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Copyright © by John Wiley & Sons 2003 Insulated Gate Bipolar Transistors (IGBTs) MANGAL DAS M.TECH VST SHIV NADAR UNIVERSITY 1

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No Slide TitleInsulated Gate Bipolar Transistors (IGBTs)
MANGAL DAS
Outline
IGBT
BJT
MOSFET
Multi-cell Structure of IGBT
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Cross-section Of IGBT
• Cell structure similar to power MOSFET cell.
• P-region at collector end unique feature of IGBT compared to MOSFET.
• Punch-through (PT) IGBT - N+ buffer layer present.
• Non-punch-through (NPT) IGBT - N+ buffer layer absent.
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Vgs<Vth : No inversion layer created
Depletion layer is created along J2 ,which expands as Vgs increases.
In ‘NON PUNCH THROUGH’ no buffer layer is present so large reverse voltage blocking capacity.
In ‘PUNCH THROUGH ’ buffer layer is present shorter drift region, which lower on-state losses but reverse voltage blocking capacity will be low.
Drift layer
Buffer layer
• With N+ buffer layer, junction J1 has small breakdownvoltage and thus IGBT has little reverse blocking capability - anti-symmetric IGBT
• Buffer layer speeds up device turn-off
• Blocking state operation - VGE < VGE(th)
• Junction J2 extends principally in to n- drift
Region, since the p-type body region is purposely
Doped much more heavily than drift region.
· The thickness of Drift region is large enough to
Accommodate the depletion layer.
Copyright © by John Wiley & Sons 2003
IGBT On-state Operation
Holes moves towards body region along a random path .
Many holes will attracted by emitter metallization.
Some holes recombines with electrons.
Copyright © by John Wiley & Sons 2003
• Approximate equivalent circuit for IGBT valid for normal operating conditions.
• IGBT equivalent circuit showing transistors comprising the parasitic thyristor.
Approximate Equivalent Circuits for IGBTs
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Copyright © by John Wiley & Sons 2003
IGBT I-V Characteristics and Circuit Symbols
• Transfer curve
• Output characteristics
Development of Spice IGBT Model
• Reference - "An Experimentally Verified IGBT Model Implemented in the SABER Circuit Simulator", Allen R. Hefner, Jr. and Daniel M. Diebolt, IEEE Trans. on Power Electronics, Vol. 9, No. 5, pp. 532-542, (Sept., 1994)
• Nonlinear capacitors Cdsj and Ccer due to N-P junction depletion layer.
• Nonlinear capacitor Cebj + Cebd due to P+N+ junction
• MOSFET and PNP BJT are intrinsic (no parasitics) devices
• Nonlinear resistor Rb due to conductivity modulation of N- drain drift region of MOSFET portion.
• Nonlinear capacitor Cgdj due to depletion region of drain-body junction (N-P junction).
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• Built-in IGBT model requires nine parameter values.
• Parameters described in Help files of Parts utility program.
• Parts utility program guides users through parameter estimation process.
• IGBT specification sheets provided by manufacturer provide sufficient informaiton for general purpose simulations.
• Detailed accurate simulations, for example device dissipation studies, may require the user to carefully characterize the selected IGBTs.
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Application
Current rating of single IGBT can be up to 1200 volts,400Amps.
Frequency of operation:20Khz.
Ac and DC motor drives.
Solid state relays
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THANK YOU
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Doped much more heavily than drift region.
The thickness of Drift region is large enough to
Accommodate the depletion layer.

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