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ILC Electronics Manufacturing Opportunities. ILC Industrial Forum at Fermilab September 21-22, 2005 Ray Larsen for SLAC ILC Electronics Group. Outline. I. Power Electronics Modulators Power Supplies II. Controls & Networks III. Instrumentation. Subsystem Relative Costs. - PowerPoint PPT Presentation
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ILC Electronics ManufacturingOpportunities
ILC Industrial Forum at FermilabSeptember 21-22, 2005
Ray Larsen for SLAC ILC Electronics Group
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 2
Outline I. Power Electronics
Modulators Power Supplies
II. Controls & Networks III. Instrumentation
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 3
Subsystem Relative Costs
0
5
10
15
20
25
30
35
% TPC
CF Struct RF SysEng InstTest MagnetVac Cntrl Cryo Ops Instr
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 4
2-Tunnel Model w/~Penetrations
Dual Serial
Gigabit Trays
Dual DC
Power Buses
Instrumentation Electronics
Alcove
Power Electronics
Alcove
Cooling
AC Power Buses & Pnls
Beamline Devices Control/
Data In/Out
Module ServiceSystem
ModulatorsPower
Supplies
Radiation Protection
~6in. Penetration
Module Tray
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 5
I. Power Electronics Modulators
Est. Production Cost 4% TPC Est. Range $100-200M
Power Supplies Est. Production Cost ~4% TPC
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 6
Modulators: TESLA and Marx
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 7
Design Comparison 600 Units total Assume Dual Tunnels, short HV cables to klystron TESLA – Current Baseline design
PFN, IGBT redundant switch at 1/10 HV, bouncer flattener, step-up Xfmr to 120KV, 140A
MARX – R&D Design Potential 40-50% cost reduction, 10X lower switch
current, losses. Plug-in module design to backplane, IGBT switch arrays
each board, vernier board flattener, redundant switches, modules, diagnostic controllers, robotic module swap
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 8
Manufacturing Comparison TESLA:
Traditional capacitor banks in cabinets, point-to-point interconnects, separate charging source at 10KV DC, separate dual discharge switch, separate oil-filled transformer.
Entire unit can be contracted to assembler Could subcontract switches, transformer, HV
cable assemblies, controls subassemblies Modulators and Xfmrs separately factory tested.
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 9
Manufacturing Comparison 2 MARX
Transformer-less oil-free design Each unit has 16 plug-in circuit board modules Total boards = 9600 for 600 units 60% Parts cost in IGBT switch sub-modules Total sub-modules =10 per module, 96,000 for 600 units Capacitors mount on each module Operates in sealed box with air-water heat exchanger Contract for fully assembled factory tested units Subcontract all subassemblies to standard PC board
manufacturers.
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 10
Installation Comparison TESLA
Install tested units in large cabinets, move units into tunnel position depending on how large can handle. May have to separate racks.
Install transformer, HV connections separately Repair in situ or remove failed Xfmr
MARX Install box 2x2x1.5m, populated with modules optional. Option: Populate, service with robotic module remove
and replace system. Can work 24/7 from maintenance depots along machine.
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 11
Power Supplies High Availability 1/n Modular Designs where
failure will interrupt machine Apply as needed to:
KW to 100KW single load or string supplies Multi-channel Corrector supplies Cryogenic magnet supplies
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 12
HA PS Concept – Quads, LGPS5 Parallel 1.25 KW Modules
Backplane
DC Out
AC In/ Out
Serial I/O (5x2)
EmbeddedPSDC’s
n/N parallel modules for DC magnet supply (1/5 shown)
Overall load current feedback
Dual Diagnostics Controller Mezzanine Card each module
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 13
HA PS Module - Correctors, Cryo Motherboard Dual Serial
Control IO Independent
Carriers Hot Swappable
Optional: Redundant n/N w/ Switchover
Dual Bulk 48V DC In
DCOut
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 14
ManufacturingInjection, Damping Ring and Beam Delivery all
warm supplies, LGPS & Modular Main Linac quads, correctors cryogenic low
voltage, high current, low power supplies Total units estimates
LGPS 1/n redundant supplies:1500? Modular n-channel supplies: 3000? Cryogenic modular supplies: 3000
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 15
II. Controls & Networks Review of existing SLAC Linear Collider &
PEP Control System Redundant DEC (HP) Alpha mainframes with 4
tandem processors each Remote Multibus SBC IOCs throughout systems IOCs fan out over multiple serial links to
CAMAC simple communications controllers SLCnet, PEPnet, Pnet custom protocols Special fast timing net locked to Linac, PEP RF
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 16
Existing SLC Layout, Networks
MAIN CONTROL CENTER
SLCnet + Pnet + Timing
PEPnet + Pnet + Ethernet + Timing
SLC/SLD
PEP/ BABAR
3 Km Linac Damping Rings
Injector
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 17
SLC-PEP Controls Architecture
DEC Alphas
Switch
Ethernet
IOC MBCD
CAMAC Serial
CAMAC Crates
PEPnet Pnet
Timing Net
SLCnet Pnet
Timing Net
MAIN CONTROL
PEP/ BABAR SLC/
SLD
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 18
SLC-PEP Summary
SLC Item Function Number Model Location RedundancyControlsExisting Hdwe Architecture
Central Computers Main Control Center 2X4 Proc. DEC Alpha Mainframe MCC 1 of 2Multibus IOCs Remote Nodes 75 Intel SBCs Sectors, Ring IRs NoneMBCDs Serial drivers to CAMAC SCC's 75 Custom SLAC design ~Every 4th Camac Crate NoneCAMAC SCCs Serial crate controllers 300+ Custom SLAC design Every Linac sector, rings NoneNetworksSLCnet Linac to SLD controls Custom SLAC design Linac, Arcs, SLD NonePEPnet PEP ring controls Custom SLAC design PEP rings NoneEthernet PEP new Pentium IOCs Commercial product PEP rings NonePnet Pattern Broadcast Config Custom SLAC design All priority timed areas NoneFast Timing Net RF locked fiducials, PDUs Custom SLAC design RF Master Osc at head end None
SLC Coax cables to PDUs all areas
Software Notes
HP VMS 1Vxworks 2Commun Firmware 3Commun Firmware 3
Notes1 2 computers 4 proc each, 1 is development system and backup, manual failover2 Approx. One per 4 CAMAC crates3 No processor
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 19
SLC-PEP Upgrade Plan
DEC Alphas Or SBC Cluster
Switch Matrix
FECC
Ethernet
CAMAC Crates
Ethernet Timing Net
MAIN CONTROL
PEP/ BABAR
SLC/ SLD
IOC Cluster
Ethernet SCCs
Ethernet Timing Net
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 20
SLC-PEP Upgrade Summary
SLC Proposed Upgrade Hdwe Architecture
Central Computers System Main Control >3 Commercial cluster Main Control Center ~1/3IOCs Remote Node Control ~50 Commercial SBCs (tbd) Main Control Center 1/nFECC CAMAC Cntrlr Replace MBCDs ~50 SLAC custom desing Remote Nodes 1/nCAMAC SCCs Communication cntrlrs (new) 2-400 Commercial unit Remote Front Ends noneNetworksEthernet Dual Star Replace SLC, PEPnet Commercial Main to all nodes DualPnet Upgrade Repalce w/ Ethernet Commercial All priority timed areas DualFast Timing Net RF locked fiducials, PDUs Custom SLAC design RF Master Osc at head end Dual
Fibers to PDUs all areas
SLC Item Function Number Model Location Redundancy
RTEMS?RTEMSVxWorks or RTEMSCommun. Firmware
Software Notes
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 21
ILC Proposed Architecture
Node N
Detector
Linac
Damping Ring
Injector
Instrument Modules
Linac Sector
Dual Star Network
Dual Star Network
Main Control Cluster
Ethernet (Pnet Imbedded) Timing Net
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 22
ILC Proposed SummaryItem Function Number Model Location Redundancy Software Notes
ILCProposed Hdwe Architecture
ATCA Central Cluster System Main Control 2-400 Commercial SBCs (tbd) Main Control Center 1/n Crate LevelATCA Cluster Cntrlrs Data IO from Remote Nodes ~600 Commercial Switches (tbd) Main Control Center Dual Star BackboneATCA NodeCntrlrs Data IO from Front End Brds ~600 Commercial Switches (tbd) Remote Nodes Dual Star BackboneATCA AMC cards Intelligent Front End Modules ~25000 Custom Design, Comml Mfgr All areas along machines Dual Star, 1/n redund.NetworksEthernet All IO, timing to 10 nsec ~5000 Commercial TxRx, switches All carrier modules in crates Dual Star Gb FiberPnet Pattern Broadcast Config ~5000 Commercial Ethernet All priority timed areas Dual Star Gb FiberFast Timing Net RF locked fiducials, chip PDUs ~2500 Custom design RF dual master phase locked Dual Star RF Fiber
to satellite, dual fibers to FEMs
TBD 4,5Linux OS? 5Linux OS? 5Linux OS? 6
Priority Mode on Std. Enet7
4 Auto failover at crate level5 Autofailover ATCA Backbone6 Auto failover modules in critical applications7 Temp compensated fibers, phase locked to RF dual master clocks; auto-failover
Notes
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 23
FEATURES
◊ Dual Star 1/NRedundant Backplanes
◊ Redundant Fabric Switches
◊ Dual Star/ Loop/ Mesh Serial Links
◊ Dual Star Serial Links To/From
Level 2Sector Nodes
Dual Star to/From Sector Nodes
Dual FabricSwitches
ApplicationsModules
Dual Star/Loop/Mesh
Central Controls Cluster
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 24
Linac Sector Nodes
Sector N+1
Sector N
Sector N+2
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 25
Manufacturing Controls Est. = 4% of TPC. Propose all controls to be designed to HA platform. ATCA under study as candidate de facto standard. Modules, hardware, base software -- commercial
contracts from standard suppliers. Custom design necessary for some data switching, fast
timing modules; commercial manufacture. Total modules est. ~4,000 (not incl. instrumentation) Ethernet & Timing fiber plants substantial cost item. HA software major engineering effort, cost
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 26
III. Instrumentation Front End Instrument Modules Est. at 2.5% of TPC. Standard Packaging system required.
Use ATCA HA packaging, concepts Some custom design necessary Assume 2-tunnel model for packaging R&D on Robotic Service System Assume 2-Tunnel Model Consider 1-Tunnel issues as backup (Cost vs.
Availability)
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 27
ILC Linac Instrumentation (~40m)
Cryomodule 1 Cryomodule 2 Cryomodule 3
Cavities 1-12
Cavity Tuner Motor (2)
Coupler (3) Tuner Motor (1 per) Window Arc Detect (2 per) Vacuum Pump (1per)
Piezo Tuner (2)
HOM BPM Ports (2)
RF Power Pickup (1)
Coupler Pfwd Prev
Cryo Resistive Sensors (12) (4/Cryomodule)
K
LLRF Vector Sum
Cryo Vacuum Pumps (6) 2/Cryomodule
SC Quad (1) SC Corrector (2) Cavity BPM (1)
~1m
ATCA StandardModule
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 28
Sector Node Instrument Modules
ATCA Style Carrier Modules, Hot SwappableATM Mezzanine Modules, Hot SwappableStand-Alone or Shelf ClusterDual Redundant Serial I/O, PowerRobotic Replaceable
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 29
Manufacturing All instrument packaging to be as far as possible in
standard HA modules and hot-swappable sub-modules.
Estimate ~ 1 ATCA carrier card w/ sub-modules per meter of machine, ~25,000 total carriers, 100,000 mezzanine modules.
Standard hardware and PC board techniques. Custom designs for high performance, reliability,
minimum cost.
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 30
Addenda: Single Tunnel Cost Study In 2001-2 post-Lehman Review studied placing
instruments inside beam tunnel in concrete holes (TEEs) for radiation protection to reduce overall costs. Study known as CD0.4.
Seemed feasible but for availability would need remote robotics servicing.
Applied to BPMs, LLRF, vacuum pumps-gauges-valves, magnet movers, temperature, MPS-BCS-PPS...
Note: Study was not for HA redundant design, did not estimate civil or robotics costs.
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 31
Lehman ($253M) vs. CD 0.4 ($118M)
Potential Cost Reduction: $135M (53%)
0
10
20
30
40
50
60
70
80
LLRf BPMs Movers Vacuum Racks TEEs
Lehman CD 0.4
September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 32
Comment on Robotics Servicing Study of robotic service system conducted by J. Cornuelle in
collaboration with Stanford ME department graduate engineering students. Simple manipulations of removing, replacing modules in tunnel. Cost payback appears viable; major positive impact on availability
(avoid machine shutdown to replace modules). Viability in dual tunnel also significant in providing 24/7 operation to
minimize size, cost of crews.
All ILC electronics systems planned to be modular, robotically serviceable, some hot-swappable.
Significant manufacturer system opportunity.