Intel® Solid-State Drive DC S3700 Series

Intel® Solid-State Drive DC S3700 Series

Product Specification

Capacity: 2.5-inch: 100GB, 200GB, 400GB, 800GB 1.8-inch: 200GB, 400GB

Components: − Intel® 25nm NAND Flash Memory − High Endurance Technology (HET) Multi-Level Cell

(MLC) Form Factors: 2.5-inch and 1.8-inch Read and Write IOPS1,2 (Full LBA Range, IOMeter* Queue

Depth 32) − Random 4KB3 Reads: Up to 75,000 IOPS − Random 4KB Writes: Up to 36,000 IOPS

− Random 8KB3 Reads: Up to 47,500 IOPS − Random 8KB Writes: Up to 20,000 IOPS

Bandwidth Performance1 − Sustained Sequential Read: Up to 500 MB/s4 − Sustained Sequential Write: Up to 460 MB/s

Endurance: 10 drive writes per day5 for 5 years Latency (average sequential)

− Read: 50 µs (TYP) − Write: 65 µs (TYP)

Quality of Service6,8 − Read/Write: 500 µs (99.9%)

Performance Consistency7,8 Read/Write: Up to 90%/90% (99.9%)

AES 256-bit Encryption Altitude (simulated)

– Operating: -1,000 to 10,000 ft – Operating9: 10,000 to 15,000 ft – Non-operating: -1,000 to 40,000 ft

Product Ecological Compliance − RoHS*

Compliance − SATA Revision 3.0; compatible with SATA 6Gb/s, 3Gb/s

and 1.5Gb/s interface rates − ATA/ATAPI command Set – 2 (ACS-2); includes SCT

(Smart Command Transport) and device statistics log support

− Enhanced SMART ATA feature set − Native Command Queuing (NCQ) command set − Data set management Trim command

Power Management − 2.5-inch: 5V or 12V SATA Supply Rail10 − 1.8-inch: 3.3V SATA Supply Rail − SATA Interface Power Management − OS-aware hot plug/removal − Enhanced power-loss data protection

Power11 − Active: Up to 6 W (TYP) − Idle: 650 mW

Weight: − 2.5” 200, 400, 800GB: 73.6 grams ± 2 grams − 2.5” 100GB: 70 grams ± 2 grams − 1.8” 200, 400GB: 38 grams ± 2 grams

Temperature − Operating: 0o C to 70o C − Non-Operating12: -55o C to 95o C − Temperature monitoring and logging − Thermal throttling

Shock (operating and non-operating): − 1,000 G/0.5 msec

Vibration − Operating: 2.17 GRMS (5-700 Hz) − Non-operating: 3.13 GRMS (5-800 Hz)

Reliability − Uncorrectable Bit Error Rate (UBER):

1 sector per 10^17 bits read − Mean Time Between Failures (MTBF):

2 million hours − End-to-End data-path protection

Certifications and Declarations − UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft* WHCK*,

VCCI*, SATA-IO* Compatibility

− Windows* 7 and Windows* 8 − Windows* Server 2012 − Windows* Server 2008 Enterprise 32/64bit SP2 − Windows* Server 2008 R2 SP1 − Windows* Server 2003 Enterprise R2 64bit SP2 − Red Hat* Enterprise Linux* 5.5, 5.6, 6.1, 6.3 − SUSE* Linux* Enterprise Server 10, 11 SP1 − CentOS* 64bit 5.7, 6.3 − Intel® SSD Toolbox with Intel® SSD Optimizer

1. Performance values vary by capacity and form factor 2. Performance specifications apply to both compressible and incompressible data 3. 4KB = 4,096 bytes; 8KB = 8,192 bytes. 4. MB/s = 1,000,000 bytes/second 5. Based on JESD218 standard. For 200GB 1.8 inches drive, it is 9.8 drives write per day. 6. Based on Random 4KB QD=1 workload, measured as the time taken for 99.9 percentile of commands to finish the round-trip from host to drive and back to host 7. Based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test) 8. Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability9. Extended operation at a higher altitude might impact reliability. 10. Defaults to 12V, if both 12V and 5V are present 11. Based on 5V supply; refer to Table 7 for more details 12. Please contact your Intel representative for details on the non-operating temperature range

Order Number: 328171-010US

Ordering Information

Contact your local Intel sales representative for ordering information.

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Copyright © 2015 Intel Corporation. All rights reserved.

Product Specification January 2015 2 328171-010US


Contents

Revision History ........................................................................................................................................................................ 4 Terms and Acronyms................................................................................................................................................................ 5 1.0 Overview ....................................................................................................................................................................... 6 2.0 Product Specifications............................................................................................................................................... 7

2.1 Capacity ......................................................................................................................................................................................... 7 2.2 Performance ................................................................................................................................................................................ 7 2.3 Electrical Characteristics........................................................................................................................................................ 9 2.4 Environmental Conditions ................................................................................................................................................. 11 2.5 Product Regulatory Compliance ..................................................................................................................................... 12 2.6 Reliability ................................................................................................................................................................................... 12 2.7 Temperature Sensor............................................................................................................................................................. 13 2.8 Power Loss Capacitor Test ................................................................................................................................................ 13 2.9 Hot Plug Support ................................................................................................................................................................... 13

3.0 Mechanical Information ......................................................................................................................................... 14 4.0 Pin and Signal Descriptions .................................................................................................................................. 16

4.1 2.5-inch Form Factor Pin Locations .............................................................................................................................. 16 4.2 1.8-inch Form Factor Pin Locations .............................................................................................................................. 16 4.3 Connector Pin Signal Definitions .................................................................................................................................... 17 4.4 Power Pin Signal Definitions ............................................................................................................................................. 17

5.0 Supported Command Sets..................................................................................................................................... 19 5.1 ATA General Feature Command Set ............................................................................................................................. 19 5.2 Power Management Command Set ............................................................................................................................... 19 5.3 Security Mode Feature Set ................................................................................................................................................ 20 5.4 SMART Command Set ......................................................................................................................................................... 20 5.5 Device Statistics ...................................................................................................................................................................... 27 5.6 SMART Command Transport (SCT) ............................................................................................................................... 28 5.7 Data Set Management Command Set .......................................................................................................................... 28 5.8 Host Protected Area Command Set .............................................................................................................................. 28 5.9 48-Bit Address Command Set ......................................................................................................................................... 29 5.10 General Purpose Log Command Set ............................................................................................................................. 29 5.11 Native Command Queuing ................................................................................................................................................ 29 5.12 Software Settings Preservation ....................................................................................................................................... 29

6.0 Certifications and Declarations ............................................................................................................................ 30 7.0 References................................................................................................................................................................. 31 Appendix A: IDENTIFY DEVICE Command Data ............................................................................................................... 32

January 2015 Product Specification 328171-010US 3


Revision History Date Revision Description

October 2012 001 Initial release

November 2012 002 Updated Power On to Ready specification for 800 GB capacity

February 2013 003 Updated: OS Compatibility; Certifications and Declarations; Power Pin Signal Definitions; SMART Attributes descriptions

March 2013 004 Edited for clarity

April 2013 005 Updated Device Identify Table; SMART Attribute Definition. Endurance spec for 1.8-inch 200 GB drive, voltage spec

June 2013 006 Added X,Y, Z dimension in section 3.0

March 2014 007

Page 1: Compliance, Changed from ATA8-ACS2 to ATA9-ACS2 Table 14: Changed Endurance Rating Value Table 18: Changed SMART Attribute E9h, PW and Threshold values to 1. Section 5.4.1.1: Added User Notes and changed step 6 in Use Case 2. Appendix A: Changes to Words 59-62, 80, 81, 89, 90, 129-159, 176-205 and 255.

April 2014 008

Page 1: Compliance, Changed from ATA9-ACS2 to ATA/ATAPI Command Set - 2 (ACS-2) Table 9: Added footnotes Table 10: Footnote corrections Table 11: Title correction Appendix A: Changed Default Value of Word 105 from 0004h to 0006h

September 2014 009 Page 1: Altitude spec change with added footnote (note 9). Table 14: Updated footnote for Reliability table Table 18: Updated SMART attribute B8h description and changed threshold values

January 2015 010 In Section 5.6, added clarification to word 106 of Identify Device Command and SCT command process to change the reported value.



Terms and Acronyms

Term Definition

ATA Advanced Technology Attachment

CRC Cyclic Redundancy Check

DAS Device Activity Signal

DMA Direct Memory Access

ECC Error Correction Code

EXT Extended

FPDMA First Party Direct Memory Access

GB Gigabyte Note: The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.

Gb Gigabit

HDD Hard Disk Drive

HET High Endurance Technology

KB Kilobyte

I/O Input/Output

IOPS Input/Output Operations Per Second

ISO International Standards Organization

LBA Logical Block Address

MB Megabyte (1,000,000 bytes)

MLC Multi-level Cell

MTBF Mean Time Between Failures

NCQ Native Command Queuing

NOP No Operation

PB Petabyte

PBW Peta Bytes Written

PCB Printed Circuit Board

PIO Programmed Input/Output

RDT Reliability Demonstration Test

RMS Root Mean Square

SATA Serial Advanced Technology Attachment

SCT SMART Command Transport

SMART Self-Monitoring, Analysis and Reporting Technology An open standard for developing hard drives and software systems that automatically monitors the health of a drive and reports potential problems.

SSD Solid-State Drive

TB Terabyte

TB Tera Bytes Written

TYP Typical

UBER Uncorrectable Bit Error Rate



1.0 Overview

This document describes the specifications and capabilities of the Intel® SSD DC S3700 Series.

The Intel SSD DC S3700 Series delivers leading performance and Quality of Service combined with world-class reliability and endurance for Serial Advanced Technology Attachment (SATA)-based computers in four capacities: 100GB, 200GB, 400GB and 800GB.

By combining 25nm Intel® NAND Flash Memory technology with SATA 6Gb/s interface support, the Intel SSD DC S3700 Series delivers sequential read speeds of up to 500 MB/s and sequential write speeds of up to 460 MB/s. Intel SSD DC S3700 Series delivers Quality of Service of 500 µs for random 4KB reads and writes measured at a queue depth of 1 (see Table 6).

The Intel SSD DC S3700 Series also includes High Endurance Technology (HET), which combines NAND silicon enhancements and SSD NAND management techniques to extend the write endurance of an SSD, leading to lifetime endurance levels of 10 drive writes per day for 5 years.

The industry-standard 2.5-inch form factor enables interchangeability with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, ruggedness, and power savings offered by an SSD.

Intel SSD DC S3700 Series offers these key features:

• High Endurance Technology (HET)

• High I/O and throughput performance

• Consistent I/O latency

• Enhanced power-loss data protection

• End-to-End data-path protection

• Thermal throttling

• Temperature Sensor

• Inrush current management

• Low power

• High reliability

• Enhanced ruggedness

• Temperature monitor and logging

• Power loss protection capacitor self-test



2.0 Product Specifications

2.1 Capacity

Table 1: User Addressable Sectors

Intel® SSD DC S3700 Series Unformatted Capacity

(Total User Addressable Sectors in LBA Mode)

100GB 195,371,568

200GB 390,721,968

400GB 781,422,768

800GB 1,562,824,368

Notes: 1GB = 1,000,000,000 bytes; 1 sector = 512 bytes. LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive. The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.

2.2 Performance

Table 2: Random Read/Write Input/Output Operations Per Second (IOPS)

Specification1 Unit Intel SSD DC S3700 Series

100 GB 200 GB (2.5”/1.8”) 400 GB (2.5”/1.8”) 800 GB

Random 4KB Read (up to)2 IOPS 75,000 75,000 / 75,000 75,000 / 75,000 75,000

Random 4KB Write (up to) IOPS 19,000 32,000 / 29,000 36,000 / 36,000 36,000

Random 8KB Read (up to)3 IOPS 47,500 47,500 / 47,500 47,500 / 47,500 47,500

Random 8KB Write (up to) IOPS 9,500 16,500 / 14,500 19,500 / 19,500 20,000

Notes: 1. Performance measured using IOMeter* with Queue Depth 32. Measurements are performed on a full Logical Block Address (LBA) span of the

drive. 2. 4KB = 4,096 bytes 3. 8KB = 8,192 bytes



Table 3: Random Read/Write IOPS Consistency


100 GB 200 GB (2.5”/1.8”) 400 GB (2.5”/1.8”) 800 GB

Random 4KB Read (up to)2 % 90 90 90 90

Random 4KB Write (up to) % 85 90 90 90

Random 8KB Read (up to)3 % 90 90 90 90

Random 8KB Write (up to) % 85 90 90 90

Notes: 1. Performance consistency measured using IOMeter* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th

percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

2. 4KB = 4,096 bytes 3. 8KB = 8,192 bytes

Table 4: Sequential Read and Write Bandwidth

Specification Unit Intel® SSD DC S3700 Series

100GB 200GB 400GB 800GB

Sequential Read (SATA 6Gb/s)1 MB/s 500 500 500 500

Sequential Write (SATA 6Gb/s)1 MB/s 200 365 460 460

Notes: 1. Performance measured using IOMeter* with 128KB (131,072 bytes) of transfer size with Queue Depth 32.

Table 5: Latency

Specification Intel SSD DC S3700 Series

100, 200 and 400GB 800 GB

Latency1 (TYP) Read Write Power On to Ready2

50 µs 65 µs 2.0 s

50 µs 65 µs 3.0 s

Notes: 1. Device measured using IOMeter. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential

workload. 2. Power On To Ready time assumes proper shutdown. Time varies if shutdown is not preceded by STANDBY IMMEDIATE command.



Table 6: Quality of Service

Specification Unit

Intel SSD DC S3700 Series

Queue Depth=1 Queue Depth=32

100GB 200/400/800

GB 100GB

200/400/800 GB

Quality of Service1,2 (99.9%)

Reads ms 0.5 0.5 1 1

Writes ms 0.5 0.5 15 10

Quality of Service 1,2 (99.9999%)

Reads ms 10 5 10 5

Writes ms 10 5 20 20

Notes: 1. Device measured using IOMeter. Quality of Service measured using 4 KB (4,096 bytes) transfer size on a random workload on a full Logical

Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

2. Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the round-trip from host to drive and back to host.

2.3 Electrical Characteristics

Table 7: Operating Voltage for 2.5-inch Form Factor

Electrical Characteristics Intel® SSDDC S3700 Series

100, 200, 400 and 800GB

5 V Operating Characteristics: Operating Voltage range Rise time (Max/Min) Fall time (Min)2 Noise level Min Off time3 Inrush Current (Typical Peak) 1

5 V (±5%) 1 s / 1 ms

1 ms 500 mV pp 10 Hz – 100 KHz 50 mV pp 100 KHz – 20 MHz

500 ms 1.0 A, < 1 s

12 V Operating Characteristics: Operating Voltage range Rise time (Max/Min) Fall time (Min)2 Noise level Min Off time3 Inrush Current (Typical Peak) 1

12 V (±10%) 1 s / 1 ms

1 ms 1000 mV pp 10 Hz – 100 KHz 100 mV pp 100 KHz – 20 MHz

500 ms 1.0 A, < 1 s

Notes: 1. Measured from initial device power supply application 2. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management 3. The drive needs to be powered off for at least 500msec before powering on



Table 8: Power Consumption for 2.5-inch Form Factor (5V Supply)

Specification Unit Intel SSD DC S3700 Series

100GB 200GB 400GB 800GB

Active Write - RMS Average 1 W 2.8 4.2 5.2 5.8

Active Write - RMS Burst 2 W 3.1 4.6 7.7 8.2

Idle W 0.6 0.6 0.6 0.6

Notes: 1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is

measured using scope trigger over a 100 ms sample period 2. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured

using scope trigger over a 500 µs sample period

Table 9: Power Consumption for 2.5-inch Form Factor (12V Supply)

Specification Unit Intel SSD DC S3700 Series

100GB 200GB 400GB 800GB

Active Write - RMS Average1 W 2.9 4.4 5.4 6.0

Active Write - RMS Burst2 W 3.3 4.8 7.6 8.2

Idle W 0.8 0.8 0.8 0.8

Notes: 1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is

measured using scope trigger over a 100 ms sample period 2. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured

using scope trigger over a 500 µs sample period

Table 10: Operating Voltage for 1.8-inch Form Factor

Electrical Characteristics Intel® SSD DC S3700 Series

200 and 400GB

Operating Voltage for 3.3 V (±5%) Min Max Rise time (Max/Min) Fall time (Min)2 Noise level Min Off time3

3.13 V 3.47 V

1 s / 1 ms 1 ms

300 mV pp 10 Hz – 100 KHz 500 mV pp 100 KHz – 20 MHz

500 ms

Inrush Current (Typical Peak) 1 1.2 A, < 1 s

Notes: 1. Measured from initial device power supply application 2. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management 3. The drive needs to be powered off for at least 500msec before powering on



Table 11: Power Consumption for 1.8-inch Form Factor


200GB 400GB

Active Write - RMS Average @ 3.3V W 4.3 5.3

Active Write - RMS Burst @ 3.3V W 4.7 7.9

Idle @ 3.3V W 0.6 0.6

Notes: 1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) power is measured

using scope trigger over a 100 ms sample period.

2.4 Environmental Conditions

Table 12: Temperature, Shock, Vibration

Temperature Range

Case Temperature Operating Non-operating1

0 – 70 oC

-55 – 95 oC

Temperature Gradient2

Operating Non-operating

30 oC/hr (Typical) 30 oC/hr (Typical)

Humidity Operating Non-operating

5 – 95 % 5 – 95 %

Shock and Vibration Range

Shock3


1,000 G (Max) at 0.5 msec 1,000 G (Max) at 0.5 msec

Vibration4


2.17 GRMS (5-700 Hz) Max 3.13 GRMS (5-800 Hz) Max

Notes: 1. Please contact your Intel representative for details on the non-operating temperature range. 2. Temperature gradient measured without condensation. 3. Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be

applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value. 4. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be

applied in the X, Y or Z axis. Vibration specification is measured using RMS value.



2.5 Product Regulatory Compliance

Intel® SSD DC S3700 Series meets or exceeds the regulatory or certification requirements in the following table:

Table 13: Product Regulatory Compliance Specifications

Title Description Region For Which

Conformity Declared

TITLE 47-Telecommunications CHAPTER 1— FEDERAL COMMUNMICATIONS COMMISSION PART 15 — RADIO FREQUENCY DEVICES ICES-003, Issue 4 Interference-Causing Equipment Standard Digital Apparatus

FCC Part 15B Class B CA/CSA-CEI/IEC CISPR 22:02. This is CISPR 22:1997 with Canadian Modifications

USA

Canada

IEC 55024 Information Technology Equipment — Immunity characteristics— Limits and methods of measurement CISPR24:2010

EN-55024: 1998 and its amendments European Union

IEC 55022 Information Technology Equipment — Radio disturbance Characteristics— Limits and methods of measurement CISPR24:2008 (Modified)

EN-55022: 2006 and its amendments European Union

EN-60950-1 2nd Edition Information Technology Equipment — Safety — Part 1: General Requirements

USA/Canada

UL/CSA EN-60950-1 2nd Edition Information Technology Equipment — Safety — Part 1: General Requirements

USA/Canada

2.6 Reliability

Intel SSD DC S3700 Series meets or exceeds SSD endurance and data retention requirements as specified in the JESD218 standard. Reliability specifications are listed in the following table:

Table 14: Reliability Specifications

Parameter Value

Uncorrectable Bit Error Rate (UBER)

< 1 sector per 1017 bits read Uncorrectable bit error rate will not exceed one sector in the

specified number of bits read. In the unlikely event of a non-recoverable read error, the SSD will report it as a read failure to the host; the sector in error is considered corrupt and is not returned to the host.

Mean Time Between Failures (MTBF)

2 million hours Mean Time Between Failures is estimated based on Telcordia* methodology and demonstrated through Reliability Demonstration Test (RDT).



Parameter Value

Power On/Off Cycles

24 per day Power On/Off Cycles is defined as power being removed from the SSD, and then restored. Most host systems remove power from the SSD when entering suspend and hibernate as well as on a system shutdown.

Insertion Cycles 50 on SATA cable 500 on backplane

SATA/power cable insertion/removal cycles.

Data Retention 3 months power-off retention once SSD reaches rated write endurance at 40 °C The time period for retaining data in the NAND at maximum rated

endurance.

Endurance Rating 100GB: 1.83 PBW 200GB: 3.65 PBW 400GB: 7.30 PBW 800GB: 14.60 PBW While running JESD218 standard1 and based on JESD219 workload.

Note:

1 Refer to JESD218 standard table 1 for UBER, FFR and other Enterprise SSD endurance verification requirements. UBER design and majority of life target is 1E-17. Endurance verification acceptance criterion based on establishing <1E-16 at 60 confidence.

2.7 Temperature Sensor

The Intel® SSD DC S3700 Series has an internal temperature sensor with an accuracy of +/-2C over a range of -20C to +80C which can be monitored using two SMART attributes: Airflow Temperature (BEh) and Device Internal Temperature (C2h).

For more information on supported SMART attributes, see Table 19 “SMART Attributes” on page 20.

2.8 Power Loss Capacitor Test

The Intel SSD DC S3700 Series supports testing of the power loss capacitor, which can be monitored using the following SMART attribute: (175, AFh).

2.9 Hot Plug Support

Hot Plug insertion and removal is supported in the presence of a proper connector and appropriate operating system (OS), as described in the SATA 3.0 specification.

This product supports asynchronous signal recovery and issues an unsolicited COMINIT when first mated with a powered connector to guarantee reliable detection by a host system without hardware device detection.



3.0 Mechanical Information Figures 1 and 2 show the physical package information for the Intel® SSD DC S3700 Series in the 2.5- and 1.8-inch form factors. All dimensions are in millimeters.

Figure 1. Intel SSD DC S3700 Series, 2.5-inch Form Factor Dimensions

X – Length -- * Y - Width Z - Height

100.45 Max 69.85 +/- 0.25 7.0 +0/-0.5

* - does not include 0.3 connector protrusion



Figure 2: Intel® SSD DC S3700 Series, 1.8-inch Form Factor Dimensions

X - Length Y - Width Z - Height

78.50 +/- 0.60 54.0 +/- 0.25 5.0 +/- 0.35



4.0 Pin and Signal Descriptions

4.1 2.5-inch Form Factor Pin Locations

Figure 3: Layout of 2.5-inch Form Factor Signal and Power Segment Pins

Note: 2.5-inch connector supports built in latching capability.

4.2 1.8-inch Form Factor Pin Locations

Figure 4: Layout of 1.8-inch Form Factor Signal and Power Segment Pins



4.3 Connector Pin Signal Definitions

Table 15: Serial ATA Connector Pin Signal Definitions—2.5- and 1.8-inch Form Factors

Pin Function Definition

S1 Ground 1st mate

S2 A+ Differential signal pair A

S3 A-

S4 Ground 1st mate

S5 B- Differential signal pair B

S6 B+

S7 Ground 1st mate

Note: Key and spacing separate signal and power segments.

4.4 Power Pin Signal Definitions

Table 16: Serial ATA Power Pin Definitions—2.5-inch Form Factors

Pin1 Function Definition Mating Order

P12 Not connected (3.3 V Power) --

P22 Not connected (3.3 V Power) --

P32 Not connected (3.3 V Power; pre-charge) 2nd Mate

P43,4 Ground Ground 1st Mate

P53 Ground Ground 1st Mate


P73,5 V5 5 V Power 1st Mate

P83,5 V5 5 V Power 2nd Mate

P93,5 V5 5 V Power 2nd Mate


P116 DAS/DSS Device Activity Signal/Disable Staggered Spin-up

2nd Mate

P123,4 Ground Ground 1st Mate

P137 V12 12 V Power 1st Mate

P147 V12 12 V Power 2nd Mate

P157 V12 12 V Power 2nd Mate

Notes: 1. All pins are in a single row, with a 1.27 mm (0.050-inch) pitch. 2. Pins P1, P2 and P3 are connected together, although they are not connected internally to the device. The host may put 3.3 V on these pins. 3. The mating sequence is:

• ground pins P4-P6, P10, P12 and the 5V power pin P7 • signal pins and the rest of the 5V power pins P8-P9

4. Ground connectors P4 and P12 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in a suitably configured backplane connector.

5. Power pins P7, P8, and P9 are internally connected to one another within the device. 6. The host may ground P11 if it is not used for Device Activity Signal (DAS). 7. Pins P13, P14 and P15 are internally connected to one another within the device. The host may put 12 V on these pins.



Table 17: Serial ATA Power Pin Definitions—1.8-inch Form Factors

Pin Function Definition Mating Order1

P12 V33 3.3 V Power 2nd Mate

P22 V33 3.3 V Power, per-charge 2nd Mate

P33 Ground -- 1st Mate

P43 Ground -- 1st Mate

P54 V5 5 V Power; not connected. 1st Mate

P64 V5 5 V Power; not connected. 2nd Mate

P75 DAS/DSS Device Activity Signal/Disable Staggered Spin-up

2nd Mate

Key Key NC NC

P86 Optional Manufacturing Test Pin 2nd Mate

P96 Optional Manufacturing Test Pin 2nd Mate

Notes: 1. All mate sequences assume zero angular offset between connectors. 2. P1 and P2 are internally connected to one another within the device. 3. Ground connectors P3 and P4 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in

a suitably configure backplane connector. 4. Pins P5 and P6 are not connected internally to the device but there is an option to connect through a zero ohm stuffing resistor. The host may

put 5V on these pins. 5. The host may ground P7 if it is not used for Device Activity Signal (DAS). 6. P8 and P9 should not be connected by the host.



5.0 Supported Command Sets Intel® SSD DC S3700 Series supports all mandatory ATA (Advanced Technology Attachment) commands defined in the ATA8-ACS specification described in this section.

5.1 ATA General Feature Command Set The Intel SSD DC S3700 Series supports the ATA General Feature command set (non- PACKET), which consists of:

− EXECUTE DEVICE DIAGNOSTIC − SET FEATURES − IDENTIFY DEVICE

Note: See Appendix A, “IDENTIFY DEVICE Command Data” on page 30 for details on the sector data returned after issuing an IDENTIFY DEVICE command.

Intel SSD DC S3700 Series also supports the following optional commands:

− READ DMA − WRITE DMA − READ SECTOR(S) − READ VERIFY SECTOR(S) − READ MULTIPLE − SEEK − SET FEATURES − WRITE SECTOR(S) − SET MULTIPLE MODE1 − WRITE MULTIPLE − FLUSH CACHE − READ BUFFFER − WRITE BUFFER − NOP − DOWNLOAD MICROCODE − WRITE UNCORRECTABLE EXT

1. The only multiple supported will be multiple 1

5.2 Power Management Command Set

Intel SSD DC S3700 Series supports the Power Management command set, which consists of:

− CHECK POWER MODE − IDLE − IDLE IMMEDIATE − SLEEP − STANDBY − STANDBY IMMEDIATE



5.3 Security Mode Feature Set

Intel SSD DC S3700 Series supports the Security Mode command set, which consists of:

− SECURITY SET PASSWORD − SECURITY UNLOCK − SECURITY ERASE PREPARE − SECURITY ERASE UNIT − SECURITY FREEZE LOCK − SECURITY DISABLE PASSWORD

5.4 SMART Command Set

Intel® SSD DC S3700 Series supports the SMART command set, which consists of:

− SMART READ DATA − SMART READ ATTRIBUTE THRESHOLDS − SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE − SMART SAVE ATTRIBUTE VALUES − SMART EXECUTE OFF-LINE IMMEDIATE − SMART READ LOG SECTOR − SMART WRITE LOG SECTOR − SMART ENABLE OPERATIONS − SMART DISABLE OPERATIONS − SMART RETURN STATUS − SMART ENABLE/DISABLE AUTOMATIC OFFLINE

5.4.1 SMART Attributes

The following table lists the SMART attributes supported by the Intel SSD DC S3700 Series and the corresponding status flags and threshold settings.

Table 18: SMART Attributes

ID Attribute Status Flags

Threshold SP EC ER PE OC PW

05h

Re-allocated Sector Count Raw value: shows the number of retired blocks since leaving the factory (grown defect count). Normalized value: beginning at 100, shows the percent

remaining of allowable grown defect count.

1 1 0 0 1 0 0 (none)

09h

Power-On Hours Count Raw value: reports power-on time, cumulative over the

life of the SSD, integer number in hour time units. Normalized value: always 100.

1 1 0 0 1 0 0 (none)

0Ch

Power Cycle Count Raw value: reports the cumulative number of power cycle events over the life of the device.

Normalized value: always 100.

1 1 0 0 1 0 0 (none)

AAh Available Reserved Space (See Attribute E8) 1 1 0 0 1 1 10





ABh

Program Fail Count Raw value: shows total count of program fails. Normalized value: beginning at 100, shows the percent remaining of allowable program fails.

1 1 0 0 1 0 0 (none)

ACh

Erase Fail Count Raw value: shows total count of erase fails. Normalized value: beginning at 100, shows the percent remaining of allowable erase fails.

1 1 0 0 1 0 0 (none)

AEh

Unexpected Power Loss Also known as “Power-off Retract Count” per magnet-ic-drive terminology. Raw value: reports number of unclean shutdowns, cu-mulative over the life of the SSD. An “unclean shutdown” is the removal of power without STANDBY IMMEDIATE as the last command (regardless of PLI activity using capacitor power). Normalized value: always 100.

1 1 0 0 1 0 0 (none)

AFh

Power Loss Protection Failure Last test result as microseconds to discharge cap, satu-rates at max value. Also logs minutes since last test and lifetime number of tests. Raw value: Bytes 0-1: Last test result as microseconds to dis-charge cap, saturates at max value. Test result expected in range 25 <= result <= 5000000, lower indi-cates specific error code. Bytes 2-3: Minutes since last test, saturates at max value. Bytes 4-5: Lifetime number of tests, not increment-ed on power cycle, saturates at max value. Normalized value: set to 1 on test failure or 11 if the capacitor has been tested in an excessive temperature condition, otherwise 100.

1 1 0 0 1 1 10

B7h

SATA Downshift Count Raw value: reports number of times SATA interface selected lower signaling rate due to error. Normalized value: always 100.

1 1 0 0 1 0 0 (none)

B8h

End-to-End Error Detection Count Raw value: reports number of LBA tag mismatches in end-to-end data protection path. Normalized value: always 100.

1 1 0 0 1 1 90

BBh

Uncorrectable Error Count Raw value: shows the number of errors that could not be recovered using Error Correction Code (ECC). Normalized value: always 100.

1 1 0 0 1 0 0 (none)





BEh

Temperature - Airflow Temperature (Case) Raw value: reports SSD case temperature statis-

tics. Bytes 0-1: Current case temperature, Celsius Byte 2: Recent min case temperature, Celsius Byte 3: Recent max case temperature, Celsius Bytes 4-5: Over temperature counter. Number of times sampled temperature exceeds drive max operating temperature specification. Normalized value: 100 – case temperature in C degrees

1 0 0 0 1 0 0 (none)

C0h

Power-Off Retract Count (Unsafe Shutdown Count) Raw value: reports the cumulative number of unsafe

(unclean) shutdown events over the life of the device. An unsafe shutdown occurs whenever the device is powered off without STANDBYIMMEDIATE being the last command.


1 1 0 0 1 0 0 (none)

C2h

Temperature - Device Internal Temperature Raw value: Reports internal temperature of the SSD in degrees Celsius. Temperature reading is the value direct from the printed circuit board (PCB) sensor without offset. Normalized value: 150 – device temperature in C degrees, 100 if device temperature less than 50.

1 0 0 0 1 0 0 (none)

C5h

Pending Sector Count Raw value: number of current unrecoverable read

errors that will be re-allocated on next write. Normalized value: always 100.

0 1 0 0 1 0 0 (none)

C7h

CRC Error Count Raw value: shows total number of encountered SATA

interface cyclic redundancy check (CRC) errors. Normalized value: always 100.

1 1 0 0 1 0 0 (none)

E1h

Host Writes Raw value: reports total number of sectors written by the

host system. The raw value is increased by 1 for every 65,536 sectors (32MB) written by the host.


1 1 0 0 1 0 0 (none)

E2h

Timed Workload Media Wear Raw value: measures the wear seen by the SSD (since

reset of the workload timer, attribute E4h), as a percentage of the maximum rated cycles. Divide the raw value by 1024 to derive the percentage with 3 decimal points.


1 1 0 0 1 0 0 (none)





E3h

Timed Workload Host Read/Write Ratio Raw value: shows the percentage of I/O operations that

are read operations (since reset of the workload timer, attribute E4h). Reported as integer percentage from 0 to 100.


1 1 0 0 1 0 0 (none)

E4h

Timed Workload Timer Raw value: measures the elapsed time (number of

minutes since starting this workload timer). Normalized value: always 100.

1 1 0 0 1 0 0 (none)

E8h

Available Reserved Space Raw value: reports number of reserve blocks remaining. Normalized value: begins at 100 , which corresponds

to 100 percent availability of the reserved space. The threshold value for this attribute is 10 percent availability.

1 1 0 0 1 1 10

E9h

Media Wearout Indicator Raw value: always 0. Normalized value: reports the number of cycles the

NAND media has undergone. Declines linearly from 100 to 1 as the average erase cycle count increases from 0 to the maximum rated cycles.

Once the normalized value reaches 1, the number will not decrease, although it is likely that significant additional wear can be put on the device.

1 1 0 0 1 1 1

EAh

Thermal Throttle Status Raw value: reports Percent Throttle Status and Count of events

Byte 0: Throttle status reported as integer percentage. Bytes 1-4: Throttling event count. Number of times thermal throttle has activated. Preserved over power cy-cles. Byte 5: Reserved.


1 1 0 0 1 0 0 (none)

F1h

Total LBAs Written Raw value: reports the total number of sectors written

by the host system. The raw value is increased by 1 for every 65,536 sectors (32MB) written by the host.


1 1 0 0 1 0 0 (none)

F2h

Total LBAs Read Raw value: reports the total number of sectors read by

the host system. The raw value is increased by 1 for every 65,536 sectors (32MB) read by the host.


1 1 0 0 1 0 0 (none)



Table 19: SMART Attribute Status Flags

Status Flag Description Value = 0 Value = 1

SP Self-preserving attribute Not a self-preserving attribute Self-preserving attribute

EC Event count attribute Not an event count attribute Event count attribute

ER Error rate attribute Not an error rate attribute Error rate attribute

PE Performance attribute Not a performance attribute Performance attribute

OC Online collection attribute Collected only during offline activity

Collected during both offline and online activity

PW Pre-fail warranty attribute Advisory Pre-fail

5.4.1.1 Timed Workload Endurance Indicators

Timed Workload Media Wear Indicator — ID E2h

This attribute tracks the drive wear seen by the device during the last wear timer loop, as a percentage of the maximum rated cycles. The raw value tracks the percentage up to 3 decimal points. This value should be divided by 1024 to get the percentage.

For example: if the raw value is 4450, the percentage is 4450/1024 = 4.345%. The raw value is held at FFFFh until the wear timer (attribute E4h) reaches 60 (minutes) after a SMART EXECUTE OFFLINE IMMEDIATE (B0h/D4h) subcommand 40h to the SSD. The normalized value is always set to 100 and should be ignored.

Timed Workload Host Reads Percentage — ID E3h

This attribute shows the percentage of I/O operations that are read operations during the last workload timer loop. The raw value tracks this percentage and is held at FFFFh until the workload timer (attribute E4h) reaches 60 (minutes). The normalized value is always set to 100 and should be ignored.

Workload Timer — ID E4h

This attribute is used to measure the time elapsed during the current workload. The attribute is reset when a SMART EXECUTE OFFLINE IMMEDIATE (D4h) subcommand 40h is issued to the drive. The raw value tracks the time in minutes and has a maximum value of 2^32 = 4,294,967,296 minutes (8,171 years). The normalized value is always set to 100 and should be ignored.



User Notes

• Sending a SMART EXECUTE OFFLINE IMMEDIATE (B0h/D4h) subcommand 40h to the SSD resets and starts all three attributes (Media Wear Indicator, Attribute E2h, Host Reads Percentage, Attribute E3h, and the Workload timer, Attribute E4h) to FFFFh.

• The Attribute raw values are held at FFFFh until the Workload timer (Attribute E4h) reaches a total of 60 (minutes) of power on time. After 60 minutes, the Timed Workload data is made available.

• After the Workload timer (E4h) reaches 60 (minutes), the Timed Workload data is saved every minute so only 59 seconds of data is lost if power is removed without receiving ATA STANDBY IMMEDIATE. Accumulated data is not reset due to power loss.

• Upon power up, the attributes hold a snapshot of their last saved values for 59 seconds and live data is available after 60 seconds, once the initial one hour interval is completed.

Example Use Cases

The Timed Workload Endurance attributes described in this section are intended to be used to measure the amount of media wear that the drive is subjected to during a timed workload.

Ideally, the system that the drive is being used in should be capable of issuing SMART commands. Otherwise, provisions have been provided to allow the media wear attributes to be persistent so the drive can be moved to a SMART capable system to read out the drive wear attribute values.

Use Case 1 – With a System Capable of SMART Commands

1. On a SMART capable system issue the SMART EXECUTE OFF-LINE IMMEDIATE (D4h) sub-command 40h to reset the drive wear attributes.

2. Run the workload to be evaluated for at least 60 minutes. Otherwise the drive wear attributes will not be available.

3. Read out the drive wear attributes with the SMART READ DATA (D0h) command.

Use Case 2 – With a System Not Capable of SMART Commands

1. On a SMART capable system, issue the SMART EXECUTE OFF-LINE IMMEDIATE (D4h) sub-command 40h to reset the drive wear attributes.

2. Move the drive to the system where the workload will be measured (and not capable of SMART commands).

3. Run the workload to be evaluated for at least 60 minutes. Otherwise the drive wear attributes will not be available.

4. Do a clean system power down by issuing the ATA STANDBY IMMEDIATE command prior to shutting down the system. This will store all the drive wear SMART attributes to persistent memory within the drive.

5. Move the drive to a SMART capable system. 6. Read out the drive wear attributes with the SMART READ DATA (D0h) command within 59

seconds after power-up.



Example Calculation of Drive Wear

The following is an example of how the drive wear attributes can be used to evaluate the impact of a given workload. The Host Writes SMART attribute (E1h) can also be used to calculate the amount of data written by the host during the workload by reading this attribute before and after running the workload. This example assumes that the steps shown in “Example Use Cases” on page 18 were followed to obtain the following attribute values:

• Timed Workload Media Wear (E2h) has a raw value of 16. Therefore, the percentage wear = 16/1024 = 0.016%.

• Timed Workload Host Read/Write Ratio (E3h) has a normalized value of 80, indicating that 80% of operations were reads.

• Workload Timer (E4h) has a raw value of 500. Therefore the workload ran for 500 minutes.

• Host Writes Count (E1h) had a raw value of 100,000 prior to running the workload and a value of 130,000 at the end of the workload. Therefore, the number of sectors written by the host during the workload was 30,000 * 65,535 = 1,966,050,000 sectors or 1,966,050,000 * 512/1,000,000,000 = 1,007 GB.

The following conclusions can be made for this example case:

The workload took 500 minutes to complete with 80% reads and 20% writes. A total of 1,007 GB of data was written to the device, which increased the media wear in the drive by 0.016%. At this point in time, this workload is causing a wear rate of 0.016% for every 500 minutes, or 0.00192%/hour.

5.4.2 SMART Logs

Intel® SSD DC S3700 Series implements the following Log Addresses: 00h, 02h, 03h, 06h, and 07h.

Intel DC S3700 Series implements host vendor specific logs (addresses 80h-9Fh) as read and write scratchpads, where the default value is zero (0). Intel SSD DC S3700 Series does not write any specific values to these logs unless directed by the host through the appropriate commands.

Intel DC S3700 Series also implements a device vendor specific log at address A9h as a read-only log area with a default value of zero (0).



5.5 Device Statistics

In addition to the SMART attribute structure, statistics pertaining to the operation and health of the Intel SSD DC S3700 Series can be reported to the host on request through the Device Statistics log as defined in the ATA specification.

The Device Statistics log is a read-only GPL/SMART log located at read log address 0x04 and is accessible using READ LOG EXT, READ LOG DMA EXT or SMART READ LOG commands.

The following table lists the Device Statistics supported by the Intel SSD DC S3700 Series.

Table 20: Device Statistics Log

Page Offset Description Equivalent SMART attribute

(if applicable)

0x00 -- List of Supported Pages --

0x01 – General Statistics

0x08 Power Cycle Count 0Ch 0x10 Power-On Hours 09h 0x18 Logical Sectors Written E1h

0x20 Num Write Commands – incremented by one for every host write

--

0x28 Logical Sectors Read F2h

0x30 Num Read Commands – incremented by one for every host read

--

0x04 – General Error Statistics 0x08 Num Reported Uncorrectable Errors BBh

0x10 Num Resets Between Command Acceptance and Completion

--

0x05 – Temperature Statistics

0x00 Device Statistics Information Header --

0x08 Current Temperature --

0x10 Average Short Term Temperature --

0x18 Average Long Term Temperature --

0x20 Highest Temperature --

0x28 Lowest Temperature --

0x30 Highest Average Short Term Temperature --

0x38 Lowest Average Short Term Temperature --

0x40 Highest Average Long Term Temperature --

0x48 Lowest Average Long Term Temperature --

0x50 Time in Over-Temperature --

0x58 Specified Maximum Operating Temperature --

0x60 Time in Under-Temperature --

0x68 Specified Minimum Operating Temperature --

0x06 – Transport Statistics

0x08 Number of Hardware Resets --

0x10 Number of ASR Events --

0x18 Number of Interface CRC Errors --

0x07 – Solid State Device Statistics 0x08 Percentage Used Endurance Indicator E9h

Note: This device statistic counts from 1 to 150



5.6 SMART Command Transport (SCT)

With SMART Command Transport (SCT), a host can send commands and data to an SSD and receive status and data from an SSD using standard write/read commands to manipulate two SMART Logs:

− Log Address E0h ("SCT Command/Status") — used to send commands and retrieve status

− Log Address E1h ("SCT Data Transfer") — used to transport data

Intel® SSD DC S3700 Series supports the following standard SCT actions:

− Write Same — Intel DC S3700 Series implements this action code as described in the ATA specification.

− Error Recovery Control — Intel DC S3700 Series accepts this action code, and will store and return error-recovery time limit values.

− Feature Control – Intel DC S3700 Series supports feature code 0001h (write cache) feature code 0002h (write cache reordering), and feature code 0003h (time interval for temperature logging). It also supports D000h(Power Safe Write Cache capacitor test interval), (D001h(read/write power governor mode), D002h(read/write thermal governor mode), D003h(read power governor burst power), D004h(read power governor average power).

− Data table command – Intel DC S3700 Series supports data table command as specified in ATA8-ACS2. This will read out temperature logging information in table ID 0002h.

− Read Status Support – Intel DC S3700 Series supports read status log.

− SCT command 0xD801with State=0, Option=1, ID Word 106 can be used to change from 0x6003 to 0x4000 (4KB physical sector size to 512B physical sector size support change).

5.7 Data Set Management Command Set

Intel SSD DC S3700 Series supports the Data Set Management command set Trim attribute, which consists of:

− DATA SET MANAGEMENT

5.8 Host Protected Area Command Set

Intel SSD DC S3700 Series supports the Host Protected Area command set, which consists of:

− READ NATIVE MAX ADDRESS − SET MAX ADDRESS − READ NATIVE MAX ADDRESS EXT − SET MAX ADDRESS EXT

Intel SSD DC S3700 Series also supports the following optional commands:

− SET MAX SET PASSWORD − SET MAX LOCK − SET MAX FREEZE LOCK − SET MAX UNLOCK



5.9 48-Bit Address Command Set

Intel SSD DC S3700 Series supports the 48-bit Address command set, which consists of:

− FLUSH CACHE EXT − READ DMA EXT − READ NATIVE MAX ADDRESS EXT − READ SECTOR(S) EXT − READ VERIFY SECTOR(S) EXT − SET MAX ADDRESS EXT − WRITE DMA EXT − WRITE MULTIPLE EXT − WRITE SECTOR(S) EXT − WRITE MULTIPLE FUA EXT − WRITE DMA FUA EXT

5.10 General Purpose Log Command Set

Intel® SSD DC S3700 Series supports the General Purpose Log command set, which consists of:

− READ LOG EXT − WRITE LOG EXT

5.11 Native Command Queuing

Intel SSD DC S3700 Series supports the Native Command Queuing (NCQ) command set, which includes:

− READ FPDMA QUEUED − WRITE FPDMA QUEUED

Note: With a maximum Queue Depth set to 32.

5.12 Software Settings Preservation

Intel SSD DC S3700 Series supports the SET FEATURES parameter to enable/disable the preservation of software settings.



6.0 Certifications and Declarations The following table describes the Device Certifications supported by the Intel SSD DC S3700 Series.

Table 21: Device Certifications and Declarations

Certification Description

CE Compliant Low Voltage DIRECTIVE 2006/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 12 December 2006, and EMC Directive 2004/108/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 15 December 2004.

UL Recognized

Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd Edition, 2007-03-27 (Information Technology Equipment - Safety - Part 1: General Requirements) CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Information Technology Equipment - Safety - Part 1: General Requirements)

C-Tick Compliant Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA).

BSMI Compliant Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment - Radio disturbance Characteristics - limits and methods of measurement, as amended on June 1, 2006, is harmonized with CISPR 22: 2005.04.

KCC Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control Regulation and meets the Electromagnetic Compatibility (EMC) Framework requirements of the Radio Research Laboratory (RRL) Ministry of Information and Communication Republic of Korea.

VCCI Voluntary Control Council for Interface to cope with disturbance problems caused by personal computers or facsimile.

RoHS Compliant Restriction of Hazardous Substance Directive

WEEE Directive on Waste Electrical and Electronic Equipment



7.0 References

The following table identifies the standards information referenced in this document.

Table 22: Standards References

Date Title Location

July 2012 Solid-State Drive (SSD) Requirements and Endurance Test Method (JESD219)

http://www.jedec.org/standards-documents/results/jesd219

Sept 2010 Solid-State Drive (SSD) Requirements and Endurance Test Method (JESD218)

http://www.jedec.org/standards-documents/docs/jesd218/

Dec 2008 VCCI http://www.vcci.jp/vcci_e/

June 2009 RoHS http://qdms.intel.com/ Click Search MDDS Database and search

for material description datasheet

August 2009 ACS-2-ATA/ATAPI Command Set 2 Specification http://www.t13.org/

June 2009 Serial ATA Revision 3.0 http://www.sata-io.org/

May 2006 SFF-8223, 2.5-inch Drive w/Serial Attachment Connector http://www.sffcommittee.org/

May 2005 SFF-8201, 2.5-inch drive form factor http://www.sffcommittee.org/

1995 1996 1995 1995 1997 1994

International Electrotechnical Commission EN 61000 4-2 (Electrostatic discharge immunity test) 4-3 (Radiated, radio-frequency, electromagnetic field immunity test) 4-4 (Electrical fast transient/burst immunity test) 4-5 (Surge immunity test) 4-6 (Immunity to conducted disturbances, induced by radio- frequency fields) 4-11 (Voltage Variations, voltage dips, short interruptions and voltage variations immunity tests)

http://www.iec.ch/

1995 ENV 50204 (Radiated electromagnetic field from digital radio telephones)

http://www.dbicorporation.com/radimmun.htm/






http://www.vcci.jp/vcci_e/

http://qdms.intel.com/

http://www.t13.org/

http://www.sata-io.org/

http://www.sffcommittee.org/

http://www.sffcommittee.org/

http://www.iec.ch/

http://www.dbicorporation.com/

http://www.dbicorporation.com/


Appendix A: IDENTIFY DEVICE Command Data

Table 23: Returned Sector Data

Word F = Fixed

V = Variable X = Both

Default Value Description

0 X 0040h General configuration bit-significant information

1 X 3FFFh Obsolete - Number of logical cylinders (16,383)

2 V C837h Specific configuration

3 X 0010h Obsolete - Number of logical heads (16)

4-5 X 0h Retired

6 X 003Fh Obsolete - Number of logical sectors per logical track (63)

7-8 V 0h Reserved for assignment by the CompactFlash* Association (CFA)

9 X 0h Retired

10-19 F varies Serial number (20 ASCII characters)

20-21 X 0h Retired

22 X 0h Obsolete

23-26 F varies Firmware revision (8 ASCII characters)

27-46 F varies Model number (Intel® Solid-State Drive)

47 F 8001h 7:0—Maximum number of sectors transferred per interrupt on multiple commands

48 F 4000h Trusted Computing Feature Set

49 F 2F00h Capabilities

50 F 4000h Capabilities

51-52 X 0h Obsolete

53 F 0007h Words 88 and 70:64 valid

54 X 3FFFh Obsolete - Number of logical cylinders (16,383)

55 X 0010h Obsolete - Number of logical heads (16)

56 X 003Fh Obsolete - Number of logical sectors per logical track (63)

57-58 X FC1000FBh Obsolete

59 F BF01 Number of sectors transferred per interrupt on multiple commands

60-61 V

100GB: 0BA52230h 200GB: 0FFFFFFFh 400GB: 0FFFFFFFh 800GB: 0FFFFFFFh

Total number of user-addressable sector

62 X 0h Obsolete

63 X 0007h Multi-word DMA modes supported/selected

64 F 0003h PIO modes supported

65 F 0078h Minimum multiword DMA transfer cycle time per word

66 F 0078h Manufacturer’s recommended multiword DMA transfer cycle time

67 F 0078h Minimum PIO transfer cycle time without flow control

68 F 0078h Minimum PIO transfer cycle time with IORDY flow control

69 F 4030h Additional Supported

70 F 0000h Reserved

71-74 F 0h Reserved for IDENTIFY PACKET DEVICE command

75 F 001Fh Queue depth

76 F 850Eh Serial ATA capabilities



Word F = Fixed



77 F 0006h Reserved for future Serial ATA definition

78 F 0040h Serial ATA features supported

79 V 0040h Serial ATA features enabled

80 F 03FCh Major version number

81 F 0110h Minor version number

82 F 746Bh Command set supported

83 F 7501h Command sets supported

84 F 6163h Command set/feature supported extension

85 V 7469h Command set/feature enabled

86 V B401h Command set/feature enabled

87 V 6163h Command set/feature default

88 V 407Fh Ultra DMA Modes

89 F 0002h Time required for security erase unit completion

90 F 0002h Time required for enhanced security erase completion

91 V 0h Current advanced power management value

92 V 0FFFEh Master Password Revision Code

93 X 0h Hardware reset result: the contents of bits (12:0) of this word shall change only during the execution of a hardware reset

94 V 0h Vendor’s recommended and actual acoustic management value

95 F 0h Stream minimum request size

96 V 0h Streaming transfer time - DMA

97 V 0h Streaming access latency - DMA and PIO

98-99 F 0h Streaming performance granularity

100-103 V

100GB: 0BA52230h 200GB: 1749F1B0h 400GB: 2E9390B0h 800GB: 5D26CEB0h

Maximum user LBA for 48-bit address feature set

104 V 0h Streaming transfer time - PIO

105 V 0006h Maximum number of 512-byte blocks of LBA Range Entries per DATA SET MANAGEMENT command

106 F 6003h Default Physical sector size / logical sector size. Can be changed to 0004h to reflect 512Bytes/Sector.

107 F 0h Inter-seek delay for ISO-7779 acoustic testing in microseconds

108-111 F varies Unique ID

112-115 F 0h Reserved for world wide name extension to 128 bits

116 V 0h Reserved for technical report

117-118 F 0h Words per logical sector

119 F 405Ch Supported settings

120 F 401Ch Command set/feature enabled/supported

121-126 F 0h Reserved

127 X 0h Removable Media Status Notification feature set support

128 V 0021h Security status

129 V 1Ch Vendor-specific

130-139 X 0h Vendor-specific

140-149 X 0h Disable Logical Error Field



Word F = Fixed



150-159 X 0h Vendor-specific

160 X 0h CompactFlash Association (CFA) power mode 1

161-167 X 0h Reserved for assignment by the CFA

168 X 3h Reserved for assignment by the CFA

169 X 0001h Data set management Trim attribute support

170-175 F 0h Reserved for assignment by the CFA

176-205 X Varies Current media serial number

206 X 003Dh SCT Command Transport


209 X 4000h Alignment of logical blocks within a physical block

210-211 V 0000h Write-Read-Verify Sector Count Mode 3 (DWord)

212-213 F 0000h Write-Read-Verify Sector Count Mode 2 (DWord)

214 X 0000h NV Cache Capabilities

215-216 V 0000h NV Cache Size in Logical Blocks (DWord)

217 F 0001h Nominal media rotation rate

218 V 0000h Reserved

219 F 0000h NV Cache Options

220 V 0000h Write-Read-Verify feature set

221 X 0000h Reserved

222 F 101Fh Transport major version number

223 F 0000h Transport minor version number


230-233 X 0000h Extended Number of User Addressable Sectors (QWord)

234 F 0001h Minimum number of 512-byte data blocks per DOWNLOAD MICROCODE command for mode 03h

235 F FFFFh Maximum number of 512-byte data blocks per DOWNLOAD MICROCODE command for mode 03h

236-254 X 0000h Reserved

255 V Varies Integrity word

Notes: F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when media is removed

or changed. V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the commands executed

by the device. X = F or V. The content of the word may be fixed or variable.


Documents

Intel® Solid-State Drive DC S3700 Series