Introduction Component Selection

ISL62871EVAL2Z Rev A Evaluation Board User Guide

APPLICATION NOTE

AN1441Rev 0.00

Nov 17, 2008

IntroductionThe ISL62870EVAL2Z Rev A evaluation board demonstrates the performance of the ISL62870HRUZ single-phase synchronous-buck PWM controller featuring Intersil's Robust Ripple Regulator (R3) technology. An on-board dynamic-load generator is included for evaluating the transient-load response, which applies a pulse of 125m across VOUT and GND. Contents of this document include:

• Design Criteria

• Component Selection

• Recommended Test Equipment

• Interface Connections

• Switch Descriptions

• Jumper Descriptions

• Test Point Descriptions

• Typical Load-transient Response Waveforms

• Evaluation Board Documentation

- Schematic

- Silk-screen plots

- Board layer plots

- Bill of materials

Design Criteria

Component Selection

Output Setpoint Voltage Programming

The procedure for programming the output setpoint voltage requires only the component selection for the feedback divider network that attenuates the output voltage and applies it to the FB pin. The voltage at the FB pin is regulated to equal VSREF which is equal to the 500mV internal reference VREF once the soft-start sequence has completed.

CALCULATE THE ATTENUATION CONSTANT “K”

Calculate K with Equation 1:

CALCULATE ROFS USING ATTENUATION CONSTANT K

The feedback voltage divider network consists of two resistors RFB and ROFS where:

- RFB is the loop-compensation feedback resistor that connects from the FB pin of the IC to the positive voltage of the converter output

- ROFS is the scaling resistor that connects from the FB pin of the IC to GND, which must be recalculated after each instance of changing the value of resistor RFB.

Calculate ROFS with Equation 2:

The results from Equation 2 must be rounded to the next highest or next lowest standard resistor value that most accurately reproduces K using Equation 3:

Check VOUT output setpoint voltage with Equation 4:

SOFT-START DELAY PROGRAMMING

Calculate Value for CSOFT

The elapsed time from when the EN pin is asserted to when VSREF has charged CSOFT to VREF is called the soft-start delay tSS which is given by Equation 5:

Where:

- ISS is the soft-start current source at the 20µA limit

- VSREF is 500mV

The end of soft-start is detected by ISS tapering off when capacitor CSOFT charges to VSREF. The internal SSOK flag

TABLE 1. DC/DC DESIGN CRITERIA

PARAMETER VALUE UNITS

VIN 3.3V to 25V VDC

VOUT 1.20 VDC

MAX DC LOAD 20 ADC

tSS 1.5 ms

OCP THRESHOLD 30 ADC

KVSREFVOUT-------------------= (EQ. 1)

ROFS

K R FB1 K–

--------------------= (EQ. 2)

KROFS

RFB ROFS+----------------------------------= (EQ. 3)

VOUT

VSREFK

-------------------= (EQ. 4)

tSS

VSREF CSOFT

ISS-------------------------------------------= (EQ. 5)

AN1441 Rev 0.00 Page 1 of 16Nov 17, 2008

ISL62871EVAL2Z Rev A EvaluationBoard User Guide

is set, the PGOOD pin goes high, and diode emulation mode (DEM) is enabled.

Component Selection For CSOFT Capacitor

Choosing the CSOFT capacitor to meet the requirements of a particular soft-start delay tSS is calculated using Equation 6, written as follows:

Where:

- tSS is the soft-start delay

- ISS is the 20µA soft-start current source at the 20µA limit

- VSREF is 500mV

DCR-SENSE OVERCURRENT THRESHOLD PROGRAMMING

DCR-sensing for overcurrent protection OCP, is accomplished by detecting the voltage created across the DCR of the output inductor LO.

VDCR is calculated with Equation 7:

A series-connected RC network consisting of resistor ROCSET and capacitor CSEN are connected across the centers of the PCB pads where the output inductor LO is mounted. Resistor ROCSET connects to the phase side of LO while capacitor CSEN connects to the VOUT side of LO.

The OCSET pin sinks the 10µA programming current reference IOCSET continuously through resistor ROCSET creating a voltage VROCSET that is equal to VDCR at the specified overcurrent threshold through ILO.

VROCSET is calculated with Equation 8:

The VO pin is connected through resistor RO to the VOUT side of capacitor CSEN and is the reference to which the OCSET pin is compared. The value of RO must always match the value of ROCSET.

COMPONENT SELECTION FOR ROCSET AND CSEN

Calculate ROCSET with Equation 9:

Where:

- ROCSET is the resistor used to program the overcurrent setpoint

- IOC is the output DC load current that will activate the OCP fault detection circuit

- DCR is the inductor DC resistance

- IOCSET is the 10µA programming current reference that is sinked into the OCSET pin

To sense the inductor current correctly during dynamic operation, the RC time constant ROCSET •CSEN needs to match LO/DCR.

Calculate CSEN with Equation 10:

Calculations for ISL62870EVAL2Z Rev A Component Values

CALCULATE THE ATTENUATION CONSTANT "K"

Using the criteria from Table 1.

- VOUT is 1.2V

From Equation 1, K is:

The value to be used for RIN shall be the typical value of 2.49k.

From Equation 2, ROFS is:

SELECT NEAREST STANDARD RESISTOR VALUE FOR THE CALCULATED ROFS COMPONENT VALUE AND CHECK RESULTANT OUTPUT SETPOINT VOLTAGE:

From Equation 3 K is:

From Equation 4 VOUT is:

CALCULATE THE VALUE FOR CSOFT AS A FUNCTION OF THE tSS REQUIREMENT

For this application, the soft-start delay needs to complete at approximately 1.5ms:

From Equation 6 CSOFT is:

CSOFT

tSS ISS

VSREF-----------------------= (EQ. 6)

VDCR ILO DCR= (EQ. 7)

VROCSET 10A ROCSET= (EQ. 8)

(EQ. 9)ROCSET

IOC DCR

IOCSET----------------------------=

(EQ. 10)CSEN

LOROCSET DCR------------------------------------------=

0.5V1.2V------------ 0.4167= (EQ. 11)

0.4167 2.49k1 0.4167–

------------------------------------------- 1.778k= (EQ. 12)

ROFS 1.78k= (EQ. 13)

1.78k2.49k 1.78k+---------------------------------------------- 0.4168= (EQ. 14)

0.5V0.4168------------------ 1.1996V= (EQ. 15)

1.5ms 20s0.5V

----------------------------------- 60nF= (EQ. 16)

AN1441 Rev 0.00 Page 2 of 16Nov 17, 2008


SELECT NEAREST STANDARD CAPACITOR VALUE FOR CSOFT AND CHECK RESULTANT tSS

The closest standard capacitor value for the calculated value of CSOFT:

From Equation 5 tSS is:

DCR-SENSE OVERCURRENT THRESHOLD PROGRAMMING

From Equation 9 ROCSET is:

Select the nearest standard resistor value for ROCSET:

From Equation 10 CSEN is:

Select the nearest standard capacitor value for CSEN:

Recommended Equipment• (QTY 1) Adjustable 25V, 10A Power Supply

• (QTY 1) Fixed 12V, 100mA Power Supply

• (QTY 1) Fixed 5V, 100mA Power Supply

• (QTY 1) Adjustable 20A Constant Current Electronic Load

• (QTY 1) DVM

• (QTY 1) 4-Channel Oscilloscope

Interface Connections• VIN: Input voltage to the power stage of the converter

- J1: VIN positive power input

- J2: VIN return power input

• VOUT: Regulated output voltage from the converter

- J19: VOUT positive power output

- J17: VOUT return power output

• +5VIN: +5V input voltage for PVCC, PGOOD-LED, and pull-up voltage rail

- J9: 5V positive input

- J12: 5V return input

• +12V: Input voltage for the dynamic-load generator

- J14: 12V positive input

- J13: 12V return input

Switch Descriptions• S1: ENABLE

- OFF: Shorts the EN pin to GND (disable PWM)

- ON: Allows the EN pin to pull-up to +5V (enable PWM)

• S4: DYNAMIC LOAD

- ON: Load enabled

- OFF: Load disabled

Jumper Descriptions• J3: Connects +5V supply to the PGOOD LED circuit. The

shunt jumper is normally installed and should be removed when making low power efficiency measurements.

• J21: Isolates the EN input pin from switch S1 so that an external signal can be used. The shunt jumper is normally installed.

• J20: Isolates the PGOOD input pin from the pull-up resistor so that the pull-down resistance can be measured. The shunt jumper is normally installed and should be removed when making low power efficiency measurements.

• J6: Selects DCR current sense signal source. Short across PCB pads with a solder bridge to select.

• J7: Selects shunt-resistor current sense signal source. Short across PCB pads with a solder bridge to select.

• J10: Selects shunt-resistor current sense signal source. Short across PCB pads with a solder bridge to select.

• J11: Selects DCR current sense signal source. Short across PCB pads with a solder bridge to select.

Test-point Descriptions• TP3: EN pin

• TP5: PGOOD pin

• TP18: VIN positive voltage sense

• TP15: VIN return voltage sense

• TP32: VOUT positive voltage sense

• TP14: VOUT return voltage sense

• J15: Scope-probe socket for measuring the PHASE node

• J16: Scope-probe socket for measuring VOUT

• J18: Scope-probe socket for measuring voltage across the dynamic-load resistors (hence load current)

• TP31, TP13, TP33: GND

CSOFT 56nF= (EQ. 17)

0.5V 56nF20A

------------------------------- 1.4ms= (EQ. 18)

30A 2.3m10A

---------------------------------- 6.9k= (EQ. 19)

ROCSET 6.98k= (EQ. 20)

0.88H6.98k 2.3m------------------------------------------- 54.81nF= (EQ. 21)

CSEN 56nF= (EQ. 22)

AN1441 Rev 0.00 Page 3 of 16Nov 17, 2008


Typical Waveforms

FIGURE 1. LOAD TRANSIENT, 3.3V VIN, 1.20V VOUT, 125m LOAD-STEP, 1ADC LOAD




FIGURE 5. LOAD TRANSIENT, 25V VIN, 1.20V VOUT, 125m LOAD-STEP, 1ADC LOAD

FIGURE 6. LOAD TRANSIENT, 25V VIN, 1.20V VOUT, 125m LOAD-STEP, 10ADC LOAD

VOUT

VCC

EN

PGOOD

VOUT

PHASE

V_125m VOUT

VCC

EN

PGOOD

VOUT

PHASE

V_125m

VOUT

PHASE

V_125m

VOUT

PHASE

V_125m

VOUT

I-CHOKE

I-LOAD

VOUTPHASE

V_125m

VOUT

V_125m

PHASE

AN1441 Rev 0.00 Page 4 of 16Nov 17, 2008

AN

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1

J19

+5V

C28

10µH

J9

J12

C32

10µH

C31

2

J17

10µH

ISL62870EVAL2Z Rev A Circuit Schematic

BSC0

42N0

3MSG

1

6.98kJ6J1

1BS

C042

N03M

SGBS

C120

N03M

SG

R13

VO

^

OCSE

T^Q3

6

R12

3.09k

PGND

AGND

470µ

H

OP

EN

UGAT

E

51 32

4

0.88µHVOUT^

L1

330µ

H

330µ

H

VOUT

U1

SET0PGOOD

SREFNC

ENBOOT

4

5

4

2 315

4

5

3 23 1

5

4J1

J2

7 8

11

16

103

131415

121

2

9

0R5

2.2

C3

10µH

C40

0.1µ

H

C2

10µH

0.22

µH

C19

C1

0.01

µH

C22

C7

C23

22µH

Q5 Q4

R18

R24

2.49

k

R14

10µH

C30

10µH

C29

C26

OC

SE

T

PHAS

ELG

ATE

VIN

C24

R4

22µH

Q2

BSC1

20N0

3MSG

ISL62870HRUZ

VO

FB

6.98

k

SHORT

C25

C5

2700

pF

R15

100

C14

0.056µH

C11

0.05

6µH

R2

DNP

R1

DN

P

VID

SE

T

PG

OO

D

FB

VO

VC

C

PV

CC

LG

ATE

PG

ND

UGATE

BOOT

OCSET

PHASE

GND

EN

SREF

IN

IN

CS

OFT

ROFS

RFB

CSEN

RO

ROCSET

LO2

+

+

+

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PHASE NODEPROBE JACK

ASE NODE SNUBBER(OPTIONAL)

CK

J15J16

PHASE

PHASE

C8

OPEN

R23

OPEN

IN IN

IN

ISL62870EVAL2Z Rev A Circuit Schematic (Continued)

TRANSIENT LOAD GENERATOR

ENABLE AND VID CONTROL SWITCHES

POWER GOOD LED CIRCUITRY

OFF

PROBE JACKTRANSIENT LOAD

AGND AND PGNDSHORTS AND TEST POINTS

VOUT

OFF

12V

INPU

T ONENABLE

PHSELECTION ENABLE

EXTERNAL REF INPUT(OPTIONAL)

ONTEST POINTS

RESISTOR SENSE

PROBE JA

C38

PGOODENDNP

PGOOD

+5V

SET0

VCCVO^

OCSET^

VOUT^

VOUT

J18R43

0.5

R42

Q6

BSS1

38 Q7HIP2100

U2

1000

pF

10µHC39

49.9kR46

10¬µC6

499

R47S4

J13

J3

499R8

499D3

Q1Q8

J20

J7J1

0

TP18TP5TP3TP1

TP33TP13

0

R19

TP31TP15TP14

S1

J4

J21

3

3

1

2

42 1

12

2

5678 1

432

2

1

3

231

ENISO

EN VCC

D12

13 1

3

1

32 BSS138

BSS138

13

2S2

VOUT

VINVOUT

R20OPEN

R21

OPEN

R6

10k

R3

DNP

R10

10k

10k

R22

R33

OPEN

R45

665

R44

1.74k0.5

SUD5

0N03

_07

J14

+5VISO

VOUT

TP32

C37

0.1¬µ

3

R7

IN

IN

IN

IN

IN IN

IN

IN

IN

IN

IN

IN

1 2

HI

LO

HSHOLI

VSSVDD

HB

REDGRN

1 2

1 2

1 2

DNP DNP


ISL62870EVAL2Z Rev A Board Layout

FIGURE 7. ISL62870EVAL2Z REV A TOP SILK SCREEN

AN1441 Rev 0.00 Page 7 of 16Nov 17, 2008


FIGURE 8. ISL62870EVAL2Z REV A TOP ETCH

ISL62870EVAL2Z Rev A Board Layout (Continued)

AN1441 Rev 0.00 Page 8 of 16Nov 17, 2008


FIGURE 9. ISL62870EVAL2Z REV A LAYER 2 GROUND PLANES


AN1441 Rev 0.00 Page 9 of 16Nov 17, 2008


FIGURE 10. ISL62870EVAL2Z REV A LAYER 3 GROUND PLANES


AN1441 Rev 0.00 Page 10 of 16Nov 17, 2008


FIGURE 11. ISL62870EVAL2Z REV A BOTTOM ETCH


AN1441 Rev 0.00 Page 11 of 16Nov 17, 2008


FIGURE 12. ISL62870EVAL2Z REV A BOTTOM SILK SCREEN


AN1441 Rev 0.00 Page 12 of 16Nov 17, 2008


FIGURE 13. ISL62870EVAL2Z REV A BOTTOM SILK SCREEN (MIRRORED)


AN1441 Rev 0.00 Page 13 of 16Nov 17, 2008


Bill of Materials (Excluding Auxiliary Circuitry and Hardware)

QTY REFERENCE DESCRIPTION/COMMENT MFG NAME MFG NUMBER

2 C11, C14 CAP, SMD, 0603, 0.056µF, 16V, 10%, X7R, ROHS Any Any

1 C19 CAP, SMD, 0603, 0.22µF, 25V, 20%, X7R, ROHS Any Any

2 C2, C3 CAP, SMD, 0805, 10µF, 6.3V, 20%, X5R, ROHS Any Any


2 C25, C26 CAP 7m, 0.5nH,SMD, D2T, 330µF, 2V, 20% SANYO 2TPLF330M7

4 C29-C32 CAP, SMD, 0805, 10µF, 6.3V, 10%, X5R, ROHS Any Any

1 C5 CAP, SMD, 0603, 2700pF, 50V, 10%, X7R, ROHS Any Any

2 C23, C24 CAP, SMD, 1210, 22µF, 25V, 10%, X5R, ROHS PANASONIC ECJ-4YB1E226M


1 L1 PWR CHOKE COIL, SMD, 11.5x10, 0.88µH, 20%, 17.4A, CUSTOM

NEC MPC1040R88

2 Q2, Q3 TRANSIST-MOS, N-CHANNEL, 8P, TDSON, 30V, 12m RDS, ROHS

INFINEON BCS120N03MS

2 Q4, Q5 TRANSIST-MOS, N-CHANNEL, 8P, TDSON, 30V, 4.2m RDS, ROHS

INFINEON BCS042N03MS

0 R1 DNP Any Any

1 R14 RES, SMD, 0603, 2.49k, 1/16W, 1%, TF, ROHS Any Any


1 R5 RES, SMD, 0603, 2.2, 1/16W, 5%, TF, ROHS Any Any

0 R2 DNP Any Any

1 R15 RES, SMD, 0603, 100, 1/10W, 1%, TF, ROHS Any Any

2 R18, R24 RES, SMD, 0603, 6.98k, 1/16W, 1%, TF, ROHS Any Any

2 R6, R10 RES, SMD, 0603, 10k, 1/10W, 1%, TF, ROHS Any Any

1 U1 IC-PWM CONTROLLER 1-BITDAC, 16P, µTQFN, ROHS INTERSIL ISL62870HRUZ

R1, R2, R3 DNP

AN1441 Rev 0.00 Page 14 of 16Nov 17, 2008


Bill of Materials (Auxiliary Circuitry and Hardware)

QTY REFERENCE DESCRIPTION/COMMENT MFG NAME MFG NUMBER

1 C1 CAP, RADIAL, 470µF, 35V, 19mF ESR PANASONIC EEU-FM1V470

1 C28 CAP, SMD, 0805, 10µF, 6.3V, 20%, X5R, ROHS Any Any


1 C38 CAP, SMD, 0603, 1000pF, 50V, 10%, X7R, ROHS Any Any

2 C6, C39 CAP, SMD, 1206, 10µF, 25V, 20%, X7R, ROHS Any Any

1 D1 SCHOTTKY, SMD, SOT23, 3P, 30V, 200mA, DUAL FAIRCHILD BAT54S

1 D3 LED, SMD, 3mmx2.5mm, 4P, RED/GREEN, 12/20MCD, 2V LUMEX SSL-LXA3025IGC-TR

2 J1, J19 CONN-PLUG, BANA-INSUL-SDRLESS, RED, 4mm, RA DELTRON 571-0500

3 J15, J16, J18 CONN-SCOPE PROBE TEST POINT, PCB MNT TEKTRONIX 131-4353-00

2 J2, J17 CONN-PLUG, BANA-INSUL-SDRLESS, BLACK, 4mm, RA DELTRON 571-0100

4 J3, J4, J20, J21 CONN-HEADER,1x2, RET, 2.54mm, ST, ROHS Any Any

2 J10, J11 PCB SOLDER-BRIDGE JUMPER

4 J9, J12-J14 CONN-GEN, TERMINAL POST, TH, 0.09 KEYSTONE 1514-2

3 Q1, Q7, Q8 TRANSIST-MOS, N-CHANNEL, SMD, 3P, SOT23, 50V, 200mA, ROHS

ON SEMI BSS138LT1G

1 Q6 TRANSIST-MOS, N-CHANNEL, SMD, TO-252, 30V, ROHS VISHAY SUD50N03-07

2 R4, R19 RES, SMD, 0603, 0, 1/10W, 1%, TF, ROHS Any Any

1 R22 RES, SMD, 0603, 10k, 1/10W, 1%, TF, ROHS Any Any

1 R46 RES, SMD,0603, 49.9k, 1/16W, 1%, TF,ROHS Any Any

2 R42, R43 RES, SMD, 2512, 0.5, 1W, 1%, TF, ROHS VISHAY WSL-2512-R500F-EA

3 R7, R8, R47 RES, SMD, 0603, 499, 1/16W, 1%, TF, ROHS Any Any


1 R45 RES, SMD, 0603, 665, 1/16W, 1%, TF, ROHS Any Any

2 S1,S4 SWITCH-TOGGLE, SMD, ULTRAMINI, 1P, SPST MINI C&K GT11MSCKE

5 TP13-TP15, TP31, TP33 CONN-GEN, COMPACT TEST POINT, VERTICAL, BLACK KEYSTONE 5006

2 TP18, TP32 CONN-GEN, COMPACT TEST POINT, VERTICAL, RED KEYSTONE 5005

3 TP2, TP3, TP5 CONN-GEN, COMPACT TEST POINT, VERTICAL, WHITE KEYSTONE 5007

1 U2 IC-HI FREQ BRIDGE DRIVER, 8P, SOIC, 100V, ROHS INTERSIL HIP2100IBZ

- C7, C8, J4, J6, J7, R20, R21, R23, R33, S2, TP1

DO NOT POPULATE

- R13 Make Short

AN1441 Rev 0.00 Page 15 of 16Nov 17, 2008

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products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable

laws and regulations.

9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws

or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or

transactions.

10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third

party in advance of the contents and conditions set forth in this document.

11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.

12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.

(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.

(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

Documents

Introduction Component Selection