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A world class facility to develop A world class facility to develop the technology needed the technology needed to fulfill the CITRIS to fulfill the CITRIS vision. vision. 18 / 9 / 2001 UC Berkeley Microfabrication Labor atory 1

Integrated Microfabrication Facility

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IMF. Integrated Microfabrication Facility. A world class facility to develop the technology needed to fulfill the CITRIS vision. 18 / 9 / 2001. UC Berkeley Microfabrication Laboratory. 1. CITRIS Research Priorities. - PowerPoint PPT Presentation

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Page 1: Integrated Microfabrication Facility

A world class facility to develop A world class facility to develop

the technology needed the technology needed

to fulfill the CITRIS vision.to fulfill the CITRIS vision.

18 / 9 / 2001 UC Berkeley Microfabrication Laboratory 1

Page 2: Integrated Microfabrication Facility

18 September 2001 UC Berkeley Microfabrication Laboratory 2

Energy Efficiency - networked miniature sensors proposed for monitoring building conditions to maximize efficiency of utility systems

CITRIS Research PrioritiesDisaster Response - new sensors for rapidly determining casualties, structural integrity, and most effective emergency response

Low energy 16mm3 integrated sensorKSJ Pister Group Micromirror Drive Mechanism

M.P. Young

Microfabricated neural probeL.P. Lee group

Page 3: Integrated Microfabrication Facility

18 September 2001 UC Berkeley Microfabrication Laboratory 3

Transportation - optoelectronic sensors required for analysis of traffic flow to maximize efficiency of transportation networks

CITRIS Research PrioritiesHealthcare - discrete sensors for automated or point of use health monitoring. Integration with biological receptor materials of BNC.

Biological processing microdeviceA.P. Pisano, T.D. Sands groups

Electrolytic oxygen microbubblerR.T. Howe, J.D. Keasling groups

Environment – networked sensors for automated air and water analysis to enable immediate detection of and response to contamination situations

Page 4: Integrated Microfabrication Facility

18 September 2001 UC Berkeley Microfabrication Laboratory 4

ICsMEMS

OptoelectronicsBioelectronics

The Challenge: Integrate Researchacross several disciplines

Page 5: Integrated Microfabrication Facility

18 September 2001 UC Berkeley Microfabrication Laboratory 5

Optoelectronic materials

Berkeley Microlab

Berkeley Sensor and Actuator Center

Integrated Circuit Design

MEMs

The opportunity:The Integrated Microfabrication Facility

Page 6: Integrated Microfabrication Facility

18 September 2001 UC Berkeley Microfabrication Laboratory 6

Based Upon the Successful Microlab Model:Shared Laboratory Capabilities

Common Academic Model:Individual Fiefdoms

Successful Microlab Model:Shared Laboratory

The shared model implies professional administration and support staff, funded by “per use” fees:

efficient use of valuable laboratory space significant improvement in quality of support PI research flexibility research cross fertilization

Page 7: Integrated Microfabrication Facility

18 September 2001 UC Berkeley Microfabrication Laboratory 7

Existing Microlab / Future IMF:Accessible to All

>70 Principal Investigators; 7 departments, >240 active usersfrom UCD, UCSB and UCSD LBL, LLNL, Sandia NL

Page 8: Integrated Microfabrication Facility

18 September 2001 UC Berkeley Microfabrication Laboratory 8

A Unique High Tech Incubator among theCalifornia Institutes for Science and Innovation

The Berkeley Microfabrication Laboratory Affiliates has28 member companies, many with fewer than 10 employees.The IMF will greatly expand these activities.

Onix Microsystems, Inc.

Paracer, Inc.

Photon Imaging, Inc.

Progressant Technologies

Robert Bosch Corporation

Sandia National Lab

MicroAssembly Tech

MicroGen Systems

Molecular Reflections

Nanochip, Inc.

NewPeregrine, Inc.

Network Photonics Inc.

OMM, Inc.

DICon Fiberoptics, Inc.

Emitronix, Inc.

General Nanotechnology

GENOA Corporation

Hewlett-Packard Company

Jet Propulsion Laboratory

MEMS PI

Adriatic Research Institute

Advanced Integrated Photonics

Alien Technology Corp.

Analog Devices

Bandwidth9

Bluefox

Covalent Materials, Inc.

Page 9: Integrated Microfabrication Facility

18 September 2001 UC Berkeley Microfabrication Laboratory 9

Compound semiconductor processing for integration of optoelectronic components

Berkeley Microlab

Integrated Microfabrication Facility

MEMs processing compatible with

biologically modified substrates and

silicon ICs

Bioengineering Nanotechnology

Center

Integrated Materials

Laboratory

Silicon Integrated circuit fabrication with better than

0.25 m minimum geometries

Education - fiber connected teaching laboratories for long distance learning and remote access to specialized analytical equipment.

Page 10: Integrated Microfabrication Facility

18 September 2001 UC Berkeley Microfabrication Laboratory 10

20,000 ft2 Class 100 clean room (1st floor)16-20 ft ceilings and 20-30 ft spans critical for equipment installation8” silicon, 8”/6” MEMs, optoelectronics, and multi-substrate integration

Significant Infrastructure Requirements

16,000 ft2 utilities and support (basement / roof / perimeter)5000 gal DI water, 7gpm, 60gpm non-DI recirc. chilled water30 changes per hour air filtering, 60 ft3/min 80-100psi clean dry airmultiple hazardous gas and liquid effluent treatment systems 300 tons cooling capacity, >50,000 ft3/min supply and exhaust air9000 gal liquid nitrogen storage tank, 400 gal liquid oxygen storagetoxic and flammable compressed gas delivery and storage areaequipment and supplies delivery and staging area

Page 11: Integrated Microfabrication Facility

18 September 2001 UC Berkeley Microfabrication Laboratory 11

Significant Space Allocation

Page 12: Integrated Microfabrication Facility

18 September 2001 UC Berkeley Microfabrication Laboratory 12

Laboratory construction from CITRIS development funds (~44M)

Laboratory equipment funding (~50M)corporate equipment donationsexisting Microlab equipmentnew funding

Detailed tool lists will include:<.25m photolithography (8”, 6” and manual)in house >1m minimum feature mask productionthin film deposition (furnace, rapid thermal, and plasma)thin film etching (wet etching and plasma)Analysis (CDSEM, TEM, ellipsometry, profilometry, interferometry)MEMs specific (etch release, supercritical drying,capillary self assembly)packaging (electroplating, dicing, wafer/wire/flipchip bonding)

Extensive Equipment Requirements

Page 13: Integrated Microfabrication Facility

18 September 2001 UC Berkeley Microfabrication Laboratory 13

• Advanced Energy

• ASML

• Atmel Corp.

• Advanced Micro Devices

• Applied Materials

• Asyst Technologies Inc.

• Cymer

• Etec Systems Inc.

• Intel Corporation

• KLA-TENCOR

• Lam Research Corp.

• Mykrolis Corp.

• Nikon Research Corp.

• Novellus Systems Inc.

• Silicon Valley Group

• Schlumberger

• Tokyo Electron Limited

“Small Feature Reproducibility” Group – key potential sponsors for equipping IMF