16V/X7R

INPUT_FILT ER

Input_Fi l ter

ABNM

DIO_1DIO_2DIO_3

StatorT emp

VDC

T EM P_IGBT _UT EM P_IGBT _VT EM P_IGBT _W

I_UI_VI_W

AN15AN14

AN3

AN1

ADC_IN1ADC_IN2

AN17

AN19

AN13

T EM P_Board

ADC_IN3

AN31

P1_8P1_10P4_3

P0_12P0_14P0_11

P4_2P2_0P2_2

P4_0P4_1

P2_5

AN18

AN29

AN4

AN2

AN5

PosW/iGMR_W


PosU/iGMR_U

PosZ/iGMR_Z+

PosV/iGMR_V

PosZ/iGMR_Z-


FLT _Vn

Resetn

C111

100n/16V/X7R

GND_DIG1

WDI

R134

1K

FLT _Vn

PWM UBnPWM UT n

PWM VBn

PWM VT n

PWM WBn

PWM WT n

T CK

AD2S1200_DB0_uC

R1351K

StatorT emp

EEPR

OM

EEPROM

CSn

SCK SI SO

T RSTn

C11

5

100n

/16V

/X7R


C11

4

100n

/16V

/X7R


AD2S1200_RESET n_uC


RST n


VDIG33+3.3V

RXDOA

T XDOA

IC52M AX3232EIPWRQ1

C2+4

C1+1

C1-3

T 2out7

V-6

T 2in10

R2in8

T 1in11

R1out12

R1in13

R2out9

V+2

C2-5

Vcc16

GND15

T 1out14

GND_DIG1

GND_DIG1

GND_DIG1

AD2S1200_DB9_uC

GND_DIG1

ASCRX

ASCTX

PosA/iGMR_A+

PosZ/iGMR_Z-

PosB/iGMR_B-

PosA/iGMR_A-

PosZ/iGMR_Z+

PosB/iGMR_B+

PosU/iGMR_U

PosW/iGMR_W

PosV/iGMR_V

I_U

FLT _n

C10

8

22uF

/6.3

V/X7

R

R13160R

R13260R

C1104.7n/50V/X7R

GND_DIG1

FL1

B82789C0104N001

1

2 3

4

I_VI_W

FLT _n

VDC_uC

T EM P_IGBT _U

T EM P_IGBT _WT EM P_IGBT _V

ADC_IN1

AD2S1200_FS1_uC


VDIG33+3.3V

iGM R_ROUT _uC

iGM R_INDEX_uC

AD2S1200_CSn_uC

AD2S1200_DB11_SO_uC

iGMR


iGM R_DI_uC

SW2SW DIP-4/SM

iGMR Serial Mode/Encoder Mode: (switch pin 1 open (OFF)) -> iGMR_INDEX_uC low

iGMR disabled: (switch pin 1 closed (ON))

Resolver Serial (2,3,4 is ON)- uC_TC1767.SCLK1 drives- MRST1 as input, driven by Resolver- SERIAL_PARALLEL_MODE_uC is Default is serial mode- AD2S1200_CSn_uC

iGM R_CLK_uC

iGM R_RE_uCiGM R_CS_uC

AD2S1200_SOE_uC

A

RST n

CAN1_H

uc_T C1767

uc_T C1767

AN14AN15

GPT A27

GPT A19

GPT A18GPT A20

GPT A9GPT A8

AN1

T DOT MS

T DIT CKT RSTn

BRKINnBRKOUT n

Clk

T XD0ARXD0A

SLSO0

SLSO1

SCLK0

M TSR0M RST0

PORST n

SCLK1M RST1

RXDCAN1T XDCAN1

AN17

AN19

AN3AN4

AN2

P5_8P5_9

AN13

GPT A39

AN31GPT A3

P5_6P5_7

P5_10P5_11

P5_12P5_13

P3_11P3_12

P5_15

P5_0P5_1P5_2P5_3P5_4P5_5

P3_10

P1_8P1_10P4_3

P0_12P0_14P0_11

P2_0P2_2

P4_2

P4_0P4_1

P2_5

AN18

P1_9

P1_5P1_6P1_7

AN29

AN5

P3_13

P3_8SLSO2

P2_12

DIO_1

ADC_IN2

AD2S1200_FS2_uC

R10110K

VDIG33+3.3V

ADC_IN3

B

CAN1_L

FLT _Un

AD2S1200_LOT _uC

NM

CAN_TX1

IC17T LE6250GV33

T xD1

GND

2Vc

c3

RxD4

V33V

5

CANL6CANH7

INH8

AD2S1200_SAM PLE_uC

CAN_RX1

C10

9

100n

/16V

/X7R




Figure 60 Input Filter

R223

6K8

R214

6K8

C1160

100n/16V/X7R

C1041

10p/50V/X7R

R430

100R

GND_DIG1

General Purpose

+

-

V+

V-

IC31ALT1639HS

PACKAGE = 13

21

411

C1042

10p/50V/X7R

+

-

IC31BLT1639HS

PACKAGE = 1

5

67

+

-

IC31DLT1639HS

PACKAGE = 1

12

1314

+

-

IC31CLT1639HS

PACKAGE = 1

10

98

IC33

AM26C32QD

1A+2

1Y3

Vcc

16G

ND

8

1B-1

2A+6

2B-7

3A+10

3B-9

4A+14

4B-15

2Y5

3Y11

4Y13

G+4

G-12

R217

6K8

R431

100R

Encoder Inputs/iGMR Inputs (iGMR Emulates Encoder)

C1721n/50V/X7R

GND_ANA1

R175

68KR176opt

C1761n/50V/X7RR185

opt

GND_ANA1

R184

68K

C1801n/50V/X7R

GND_ANA1

R191

68KR194opt

C1831n/50V/X7RR202

opt

GND_ANA1

R228

6K8

R198

68K

C1871n/50V/X7R

GND_ANA1

R205

68KR208opt

StatorT emp

C1916800p/10V/C0G

VDC

C1946800p/10V/C0G

C1966800p/10V/C0G

T EM P_IGBT _U

T EM P_IGBT _W

T EM P_IGBT _V

I_V

I_U

AN13

AN14

AN15

I_W

AN1

AN4

AN3

AN2

GND_ANA1

GND_ANA1

AN29

R235

6K8

Digital IN/OUT

GND_ANA1

R215

3K3

DIO_1C1161

100n/16V/X7R

GND_ANA1

General Purpose Analogue IN

GND_DIG1

R174

10K

VANA50+5.0V

VANA50+5.0V

Temperature and DC Bus MeasurementsVDIG50+5.0V

C179100p/50V/X7RR193

91K

R189

51K

R20091K

R196

51K C182100p/50V/X7R

GND_DIG1

GND_DIG1

GND_DIG1

C174100p/50V/X7RR182

91K

R179

51K

DIO_2

R180

1KR1832K

P0_14

R1902K

P0_11

R187

1K

R2012K

R197

1K

GND_DIG1

GND_DIG1

R481

optGND_ANA1

GND_DIG1

DIO_3

P0_12

R2372K

P1_10

R234

1K

R181opt

GND_ANA1

P4_3

R17851K C173

1n/50V/X7R

R238

1KR2392K

AN17ADC_IN1

R240

1KR2412K

NM

B

A P1_8

GND_DIG1

GND_DIG1

GND_DIG1

R472

3K3

C104410p/50V/X7R

R218

3K3

R192opt

GND_ANA1

R188

51K C1781n/50V/X7R

GND_ANA1

C104510p/50V/X7R

R480

opt

R17710K

C104310p/50V/X7R

GND_ANA1

C1841n/50V/X7RR203

opt

R199

51K

Phase Current Sense

AN31

R229

0R

PosA/iGMR_A+

Emulated encoder outputs out of AD2S1200

PosZ/iGMR_Z-

PosB/iGMR_B-

PosA/iGMR_A-

PosZ/iGMR_Z+

PosB/iGMR_B+

ADC_IN2

R477

opt

ADC_IN3

R18610K


P4_1

C10643300p/10V/C0G

R19510K

GND_ANA1

R224

0R_opt

C10653300p/10V/C0G

AN18

C10673300p/10V/C0G

AN19

R429

100R

P4_0

AN5T EM P_Board

C1040

10p/50V/X7R

P2_5

GND_DIG1

VANA50+5.0V

VANA50+5.0V

VANA50+5.0V

GND_ANA1

GND_ANA1

GND_ANA1

C114810p/50V/X7R

C114910p/50V/X7R

C114710p/50V/X7R

R496

1K

GND_DIG1

R4912K7

GND_ANA1

PosV/iGMR_V

PosU/iGMR_U

Hall Sensor/iGMR Inputs (iGMR Emulates Hall Sensor)Assumed Open-Collector output from Hall sensor

PosW/iGMR_W

VDIG33+3.3V

P2_2

C1213opt

P4_2

P2_0

C1215opt

C1214opt

R4922K7

R4932K7

GND_DIG1

D7BAT 54-04W

GND_DIG1

D8BAT 54-04W

GND_DIG1

D9BAT 54-04W

R494

1K

R495

1K

GND_ANA1

R482

0R

R230

6K8

R479

0R

R478

0R




Figure 61 Microcontroller TC1767 Pin Assignment

GND_ANA1

VANA33+3.3V

P5_0

GPT A39

BRKOUT n

P1_8

GND_ANA1

P5_1P5_2

P5_4P5_3

P5_5

GND_ANA1

P0_14

P5_6

P5_11P5_10P5_9P5_8P5_7

R499 100kR500 100k

P5_15

R502 100kR501 100k

R504 100kR503 100k

R506 100kR505 100k

VDIG33+3.3V

C148100n/16V/X7R

C14

6

47n/

16V/

X7R

C14

7

47n/

16V/

X7R

CFG7

CFG5CFG6

CFG0

CFG4CFG3CFG2CFG1

AN15AN14

P0_12

GPT A27

VANA50+5.0V

GPT A19GPT A20

GPT A8GPT A9

AN1

GND_ANA1

GND_REF1

VANA33+3.3V

P1_5

P4_2

P1_6P1_7

GND_ANA1

AN3

P2_0

AN4

P5_13P5_12

GPT A18

P2_12

SW1

T yco_1-1571983-1

AN13

SLSO0

RXD0AT XD0A

SCLK1

M TSR0M RST0

M RST1

SCLK0

SLSO1

T XDCAN1RXDCAN1

GND_DIG1

AN29

VANA15+1.5V

AN17

C14

5

47n/

16V/

X7R

R161 1K

AN19

Ana log Power Supply

IC24ESAK-TC1767-256F133HL

Package = 1

V_DDM54

V_DDMF24

V_DDAF23

V_S

SM53

V_S

SM

F25

V_A

GND

051

V_F

AGN

D27

V_AREF052

V_FAREF26

GND_ANA1

P3_10

R162 1K

AN5

R163 1K

Analog Inputs

IC24FSAK-TC1767-256F133HL

Package = 1

AN067

AN166

AN265

AN364

AN463

AN562

AN661

AN736

AN860

AN959

AN1058

AN1157

AN1256

AN1355

AN1450

AN1549

AN1648

AN1747

AN1846

AN1945

AN2044

AN2143

AN2242

AN2341

AN2440

AN2539

AN2638

AN2737

AN2835

AN2934

AN3033

AN3132

AN3231

AN3330 AN34

29

AN3528

P4_1

R164 1K

Port 0: GPT A, SCU

IC24GSAK-TC1767-256F133HL

Package = 1

P0.0/IN0/HWCFG0/OUT 0/OUT 56145






P0.6/IN6/HWCFG6/REQ2/OUT 6/OUT62173

P0.7/IN7/HWCFG7/REQ3/OUT 7/OUT63174

P0.8/IN8/OUT8/OUT 64149

P0.9/IN9/OUT9/OUT 65150

P0.10/IN10/OUT 10/OUT 66151

P0.11/IN11/OUT 11/OUT 67152

P0.12/IN12/OUT 12/OUT 68168

P0.13/IN13/OUT 13/OUT 69169

P0.14/IN14/REQ4/OUT 14/OUT 70175

P0.15/IN15/REQ5/OUT 15/OUT 71176

Port 1: GPT A, SSC1, ADC0, OCDSIC24H

SAK-TC1767-256F133HL Package = 1

P1.0 /IN16/OUT 16/OUT 72/BRKIN/BRKOUT116

P1.1 /IN17/OUT 17/OUT 73119

P1.2 /IN18/OUT 18/OUT 7493

P1.3 /IN19/OUT 19/OUT 7598

P1.4 /IN20/EMGSTOP/OUT 20/OUT 76107

P1.5 /IN21/OUT 21/OUT 77108

P1.6 /IN22/OUT 22/OUT 78109

P1.7 /IN23/OUT 23/OUT 79110

P1.8 /IN24/IN48/MT SR1B/OUT 24/OUT 4894

P1.9 /IN25/IN49/MRST1B/OUT 25/ OUT 4995

P1.10/IN26/IN50/OUT26/OUT50/SLSO1796

P1.11/IN27/IN51/SCLK1B/OUT 27/OUT 5197

P1.12/IN16/OUT 16/AD0EM UX073



P1.15/BRKIN/BRKOUT117

R165 1K

Port 2: GPT A, SSC0/1, MLI0 , M SC0IC24I


P2.0 /IN32/OUT 32/OUT 28/T CLK074

P2.1 /IN33/T READY0A/OUT 33/SLSO03/SLSO1375

P2.2 /IN34/OUT 34/OUT 29/T VALID0A76

P2.3 /IN35/OUT 35/OUT 30/T DAT A077

P2.4 /IN36/RCLK0A/OUT 36/OUT 3178

P2.5 /IN37/OUT 110/OUT 37/RREADY0A79

P2.6 /IN38/RVALID0A/OUT 111/OUT 3880

P2.7 /IN39/RDAT A0A/OUT3981

P2.8 /SLSO04/SLSO14/EN00164

P2.9 /SLSO05/SLSO15/EN01160

P2.10/IN10/OUT 0/M RST 1A161

P2.11/IN11/OUT 1/SCLK1A/FCLP0B162

P2.12/IN12/OUT 2/M TSR1A/SOP0B163

P2.13/IN13/OUT 3/SLSI11/SDI0165

C149100n/16V/X7R

R166 1K

Port 3: GPT A, ASC0/1 , SSC0/1 , SCU, CANIC24J


P3.0/OUT84/RXD0A136

P3.1/OUT85/TXD0135

P3.2/OUT86/SCLK0129

P3.3/OUT87/MRST 0130

P3.4/OUT88/MT SR0132

P3.5/SLSO00/SLSO10/SLSO00&SLSO10126

P3.6/SLSO01/SLSO11/SLSO01&SLSO11127

P3.7/SLSI01/OUT89/SLSO02&SLSO12131

P3.8/SLSO06/OUT 90/T XD1128

P3.9/OUT91/RXD1A138

P3.10/OUT 92/REQ0137

P3.11/OUT 93/REQ1144

P3.12/OUT 94/RXDCAN0/RXD0B143

P3.13/OUT 95/T XDCAN0/T XD0142

P3.14/OUT 96/RXDCAN1/RXD1B134

P3.15/OUT 97/T XDCAN1/T XD1133

R167 1K

Port 4: GPT A, SCUIC24K


P4.0/IN28/IN52/OUT 28/OUT 5286

P4.1/IN29/IN53/OUT 29/OUT 5387

P4.2/IN30/IN54/OUT 30/OUT 54/EXT CLK188

P4.3/IN31/IN55/OUT 31/OUT 55/EXT CLK090

GND_ANA1

Port 5: GPT A, M LI0IC24L


P5.0/IN26/IN40/OUT 8/OUT 401

P5.1/IN27/IN41/OUT 9/OUT 412

P5.2/IN28/IN42/OUT 10/OUT 423

P5.3/IN43/OUT 11/OUT 434

P5.4/IN29/IN44/OUT 12/OUT 445

P5.5/IN30/IN45/OUT 13/OUT 456

P5.6/IN31/IN46/OUT 14/OUT 467

P5.7/IN47/OUT 15/OUT 478

P5.8/OUT89/RDAT A0B13

P5.9/OUT90/RVALID0B14

P5.10/OUT 91/RREADY0B15

P5.11/OUT 92/RCLK0B16

P5.12/OUT 93/SLSO07/TDATA017

P5.13/SLSO16/T VALID0B18

P5.14/OUT 94/T READY0B19

P5.16/OUT 95/T CLK09

R168 1K

P4_0

Vre f50+5.0V

AN2

CFG0

P3_13

CFG6CFG7

CFG5

CFG1

GND_ANA1

AN31

P0_11

GPT A3

CFG2CFG3

P2_2

P2_5

GND_REF1

CFG4

GND_ANA1

P1_10

SLSO2P3_8

AN18

P4_3

P3_11

BRKINn

GND_ANA1

GND_ANA1

P3_12

P1_9

PORST n

R17

3

10K

VDIG33+3.3V R

172

220R

GND_DIG1

D4

LED

_LSM

676-

MQ

VDIG33+3.3V

10k

10kQ6A

BCR183S PACKAGE = 1

2

16

R17

1

4K7

VDIG33+3.3V

L6

B82422A1103K

R17

0

0R_o

pt

L7

B82422A1103K

R16

9

10K

VDIG33+3.3V

Clk

GND_DIG1

VDIG15+1.5V

VDIG33+3.3V

GND_DIG1

GND_DIG1Osci l l ator

IC24BSAK-TC1767-256F133HL

Package = 1

XTAL1102

XTAL2103

V_DDOSC105

V_DDOSC3106

VSSOSC104

General Contro l

IC24CSAK-TC1767-256F133HL

Package = 1

PORST121

T ESTM ODE118

ESR0122

ESR1120

OCDS / JTAG Contro l

IC24DSAK-TC1767-256F133HL

Package = 1

T RST114

T CK/DAP0115

T DI/BRKIN111

T DO/DAP2/BRKOUT113

T MS/DAP1112

GND_DIG1

T RSTnT CK

T MS

T DIT DO

C15010u/10V/X7R

C15110u/10V/X7R

C17

0

100n

/16V

/X7R

C16

8

100n

/16V

/X7R

C15

9

100n

/16V

/X7R

C15

8

100n

/16V

/X7R

C16

7

100n

/16V

/X7R

C16

6

100n

/16V

/X7R

C16

5

100n

/16V

/X7R

C15

3

100n

/16V

/X7R

C15

4

100n

/16V

/X7R

C17

1

100n

/16V

/X7R

C16

4

100n

/16V

/X7R

C16

0

100n

/16V

/X7R

C15

5

100n

/16V

/X7R

C161100n/16V/X7R

C16

3

100n

/16V

/X7R

C15

6

100n

/16V

/X7R

C16

9

100n

/16V

/X7R

C15

7

100n

/16V

/X7R

GND_DIG1

GND_DIG1

VDIG33+3.3V

GND_DIG1 VDIG33+3.3V

GND_DIG1

VDIG15+1.5V

C15

2

100n

/16V

/X7R

Dig i tal Ci rcu i try

Power Supply

IC24ASAK-TC1767-256F133HL

Package = 1

V_DDP11

V_DDP20

V_DDP69

V_DDP83

V_DDP91

V_DDP100

V_DDP124

V_DDP139

V_DDP154

V_DDP171

V_SS

12

V_SS

22

V_SS

70

V_SS

82

V_SS

85

V_SS

92

V_SS

101

V_SS

125

V_SS

140

V_SS

155

V_SS

172

V_DD10

V_DD(SB)21

V_DD68

V_DD84

V_DD99

V_DD123

V_DD153

V_DD170

V_DDFL3141

V_DD89

C11

10

100n

/16V

/X7R




Figure 62 EEPROM

Figure 63 GMR SSC Interface

Figure 64 Temperature Sense of the Logic Board

R910K

R810K

C29 100n

/16V

/X7R

R10opt

IC1

AT25256A-10T Q-2.7CS

1SO

2

WP3

GND4

SI5SCK6

HOLD7

VCC8

R710K

SCK

CSn

SOSI

VDIG33+3.3V

GND_DIG1

IC26 DS92LV010

DE1

RE5

DIN2

ROUT3 VC

C8

GND

4

DO/RI+7

DO/RI-6

IC28 74LVC2G04GW

1A1

2A3

1Y6

2Y4

VCC

5G

ND

2

iGM R_DAT A+

iGM R_DAT A-

GND_DIG1

iGM R_CS_uC

GND_DIG1

R4891K

R4901K

GND_DIG1 GND_DIG1

VDIG33+3.3V

iGM R_RE_uC

iGM R_DI_uCiGM R_ROUT _uC R447

100R

C1127

100n/16V/X7R

GND_DIG1

iGM R_REn_DE+

iGM R_CSn+

iGM R_REn_DE-

iGM R_CSn-C1131

100n/16V/X7R

GND_DIG1

C113010p/16V/X7R

GND_DIG1

C112810p/16V/X7R

GND_DIG1

VDIG33+3.3V

iGM R_CLK-

iGM R_CLK+iGM R_CLK_uC

iGM R_INDEX_uC

R4881K

GND_DIG1

VDIG33+3.3V

GND_DIG1

C1129

100n/16V/X7R

GND_DIG1

IC32

DS90LV031A

Dout1+2

Din11

Vcc

16G

ND8

Dout1-3

Dout2+6

Dout2-5

Dout3+10

Dout3-11

Dout4+14

Dout4-13

Din27

Din39

Din415

EN4

EN*12

Unit temperature sensor (Ambient)Position: bottom of Logic BoardTemp = 10mV/°C + 500mVTemp @ -40C: +100mVTemp @ +125C: +1,750V

LPF: -3dB @ 32Hz

C12

1110

0n/5

0V/X

7R R487

270K

C121222n/50V/X7R

GND

Vout

VCC

IC54

LM50CIM3

2

3

1

T em p_Board

VANA50+5.0V

GND_ANA1




Figure 65 Connector to the Driver Board

4.13.2 Assembly Drawing

Figure 66 Assembly Drawing of the Logic Board (Top)

K1

T W-12-06-L-D-475-SM-A

11

22

33

44

55

66

77

88

99

1010

1111

1212

1313

1414

1515

1616

1717

1818

1919

2020

2121

2222

2323

2424

PWM WTRST _INn

PWM VBPWM VTPWM WB

PWM UBPWM UT

VDC

FLT Vn

FLT Wn

FLT nFLT UnT EM P_HP2_V

T EM P_HP2_W

T EM P_HP2_U

KL_30+12.0V

GND_DIG1

KL_30+12.0V

GND_DIG1GND_ANA1




Figure 67 Assembly Drawing of the Logic Board (Bottom)

For detail information use the zoom function of your PDF viewer to zoom into the drawings on Figure 66 andFigure 67.

4.13.3 LayoutLayout of the Logic Board is shown on Figure 68 (Top Layer), on Figure 69 (Layer-2), on Figure 70 (Layer-3), onFigure 71 (Layer-4), on Figure 72 (Layer-5) and on Figure 73 (Bottom Layer).




Figure 68 Logic Board - Top Layer

Figure 69 Logic Board - Layer-2










Figure 73 Logic Board - Bottom Layer




4.13.4 Bill of Materials

Table 7 Bill of Materials for Logic Board for Hybrid Kit for HybridPACK™1Reference Value / Device PackageC29,C64,C68,C70,C71,C106,C107,C109,C111,C112,C113,C114,C115,C123,C148,C149,C152,C153,C154,C155,C156,C157,C158,C159,C160,C161,C163,C164,C165,C166,C167,C168,C169,C170,C171,C1110,C1210

100n/16V/X7R C0402

C65,C66,C1127,C1129,C1131,C1132,C1133,C1160,C1161,C1163,C1164

100n/16V/X7R C0603

C75 4u7/16V/X7R C1206C76,C77,C80,C81,C104 10n/16V/X7R C0402C78 10uF/10V/X7R C1206C79,C82 4u7/25V/X7R C1206C83,C84 20pF/50V/COG C0402C85,C1151,C1153 100n/50V/X7R C0603C86,C1135,C1136,C1154,C1155 22u/16V/X7R/F_1463575 C1210C92 220nF/100V/C3216X7R2A2

24KT5C1206

C93,C1152 100uF_35V_MAL214097001E3

C1010_CAP_Pin1_Plus

C105,C108 22uF/6.3V/X7R C1206C110 4.7n/50V/X7R C0603C143,C1111 22uF/16V/X7R C1210C144 100n/25V/X7R C0603C145,C146,C147 47n/16V/X7R C0402C150,C151,C1157,C1158 10u/10V/X7R C1206C172,C173,C176,C178,C180,C183,C184,C187,C1169,C1170,C1171,C1173,C1174,C1175,C1176,C1177,C1178,C1179,C1180,C1183,C1184,C1185,C1189,C1190,C1191,C1192,C1193,C1194,C1195,C1196,C1197

1n/50V/X7R C0402

C174,C179,C182 100p/50V/X7R C0402C191,C194,C196 6800p/10V/C0G C0603C1040,C1041,C1042,C1043,C1044,C1045,C1147,C1148,C1149

10p/50V/X7R C0603

C1064,C1065,C1067 3300p/10V/C0G C0603C1112,C1167 100n/50V/X7R/C0805F104

K5C0805

C1128,C1130 10p/16V/X7R C0603C1142 4u7/10V/X7R C1210




C1144,C1146 4u7/10V/X7R/F_9402195 C1206C1145 1u/25V/X7R/F_1637035 C0603C1150 680n/50V/F_1414702 C1206C1156 220n/25V/X7R/F_1414626 C0603C1159 1n/16V/X7R C0402C1166 4.7u/50V/X7R/C1210F475K

5C1210

C1172,C1181,C1182,C1187,C1188,C1201,C1202,C1203,C1204,C1205,C1206,C1207,C1208,C1209

1n/50V/X7R_opt C0402

C1211 100n/50V/X7R C0805C1212 22n/50V/X7R C0603R10,R103,R105,R107,R109,R110,R176,R181,R185,R192,R194,R202,R203,R208,R477,R480,R481,C1213,C1214,C1215,C1216,C1217

Opt R0603

D1 MBRS340T3 SMCD2 BZV55/C13 SOD80C_Pin1_CathodeD3 1SMB30AT3 SMBD4 LED_LSM676-MQ Vishay_TLMK2300D5,D6 SS12_1A_If_20V_Vr DO214AC_SMA_Pin1_CathodeD7,D8,D9 BAT54-04W SOT323FL1 B82789C0104N001 EPCOS_B82789C0IC1 AT25256A-10TQ-2.7 TSSOP8IC2 74ALVC164245DGG TSSOP48IC4,IC31 LT1639HS SO14IC6 LMH6672 SO8IC8 AD2S1200YST LQFP44_P0_8IC13 TLE7368E SO36-38IC16 EH2645ETTTS-20.000M Ecliptek_EH2645IC17 TLE6250GV33 SO8IC23 MAX6369KA-T SOT23-8IC24 SAK-TC1767-256F133HL LQFP176_p0_50IC25 TLE4266GSV10 SOT223IC26 DS92LV010 SO8IC28,IC30 74LVC2G04GW SOT363IC29 74LVCH16T245DL SSOP48IC32 DS90LV031A SO16-1IC33 AM26C32QD SO16-1IC52 MAX3232EIPWRQ1 TSSOP16

Table 7 Bill of Materials for (cont’d)Logic Board for Hybrid Kit for HybridPACK™1Reference Value / Device Package




IC53 MAX6143AASA50 SO8IC54 LM50CIM3 SOT23J1 Jumper Jumper_2wayK1 TW-12-06-L-D-475-SM-A Samtec_TW-12-06-L-D-475-SM-

AK2 Harwin M80-5125042P Harwin_M80-5125042PK3-OCDS HEADER 8X2 tyco_1761686-6L1,L8,L9,L10,L11,L12 MURATA_BLM21PG221SN L0805L3 WE_7447709470 WE-PD_744770L5 MURATA_BLM21P221SN L0805L6,L7 B82422A1103K L1210Q2 BDP949 SOT223Q4 IPD90P03P4L-04 TO252-3Q6 BCR183S SOT363R1,R2,R3,R4,R5,R6,R7,R8,R9,R71,R73,R173,R174,R177,R186,R195,R471,R473,R474,R475,R476

10K R0402

R74,R75,R76,R77,R78,R79,R80,R88,R92,R95,R98,R100,R134,R135,R161,R162,R163,R164,R165,R166,R167,R168,R180,R187,R197,R234,R238,R240,R456

1K R0402

R90,R93,R96,R99 15K R0402R101,R128,R169 10K R0603R102,R104,R106,R108,R478,R479,R482,R497

0R R0603

R113 SMK-R000 / Isabellenhuette R1206R131,R132 60R R0603R133 5K1 R0402R149,R154 Opt R0402R150,R151,R153 4K7 R0402R155,R156,R158,R160 2K4/0.1% R0603R157 390/0.1% R0603R159 3K3/0.1% R0603R170,R224,R498 0R_opt R0603R171 4K7 R0603R172 220R R0603R175,R184,R191,R198,R205 68K R0402R178,R179,R188,R189,R196,R199 51K R0402R182,R193,R200 91K R0402R183,R190,R201,R237,R239,R241 2K R0402





R214,R217,R223,R228,R230,R235 6K8 R0402R215,R218,R472 3K3 R0402R229 0R R0402R429,R430,R431,R447 100R R0603R483,R484,R485 5K_pot_0,25W_20%_Bourn

s_3314J_optBourns_3314J

R486 0R / 0.1% R0402R487 270K R0603R488,R489,R490,R494,R495,R496 1K R0603R491,R492,R493 2K7 R0603R499,R500,R501,R502,R503,R504,R505,R506

100k R0402

SW1 Tyco_1-1571983-1 Tyco_1-1571983-1SW2 SW DIP-4/SM SO8TP1,TP2,TP3,TP4,TP5,TP6,TP7,TP8,TP9 Testpad_SMD_Ettinger Ettinger_12_18_815_testpadU1 HCM49 8.192MABJ-UT Citizen_HCM49


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