Disclosure to Promote the Right To Information

Whereas the Parliament of India has set out to provide a practical regime of right to information for citizens to secure access to information under the control of public authorities, in order to promote transparency and accountability in the working of every public authority, and whereas the attached publication of the Bureau of Indian Standards is of particular interest to the public, particularly disadvantaged communities and those engaged in the pursuit of education and knowledge, the attached public safety standard is made available to promote the timely dissemination of this information in an accurate manner to the public.

इंटरनेट मानक

“!ान $ एक न' भारत का +नम-ण”Satyanarayan Gangaram Pitroda

“Invent a New India Using Knowledge”

“प0रा1 को छोड न' 5 तरफ”Jawaharlal Nehru

“Step Out From the Old to the New”

“जान1 का अ+धकार, जी1 का अ+धकार”Mazdoor Kisan Shakti Sangathan

“The Right to Information, The Right to Live”

“!ान एक ऐसा खजाना > जो कभी च0राया नहB जा सकता है”Bhartṛhari—Nītiśatakam

“Knowledge is such a treasure which cannot be stolen”

“Invent a New India Using Knowledge”

है”ह”ह

IS 5921-2 (1973): Metal-Clad Base Material for PrintedCircuits for Use in Electronic and TelecommunicationEquipment, Part 2: Paper Phenolic Copper-Clad LaminatedSheet-PF-CP-CU Economic Grade [LITD 5: Semiconductor andOther Electronic Components and Devices]

IS : 5921 (Part II ) - 1973

Indian Standard

SPECIFICATION FOR METAL-CLAD BASE MATERIAL FOR PRINTED

CIRCUITS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT

PART II PAPER PHENOLIC COPPER-CLAD LAMINATED SHEET-PF-CP-CU ECONOMIC GRADE

SHR~ H.

Electromechanical Componems for Electronic Equipment Sectional Committee, ETDC 37

ChairmaiJ J. MIRCHAN~ANI

Members

RepresesJinR Posts & Telegraphs Board, NW Delhi

SHRI JOHN FRANCIS ( Afternate to Shri H. J. Mirchandani )

i)R G. N. ACHARYA Central Electronics Engineering Research Institute (CSIR j, Pilani

SHRI R. RAMACHANDRAN ( Ahernate) 53~1 H. K. L. ARORA All India Radio snd Electronics Association

( AIREA ), Bombay SHRI R. G. KESW~NI (Aftemute I) SHRI ARUP CHAUDHURI (Alternate II ) SHRI L. S. V. EASWAR ( Alternate III )

SHRI BALRAJ BHANOT Directorate General of Technical Development, New Delhi

SHRI R. G. DEODHAR ( AlterJJate) COYTROLLER Director General oi Civil Aviation (Ministry of

SHIU S. RANCARAJAN ( Alternate) Tourism & Civii Avmtlon j, New Delhi

SH~I B. P. GHOSH National Test House, Calcutta SHRI BAKUL HARISHANKER

SHRI J. C.. SI.WDIA (Alternate 1 Allied Electronics Corporation, Bombay

SHRI S. JALEEL HASAN SHRI S. A. SHINDE ( Aiternatel

Bakelite Hylam Ltd, Hyderabad

SHRI K. S. KELKAR Bharat Electronics Ltd, Bangalore SHRI K. GURURAJA ( AlterJJate)

(Contbwed on page 2 )

INDIAN STANDARDS INSTITUTION This publication is protected under the f&an Copyright Act ( XIV of 1957 ) and reproduction in whole or in part by any means exce

P t

the publisher shail~be deemed to be an infringement with written permission of

o copyright under the said Act.

c

IS : 5921 (Part II) - 1973

( Continued from page 1 )

Members Representing

SHRI S. G. V. MANI

SHRI. P. R. MULCHANDANI

Electronics Corporation of India Ltd (Department of Atomic Energy), Hyderabad

Mulchandani Electrical & Radio Industries Ltd,

SHRI L. VENKATESAN (.4lternate) Bombay

SHRI M. S. NAIK Philips India Ltd, Calcutta DR P. B. PAREKW (Alternate)

SHRL P. V. PAPANNA Radio & Electricals hlanufacturing CO Ltd, Bangalore

SHRI S. RAJAGOPAL ( Alternate) SHRI P. K. RAO Ministry of Defence ( DGI ) SHRI D. K. SACHDEV Indian Telephone Industries Ltd, Bangalore

SHRI S. D. PANI (Alternate) SHRI S. SENGUPTA Formica India Ltd, Poona

SHRI R. D. F. ROSARIO ( Alternate) WG CDR D. SESHARATNAM Directorate of Technical Development & Production

( Air ) ( Ministry of Defence ), New Delhi SHRI T. V. VARADARAJAN (Alternate )

SHRI C. L. SHARMA M. C. Engineering Co, New Delhi SHRI S. K. GUPTA (Alternate)

SHRI K. M. TOPRANI Telcom Industries Pvt Ltd, Bombay SHR~ B. N. SHAH (Alternate )

DR S. V~NKATACHALAM Ministry of Defence ( R & D ) SHRI C. K. V. RAO (Alternate)

SHRI N. SRINIVASAN, Director General, IS1 .( Ex-pficio Member ) Deputy Director ( Elec tech )

Secretary

SHRI s. MUKHOPADHYAY Assistant Director (Elec tech), 1st

Panel for Printed Circuits, ETDC 37:Pl

Convener DR J. VAID

Members

Philips India Ltd, Calcutta

SHRI M. A. GODBOLE ( Alternate to Dr J. Vaid)

SHRI S. JALEEL HASAN Bakelite Hylam Ltd, Hyderabad SHRI S. A. SHINDE ( Alternate)

SHRI S. D. PANI SHRI M. K. SADAGOPAN

Indian Telephone Industries Ltd, Bangalore Bharat Electronics Ltd, Bangaiore

SHRI S. SENGIJPTA Fomiica India Ltd, Poona SHRI R. B. F. ROSARIO ( Afternate )

2

IS : 5921 (Part II ) - 1973

Indian Standard

SPECIFICATION FOR METAL-CLAD BASE MATERIAL FOR PRINTED

CIRCUITS FOP USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT

PART II PAPER PHENOLIC COPPER-CLAD LAMINATED SHEET-PF-CP-CU ECONOMIC GRADE

0. FOREWORD

0.1 This Indian Standard ( Part II) was adopted by the Indian Standards Institution on 12 March 1973, after the draft finalized by the Electro- mechanical Componentg for Electronic Equipment Sectional Committee had been approved by the Electrotechnical Division Council.

0.2 The object of this standard i.s to specify uniform requirements of mechanical, electrical and climatic properties of paper phenolic copper- clad laminated sheets, economic grade with non-defined high frequency applications, such as domestic radio receivers and allied equipment.

0.3 This sthndard is to be used in conjunction with IS:5921 (Part I)-1970* which is a necessary adjunct to this standard.

0.4 While preparing this standard, assistance has been derived from the following documents:

ISO/R 62( 1958) Plastics: Determination of watei absorption (Amend- ment No. 1). International Organization for Standardization.

L IEC Pub 249-2 Metal-clad base materials for printed circuits: Part 2

Specifications. International Electrotechnical Commission.

Dot : B. S. 70/9525 Metal-clad base materials for printed circuits: Parts 2-8 Specifications ( Revision of BS 3888: 1965 ). British Standards Institution.

0.5 For the purpose of deciding whether a particular requirement of this standard is Implied with, the final value, observed or calculated,

*Specification for metal-clad base material for printed circuits for use in, electronic and telecommunication equipment: Part I General requirements and tests.

3

IS : 5921 (Part II) - 1973

expressing the result of a test, shall be rounded off in accordance with IS: 2-1960*. The number of significant places retained in the rounded off value should be the same as that of the specified value in this standard.

1. SCOPE

1.1 This standard ( Part II ) specifies the requirements for paper phenolic copper-clad laminated sheet, economic grade for use in printed wiring in telecommunication and allied electronic equipment.

2. TERMINOLOGY

2.1 For the purpose of this standard, the definitions of terms given in IS:-1885 (Part VI)-1965t and 1% 5921 (Part 1)4970f shall apply.

3. MATERIALS, CONSTRUCTION AND WORKMANSHIP

3.1 Materials and Construction - The sheet shall consist’ of an insulating base with copper foil bonded to one or both the sides.

3.1.1 Insulating Base-It shall be phenolic resin bonded paper laminate.

3.1.2 Copper - Copper used shall conform to 5.3.2 of IS : 5921 ( Part I )- 1970: as well as to requirements specified in Table 1.

TABLE 1 MASS AND THICKNESS OF COPPER

NOMINAL MASS PER UNIT AREA

(1)

g/m’ 305

610

DEVIATION

(2)

percent

;! 15

-115

NOMINAL THICKNESS

(3)

pm 35

70

DEVMTION FOR THICKNESS OF THE FOIL AT ANY POINT

(4)

pm

+10 -5

+I8 -8 L

3.1.3 Measurements to determine that the foil meets the requirements given in 3.1.2 shall be made in accordance with 5?3.2 of IS : 5921 (Part I )- 1970:.

NOTE - The minimum purity of copper +hould be 99.5 percent and its minimum conductivity should be 95 percent of 1’724 1 x IO-*J)m at 20°C.

of the value equivalent to a resistivity This is for information only.

*Rules for rounding off numerical values ! revised ). tElectrotechn,ical vocabulary: Part VI Printed circuits. ZSpecification for metal-clad base material for printed circuits for use in electronic

and telecommunication equipment: Part I General requirements and tests.

4

h : 5921 (Part IX ) - 1973

3.2 Workmanship -Provision of 3.2 of IS: 5921 (Part I)-1970* shall apply.

4. MARKING

4.1 The marking shall be in black or in some other colour not to be confused with red colour and shall conform to 4 of IS: 5921 (Part I)- 1970*.

NOTE - Red ‘indicates the flame resistant grade.

4.2 The marking shall be printed so as to indicate the machine direction of the filling material.

5. TEST SCHEDULE

5.1 General-The test schedule specifies all the tests and the order in which they shall be carried out as well as the requirements to be met with.

5.2 Classification of Tests - The provision of 5.1 of IS : 5921 (Part I)- 1970* shall apply except as modified by 5.2.1.

5.2.1 Acceptance

IS : 5921 (Part II) - 1973

TABLE 2 TEST SCHEDULE

( Clause 5.4 )

l%. TEST REP TO CL No.

OF IS:5921 ( PART I )-1970*

(1) (2) (3)

i) General ex- 53.1 amination

ii) Length and width

iii) Thickness

5.3.3.1

5.3.3.2

(4) (5)

Appearance of the Copper-Clad Face-The copper-clad faccshall be substantially free from blis- ters, wrinkles, pinholes, deep scratches, pits and resin. Any discolouration or contamination shall be readily removable with hydrochloric acid solution (sp gr l-02) or with suitable organic solvent

Under consideration

The thickness of the sheet, inciud- ing the metal foil, at any point shall conform to the values given below:

Nominal Tolerance Thickness

mm mm

0.5 &tVO7

+Z f009 zto.11

71.2 i-o.12

i:.: fO.14 ho.15

2.4 f0.18 3.2 f0.20 6.4 40.30

NOTE- For any nominal thickness within the range of W5 to 6.4 mm, which is not given above, the toler- ance applicable to the thickness shall bethat for the next greater nominal thickness given above.

L

*Specification for metal-clad base material for printed circuits for use in elec- tronic and telecommunication equipment: Part I General requirements and tests. i

tNon-preferred values. ( Continued )

6

IS : 5921 (Part II) - 1973

TABLE 2 TEST SCHEDULE - Contd

SL TEST ‘REP TO CL No. No. OF 1835921

( PAHT I)-1970*

(1) (2) (3)

iv) Bow 5.3.4

v) Twist 5.3.7

vi) Resistance of the foil

5.5.1

vii) Surface resis- tance after damp heat (long term)

viii) Volume resis- tivity after damp heat (long term)

5.52

5.5.3

CONDITION REQUIREMENT OF TEST

Shall not exceed the values given by -the formula d ( L/lOOO)a mm,

where L is the lengthof the straight edge in mm and d is. as given below:

Nominal Copper Foil Copper Foil Thickness on 07 Side on Botj Sides

mm

Less than 0% Not applicable

0.8 to 1.2 109 Above 1.2 to 1’6 55 ::

,, 1.6 to 3.2 27 ,, 3.2 to 6.4 :: 15

- Shall not exceed the values given by the formula d (L/1000)2 mm,

where L is the distance in mm bet- ween the corner of the sheet not in contact with the horizontal sur- face and the diagonally cq,posite corner d as given in the table above

NOTE -The requirements for bow and twist apply only to sheet sizes as manufactured and to the cut pieces having neither length nor width less than 460 mm.

- a) 305 g/m4-3.5 mP,Mnw b) 610 g/m’- 1.75 m R, Max

- IOOOMR, Min

5000 MRcm, Min

L

*Specification for metal-clad base material for printed circuits for use in electr,onic and telecommunication equipment: Part I General requirements and tests.

(Continued )

7

IS : 5921 (Part II) - 1973

TABLE 2 TEST SCHEPULE- Contd

SL TEST No.

REF TO CL No. C~OPDI~T; OF lS:5921

( PART I );1970*

(1) (2) (3) (4)

ix) Surface resis- Under consi- - tance at deration 100°C

xj Volumeresis- Under consi- - tivity at 100°C

xi) Pull-off str- ength

xii) Peel strength after heat shock

deration

5.3.9

5.3.10.2

- Not less than SON

Temperature of the bath: 250°C

Immersion time: 10 seconds

xiii) Peelstrength after dry heat

xiv) Peel strength after expo- sure to sol- vent vapour ( trichloro- ethylene )

xv) Blistering after heat shock

xvi) Solderability xvii) Punching

qaslity xviii) Flammability

xix) Water absorp- tion

lOOOMSh, Min

Not less than 1 N/mm

5.3.10.3 Not less than 1Njmm

5.3.10.4 - Not less than 1 N/mm

5.3.11 5 seconds

NOTE- For solvents other than trichlorethylene requirements shall be as agreed between the purchaser and the supplier. No delamination or blistering shall

occur

5.4.8 5.3.12

Under consideration Under consideration

5.4.6

5.4.7

- -

-

-

Not applicable

Thickness mm

0.8

Water Absorption Max, mg

(on 50x50 mm) 45

REQUIREMENT

(5) 100 M A?, Min

1.0 1.2

L

*Specification for metal-clad base material for printed circuits for use in electronic and telecommunication equipment: Part I General requirements and tests.

( Continued )

IS : 5921 (Part II) - 1973

TABLE 2 TEST SCHEDULE - Contd

SL TEST No.

REF TO CL No. CO;~+III;N REQUIREMENT OF IS:5921

(PART I)-1970*

(1) (2) (3) (4) (5)

xx) Volume per- 5.5.9 Frequency Loi? Volwnr mittivity

To be reyie; Out Tangent Permitrivity

and loss damp heat MHz tangent cycling test

1 0.045

:“o 0.055 ::;

0’060 5.8

Non-electrical properties of the base material after complete removal of the foil by etching:

xxi) Appearance - bf base material

- The base material shall be substan- tially free from pits, holes, scrat- ches, porosity and resin inclusions and substantially uniform in colour. A small amount of ir- gular variation ‘of colour is permissible

xxiij Flexural strength

5.4.1 Applicable to Not less than 8000 N/cm% sheet not less than 1.6 mm nominal thickness

xxiii) Machinability - - The material shall not crack or de- laminate during the operation’such as drilling, sawing and cutting; the method of which shall be agreed belween the manufacturer and the purchaser

*Specification for metal-clad base material for printed circuits for use in electronic and telecommunication equipment: Part I General requirements and tests.

L

9

- AHENDMENT NO. 1 OCTOBER 1,975

TO

IS:5921(PART II)-1973 SPECIFICATION FOR METAL-CLAD BASE MATERIAL FOR PRINTED CIRCUITS FOR USE IN ELECTRONIC AND '

TELECOHMUNICATION EQUIPMENT

PART II PAPER PHENOLIC COPPER-CLAD \ LAMINATED SHEET-PF-CP-CU ECONOMIC GRADE

Alterations

(First L)O@UZ’ , pages I and 3, title) - Substitute ‘CU for ‘Co’.

[Pugs 8, Tabto 2, St Eo. (X),aoZ 51 - Substitute '1 000 M Q Cm, Min' for '1 000 W P, Ming.

[page 20, tit26 of ,XS:5921(Part II),? 19733 - Substitute 'CUJ for 'CW'.

Addendum .

(Pug63 5, atauoe 5.4, Not& 2) - Add the following clause arter the Iota:

'5.4.1 The insulation rcslot~ncc test. as an acceptance te'at shall'be carried out in accordance vlth 5.5.10 of IS:5921

/‘ (Part I)-1970' vithout any conditioning specified in the second para of 5.5.10.3 of IS:5921(Part I)-1970e. Thlm test ia applicable to the sheets of all thlcknesr.'

-‘(ETDC 37) . ’

RtrrLdraphy Unit, ISI, PCV Delkl

.

:,

. % . Y.,.’ ‘-

..’

AHEtiDHEHT NO,“2 .OCTOfiER 1977 -._

.IS:592l(Pa'rt~II)~1973~~~~PECIFICATION FOR .i /METAL-CLAD BASE HATERIAL,'FQR PRINTED:,

. . ..I CIRCUITS -FOR USE IN .ELECTRONIC AND ., % . ~ 'TELECOMMUNICATION /;EQUIPMENT, _.I~._+

COPPER-CLAD LA?fINATED SHEET-FP-CP-Cu ECONOMIC . . :/:

GRADE' for 'PART II PAPER PHENOLIC COPPER- '_: I;;; ,

..:‘:::, CLAD LAMINATED SHEET-PF-CP-CU ECONOMIC GRADE',;' : .;;;.:

, ',.‘* : ". . \: ~ ,I .' + I ',' :

clause l.l;'line.~l) - Substitute '. ~1

.- 'Substitute