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Impedances
Signal Integrity
www.we-online.com Impedances 2018/19
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Seite 1
Agenda
Signal Integrity – Products
• Würth Elektronik CBT
• Basics - Material parameters
• Impedance calculation - Measurement
• HDI aspects
• Low loss materials
www.we-online.com Impedances 2018/19
Stefan KellerProduct [email protected]
Seite 2
Victor HaaghRegional Manager
Benelux [email protected]
www.we-online.com Impedances Seite 3 2018/19
www.we-online.com Impedances Seite 4 2018/19
SI – Signal Integrity
www.we-online.com Impedances 2018/19
MICROSTRIP
Impedance - influencing factors
rε
strong
strong
low medium
w+h = layouter / manufacturert = plating process, base copper
εr = base material (dielectric)
Our offer: competent collaboration!
Seite 5
SI – Signal Integrity
www.we-online.com Impedances 2018/19
Track Width
top - bottom
Dielectricspacing
Track height
Solder Resistthickness
Parameters
Seite 6
Signal Integrity: Epsilon R / Permittivity
www.we-online.com Impedances 2018/19
Dielectric losses
FR4 Prepreg Type 1080
Thickness 60 - 70 µmResin content ~ 60%
FR4 Prepreg Type 7628
Thickness 170 – 190 µmResin content ~ 45%
εr Glas = 6 - 8εr Epoxy ~ 3,5
Influences: - Dielectric spacing- Frequency ….
Influence on impedance and edge steepness …
InfluenceResin content
Seite 7
Signal Integrity Epsilon R
www.we-online.com Impedances 2018/19
Determination εr effective
Seite 8
Signal Integrity Impedance Models
www.we-online.com Impedances 2018/19
Layer configuration:
Line configuration:
Track
Width
Gap /
separation
Track
Width
Gnd
Gnd
Single
Differential
Coplanar
Surface
Microstrip
Embedded
Microstrip
Stripline
Seite 9
Signal Integrity Impedance Calculation
www.we-online.com Impedances 2018/19
Impedance Zo / Zdiff
Seite 10
www.we-online.com Impedances 2018/19Seite 11
Signal Integrity Impedance Calculation
T1 Cu thickness
W2Line Width (head)
εrPermittivity
FR4
H1Dielectric spacingSignal - reference
εrPermittivity
Solder Resist[typ. 3,5]
C2Thickness Solder Resist
over Cu [typ. 15 µm]
S1Gap between
Trackslayout
C1=C3Thickness Solder Resist
over FR4[typ. 42 µm]
W1Line Width (foot)
layout
Signal Integrity Impedance Calculation
www.we-online.com Impedances 2018/19
Prepreg (each one ply) 1080 2113 2116
Layer spacing
above plane layer(pressed thickness , 1 oz copper L2)
68 µm
εr effective 3.5
92 µm
εr effective 3.6
108 µm
εr effective 3.8
Track Width
50 Ω Single Impedance109 µm
(with εr 4.2: 94 µm)
154 µm
(with εr 4.2: 136 µm)
179 µm
(with εr 4.2: 165 µm)
Track Width
Track Separation
100 Ω diff. Impedance
100 µm
305 µm
100 µm
137 µm
100 µm
122 µm
Prepregs: TG 150°, filled, halogen freeMicrostrip Outer Layers
Seite 12
Signal Integrity Impedance calculation
www.we-online.com Impedances 2018/19Seite 13
8 - Layers
WE-Articel No.:
Customer:
Raw-
MaterialCU
Dielectric
constant
Final
Thickness
Customer
requirements
Customer WE [εr] [µm] [µm]
TOP/VS Ref Foil 17.5 µm 17
3.5128
2 S1 S2 35 µm 33
0,150 mm 3.9150
3 Ref Ref 35 µm 33
3.5 128
4 35 µm 33
0,410 mm 4.3410
5 35 µm 33
3.5 128
6 Ref Ref 35 µm 33
0,150 mm 3.9150
PREPREG
1)
2 x 1080
configuration
2 x 1080
Build Up
2 x 1080
ML 8
layer description
Impedance calculation:
S1 Zo 50 Ohms @ 119 µm track width
S2 Zo 50 Ohms @ 236 µm track width
S2 Zdiff 100 Ohm @ 100 / 115 / 100 µm
Signal Integrity Impedance Measurement
www.we-online.com Impedances 2018/19
Technology TDR(Polar Instruments)
Crossovertest prod - PCB
Seite 14
Signal Integrity Impedance Measurement
www.we-online.com Impedances 2018/19
23 mm
28 mm
150 mm
Single150 x 23 mm
max. 6 measurements
Differential150 x 28 mm
max. 2 measurements
Impedance Report
on TCs
Seite 15
Signal Integrity HDI
www.we-online.com Impedances 2018/19
Version 1:PTH
Version 2:Microvia / Buried Via
“Open ended antennas”
Seite 16
Discontinuities in possible wiring schemes
Blind and Buried Viasresult in reduced discontinuities!
HDI instead ofexpensive RF Mat.
Spread Glas
Signal Integrity HDI
www.we-online.com Impedances 2018/19
Layer 1 GND
Layer 2 Signal 1
Layer 3 Signal 2Layer 4 GND
Layer 1 GND
Layer 2 Signal 1
Layer 3 Signal 2
Layer 4 GND
Seite 17
Signal Integrity HDI
www.we-online.com Impedances 2018/19
Layer 2 / 11 Layer 3 / 10
TypEdge Coupled
Offset strip lineEdge Coupled
Offset strip line
Distance layer 1 / 12 GND 130 µm 211 µm
Distance layer 4 / 9 GND 181 µm 100 µm
Cu Thickness T 30 µm 16 µm
Upper trace width Wup 82 µm 95 µm
Lower trace width Wlow 100 µm 100 µm
Separation S 214 µm 152 µm
Substrate Dielectric εr 3.8 / 3.5 / 3.8 3.8 / 3.5 / 3.8
Impedance 100,0 Ω 100,0 Ω
Core
Prepreg
Wlow
H1 = 130 µm
H2 = 81 µm
H3 = 100 µm
Wup
S
layer 1 / 12 GND
layer 2 / 11 Sig
layer 3 / 10 Sig
layer 4 / 9 GND
T = 30 µm
T = 16 µm
Seite 18
Signal Integrity HDI
www.we-online.com Impedances 2018/19
Almost without impedance restricions
Layer spacing ~ 100 µm
Track Width 90 µm
Example:
INTEL Atom
Pitch 0.593 mm diagonal
Seite 19
Signal Integrity
www.we-online.com Impedances 2018/19
High Frequency – High Speed
Next challenges:
– Low Loss Materials
• up to 10 or 25 GHz
– ELIC / Stacked Buried / Microvias as an alternative to Back Drilling as well
• especially for BGA Pitch ≤ 0.50 mm (because of the µVia Pad size)
– Very Low Profile copper foils (Skin Effekt)
– Upgrading measurement technique for High Frequency
Seite 20
Signal Integrity High Frequency
www.we-online.com Impedances 2018/19
0%
500%
1000%
1500%
Kern
0.1
0
Kern
0.2
5
Pre
pre
g 1
00
µm
Material Costs in Comparison(100 Panels)
FR4 Standard 100%
FR4 low CTE
Mid Performance 1
Mid Performance 2
High Performance
Seite 21
Co
re
Co
re
Services
www.we-online.com Impedances 2018/19
Services
Design
– Design Support
– DFM Check
– Impedance matching
– Build-ups
– Impedance measurement
– Development partnerships
12 - Lagen
WE-Artikel Nr.:
Kunde: CBT SH
BASIS-
Material CU
Dielektrizitäts-
konstante ENDDICKE
KUNDEN-
FORDERUNG
KUNDE WE [εr] [µm] [µm]
TOP/VS S1 S3 Foil 17,5 µm 16
4.25 175
2 REF 35 µm 33
0,100 mm 3.8 100
3 REF 35 µm 33
3.7 134
4 S2 17,5 µm 16
0,100 mm 3.8 100
5 REF REF 17,5 µm 16
3.6 87
6 S 17,5 µm 16
0,100 mm 3.8 100
7 S 17,5 µm 16
LAGENAUFBAU
ML12
AUFBAUPREPREG
ANZAHL/TYP
2 x 1080
LAGENBEZEICHNUNG
1)
1 x 1080
1 x 2116
1 x 2113
Seite 22
www.we-online.com Impedances 2018/19
ServicesSystemsProducts
Knowing the relationships - is a secret of success!
We are looking forward to good cooperation!
Stefan Keller
Product Manager
Victor Haagh
Regional Manager Benelux
Seite 23