Communications and Sensors5G systems & millimeter wave propagationCognitive Radio & Spectral SharingCommunications SecurityFirst Responder/Military Communications Green Communication Internet of Things Long Range Low Power Networks Micro/Pico/Femtocell Devices and Systems MIMO Antenna Systems for Communications Modulation & Signal Processing TechnologiesOn-Body and Short Range Communications Radio over Fiber & Optical/Wireless Convergence Sensor Networks and TechnologiesSoftware-Defined Radio & Multiple Access Space-Time Coding and Systems

Antennas, Propagation, and ScatteringSmart Antennas, Beamforming and MIMOWave Propagation and Channel ModelingWave Scattering and RCSNanoEM, Plasmonics, and ApplicationsMetamaterials, FSS and EBGEM Field Theory and Numerical TechniquesEM Interference & Compatibility, SISpectrum Management and MonitoringELF, RF, µWave, mmW and THz Measurements

Signal Processing (SP) and ImagingMicrowave Imaging and TomographyAcoustic/Sonar Imaging and TechniquesRadar SP and Imaging, SAR, ATR MIMO SP for RadarGround and Foliage Penetration SystemsSignal Acquisition and Sensor ManagementDF, Emitter Location, Elint, Array Processing Target Detection, Identification and TrackingData FusionTime Domain and UWB SP

Summary Submission: April 20, 2017Acceptance Notification: July 5, 2017 Full Paper Submission: September 4, 2017

RF/MW Devices and Circuits, RFICsSolid-State Devices, RFICs µWave, mmW and Sub-mmW Circuits/Technologies Nano and THz Devices/TechnologiesMicrowave PhotonicsPassive Components and CircuitsFilters and MultiplexersFerroelectrics, RF MEMS, MOEMS, and NEMSActive Devices and CircuitsRF Power Amplifiers and DevicesTunable and Reconfigurable Circuits/Systems Analog/Digital/Mixed RF Circuits Circuit Theory, Modeling and ApplicationsInterconnects, Packaging and MCM CAD Techniques for Devices and CircuitsEmerging TechnologiesThermal Management for Devices

Microwave Systems, Radar, Acoustics Aeronautical and Space Applications RFID Devices/Systems/ApplicationsAutomotive/Transportation Radar & CommunicationsEnvironmentally Sensitive (“Green”) DesignUWB and Multispectral Technologies & SystemsEmerging System ArchitecturesModelling Techniques for RF SystemsRadar Techniques, Systems and ApplicationsSonar Systems and ApplicationsWireless Power Transfer & Energy HarvestingTerahertz Systems Biomedical Engineering Advances in MRI: Technology, Systems and ApplicationsMedical RF, MW & MMW Applications and DevicesMedical Imaging and Image Processing

Call for Papers

Important Deadlines

For more information visit:

www.comcas.orgEmail: comcas@ieee.org Organizing CommitteeConference Chair:Shmuel AusterElta Systems Ltd, Israel.IEEE AP/MTT Chapter Chair

Technical Program Chair:Amir BoagTel Aviv University, Israel

Technical Program Co-Chairs:Stephen B. WeinsteinCTTC, USACaleb FultonUniv. of Oklahoma, USAOren EliezerPhazr, Texas, USALance M. KaplanUS Army ARL, USAAleksey DyskinTechnion, Israel Reuven ShavitBen-Gurion University, IsraelOfer BarneaTel Aviv University, Israel

Publications Chair:Benjamin EpsteinECS Inc., USA

Global Administration:James RautioSonnet Software USA

Exhibition Co-ChairsOren HagaiInterlligent, Israel

Tali Pe’erAnalog Devices, Israel

Students and Young Professionals:Aleksey Dyskin Technion, Israel

Yiftach RichterBar Ilan University, Israel

Treasurer:Robert C. ShapiroIEEE ComSoc

Electronic Submissions Chair and Co-chair:Benjamin EpsteinECS Inc., USAMatthias RudolphBTU Cottbus, Germany

Local Arrangements Chair:Itai VollerAEAI, Israel

Publicity Chair and Co-ChairsCarl SheffresMicrowave Journal, USAPat HindleMicrowave Journal, USAGary LerudeMicrowave Journal, USASherry HessNI/AWR, USAAntti LautanenNI/AWR, FinlandTushar SharmaUniversity of Calgary, Canada

Members at Large:Barry S. PerlmanIEEE MTT SocietyDouglas N. ZuckermanIEEE Communications Society

Advisor:Paz Itzhaki-WeinbergerIWC Ltd, Israel

All submitted papers will be peer reviewed. Accepted papers will be published in the COMCAS 2017

Proceedings, which will be submitted for inclusion to IEEE Xplore®.

For author’s instructions and further information, see www.comcas.org.Secretariat:

Ortra Ltd.Tel-Aviv, IsraelTel: +972-3-6384444 Fax: +972-3-6384455Email: comcas@ieee.org

COMCAS 2017 continues the tradition of providing an international, multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwave/RF/mm-wave engineering, communications, antennas, solid state circuits, electronic devices, engineering in medicine, radar, sonar and electronic systems.

The technical program includes invited talks by international experts and contributed papers and will be complemented by a large industrial exhibition.

IEEE COMCAS 2017International Conference on Microwaves, Communications, Antennas and Electronic SystemsDavid Intercont inental Hotel 13-15 November 2017 Tel Aviv, I s rae l

Papers are solicited in a wide range of topics:

www.comcas.org