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Importance of Materials Processing All electronic devices & systems are made of materials in various combinations Raw materials are far from the final electronic products Semiconductor materials (e.g., Si, Ge, GaAs, GaN...) used for devices must be of extremely high purity and crystalline order

Importance of Materials Processing All electronic devices & systems are made of materials in various combinations Raw materials are far from the final

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Importance of Materials Processing

All electronic devices & systems are made of materials in

various combinations

Raw materials are far from the final electronic products

Semiconductor materials (e.g., Si, Ge, GaAs, GaN...) used for

devices must be of extremely high purity and crystalline order

Real Materials and their Processing

Particles, lines and rigid bodies vs. real materials

Material-specific properties determine the function

and processing details of a material

Comprehensive knowledge of materials processing

requires ~ 5-10 years of learning and practice

Advantage and role of physics students

Different Types of Electronic Devices

Discrete devices: diodes, transistors, rectifiers, sensors, …

Integrated circuits (IC): CPU, DRAM, ASIC, …

Opto-electronics: LED, semiconductor laser (in CD/VCD players, optical communication), display, lighting, …

Solar cells: on satellites, calculators, large-scale power generation

Data storage: DRAM, hard disk, ZIP, flush memory, CD-ROM, ...

Electro-mechanic devices: electro-magnetic, piezo-electric, ...

Different Electronic Materials Semiconductors: Elemental (Si, Ge) & Compound (GaAs, GaN,

ZnS, CdS, …)

Insulators: SiO2, Al2O3, Si3N4, SiOxNy, ...

Conductors: Al, Au, Cu, W, silicides (metal-Si compounds), ...

Organic and polymer: liquid crystal, insulator, semiconductor, conductor

Composite materials: multi-layer structures, nano-materials, photonic crystals, ...

More: magnetic, superconductor, bio-material, …

Cubic Lattices and Main Crystal Faces

X

Z

Y

Lattice Structures of Semiconductors

Ga

Ga

Ga

Ga

GaGa

Ga

GaGa

Ga

Ga GaGa

Ga

AsAs

AsAs

Si

Si

Si

SiSi

Si

Si

Si

Si

Si

Si

Si

Si

SiSi

SiSi

Si

Silicon, a = 5.43 Å(diamond structure)

GaAs, a = 5.65 Å(zincblende structure)

Point Defects

impurities

1D & 2D Defects

Edge Dislocation

Real Device Structures in IC

MOSFET

Bipolar transistorDiode

n

n+ p

metal contacts

Si(001) wafer

Primary flat edgealong [110]

Secondary flat

N-channel MOSFET (Metal-oxide-semiconductor FET)

Schematic vs. Real

Fabrication of a Diode

wafer cut diffusion

oxidation lithography

diffusion(f) metallization

Crystal growth andwafer preparation

Diffusion

Oxidation

Lithography Diffusion

Ion implantation

Etching

Deposition

Testing Packaging

Processes involved in Semiconductor device and IC manufacture

Connection

Epitaxy