Intel® Xeon® Processor E3-1200v3 Product Family …i.crn.com/misc/microsites/intelssd13/Intel_Xeon_Processor_E3-1200v... · Intel® Xeon® Processor E3-1200v3 Product Family Technical

Intel® Xeon® Processor E3-1200v3 Product Family

Technical Overview

June 2013

2 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.

Legal Disclaimer Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.

Relative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. Relative performance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms and assigning them a relative performance number that correlates with the performance improvements reported.

SPEC, SPECint, SPECfp, SPECrate. SPECpower, and SPECjbb are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.org for more information.

Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, and virtual machine monitor (VMM).

Functionality, performance or other benefits will vary depending on hardware and software configurations. Software applications may not be compatible with all operating systems. Consult your PC manufacturer. For more information, visit http://www.intel.com/go/virtualization

Intel® Hyper-Threading Technology (Intel® HT Technology): Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PC manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visit http://www.intel.com/info/hyperthreading.

Intel® Turbo Boost Technology: Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select Intel® processors. Consult your system manufacturer. Performance varies depending on

hardware, software, and system configuration. For more information, visit http://www.intel.com/go/turbo

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Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: http://www.intel.com/products/processor_number

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Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of record product roadmaps.

http://www.spec.org/

http://www.intel.com/go/virtualization

http://www.intel.com/info/hyperthreading

http://www.intel.com/go/turbo

http://ark.intel.com/

http://www.intel.com/products/processor_number


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All dates and products specified are for planning purposes only and are subject to change without notice

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http://www.intel.com/design/literature.htm

http://www.intel.com/design/literature.htm


Contents

• Platform Overview

• Performance Data

• Memory Configuration

• Ecosystem Support


PLATFORM OVERVIEW


Intel® Xeon® Processor E3-1200v3 Overview

Intel® Hyper-Threading Technology

Integrated Voltage Regulator technology

Intel® AVX 2.0 extensions and AES-NI instructions improvements

Last Level Cache (LLC) shared between CPU and Integrated Graphics

Processor Graphics 3D Gfx/Media Arch/Perf. Support for new APIs 3 Digital Displays DP 1.2/HDMI 1.4/eDP

22nm Process

DDR3-1600 2D/Ch ECC UDIMMs

PCIe 3.0 x16/2x8 3 controllers

Intel® Silicon View Technology (SVT)

E3-1200v3 Offers Better Power & Performance with Improved I/O

Intel® Turbo Boost Technology 2.0

Socket LGA 1150

2ch DDR3

Integrated Graphics

Core LLC

Core LLC

Core LLC

Core LLC

System Agent

Display

PCIe I/O Display Ports

DMI

IMC

PCIe 3.0

New Features for E3-1200v3


Intel® Xeon® Processor E3-1200 v3 Product Family Reference Table

Entry Server SKUs

Media Server SKUs

PR

OC

ES

SO

R

NU

MB

ER

BA

SE

FR

EQ

UE

NC

Y

(GH

z)

TU

RB

O B

OO

ST

MA

X

FR

EQ

UE

NC

Y (G

Hz)

TO

TA

L C

AC

HE

CO

RE

S/T

HR

EA

DS

TD

P (

W)

SO

CK

ET

S

SU

PP

OR

TE

D

ME

MO

RY

SP

EE

D

SU

PP

OR

T

INT

EG

RA

TE

D

ME

MO

RY

CH

AN

NE

LS

INT

EL®

HD

G

RA

PH

ICS

INT

EG

RA

TE

D

GR

AP

HIC

S C

OR

ES

PC

I E

XP

RE

SS

R

EV

ISIO

N

INT

EL

® T

XT

INT

EL

® V

t-X

AE

S-N

I

E3-1275V3 3.5 3.9 8M 4/8 95 1150 1600/1333 2 P4600 2 3.0

E3-1245V3 3.4 3.8 8M 4/8 95 1150 1600/1333 2 P4600 2 3.0

E3-1225V3 3.2 3.6 8M 4/4 95 1150 1600/1333 2 P4600 2 3.0

E3-1285V3 3.6 4 8M 4/8 95 1150 1600/1333 2 P4700 2 3.0

E3-1285LV3 3.1 3.9 8M 4/4 65 1150 1600/1333 2 P4700 2 3.0

E3-1280V3 3.6 4 8M 4/8 80 1150 1600/1333 2 0 0 3.0

E3-1270V3 3.5 3.9 8M 4/8 80 1150 1600/1333 2 0 0 3.0

E3-1240V3 3.4 3.8 8M 4/8 80 1150 1600/1333 2 0 0 3.0

E3-1230V3 3.3 3.7 8M 4/8 80 1150 1600/1333 2 0 0 3.0

E3-1220V3 3.1 3.5 8M 4/4 80 1150 1600/1333 2 0 0 3.0

E3-1265LV3 2.5 3.7 8M 4/8 45 1150 1600/1333 2 2500 1 3.0

E3-1230LV3 1.8 2.8 8M 4/8 25 1150 1600/1333 2 0 0 3.0

E3-1220LV3** 1.1 1.5 4M 2/4 13 1150 1600/1333 2 0 0 3.0

Microserver SKUs

Workstation SKUs

**Available Q3 2013


Intel® Xeon® Processor E3-1200 v3 Server Platform Haswell “Tock” CPU

• FIVR technology simplifies power delivery

• Memory speed – 1600 @ 2DPC

• Improved debug tools (SVT)

• Intel® AVX enhancements

USB3 and SATA 6G

• SuperSpeed™ bus @ 5.0 Gbit/s and PM: idle, sleep and suspend states

• Up to 6 lanes of SATA 3 @ 6Gb/s

CPU Efficiency and PM

• Improved Idle for CPU and PCH

• DDR3L support

• LV CPU SKUs at higher frequencies

2 Year Life for servers

• Next-gen CPU Drop-in compatibility to enable re-use of existing designs, streamlining validation process

• Intel® AMT 9 .0

• Intel RSTe

• Processor Graphics for emerging usages

• Node Manager

Leadership IO

Continued focus on Energy Efficiency

Enhancements with CPU Tock

Enhanced ROI for Servers

VGA

NVRAM OFI 3

‘Clarkville’ 10/100/1000 PHY

6x SATA @ 6G

DMI 2.0

SM B

us

LPC

SPI

Lynx Point

(PCH)

FDI

HD

Au

dio

3.0

x16/2x8

pGfx

2.0 8 Ports

Continued Advancements in

Server Technologies

All timeframes, products and dates are subject to change without notification

4 DDR3 ECC UDIMM

Haswell

(socket LGA1150 – 22nm)

Quad Core / Dual Core

NOTE: For all 6 SATA 6G ports C226 is required.

Gen3

Gen2


Intel® Xeon® Processor E3-1200 v3 Workstation Platform

Haswell “Tock” CPU

• FIVR technology simplifies power delivery

• Memory speed – 1600 @ 2DPC

• Improved debug tools (Intel® SVT)

• Intel® AVX enhancements

Next Gen Graphics Architecture

• GT2/1 with greater 3D perf vs. IVB

• DX11.1, OGL3.2+, DP/DVI/VGA, 3 displays

• Increased SW certs.

USB3 and SATA 6G

• SuperSpeed™ bus @ 5.0 Gbit/s and PM: idle, sleep and suspend states

• Up to 6 lanes of SATA 3 @ 6Gb/s

• Thunderbolt for Converged IO

CPU Efficiency and PM

• Improved Idle for CPU and PCH

• DDR3 and DDR3L support

• LV CPU SKUs at higher frequencies

Continued focus on Energy Efficiency

Outstanding Processor Graphics

Leadership IO

Enhancements with CPU Tock

DP/DVI/VGA

NVRAM OFI 3

‘Clarkville’ 10/100/1000 PHY

6x SATA @ 6G

DMI 2.0

SM B

us

LPC

SPI

3 monitors

Lynx Point

(PCH)

FDI

HD

Au

dio

3.0

x16/2x8

pGfx

2.0 8 Ports Gen2

*All timeframes, products and dates are subject to change without notification

VGA

4 DDR3 ECC UDIMM

Haswell

(socket LGA1150 – 22nm)

Quad Core / Dual Core

Gen3


Intel® C220 Series Chipset Overview

New Features:

• I/O Flexibility**

– Up to 8 PCIe* ports, 6 USB 3.0

ports or 6 SATA 6 Gb/s ports

– 2 ports can be retasked b/w

SATA, USB3, and PCIe

• Display Repartition

– VGA only; All digital displays

move to CPU

• Lower Power

• TPM Support on SPI

• Faster SMLink for integrated LAN

• Removed Legacy PCI

** Port count and capability dependent on SKU

DMI

6 Ports @ 6 Gb/s*

SMBus 2.0 Clarkville LAN PHY

Audio CODEC

Intel® Flexible Display Link (FDI)

GPIOs

SPI Flash

VGA

8 P

CIe

2.0

x1

(5

G

T/s)

*

14 USB Ports total 6 @ USB 3.0 *

LPC I/F

Super I/O

New Package: 23x22mm


Server/Workstation PCH Segmentation

Intel® C226 Chipset

Workstation

Advanced Rack & Pedestal Server

Enables vPro & AMT

Enables processor graphics

Maximum I/O Bandwidth &

Flexibility


Standard Rack & Pedestal Server

Enterprise-ready manageability with SPS FW and Node

Manager

Improved I/O Bandwidth


Essential Pedestal & Rack Server

Cost-optimized

Silicon Enabling FW

Essential I/O Bandwidth


Intel® C220 Series Chipset Family Compatibility Matrix†

Ch

ipse

t

Inte

l® v

Pro

/AM

T 9

.0

Inte

l® S

tan

da

rd M

an

ag

ea

bil

ity

††

Inte

l® T

XT

Inte

l® R

ap

id S

tora

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Te

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olo

gy

Inte

l® R

ap

id S

tora

ge

Te

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olo

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En

terp

rise

Inte

l® S

ma

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esp

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se T

ech

no

log

y*

Pro

cess

or

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ph

ics

Su

pp

ort

ed

Dis

pla

ys

Inte

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nsi

de

r

Inte

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od

e M

an

ag

er

IO F

lex

Int.

Gb

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AC

(re

q.

‘Cla

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’ PH

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Inte

l® A

nti

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eft

Te

chn

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gy

**

Inte

l® I

de

nti

ty P

rote

ctio

n T

ech

US

B 3

.0 P

ort

s

US

B 2

.0 P

ort

s

PC

Ie

2.0

Po

rts

SA

TA

(3

Gb

/s)

Po

rts

SA

TA

(6

Gb

/s)

Po

rts

ES

T. S

PI

Siz

e R

eq

. (M

B)

Intel® C226 chipset

√ √ √ √ √ √ √ 3 √ √ √ √ √ 6* 8 8* 0 6* 8


√ √ √ √ 4 8 8 2 4 8


√ √ √ 2 8 8 4 2 2

† Not all technologies available on all CPU SKUs. Please contact your Intel representative for further detailed information regarding CPU supported features.

† † ISM is the default manageability engine with C226 and non-vPro CPU SKUs. ISM is not compatible on C222/224.

* Port counts are dependent on how IO flexibility is configured between PCIe, SATA 6G and USB 3.0 for a total of 18 ports. C226 will support SATA 1.5/3/6Gb/s

** Intel Anti-Theft technology is not supported on any sku of C220 series chipset.


PERFORMANCE DATA


Intel® Xeon® Processor E3-1200 v3 Product Family Generational Performance Summary: Server Benchmarks

Expect Intel® Xeon® Processor E3-1265L v3 to Deliver Up to 66% More Energy Efficient Performance over Intel® Xeon® Processor E3-1260L

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to

any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Intel does not control or audit the design

or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate

and reflect performance of systems available for purchase. For more information go to http://www.intel.com/performance. Copyright © 2013, Intel Corporation.

Configurations: SPEC* CPU2006, Baseline: IBM* System x3100 (E3-1280, 16GB, HDD), Prev Gen: Dell* PowerEdge* II (E3-1280 v2, 16GB, HDD), New Config: Intel Xeon E3-1280 v3 (16GB, HDD). SPECjbb2013, Baseline Intel Xeon E3-1280 (32GB, SSD), Prev Gen: HP* Proliant* ML310e

G8 (E3-1280 v2, 32GB, HDD), New Config: Intel Xeon E3-1280 v3 (32GB, SSD). SPECpower_ssj2008, Baseline: Intel Xeon E3-1260L (8GB, SSD), Prev Gen: Intel Xeon E3-1265L v2 (8GB, SSD), New Config: Intel Xeon E3-1265L v3 (8GB, SSD), refer to backup for additional details. * Other

names and brands may be claimed as the property of others.

1.07 1.12 1.10 1.14 1.10

1.40

1.17 1.20 1.14

1.25 1.14

1.66

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

1.80

Intel® Xeon®Processor E3-1280(8MB, 3.50 GHz)

Integer Speed(SPECint*_base2006)

Integer Throughput(SPECint*_rate

_base2006)

Floating PointSpeed

(SPECfp*_base2006)

Floating PointThroughput

(SPECfp*_rate_base2006)

Middle-TierJava

(SPECjbb*2013)

Energy Efficiency(SPECpower_ssj*2008)

Re

lati

ve P

erf

orm

ance

Intel® Xeon® Processor E3-1280 v2 (8M Cache, 3.60 GHz) Intel® Xeon® Processor E3-1280 v3 (8M Cache, 3.60 GHz)

18% more energy

efficient performance

than previous gen

Higher is Better; see configuration details in backup

v2 v3


1.0

9

1.1

6

1.0

8

1.0

6

1.1

4

1.0

6

1.1

2

1.0

6

1.0

1

1.0

5 1

.23

1.2

7

1.1

6

1.1

7

1.2

8

1.1

2

1.1

5

1.1

6

1.2

3

1.2

8

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

Intel® Xeon®Processor E3-

1275Intel® HDGraphicsP3000

Integer Rate(SPECint*

_rate_base2006)

Floating PointRate (SPECfp*

_rate_base2006)

AutodeskSoftimage*

2013(rendering)

SPECapc* for3ds Max*2011 CPUComposite

Score

SPECapc* forMaya* 2012

CPUComposite

Score'

AutodeskSimulation*CFD 2013

(geomean of 3cases)

FEABenchamrk*

v3 forSolidworks*Simulation

2013

AutodeskInventor*

2013(geomean of 3

cases)

Cadalyst 2012on AutoCAD*

2013 CPUIndex

SPECapc* forSolidworks*2013 CPUComposite

Rela

tive P

erfo

rm

an

ce

Intel® Xeon® Processor E3-1275 v2

Intel® HD Graphics P4000

Intel® Xeon® Processor E3-1275 v3

Intel® HD Graphics P4600

General Computing Digital Content Creation

Intel® Xeon® Processor E3-1200 v3 Product Family Generational Performance Summary: Workstation Benchmarks

Higher is Better

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer

systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your

contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance. Copyright © 2013, Intel Corporation. Configurations:

SPEC* CPU2006, Baseline: Intel Xeon E3-1275 (16GB, HDD), Prev Config: Intel Xeon E3-1275 v2 (16GB, HDD), New Config: Intel Xeon E3-1275 v2 (16GB, HDD). Autodesk Softimage, SPECapc 3dsMax, SPECapc

Maya, Autodesk Simulation CFD, Cadalyst, FEA Solidworks Simulation, Autodesk Inventor (8GB for small, 16GB for med and large workload), SPECapc Solidworks : Baseline: Intel Xeon E3-1275 (8GB, HDD), Prev

Config: Intel Xeon E3-1275 v2 (8GB, HDD), New Config: Intel Xeon E3-1275 v3 (8GB,HDD), see backup for additional detail. * Other names and brands may be claimed as the property of others.

Computer-aided Engineering

Relative Geometric Mean Scores Actual performance will vary by workload

v2 v3

21% better than

previous gen

Expect Intel® Xeon® Processor E3-1275 v3 to Deliver up to 28% Better Performance over Intel Xeon Processor E3-1275


Intel® Xeon® Processor E3-1200 v3 Product Family Professional Graphics Performance Summary

1.0

6

1.1

9

1.1

0

1.2

0

1.7

5 2.1

3

1.3

1

1.3

2

1.4

0

1.4

7

2.5

3 2

.95

0.00

0.50

1.00

1.50

2.00

2.50

3.00

3.50

Intel® Xeon®

Processor E3-

1275

Intel® HD

Graphics P3000

Cadalyst 2012 on

AutoCAD* 2013

2D Index

SPECapc* for

3ds Max* 2011

GPU Composite

Score

Cadalyst 2012 on

AutoCAD* 2013

3D Index

SPECapc* for

Maya* 2012 GPU

Composite Score

SPECapc* for

Solidworks*

2013 GPU

Composite Score

SPECviewperf*

11

Geomean of 7

tests (OpenGL)

Rela

tive P

erf

orm

ance

Intel® Xeon® Processor E3-1275 v2 Intel® HD Graphics P4000

Intel® Xeon® Processor E3-1275 v3 Intel® HD Graphics P4600

38% better than prev gen

6.2

8

6.3

1

8.0

3

7.1

7

7.4

2

10

.12

0

1

2

3

4

5

6

7

8

9

10

11

12

Intel®Xeon®

ProcessorE3-1275

Intel® HDGraphicsP3000

Photoshop*Tilt Shift

Photoshop*Iris Blur

Photoshop*Field Blur

Professional Graphics OpenCL* Performance

v2 v3

Higher is Better Relative Geometric Mean Score Actual performance will vary by workload

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer

systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your

contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance. Copyright © 2013, Intel Corporation.. Configurations:

SPECapc 3dsMax, SPECapc Maya, Cadalyst, SPECapc Solidworks(igfx driver 2712, for E3-1275), SPECviewperf, Adobe Photoshop: Baseline: Intel Xeon E3-1275 (8GB, HDD, igfx driver 2455 , Prev Config: Intel Xeon

E3-1275 v2 (8GB, HDD, igfx driver 2712), New Config: Intel Xeon E3-1275 v3 (8GB,HDD, igfx driver 2989), see backup for additional detail. *Other names and brands may be claimed as the property of others

26% better than prev gen

Expect Intel® Xeon® processor E3-1275 v3 w/Intel® HD Graphics P4600 to deliver up to 2.95x better Graphics Performance over Intel Xeon E3-1275 w/Intel® HD Graphics P3000


1.1

9

1.0

6

1.1

0

1.2

5

1.4

2

1.9

7

1.3

2

1.3

1

1.4

0

1.9

5

1.7

2

2.7

1

1.6

9

1.5

0

1.3

2 1.5

4

1.6

8

1.2

6

1.7

2

1.2

4

0.00

0.50

1.00

1.50

2.00

2.50

3.00

Intel® Xeon®

Processor E3-

1275

Intel® HD

Graphics

P3000

SPECapc* for

3ds Max* 2011

GPU Composite

Score

Cadalyst 2012

on AutoCAD*

2013 2D Index

Cadalyst 2012

on AutoCAD*

2013 3D Index

Bentley

Microstation*

3DMark* 06

(DirectX 9)

3DMark*

Vantage

(DirectX 10)

3DMark* 11

(DirectX 11)

Rela

tive P

erfo

rm

an

ce

Intel® Xeon® Processor E3-1275 v2 with Intel® HD Graphics P4000

Intel® Xeon® Processor E3-1275 v3 with Intel® HD Graphics P4600

Intel® Xeon® Processor E3-1270 v3 with Nvidia* Quadro* 410

Professional Graphics

DirectX* Performance

6.2

8

6.3

1

8.0

3

7.1

7

7.4

2

10

.12

5.8

9

5.9

7

7.5

4

0.00

1.00

2.00

3.00

4.00

5.00

6.00

7.00

8.00

9.00

10.00

11.00

12.00

Intel®

Xeon®

Processor

E3-1275

Intel® HD

Graphics

P3000

Photoshop*

Tilt Shift

Photoshop*

Iris Blur

Photoshop*

Field Blur

Intel® Xeon® Processor E3-1200 v3 Product Family Intel® HD P4600 vs. Discrete Graphics Performance Summary

Higher is Better

OpenCL* Performance

HD P4000 vs.

HD P4600 vs.

Quadro*410

v2 v3

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems,

components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases,

including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance. Copyright © 2013, Intel Corporation. Configurations: SPECapc 3dsMax, Cadalyst, Bentley

Microstation, 3DMark/06/Vantage/11, Adobe Photoshop: Baseline: Intel Xeon E3-1275 (8GB, HDD, igfx driver 2455 ), Prev Config: Intel Xeon E3-1275 v2 (8GB, HDD, igfx driver 2712), New Config: Intel Xeon E3-1275 v3 (8GB,HDD, igfx

driver 2989), Intel Xeon E3-1270 v3 (8GB, HDD, Nvidia Quadro 410, driver 311.55), see backup for additional detail. *Other names and brands may be claimed as the property of others.

Intel® Xeon® processor E5-1275 v3 w/Intel® HD Graphics P4600 delivers competitive performance vs. Entry Level Discrete Graphics


MEMORY CONFIGURATION


Platform UDIMM Support

Supported Config

DIMM Slots per

Channel

DIMM Type POR Speeds Ranks per DIMM

Layer Count FW Base Supported Voltage

Rack

Micro Server

VHD

2 Unbuffered DDR3L ECC

1333, 1600 SR, DR 6 SPS 1.35V2

AMT Server 2 Unbuffered DDR3 and

DDR3L1 ECC 1333, 1600 SR, DR 4 AMT 1.5V2

Workstation 2 Unbuffered DDR3 and

DDR3L1 ECC 1333, 1600 SR, DR 4 AMT 1.5V2

Other Notes & Restrictions:

–No support for RDIMMs or SODIMM

–All channels in a system run at the fastest common

frequency

–Non-ECC UDIMMs supported on the Denlow

workstation platforms

–Mixing ECC and non-ECC UDIMMs is not supported

–Static CLTT supported via BMC (requires ECC DIMMs

with thermal sensor)

Max Memory

Possible**

1Gb DRAM Technology

2Gb DRAM Technology

4Gb DRAM Technology

Single Rank UDIMM

4GB (4x 1GB DIMMs)

8GB (4x 2GB DIMMs)

16GB (4x 4GB DIMMs)

Dual Rank UDIMMs

8GB (4x 2GB DIMMs)

16GB (4x 4GB DIMMs)

32GB (4x 8GB DIMMs)

1DDR3L support at 1.5V only 2CPU has no HW or FW voltage restrictions, but only the “Supported Voltage” is POR and validated for each configuration.


Platform DIMM

Configuration

Intel® Xeon® processor E3-

1200 v3 product family

Intel® CoreTM i3 processor

series

Intel® CoreTM

I5/ i7 processor

series


(Essential Server)

and C224 Chipset

(Standard Server)

UDIMM Non-ECC Not Supported Not Supported Not Supported*

UDIMM ECC Supported Supported Not Supported

UDIMM Mix ECC with

Non-ECC Not Supported Not Supported Not Supported

Intel® C226

(C226 Workstation and Advanced Server)

UDIMM Non-ECC

Supported (Client OS)

Not Supported (Server OS)

Supported (Client OS)

Not Supported (Server OS)

Not Supported

UDIMM ECC Supported Supported Not Supported

UDIMM Mix ECC with


Intel® 8 Series Chipset

(Desktop)

UDIMM Non-ECC Not Supported Supported Supported

UDIMM ECC Not Supported Not Supported Not Supported

UDIMM Mix ECC with


Intel® Xeon® Processor E3-1200 v3 Product Family Memory Support

* ”Not Supported” configurations may or may not boot


ECOSYSTEM SUPPORT


4 DDR3

1333/1600 ECC

UDIMM slots

32 GB maximum

Integrated Dual GbE

(i210 - Springville) for

Virtualization support

Target market: First Server

Key Benefits:

Small uATX form factor

Storage Expandability

Real Server Performance

4 PCIe slots

1 PCIe Gen3 x16

slot for 1U rack

server

1 PCIe Gen3 x8

slot for 1U rack

server

1 PCIe Gen3 x4

slot for 1U rack

server

RMM4 Support (LC

only)

6 SATA ports

LC board: Intel® C226 chipset, 6x

@ 6GB/s

SE board: Intel® C222 chipset, 2x

@6Gb/s, 4x @3Gb/s

uATX (9.6” x 9.6”)

small form factor,

rack friendly layout

Intel® Rapid Storage

Technology - SW RAID

0,1,10, 5 ( w/ Linux

support)

Intel® Embedded

Storage RAID


0, 1, 10

1

LC Available in 4U Pedestal

Systems with Redundant

Power , 8 drive support

2 3 4

Single Intel® Xeon®

processor E3-1200 v3

SAS ROC module

support

Intel® Server Board S1200V3RP LC/SE “Rainbow Pass”


Single Intel® Xeon®

processor E3-1200 v3

4 DDR3

1333/1600 ECC

UDIMM slots

32 GB maximum

Integrated Dual GbE

(i210 - Springville) for

Virtualization support

Target market: First Server,

Media/VDI

Key Benefits:

Rack Optimized Layout

Small uATX form factor

Real Server Performance

Processor Graphics (RM SKU)

1 PCIe slots

1 PCIe Gen3 x16

slot for 1U rack

server

Intel IO expansion

module support

RMM4 Support

uATX (9.6” x 9.6”)

rack optimized layout

Intel® Rapid Storage


0,1,10, 5 ( w/ Linux

support)

Intel® Embedded

Storage RAID


0, 1, 10

1

SAS ROC module

support

Available in 1U Rack

Systems with

Redundant Power

Intel® Server Board S1200V3RP RO/RM “Rainbow Pass”

6 SATA ports

RM board: Intel® C226 chipset,

6x @ 6GB/s

RO board: Intel® C224 chipset,

4x @6Gb/s, 2x @3Gb/s


Socket support LGA 1150/1155

Code Name/

Intel Part #

DHA-A / E97378-001

Features •Active Solution •Radial Fin Copper Core

Thermal Support •Up to 95W

Included with Intel® Xeon® Processor E3-1200v3. E3-1220v2, & E3-1200 product families boxed skus

Intel® Boxed Thermal Solutions for Intel® Xeon® Processor E3 Family LGA 115x Socket Included With All Intel Xeon Processor E3 Family Box SKUs

Thermal Solution Not Available for Purchase Separately from CPU


Compatible 3rd Party Thermal Solutions Heatsinks for Intel® Xeon® Processor E3-1200/1200v2/1200v3 with TDP up to 95W Supplier Part description

Intel part number

Contact Phone Email

Nidec* Intel® RCFH7-115x Reference Heatsink (DHA-A)

E41759-002 Karl Mattson +1-360-666-2445 [email protected]

Delta* Intel® RCFH7-115x Reference Heatsink (DHA-A)

E41759-002 Jason Tsai +1-503-533-8444 x111 +1-503-539-3547

[email protected]

Foxconn* Intel® RCFH7-115x Reference Heatsink (DHA-A)

E41759-002 Julia Jiang +1-408-919-6178 [email protected]

mailto:[email protected]








SUMMARY


Intel® Xeon® Processor E3-1200 v3 Product Family

• More Performance

• Advanced Graphics

• Increased Security

• Enhanced Reliability

Intelligent, Adaptive Performance with Improved I/O For Graphics, Microserver, Workstation, and Entry Server


BACKUP


Server Benchmark Configuration (Summary)

SPEC CPU2006*:

Baseline Configuration: IBM System x3100 M4 with one Intel® Xeon® Processor E3-1280 (8M Cache, 3.50 GHz), 16GB

(2x8GB 2Rx8 PC3-10600E-9, ECC), 1 x 250 GB SATA, 7200 RPM, Intel® Hyper-Threading® Enabled, Intel® Turbo Boost

Enabled, Red Hat* Enterprise Linux Server Release 6.1, Kernel 2.6.32-131.0.15.el6.x86_64,Compiler Version 12.1.0.225 of

Intel C++ Compiler XE for applications running on IA-32 and Intel 64. Represents the best published results as of April

2013. Score: SPECint*_rate_base2006=172; SPECint*_base2006=51.1; SPECfp*_rate_base2006=118;

SPECfp*_base2006=62.7

http://www.spec.org/cpu2006/results/res2011q3/cpu2006-20110908-18542.html




Previous Configuration: Dell PowerEdge R210 II with one Intel® Xeon® Processor E3-1280 v2 (8M Cache, 3.60 GHz), 16GB

(2x8GB 2Rx8 PC3-12800R-11, ECC), 1 TB 7200 RPM SATA, Intel® Hyper-Threading® Enabled, Intel® Turbo Boost Enabled,

SUSE Linux Enterprise Server 11 SP2 (x86_64) 3.0.13-0.9-default,Compiler Version 12.1.0.225 of Intel C++ Studio XE for

Linux. Represents the best published results as of April 2013. Score: SPECint*_rate_base2006=192;

SPECint*_base2006=54.8; SPECfp*_rate_base2006=135; SPECfp*_base2006=68.8





New Configuration: Intel® C226 chipset based Intel® Xeon® server platform with one Intel® Xeon® Processor E3-1280 v3

(8M Cache, 3.60 GHz), 16GB (2x8GB Dual-Rank DDR3-1600 ECC UDIMM), 250 GB SATA 6Gb/s HDD, Intel® Hyper-Threading®

Enabled, Intel® Turbo Boost Enabled, Red Hat* Enterprise Linux Server 6.3 for x86_64,Compiler version 13.0.0.133 of Intel

C++ Studio XE and Intel Fortran. Source: Intel internal estimated measurements, April 2013. Score:

SPECint*_rate_base2006=206; SPECint*_base2006=59.8; SPECfp*_rate_base2006=148; SPECfp*_base2006=71.6


Server Benchmark Configuration (Continued) SPECjbb*2013: Baseline Configuration: Intel® C206 chipset based server platform with one Intel® Xeon® Processor E3-1280 (Quad-Core, 3.5GHz, 4C), 32GB memory (4x 8GB DDR3-1333 UDIMM), 64GB SATA SSD, Turbo Boost Enabled, HT Enabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_17, Source: Intel internal testing as of May 2013. MultiJVM Score: 11,208 max-jOPS.

Previous Configuration: HP* ProLiant ML310e Gen8 with one Intel® Xeon® Processor E3-1280 v2 (Quad-Core, 3.6GHz, 4C), 32GB memory (4x 8GB DDR3-1600 DIMM), 1 x 500 GB 7200 RPM SATA, HP Power Profile Maximum Performance, SATA AHCI Support Enabled, Thermal Configuration Maximum Cooling, Collaborative Power Control Disabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_15. Represents the best published results as of Apr 2013. MultiJVM score: 12,453 max-jOPS. http://www.spec.org/jbb2013/results/res2013q2/jbb2013-20130319-00014.html

New Configuration: Intel® C226 chipset based server platform with one Intel® Xeon® Processor E3-1280 v3 (Quad-core, 3.6GHz,4C), 32GB memory (4x 8GB DDR3-1600 UDIMM), 64GB SATA SSD, Turbo Boost Enabled, HT Enabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_17, Source: Intel internal testing as of May 2013. MultiJVM Score: 13,007 max-jOPS. SPECpower_ssj*2008: Baseline Configuration: Intel® C206 chipset based server platform with one Intel® Xeon ® Processor E3-1260L (Quad-Core, 2.4GHz, 8MB L3 cache), , Turbo Boost Disabled, Hyper-Threading Enabled, 8GB (2x4GB DDR3-1333 UDIMM), 64GB SATA SSD, Microsoft Windows* 2008 R2 SP1, Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal

testing as of Mar 2012. SPECpower_ssj2008* score: 3069 Previous Configuration: Intel® C206 chipset based server platform with one Intel® Xeon® Processor E3-1265L v2 (8M Cache, 2.5GHz), EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 8GB (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD, Microsoft Windows* 2008 R2 SP1, Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. SPECpower_ssj2008* score: 4291.2

New Configuration: Intel® C226 chipset based server platform with one Intel® Xeon® Processor E3-1265L v3 (8M Cache, 2.5GHz), EIST Enabled, Turbo Boost Enabled, C3 Disabled, C6 Enabled, Hyper-Threading Enabled, 8GB (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD , Microsoft Windows* 2008 R2 SP1, IBM J9 VM (build 2.6, JRE 1.7.0 Windows Server 2008 amd64-64 20120322_106209v)(JIT enabled, AOT enabled). Source: Intel internal testing as of April 2013. SPECpower_ssj2008* score: 5094


Workstation Benchmark Configuration (Linux)

SPEC* CPU2006:

Baseline configuration: Intel® C206 chipset based Intel® Xeon® workstation platform with one Intel® Xeon® processor E3-

1275 (quad-core, 3.4GHz, 8M cache), ASNBCPT1.86C.0085.P00 July 5, 2012, Intel® Hyper Threading Technology (Intel® HT

Technology) enabled, 16GB memory (4x4GB DDR3-1333 ECC UDIMM), 2TB 7200RPM SATAIII HDD (WD2000FYYZ), RHEL

v6.3 - 2.6.32-278.e16.x86_64. Compiler version 13.0.0.133 of Intel® C++ Studio XE and Intel® Fortran. Source: Intel internal

estimated measurements, April 2013. Scores:SPECfp*_base2006=59.2; SPECint*_base2006=49.4;

SPECfp*_rate_base2006=112; SPECint*_rate_base2006=170.

Previous configuration: Intel® C216 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-

1275 v2 (quad-core, 3.5GHz, 8M cache), ACRVMBY1.86C.0096.P00 September 9, 2012, Intel HT Technology enabled, 16GB

memory (4x4GB DDR3-1600 ECC UDIMM), 2TB 7200RPM SATAIII HDD (WD2000FYYZ), RHEL v6.3 - 2.6.32-

278.e16.x86_64. Compiler version 13.0.0.133 of Intel C++ Studio XE and Intel Fortran. Source: Intel internal estimated

measurements, April 2013. Scores: SPECfp*_base2006=65.1; SPECint*_base2006=52.5; SPECfp*_rate_base2006=130;

SPECint*_rate_base2006=185.

New configuration: Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3

(quad-core, 3.5GHz, 8M cache), HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology enabled, 16GB memory

(4x4GB DDR3-1600 ECC UDIMM), 2TB 7200RPM SATAIII HDD (WD2000FYYZ), RHEL v6.4 - 2.6.32-358.e16.x86_64.

Compiler version 13.0.0.133 of Intel C++ Studio XE and Intel Fortran. Source: Intel internal estimated measurements, April

2013. Scores: SPECfp*_base2006=72.4; SPECint*_base2006=59.4; SPECfp*_rate_base2006=142;

SPECint*_rate_base2006=209.


Workstation Benchmark Configuration (Windows)

SPECviewperf* 11 (ensight-04, lightwave-01, maya-03, proe-05, sw-02, tcvis-02, & snx-01),

SPECapc* for 3ds Max* 2011, SPECapc* for Maya* 2012, Autodesk Softimage* 2013,

Autodesk Simulation CFD* 2013 (3 cases), Autodesk Inventor* 2013 (Small workload),

Cadalyst 2012 on AutoCAD* 2013, Adobe Photoshop* CS6, Bentley MicroStation* Graphics Benchmark,

3DMark* 06, 3DMark* Vantage, 3DMark* 11, & SysMark* 2012:

Baseline configuration: Intel® C206 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 (quad-

core, 3.4GHz, 8M cache), ASNBCPT1.86C.0085.P00 July 5, 2012, Intel® Hyper Threading Technology (Intel® HT Technology) best

configuration, 8GB memory (2x4GB DDR3-1333 ECC UDIMM), Intel® HD Graphics P3000 with driver 2455, 2TB 7200RPM SATAIII HDD

(WD2000FYYZ), Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.

Previous configuration: Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v2 (quad-

core, 3.5GHz, 8M cache), ACRVMBY1.86C.0096.P00 September 9, 2012, Intel HT Technology best configuration, 8GB memory (2x4GB

DDR3-1600 ECC UDIMM), Intel HD Graphics P4000 with driver 2712, 2TB 7200RPM SATAIII HDD (WD2000FYYZ), Microsoft Windows

7* Service Pack 1. Source: Intel internal testing as of April 2013.

New configuration(HDD): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3

(quad-core, 3.5GHz, 8M cache), HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 8GB memory

(2x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4600/4700 with driver 2989, 2TB 7200RPM SATAIII HDD (WD2000FYYZ),

Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.

New configuration(SSD): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3

(quad-core, 3.5GHz, 8M cache), HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 8GB memory

(2x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4600/4700 with driver 2989, 240GB Intel® 520 SATAIII SSD, Microsoft Windows

7* Service Pack 1. Source: Intel internal testing as of April 2013.

New configuration(Discrete GFX): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-

1270 v3 (quad-core, 3.5GHz, 8M cache), HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 8GB

memory (2x4GB DDR3-1600 ECC UDIMM), Nvidia* Quadro* 410 with driver v311.55, 240GB Intel® 520 SATAIII SSD, Microsoft

Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.


Workstation Benchmark Configuration (Windows, continued)

Autodesk Inventor*2013 (Medium & Large Workload):

Baseline configuration: Intel® C206 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 (quad-core, 3.4GHz, 8M cache),

ASNBCPT1.86C.0085.P00 July 5, 2012, Intel® Hyper Threading Technology (Intel® HT Technology) best configuration, 16GB memory (4x4GB DDR3-1333 ECC

UDIMM), Intel® HD Graphics P3000 with driver 2455, 2TB 7200RPM SATAIII HDD (WD2000FYYZ), Microsoft Windows 7* Service Pack 1. Source: Intel internal testing

as of April 2013.

Previous configuration: Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v2 (quad-core, 3.5GHz, 8M cache),

ACRVMBY1.86C.0096.P00 September 9, 2012, Intel HT Technology best configuration, 16GB memory (4x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4000

with driver 2712, 2TB 7200RPM SATAIII HDD (WD2000FYYZ), Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.

New configuration(HDD): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3 (quad-core, 3.5GHz, 8M cache),

HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 16GB memory (4x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4600/4700


New configuration(SSD): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3 (quad-core, 3.5GHz, 8M cache),


with driver 2989, 240GB Intel® 520 SATAIII SSD, Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.

New configuration(Discrete GFX): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1270 v3 (quad-core, 3.5GHz, 8M

cache), HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 16GB memory (4x4GB DDR3-1600 ECC UDIMM), Nvidia* Quadro* 410

with driver v311.55, 240GB Intel® 520 SATAIII SSD, Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.

SPECapc* for SolidWorks* 2013, SolidWorks* 2013 Performance Test, & FEA Benchmark* v3 on SolidWorks* Simulation 2013:

Baseline configuration: Intel® C206 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 (quad-core, 3.4GHz, 8M cache),

ASNBCPT1.86C.0085.P00 July 5, 2012, Intel® Hyper Threading Technology (Intel® HT Technology) best configuration, 8GB memory (2x4GB DDR3-1333 ECC

UDIMM), Intel® HD Graphics P3000 with driver 2712, 2TB 7200RPM SATAIII HDD (WD2000FYYZ), Microsoft Windows 7* Service Pack 1. Source: Intel internal testing

as of April 2013.

Previous configuration: Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v2 (quad-core, 3.5GHz, 8M cache),

ACRVMBY1.86C.0096.P00 September 9, 2012, Intel HT Technology best configuration, 8GB memory (2x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4000 with

driver 2712, 2TB 7200RPM SATAIII HDD (WD2000FYYZ), Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.

New configuration(HDD): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3 (quad-core, 3.5GHz, 8M cache),



New configuration(SSD): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3 (quad-core, 3.5GHz, 8M cache),


with driver 2989, 240GB Intel® 520 SATAIII SSD, Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.

New configuration(Discrete GFX): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1270 v3 (quad-core, 3.5GHz, 8M

cache), HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 8GB memory (2x4GB DDR3-1600 ECC UDIMM), Nvidia* Quadro* 410 with

driver v311.55, 240GB Intel® 520 SATAIII SSD, Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.

Documents

Intel® Xeon® Processor E3-1200v3 Product Family …i.crn.com/misc/microsites/intelssd13/Intel_Xeon_Processor_E3-1200v... · Intel® Xeon® Processor E3-1200v3 Product Family Technical