Integrated Photonics for

Fiber Optic Sensing Solutions

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Technobis group

Developing and providing state of the

art solutions for instruments

and modules based on

advanced technologies

Offices & Meeting Rooms (800 m2)

Assembly & testing (700 m2, ESD Compliant)

Conditioned labs for prototyping (128 m2)

Vibration isolated labs (64 m2)

Down-flow lab (28 m2)

ENGINEERING ASSEMBLY TESTING R&D VALIDATION PACKAGING INTEGRATION

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Fibre Optic Sensing technology

Integrated Photonics

Demand for high performance

Technology benefits

Technobis Fibre Technologies

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Strain

Temperature

Pressure

Humidity

Chemicals

Shape

Fibre Optic Sensing Technology Why Fibre Optics?• Totally passive

• Small size & weight

• Chemically inert, intrinsically safe

• Non-conductive, immune to EMI

• Low loss allows remote sensing

Fibre Bragg Grating

State of the Art systems:

Deminsys High Speed (20kHz, 1pm)

“ Python Medical, real-time data transfer

“ Ultra Flight Approved TRL6

Ladybug High Resolution (7kHz, 20fm)

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High Performance, High Endurance, High Reliability

High-tech Industry

High resolution strain sensing

Precision stabilization control in vacuum

Medical

Minimal invasive sensing

Steerable needle shape monitoring, vascular

sensing of pressure and temperature

Automotive Testing

High speed strain sensing

Impact deflection analysis on crash dummies

and structures

Aerospace

High reliability strain sensing

Damage detection and shape monitoring

on composite structures

Nuclear

High endurance sensing

Strain sensing in high temperature and

radiated environments

Space

High reliability sensing

Thermal mapping, displacement sensing

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Benefits from Free Space Optics to Integrated Photonics

Solid State, Smaller Sizes

Reduced Weight, Low Power, Low Costs

Hybrid Integration of Materials and Electronics

Improved Thermal and Vibration Stability

Improved Reliability

Conventional Optics Integrated Photonics

Systems Modules

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Small size

Low weight

Solid state

Low power

Thermal stability

Mechanically stable

Gator system, Next Generation FBG interrogation

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World Records

Measurement Resolution of 0.02 fmΔλ (~ 0.02 nano-strain)

Sampling Speeds up to 20MHz

100 unique FBG Sensors per single fiber (20kHz, 10fmΔλ)

ASPIC Achievements World Records & Products

1 kHz 20 kHz 80 kHz 2 MHz 20 Mhz

1 pm Grasshopper Gator

0.1 pm FlyingGator SuperGator

10 fm SpaceGator

1 fm LadyGator MediGator

0.4 fm LadyBug

Speed

R

esolu

tion

high performance

extreme performance

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Packaging in General

Thermal Management (sub-milliKelvin control)

Low-noise front-end electronics

ASPIC Design rules -> repeatability, consistent quality

Generic Packaging

Easy accessible and fast ASPIC assessment

Small pre-series possibility

Few to many electrical and optical I/O (incl. RF)

Custom Packaging

Suitable for volume production

Focus on high performance

Interfacing

Thermal stability

Cost efficient

High sensing speeds (MHz)

Extreme measurement resolutions

ASPIC packaging : a bare die will not work

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Aerospace

Smart (Reliable) Sensing & Datacom

Damage & Impact Detection

Shape Sensing

Helicopter Blade Monitoring

Example Applications

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Long-term and in-service monitoring of the condition and damage state of

vehicle systems in operation using advanced sensors that are permanently

attached to the structure.

Smart Sensing

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Smart Sensing

Light

Source

Divider

1:N

Interrogator

Switch

1:N

Interrogator

Switch

1:N

Interrogator

Interrogator

Single Module

Sensing System

Concept

Damage Detectionhigh speed, high resolution,

time-inteleaved

Shape Sensinglow speed, low resolution, time-

interleaved

Impact detectionhigh speed, high resolution

continuous

Load Monitoringlow speed, high resolution,

continuous

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Redundancy / Time-Interleaved Multiplexing

Datacomm Integration, Sync locking mechanism

One Single Module fits the mentioned features and all relevant performances

Smart (Reliable) Sensing and Datacom

ASPIC based FBG interrogator device design with integrated datacommunication capability

Sensing/datacomm device #1 Sensing/datacomm device #2

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Damage Detection / Impact Detection (TAPAS/SARISTU)

damage

Interrogator & Sensor development

(a.o. stringer debonds, impact damage, delaminations, crack growth)

• Embedding of sensors • Impact monitoring

• Frequency analysis • Load, strain, temperature and humidity

Composite panel

Modal behavior

Damage (delamination, debondig, …) Change in modal behavior Analysis (NLR) detects and identifies damage

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Morphing trailing edge

Shape control

Fibre optic based sensing beams

Morphing Structures - Shape Monitoring (SARISTU)

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Test Results

Highspeed (20kHz)

32 sensors simultaneously

0% dataloss

Graph:

Conventional Strain Gage -> blue

FBG sensor -> yellow & red

Helicopter Blade Monitoring (BOEING)

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Medical Applications

Haptic Feedback Grasper

Minimal Invasive Biopsy Needle

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Reducing applied grasping force

Offering visco-elastic tissue feeling

Ergonomic pistol hand grip

Shorter learning curve

The First Haptic Feedback Grasper

FROIForce-Reflecting Operative Instrument

“An instrument with feeling

allows a surgeon to work with

more accuracy”

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Steerable MRI compatible robotic instruments

with precise force sensing for accurate tissue

characterization and dexterous navigation in

percutaneous interventions

Minimal Invasive Biopsy Needle

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Company Highlights

Technology Roadmap

Achievements

Chip manufacturing

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Market Focus

Aeronautics & Space

High-Tech Industry

Medical System

Application Focus

Damage & Impact Detection

Integration of Sensing & Datacomm

Thermal Mapping of Structures

Shape Sensing

Smart Structure Concepts

Other: Gyroscope, BOTDR, Multi-Cavity

Technology Focus

High Performance (FBG) Sensing

Discrimination Strain /Temperature

Design of minimal SHM sensor networks

Technology Roadmap

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ASPIC Technology Highlights & Factsheet

Patents

1 patent by Technobis

1 patent with Customer (ASML)

2 patents pending by Technobis

3 patents pending with Customers

ASPIC Timeline

2008: ASPIC activities (Jeppix, Paradigm)

2009: ASPIC design support

2012: First ASPIC

2013: ASPIC tft-fos design with Bright Photonics

2015: First Full Wafer Runs (HHI and SmartPhotonics)

Facilities

2013: Down-flow chamber

2014: New Facilities

2014: Two vibration-isolated test labs

Multiple ASPIC platforms

InP, SOI, TriPleXTM

Most foundries

IME, CEA-LETI, SmartPhotonics

HHI, OclaroPackaging & Package Design

Close cooperation with Tyndall Institute

New BU; Technobis ipps

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58 chip designs, multiple test structures and 2500 chips !

Run : Europic, HHI

Description : MZI

# Designs : 2

# Chips : 5

Run : LETI

Descripotion : Tests, MZI

# Designs : 1

# Chips : 42

Run : JePPIX

Description : MZI

# Designs : 1

# Chips : 4

Run : Paradigm, Oclaro

Description : Gator

# Designs : 1

# Chips : 4

Run : Lionix

Description : Interposer

# Designs : 1

# Chips : 5

Run : GPICSFab

Description : Tests, Grasshopper, Ladybug, Dragonfly, Ant

# Designs : 4

# Chips : 17

Run : Paradigm, HHI

Description : Gator

# Designs : 4

# Chips : 8

Run : IME

Description : MZI

# Designs : 2

# Chips : 8

Run : Testrun, HHI

Description : SOA Test

# Designs : 1

# Chips : 1

Run : Smartphotonics SP9

Description : Test structures, SOA

# Designs : 3

# Chips : 17

Run : Lionix

Description : Dividers, Interposers

# Designs : 6

# Chips : 162

Run : Paradigm, HHI

Description : Grasshopper, Ladybug, Casgator, Test Structures

# Designs : 3

# Chips : 12

Run : Paradigm, Oclaro

Description : Ant

# Designs : 1

# Chips : 42

Run : Leti

Description : Ring Resonator

# Designs : 1

# Chips : 2

Run : Smartphotonics SP10

Description : Gator, MWL, Grasshopper

# Designs : 4

# Chips : 58

Run : Smartphotonics SP11

Description : Grasshopper, Ladybug, Ladygator, SOA

# Designs : 6

# Chips : 153

Run : Jeppix, HHI

Description : Chiroptera, Grasshopper, Ladybug

# Designs : 3

# Chips : 36

Run : Paradigm, HHI

Description : BOTDR

# Designs : 4

# Chips : 12

Run : Lionix

Description : AWG

# Designs : 1

# Chips : 4

Run : Spitfire 1

Description : Chip 6, 7

# Designs : 2

# Chips : 300

Run : Smartphotonics SP13

Description : LuckyChip

# Designs : 1

# Chips : 8

Run : Actphast, Full Wafer, HHI

Description : Grasshopper, Ladybug, Ladygator, CasGator, Gator, Ant, SOA, Chiroptera

# Designs : 10

# Chips : 86

2012

2013

2014

2015

InP SOI TriplexTM

Run : Spitfire 2

Description : Chip 19

# Designs : 1

# Chips : 1500

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Thank you for your attention