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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 1 JB INSTITUTE OF TECHNOLOGY Approved by AICTE, Ministry of HRD, Govt. of India, Affiliated to Uttarakhand Technical University Campus: NH-72, Village Shankarpur, Chakrata Road, Dehradun (UK) Tel.: 0135-269880, 2698896 E-mail: [email protected] Website: www.jbitdoon.com FOR B.TECH[ECE] –VI SEM Student Hand Book

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Page 1: JB INSTITUTE OF TECHNOLOGY: Handbook of B.Tech-ECE_VIth Sem Page 1 JB INSTITUTE OF TECHNOLOGY Approved by AICTE, Ministry of HRD, Govt. of India, Affiliated to Uttarakhand Technical

JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 1

JB INSTITUTE OF TECHNOLOGY

Approved by AICTE, Ministry of HRD, Govt. of India, Affiliated to Uttarakhand Technical University

Campus: NH-72, Village Shankarpur, Chakrata Road, Dehradun (UK) Tel.: 0135-269880, 2698896

E-mail: [email protected] Website: www.jbitdoon.com

FOR B.TECH[ECE] –VI SEM

Student Hand Book

Page 2: JB INSTITUTE OF TECHNOLOGY: Handbook of B.Tech-ECE_VIth Sem Page 1 JB INSTITUTE OF TECHNOLOGY Approved by AICTE, Ministry of HRD, Govt. of India, Affiliated to Uttarakhand Technical

JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 2

Page 3: JB INSTITUTE OF TECHNOLOGY: Handbook of B.Tech-ECE_VIth Sem Page 1 JB INSTITUTE OF TECHNOLOGY Approved by AICTE, Ministry of HRD, Govt. of India, Affiliated to Uttarakhand Technical

JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 3

JB INSTITUTE OF TECHNOLOGY

(Master Academic Policy-Part 1 :: Release Ref No :: December/12 :: Dated 20/12/12 )

[W.e.f.: - 01/01/2013]

Academic Policy for Internal Marks, Theory & Lab Assessments, Attendance,

Projects etc: [Clarification: All Academic rules will be strictly adhered to as per guidelines of the latest Ordinances of

Uttrakhand Technical University, In case any mismatch is observed under any clause, rules of Uttrakhand

Technical University will be final and binding to all.]

Clause (1): Internal Marks Policy: Internal marks in all Theory courses will be allotted on following

basis:-All internal marks for all theory exams first will be awarded out of 100.

[Marks Out of 100 will be awarded as follows:]

Component Total Number

in a Semester

% Marks per

component

Total % Marks

1) Attendance Above 75% 20%

2) Continuous Assessments 5 4 20%

3) Sessional Exams 2 30 60%

Grand Total 100

Appropriate scaling of marks obtained out of 100 will be done according to the corresponding study and

evaluation scheme:-

Clause (2): Attendance Marks: [20 out of 100]

Attendance Policy:

a) No Financial Fine/Penalty etc will be imposed on any student because of attendance issue at

any stage.

b) It is necessary for a student to maintain at least 75% attendance in each theory and practical

subject to be eligible for sitting in the internal exams/university exams.

c) Students will be debarred based on their attendance in individual Theory/Practical subject.

[Clarification- In case student is having above or equal to 75% in some subjects and less than

75% in some subjects, he/she will be debarred only from those subjects where attendance is less

than 75%.]

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 4

d) There is no provision to consider approved leaves in calculating attendance percentage.

Attendance percentage will not increase due to any kind of approved/unapproved

leaves. Prior information is totally a personal issue between the student and the authority to

whom he/she is informing. In case some student is informing to some authority verbal or in

writing about his/her absence that will be considered as ABSENT with prior information. In

no circumstances it may be considered as PRESENT.

e) Relaxations: Students in some cases may be given relaxation upto 15% in attendance

requirement (by the Director) in the circumstances that were beyond the control of the

Students e.g. Medical problems, Natural Disasters at home town of national etc.

f) Balance of 25% of attendance is left to the use of students unforeseen requirements,

attending ceremonies at home/

g) Calculation of Attendance Duration:

1) To be eligible for First Internal Exam: From First day of Teaching of starting of the semester to

last teaching days before the date of First paper of First Internal Exam.

2) To be eligible for Second Internal Exam: Attendance from first day of teaching after the First

Sessional exams to last teaching days before the First paper of Second Internal Exam.

3) To be eligible for University Exam and awarding marks of attendance component: From First

day of Teaching of starting of the semester to last teaching day.

[Clarification- Make up classes for Short attendance students]

For those students who are not able to maintain 75% till last teaching day, Extra make up classes will

be arranged during preparation leaves etc so that students able to achieve 75% attendance to

fulfill the university attendance criterion.

Students who will not be able to obtain 75% attendance even after make up classes will be debarred from the

university exam. Students are advised to maintain their 75% attendance till last teaching day so that

preparation leaves/holidays may be used by them for self preparation.

Clause (3) Policy regarding missing classes due to preparation of technical festivals,

sports week, cultural festivals etc

Student who are helping the institute in preparing the above activities may be granted permission to miss

the classes maximum up to 6 teaching days in a semester subject to following conditions:

1) Their names are approved in advance by the competent authority.

2) They are actively participating in organization of such activities.

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 5

Students those who are participating in such event in some other institutes on behalf of the institute may also

be granted permission to miss the classes maximum up to 6 teaching days subject to following conditions:

3) Their names were approved by the competent authority well in advance.

4) They have submitted the proof of participating in such events.

Attendance calculation for such students will be done after excluding their granted days from total

attendance days. This rectification will be made only at end of the semester.

Clause (4): Continuous Assessment Marks: (Based on Assignments)

a) Continuous Assessment refers to the assessment of the student based on class test & the assignments

submitted by him/her through out the semester.

b) Total 5 Tests Based Assignments (i.e. one TBA per 5th portion of the syllabus) to be given to the students

in a semester. Every Assignment will be of 4 marks and thus total 4 * 5 = 20% Marks out of 100 will be for

such class test/assignments.

c) Following are the guidelines for assignments, their evaluation and their secured accumulation

1. Assignment means a set of work, tasks and/or numerical problems to be given to the student, based on

topics recently covered in the class as homework to be solved and submitted, before a specified date.

Each assignment should require 4 – 6 hours of written work to be done by the student. The Date of

Submission (DOS) will be announced on the Date of Allotment (DOA) to the student.

2. The assignment is to be submitted on or before the DOS as announced to faculty.No late submissions

should be accepted.

3. TBA: The evaluation of an assignment will be done by faulty through a (TBA) test based on the

assignment. The following process must be adopted for the purpose:

(a) On DOS, students will submit the assignment; faculty will randomly decide one question without

telling to the students. He/She will check only that question in all assignments and will identify the

students that have copied the assignments.

(b) Faculty member will clearly mention on assignment “COPIED” or “NOT COPIED”.

(c) On the DOT a test is to be conducted by the faculty member for all that have “NOT COPIED” as

below:

(d) Prepare a test paper with at least three questions based on the assignment, with similar but not the

same problems.

(e) Collect the TBA Sheets from HOD having following format.

(f) Write three questions on board, and allot any one question to the student, ensure that two

consecutive student should not get similar question.

JBIT, Dehradun: TBA: Test Based Assignment No…….

Faculty………………………. Department……………….. School……………….

Subject Code……………….. Subject Name……………. TBA No……………..

DOA…………………………. DOS………………………. DOT…………………

Note: - Attempt only one question that is ticked in your sheet:

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 6

Question No (1)

Question No (2)

Question No (3)

The test has to be administered in the last 15 or 20 minutes of the class. Give student just sufficient time

to solve the problem assuming that they have done the assignment at home.

4. The evaluated assignments/tests are to be shown to the student and are to be retained by the instructor.

All tests/assignments should be retained till the final Internal Marks are displayed to the students. These

may be discarded afterwards. This is to permit randomly checking by designated authority at any

instance.

5. This procedure is to be announced and explained to the students in the very first class. The importance

of TIMELY SUBMISSION of assignments and NOT COPYING should be explained.

6. Copying of the assignment is an example of academic dishonesty for which student must be awarded

ZERO and should not be allowed to appear in TBA.

Clause (5): Proposed Master Pedagogy for Assignments: Assignments must be given to the students

and evaluated as per following pedagogy:-

TBA DOA DOS DOT

1 First Teaching day of the

second week of actual

teaching in that class.

First Teaching day of the

third week of actual

teaching in that class.

Last Teaching day of the

third week of actual

teaching in that class.

2 First Teaching day of the

fourth week of actual

teaching in that class.

First Teaching day of the

fifth week of actual

teaching in that class.

Last Teaching day of the

fifth week of actual

teaching in that class.

3 First Teaching day of the

sixth week of actual

teaching in that class.

First Teaching day of the

seventh week of actual

teaching in that class.

Last Teaching day of the

seventh week of actual

teaching in that class.

4 First Teaching day of the

eight week of actual

teaching in that class.

First Teaching day of the

ninth week of actual

teaching in that class.

Last Teaching day of the

ninth week of actual

teaching in that class.

5 First Teaching day of the

ninth week of actual

teaching in that class.

First Teaching day of the

tenth week of actual

teaching in that class.

Last Teaching day of the

tenth week of actual

teaching in that class.

• DOA – Date of allotment of the assignment to students is to be decided by the faculty member within

specified week. Date of Allotment of the Assignment means when one hard copy of the assignment

has been given to the CR and receiving has been taken from the CR.

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 7

• DOS – Date of Submission means the date on which assignment must be submitted by the student to

the Faculty members.

• DOT- Date of Test means the date on which faculty member is supposed to take the Test Based on

the Assignment.

• Specific dates are flexible and are to be decided by the respective faculty member.

• Once decided, these dates must be mentioned by the respective faculty member in course file

on timely basis well in advance. No deviation is permitted afterwards for any student without

written permission of the HOD.

• In case any student is absent on the DOT, he/she must be awarded as ZERO.

• Student’s failed to submit the assignment by DOS must be awarded ZERO.

.

Clause (6) Sessional Exams:

a) Two internal exams will be conducted by the Institute during the dates mentioned in academic

calendar. Weightage of Internal Exams will be 60% of Total Internal Marks allotted for that subject. If

internal marks in a subject is 50 & external marks is 100 in the theory, then out of 50 internal marks

(50*60%)=30 marks will be for internal Theory(divided as 15+15 for two internal test).

b) All internal exams will be third party test that means HOD has right to change the question

paper at any stage:-

i) Syllabus for specific internal exam will be specified at beginning of the semester.

ii) Ensuring Completion of that portion of the syllabus will be the responsibility of respective faculty

member, HOD and students. Extra lectures may be requested well in advance on off days in case syllabus

is lagging behind.

iii) Question papers for internal exams will usually not be set by the faculty member teaching that

subject in that class.

iv) Evaluation for internal exams will be centralized, within institute premises and time bound during

the dates specified in the academic calendar for so.

v) Scrutiny for the internal exams sheets is mandatory for the students. Students will verify the marks

and sign mentioning “SEEN” on the award sheet.

vi) Student that will miss any internal exam due to any reason will not get any chance to appear in

any kind of Make up Exams etc.

Students must understand that it is necessary to appear and pass in

both internal exams as per university rules.

Clause (7): Laboratory Assessments

(a) It is recommended however not mandatory that wherever possible, Lab files must be published by

the Department/School in standardized format, In some subjects if concept of printed files is not possible,

practice of normal lab files may be followed.

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 8

(b) Internal Marks for Laboratories: Internal marks in all practical labs (except projects) will be allotted

on following basis:

All internal marks for all practical exams first will be awarded out on 100. Appropriate scaling of marks

obtained out of 100 will be done according to the corresponding study and evaluation schemes: [Marks Out

of 100 will be awarded as follows:]

At least 5 experiments will be considered for internal assessment. For each experiment faculty is

supposed to award marks based on following components:

At last of the semester average of these 5 assessments will be internal marks for practical subject.

[Clarification]

In case some student is absent on the day of assessment, he/she must be awarded ZERO for that

practical. Moreover faculty is not bound to inform about the date of assessment in practical lab.

Students must attend all labs as assessment will be in almost in all labs. No makeup can be

arranged for lab assessments irrespective of the reasons/excuses.

(c) Following are the guidelines for the conduct and evaluation of practical in all courses with laboratory

components:

1. A practical is where a student is taken to a laboratory and is asked to perform a set of task on the given

computer, equipment or on a setup comprising of devices or components. This includes on-the-spot

conduct of an activity to derive desired results and to report the findings.

2. A student will have to maintain record of the performance done in the lab in the lab notebook as

prescribed by the Institute/Department.

3. The lab notebook should be maintained in the format of a lab journal, where (in general) the aim of the

experiment, the observations, calculations, results ad discussions are reported. These should not have

any description like ‘method’ etc, unless the method itself is the aim of the experiment.

4. Error analysis forms an essential part of the lab journal.

Component % 100

Conduct/Performance/Execution 50

Written Record

a. Observations

b. Analysis

c. Error Analysis

d. Results and Discussions

20

Viva – Voce 30

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 9

5. A student will be evaluated on every experiment/lab performed. The components of practical

assessment as prescribed above are to be pre-defined, notified to the student and are to be strictly

adhered to.

6. This policy is to be duly announced and explained to the students in the very first lab where the

importance of timely submission of lab reports must be emphasized. The students are also to be

informed about secure retention of Lab Records till last etc.

7. However no marks will be awarded in practical based on attendance, yet student is required to

maintain at least 75% attendance in each practical lab to be eligible for external assessment of the

practical. Moreover student must understand that assessment in going in each lab, absence

means award of ZERO for the lab assessment on that day.

Clause (8) Evaluation of Projects:

(a) Internal Evaluation of projects where the duration is one or more semesters will be governed by

following policy:-

In each semester of a project there shall be three formal evaluations by a group of three examiners

selected from a panel of examiners constituted by the HOD for the purpose. As far as possible, the set of

examiners for each evaluation should be different

1. Each panel will consist of at least three persons (examiners).

2. The following shall be the break-up of weightage amongst the evaluations:

First evaluation (during 3rd week) 20%

Second evaluation (during 7thth week) 30%

Final Evaluation(during 10th week) 50%

3. In each of these evaluations, each examiner will allot marks independently on the following

components:

4. The record of marks allotted by each examiner on each component to for each student will be

maintained (with signatures of each examiner). A photocopy of the same will be deposited with the

HoD, and the original retained by the teacher-in-charge of the course.

5. These original records are to be submitted with the final award list of internal assessment at the end of

the Semester.

Amount of work done 5

Quality of work done 10

Quality of written report/presentation 20

Responses to the questions asked 15

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 10

Each student will prepare an allotted topic, submit a write-up along with project work, and make a

presentation in the class of about 6 minutes, to be followed by about 3 minutes of questions and answers.

The topics and dates of presentation should be assigned right in the beginning of a semester. It is also

mandatory to maintain at least 75% attendance in project labs to be eligible for external assessment.

Clause (9) Evaluation of General Proficiency & Discipline Marks:

Students will be awarded marks in General Proficiency and Discipline by the departments based on

following parameters:

1) His/Her attendance during the Department level activities as mentioned in the academic

calendar. [5 Point per event]

2) His/Her attendance during the Department wise National Level Technical/Management

Festivals. [10 Point per event]

3) His/Her participation in Department level activities as mentioned in academic calendar.

[20 Point per event]

4) His/Her participation in the Department wise National Level Technical/Management

Festivals. [10 Point per event]

5) His/Her involvement in various recognised student event committees formed by various

organizing committees of various cultural/technical/sports festivals.

[15 Points per involvement]

6) Assignment of profile of CR and impartial working done as a CR in the current semester.

[25 Points per Semester]

7) Student’s Special Achievement: [5 to 25 points per achievement to be decided by the

HOD].

Negative awards for G.P. (For every act of in disciplinary behavior/act):-

1) For every occurrence of not wearing proper uniform: [ - 5 Points ]

2) For every late entry in the lecture: [ - 5 Points ]

3) For every late entry in the lab: [ - 5 Points ]

4) For every semesterwise late registration: [ - 5 Points ]

5) For every suspension due to any reason: [ (- 5*Number of suspension days) Points ]

G.P. Marks will be calculated based on the following formula: = (Total Points earned by the students

– negative points) * (Total Marks specified for G.P.)

/ (Maximum Points earned by the any student in that class)

Clause (10) Course File Content: Every Faculty members will maintain the course file for subjects

teaching that must contain the following:

1) Time Table

2) Academic Calendar

3) Syllabus

4) Lecture Plan

5) Previous 3-Years Question Papers

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 11

6) Unit-wise Question Banks/Assignments.

7) Fortnightly course completion review formats.

8) Any other material as instructed by HOD/Director.

Clause (11) Lab Manuals:Every faculty taking labs will ensure availability of updated lab manuals that

must clearly explain the following details for following.

1) University Syllabus of that Lab

2) List of Experiments to be conducted in that lab during current semester.

3) Objective of that each practical.

4) Methods/Steps to be used.

5) Instruments required and their description (if required as per syllabus)

6) Observations to be carried out.

7) Any Remarks etc .

8) Any thing special according to specialization as decided by HOD.

Clause (12) Role of Lab Assistants and Faculty in the Lab:

Role of Lab Assistants/Technicians:

1) To ensure availability of the required equipments before any experiment.

2) To display all the list of experiments and Time scheduling that must be updated.

3) To ensure proper recording of students entry in lab usage Registers.

4) To ensure stock registers updated and monthly audited by Admin Officer.

5) To maintain proper discipline in the labs.

6) To ensure proper safety, security and cleanliness of the instruments and labs.

7) To ensure regular maintenance of the equipments, all equipments must work all the time.

8) To help the students in performing the experiments after demonstration by the faculty members

Role of Teacher in the Lab:

1) To maintain attendance of the students. And informing to HOD/HR-Section/Director about the

students that are absent/irregular in labs.

2) To keep updating own knowledge about the prescribed syllabus, experiment objective, methods etc.

3) To verify display of all the lists of experiments and Time scheduling that must be updated.

4) Demonstration of the practical in detail before bringing students in the lab.

5) Leading smooth conduction of the practical in the lab.

6) Take help of lab assistants after demonstration to some groups of students if teacher is busy with

some group.

7) Ensure handle with care for all instruments.

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8) Generating interest of the students in lab by explaining importance and use in real life.

9) Developing innovative environment among the students by discussing latest market trends related to

that practical.

10) Ensuring availability of updated lab manuals all the time.

Uttrakhand Technical University STUDY AND EVALUATION SCHEME(B.TECH III YEAR) VI SEM ESTER

B.Tech. Electronics Communication and Engineering (Effective from the session: 2012-2013)

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 13

MICROWAVE TECHNIQUES(TEC-601)

UNIT 1

ELEMENTS OF MICROWAVE/MILLIMETER WAVE INTEGRATED CIRCUITS:

classification of Transmission lines: Planar, quasi- planar and 3D structure and their

properties, field distribution and range of application, Transverse transmission the

techniques for multi-dielectric planar structure, Analysis of discontinuities in planar and

non-planar transition line.

UNIT 2

PROPAGATION THROUGH WAVEGUIDES: Rectangular and circular waveguides solution

of wave equation for TE & TM modes, degenerate and dominant modes, power

transmission power loss, Excitation of wave guides , Non existence of TEM mode in

waveguide, Introduction to stripline and Microstrip-line.

UNIT 3

MICROWAVE CAVITY RESONATORS: Rectangular and cylindrical cavities, Quality factor

and Excitation of cavities. Microwave Components: Waveguide couplings, bends and

tourists, Design and circuit realization of filters, couplers, phase shifters, E-plane, H-plane

and hybrid Tees, Hybrid ring wave meters: Isolators and circulators, tunable detectors,

slotted line carriage, VSWR meter.

UNIT 4

MICROWAVE MEASUREMENTS: measurement of frequency, wave length, VSWR,

impedance, Attenuation Low and high power radiation patterns. Limitation of Conventional

active devices at microwave frequency.

UNIT 5

MICROWAVE TUBES: Klystron, Reflex klystron, magnetron, TWT, BWO: principle of

operation and its performance characteristic and application.

SUGGESTED BOOKS:

1. Pozar « Microwave Engineering » 3rd edition, John Wiley (India).

2. Microwave Engg. , Radhakrishna, BSP Publication

3. Collin, R.E. Foundations for Microwave Engineering; TMH 2nd Ed.

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4. Rizzi, Microwave Engineering: Passive Circuits; PHI.

VLSI CIRCUIT DESIGN (TEC-602)

UNIT 1

REVIEW: Current conduction in MOSFET, Electrical Properties of MOS and BiCMOS, The

Pass

Transistor, CMOS.

UNIT 2

CMOS Inverter: Static CMOS inverter, layout, switching threshold and noise margin

concepts and their evaluation, dynamic behavior, power consumption. NMOS MOS pass

transistor inverter.

COMBINATIONAL LOGIC: Static CMOS design, rationed logic, pass transistor logic,

dynamic logic, cascading dynamic gates, CMOS transmission gate logic.

UNIT 3

SEQUENTIAL LOGIC: Static latches and registers, bi-stability principle, MUX based latches,

static SR flip-flops, master-slave edge-triggered register, dynamic latches and registers,

concept of pipelining, Timing issues.

UNIT 4

MEMORY AND ARRAY STRUCTURE: ROM, RAM, peripheral circuitry, memory reliability

and yield, SRAM and DRAM design, flash memory, PLA,PAL, FPGA.

UNIT 5

DESIGN FOR TESTABILITY: Logic Testing, sequential Logic Testing, Guidelines to be

adopted in Design for Test, Scan Designing Techniques, Built-In self Test (BIST)Techniques.

SUGGESTED BOOKS:

1. Basic VLSI Design by D.A. Pucknell & Eshraghian (PHI)

2. Modern VLSI Design Systems on Silicon by Wayne Wolf (Pearson Pub.)

3. R. K. Singh « VLSI DESIGN (With VHDL), Kataria & Sons » , 2nd Edition, 2010.

S. Gandhi / VLSI Fabrication Principles / 2nd ED. John Willey 1994.

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 15

TELECOMMUNICATION SWITCHING SYSTEMS (TEC-603)

UNIT 1

INTRODUCTION: Message switching, circuits switching, functions of a switching system,

registertranslator- senders, distribution frames, crossbar switch, a general trunking.

Transmission Systems, FDM Multiplexing and modulation, Time Division Multiplexing,

Digital

Transmission and Multiplexing: Pulse Transmission, Line Coding, Binary N-Zero

Substitution,

Digital Bi-phase, Differential Encoding, Time Division Multiplexing (T1 carrier system CCIT

and DSlines) Time Division Multiplex Loops and Rings.

UNIT 2

DIGITAL SWITCHING: Switching functions, space division switching, multiple stage

switching, no blocking switches, blocking Probabilities DCS hierarchy, integrated cross

connect equipment, digital switching in environment, zero loss switching.

UNIT 3

TELECOM TRAFFIC ENGINEERING: Network traffic load and parameters, grade of service

and blocking probability, Traffic Characterization: Arrival Distributions, Holding Time

Distributions, Loss Systems, Network Blocking Probabilities: End-to-End Blocking

Probabilities, Overflow Traffic, Delay Systems: Exponential service Times, Constant Service

Times, Finite Queues.

UNIT 4

NETWORK SYNCHRONIZATION CONTROL AND MANAGEMENT: Timing Recovery,

Phase-Locked Loop, Clock Instability, Jitter Measurements, Systematic Jitter. Timing

Inaccuracies: Slips, Asynchronous Multiplexing, Network Synchronization, U.S. Network

Synchronization, Network Control, Network Management.

UNIT 5

DIGITAL SUBSCRIBER ACCESS: ISDN Basic Rate Access Architecture, ISDN U Interface,

ISDN D Channel Protocol. HD-Rate Digital Subscriber Loops: Asymmetric Digital Subscriber

Line, VDSL.Digital Loop Carrier Systems: Universal Digital Loop Carrier Systems, Integrated

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 16

Digital Loop Carrier Systems, Next-Generation Digital Loop Carrier, Fiber in the Loop,

Hybrid Fiber Coax

Systems, Voice band Modems: PCM Modems, Local Microwave Distribution Service, Digital

Satellite Services. DSL Technology: ADSL, Cable Modem, Traditional Cable Networks, HFC

Networks, Sharing, CM & CMTS and DOCSIS. SONET: Devices, Frame, Frame Transmission,

Synchronous Transport Signals,

STS I, Virtual Tributaries and Higher rate of service.

SUGGESTED BOOKS:

1. Tele communication switching system and networks - Thyagarajan Viswanath, PHI,

2000.

2. Digital telephony - J. Bellamy, John Wiley, 2nd edition, 2001.

3. Data Communications & Networks - Achyut. S.Godbole, TMH, 2004.

4. Principles of Communication Systems – H. Taub & D. Schilling , TMH, 2nd Edition, 2003.

5. Telecommunication switching, Traffic and Networks - J E Flood, Pearson Education, 2002

DIGITAL COMMUNICATION (TEC-604)

UNIT 1

ELEMENTS OF DIGITAL COMMUNICATION AND INFORMATION THEORY: Model of a

Digital Communication, System, Probability Theory, Entropy and Information Rate,

Conditional Entropy and Redundancy, Source Coding, Fixed and Variable Length Code

Words, Source Coding Theorem, Prefix free code and, Kraft Inequality, Shannon-Fano and

Huffman Coding.

UNIT 2

DIGITAL BASE BAND TRANSMISSION

PCM Coding, DM, DPCM, ADCM, Data Transfer Rate, Line Coding and Its Properties, NRZ &

RZ

Types, Signalling Format For Unipolar, Polar, Bipolar(AMI) & Manchester Coding Matched

Filter

Receiver, Derivation of Its Impulse Response and Peak Pulse Signal to noise ratio, ISI,

Rectangular, sync & Raised cosine pulse comparison

UNIT 3

DIGITAL MODULATION TECHNIQUES

Gram-Schmidt Orthogonalization Procedure, Hilbert transform, Types of Digital

Modulation,

correlation receiver, Waveforms for Amplitude, Frequency and Phase Shift Keying, Method

of

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 17

Generation and Detection of Coherent & Non-Coherent Binary ASK, FSK & PSK & PSD

derivation

for Coherent & Non-Coherent Binary ASK, FSK & PSK. Differential Phase Shift Keying, bit

error

rate comparison of Digital modulation techniques

UNIT 4

ADVANCED MODULATION TECHNIQUES

Introduction to M-ary modulation techniques 16 PSK, QPSK , QAM , Continuous phase shift

keying , MSK, GMSK. Direct sequence spread spectrum, processing gain Frequency hop

Spread

spectrum.

UNIT 5

ERROR CONTROL CODING

Error Free Communication Over a Noise Channel, Hamming code, Relation Between

Minimum

Distance and Minimum Distance Error Correcting & detection Capability, Linear Block

Codes,

Encoding and Syndrome Decoding, Cyclic Codes, , Encoder and Decoder For Cyclic Codes,

Convolution Coding & Viterbi decoding, introduction to burst error correction codes

SUGGESTED BOOKS:

1. Haykin, Simon / “Communication Systems” / John Wiley / 5th Ed., 2010.

2. Taub & Schilling / “Principles of Communication Systems” / Tata McGraw-Hill /

3. Prokis J.J / “Digital Communications” / Pearson /

4. Charkrabarti, P. / “Analog Communication Systems” / Dhanpat Rai & Co.

5. Communication System, B P Lathi, BSP, Hyderabad

DATA STRUCTURES USING C++ (TCS-607)

UNIT 1

COMPLEXITY ANALYSIS: Time and Space complexity of algorithms, asymptotic analysis,

big O and other notations, importance of efficient algorithms, program performance

measurement, data structures and algorithms.

LINEAR LISTS: Abstract data type, sequential and linked representations, comparison of

insertion, deletion and search operations for sequential and linked lists, list and chain

classes, exception and iterator classes for lists, doubly linked lists, circular lists, linked lists

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 18

through simulated pointers, lists in STL, skip lists, applications of lists in bin sort, radix sort,

sparse tables.

UNIT 2

STACKS AND QUEUES: Abstract data types, sequential and linked implementations,

exception handling in classes, representative applications such as parenthesis matching,

towers of Hanoi, wire routing in a circuit, finding path in a maze, simulation of queuing

systems, equivalence problem.

UNIT 3

HASHING: Search efficiency in lists and skip lists, hashing as a search structure, hash table,

collision avoidance, linear open addressing, chains, uses of hash tables in text compression,

LZW algorithm.

UNIT 4

TREES: Binary trees and their properties, terminology, sequential and linked

implementations, tree traversal methods and algorithms, heaps as priority queues, heap

implementation, insertion and deletion operations, heapsort, heaps in Huffman coding,

leftist trees, tournament trees, use of winner trees in mergesort as an external sorting

algorithm, bin packing.

UNIT 5

GRAPHS: Definition, terminology, directed and undirected graphs, properties, connectivity

in

graphs, applications, implementation – adjacency matrix and linked adjacency chains,

graph

traversal – breadth first and depth first, spanning trees.

SUGGESTED BOOKS:

1. M. T. Goodrich and R. Tamassia, Algorithm Design: Foundations, Analysis and Internet

Examples, John Wiley & Sons, 2001.

2. Drozdek, A., “Data Structures and Algorithms in C++”, Vikas Publishing House. 2002

3. Wirth, N., “Algorithms and Data Structures”, Prentice-Hall of India. 1985

4. Lafore, R., “Data Structures and Algorithms in Java”, 2nd Ed., Dorling Kindersley. 2007

5. Datastructure using C, Bandopadhyaya, “Data Structures, Algorithms, and Applications in

Java”,

WCB/McGraw-Hill. 2001

6. C and datastructure, Padnabham, BSP, Hyderabad

THU-608 PRINCIPLES OF MANAGEMENT

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 19

UNIT 1

INTRODUCTION TO MANAGEMENT: Theories of management: Traditional behavioral,

contingency and systems approach. Organization as a system.

UNIT 2

MANAGEMENT INFORMATION: Interaction with external environment. Managerial

decision making and MIS.

UNIT 3

PLANNING APPROACH TO ORGANIZATIONAL ANALYSIS: design of organization

structure; job design and enrichment; job evaluation and merit rating.

UNIT 4

MOTIVATION AND PRODUCTIVITY: Theories of motivation, leadership styles and

managerial grid. Co-ordination, monitoring and control in organizations. Techniques of

control. Japanese management techniques.

· Minor Project: submission of 15 pages of Case studies on above.

SUGGESTED BOOKS

1. Peter Drucker, Harper and Row: The Practice of Management.

2. Schemerhorn” introduction to Management” 10th edition, John Wiley (India).

3. Staner: Management, PHI Learning.

4. Daft: Principles of Management, Cengage Learning.

SUBJECT: MICROWAVE TECHNIQUES CODE: TEC 601

Topic

Lecture.

No.

Books Page Number

Covered on

Unit-1

ELEMENTS OF

MICROWAVE/MILLIMETER

WAVE INTEGRATED

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 20

CIRCUITS:

classification of

Transmission lines: Planar,

quasi- planar

3D structure and their

properties

field distribution and range

of application

Transverse transmission.

techniques for multi-

dielectric planar structure

Analysis of discontinuities in

planar transition line

Analysis of discontinuities in

Non-planar transition line.

L1

L2

L3

L4

L5

L6

L7

Microwave

devices and

circuits,

third edition,

Samuel

Y.Liao

62-96

Unit-2

PROPAGATION THROUGH

WAVEGUIDES:

Rectangular waveguides

solution of wave equation for

TE & TM modes

circular waveguides solution

of wave equation for TE &

TM modes

degenerate and dominant

modes

power transmission power

loss

Excitation of wave guides

L8,L9

L10-L11

L12

L13

Microwave

devices and

circuits,

third edition,

Samuel

Y.Liao

102-135

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 21

Non existence of TEM mode

in waveguide

Introduction to Stripline

Microstrip-line.

L14

L15

L16

L17

Unit-3

MICROWAVE CAVITY

RESONATORS:

Rectangular and cylindrical

cavities

Quality factor and

Excitation of cavities.

Microwave Components:

Waveguide couplings, bends

and tourists

Design and circuit realization

of filters

couplers

phase shifters

E-plane

H-plane and hybrid Tees,

Hybrid ring wave meters:

Isolators and circulators

Tuneable detectors

slotted line carriage

VSWR meter.

L18

L19

L20

L21

L22

L23

L24

L25

L26

L27

L28

L29

Microwave

devices and

circuits, third

edition, Samuel

Y.Liao

135-160

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 22

Unit-4

MICROWAVE

MEASUREMENTS:

measurement of frequency,

wave length, VSWR,

impedance,

Attenuation

Low and high power radiation

patterns.

Limitation of Conventional

active devices at microwave

frequency.

L30

L31

L32

L33

Microwave

devices and

circuits, third

edition, Samuel

Y.Liao

Unit-5

MICROWAVE TUBES:

Klystron

Reflex klystron

Magnetron

TWT

BWO: principle of operation

its performance characteristic

Application.

L34

L35

L36

L37

L38

L39

L40

Microwave

devices and

circuits, third

edition, Samuel

Y.Liao

335-382

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 23

Topic

Lecture.

No.

Books Page Number

Covered on

UNIT-1

REVIEW:

Current conduction in

MOSFET

Electrical Properties of MOS

and BiCMOS

The Pass Transistor

CMOS.

L1

L2

L3

L4

CMOS

digital

integrated

circuits:

analysis and

design

Sung-Mo

Kang, Yusuf

Leblebici

UNIT-2

CMOS Inverter:

Static CMOS inverter

Layout

switching threshold

noise margin concepts and

their evaluation

Dynamic behaviour

Power consumption.

NMOS MOS pass transistor

inverter.

COMBINATIONAL LOGIC:

Static CMOS design

L5

L6

L7

L8

L9

L10

CMOS

digital

integrated

circuits:

analysis and

design

Sung-Mo

Kang, Yusuf

Leblebici

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 24

rationed logic

pass transistor logic

dynamic logic

cascading dynamic gates

CMOS transmission gate

logic

L11

L12

L13

L14

L15

UNIT-3

SEQUENTIAL LOGIC:

Static latches and registers

bi-stability principle

MUX based latches

Static SR flip-flops

master-slave edge-triggered

register

dynamic latches and

registers

concept of pipelining

Timing issues

L16

L17

L18

L19

L20

L21

L22

L23

Principles

CMOS VLSI

Design

Weste

UNIT-4

MEMORY AND ARRAY

STRUCTURE:

ROM, RAM, peripheral

circuitry

memory reliability and yield

SRAM and DRAM design

L24

L25

L26

Principles

CMOS VLSI

Design

Weste

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 25

flash memory

PLA, PAL, FPGA.

L27

L28

UNIT-5

DESIGN FOR TESTABILITY:

Logic Testing

sequential Logic Testing

Guidelines to be adopted in

Design for Test Scan

Designing Techniques

Built-In self Test (BIST)

Techniques.

L29

L30-L31

L32-L34

L35-L36

L37-L38

Principles

CMOS VLSI

Design

Weste

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 26

SUBJECT: Telecomminication

& switching system

CODE: TEC-603

Topics

Lect. No.

Books

Page

No.

Remark

Unit-I: Introduction

Message switching, circuits

switching, functions of a

switching system, register-

translator-senders,

distribution frames, crossbar

switch, a general trunking.

Transmission Systems,

FDM Multiplexing and

modulation,

Time Division Multiplexing,

Digital Transmission and

Multiplexing: Pulse

Transmission, Line Coding,

Binary N-Zero Substitution,

Digital Bi-phase, Differential

Encoding, Time Division

Multiplexing (T1 carrier system

CCIT and DSlines) Time

Division Multiplex Loops and

J.E.Flood

Thiagarajan

&

viswanathan

Thiagarajan

&

viswanathan

Herbert

taub’s

J. Bellamy,

John Wiley

49-80

331-355

378-379,

175-

179,352

274-278

171-176

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 27

Rings.

Herbert

taub’s

J.E.Flood

279-281

814

220-221

Unit-II: Digital switching

Switching functions, space

division switching, multiple

stage switching, non-blocking

switches, blocking

probabilities DCS hierarchy,

integrated cross connect

equipment, digital switching

in analog environment, zero

loss switching.

Thiagarajan

&

viswanathan

J.E.Flood

J. Bellamy,

John Wiley

J.E.Flood

86

157-173

268,270-

72

188,190

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 28

Unit-III:

TelecomTrafficEngineering

Network traffic load and

parameters, grade of service

and blocking probability,

Traffic Characterization:

Arrival Distributions, Holding

Time Distributions, Loss

Systems, Network Blocking

Probabilities: End-to-End

Blocking Probabilities,

Overflow Traffic,

Delay Systems: Exponential

service Times, Constant Service

Times, Finite Queues.

Thiagarajan

&

viswanathan

Thiagarajan

&

viswanathan

J.E.Flood

J. Bellamy,

John Wiley

273-278,

279-280,

292-304

105-114

530-561

Unit-IV:

NETWORK

SYNCHRONIZATION

CONTROL AND

MANAGEMENT

Timing Recovery, Phase-

Locked Loop, Clock Instability,

Jitter Measurements,

Systematic Jitter. Timing

Inaccuracies: Slips,

J. Bellamy,

John Wiley

335-377

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 29

Asynchronous Multiplexing,

Network Synchronization, U.S.

Network Synchronization,

Network Control, Network

Management.

Unit-V:

DIGITAL SUBSCRIBER

ACCESS

SDN Basic Rate Access

Architecture, ISDN U Interface,

ISDN D Channel Protocol. HD-

Rate Digital Subscriber Loops:

Asymmetric Digital Subscriber

Line, VDSL.Digital Loop Carrier

Systems: Universal Digital Loop

Carrier Systems, Integrated

Digital Loop Carrier Systems,

Next-Generation Digital Loop

Carrier, Fiber in the Loop,

Hybrid Fiber Coax

Systems, Voice band Modems:

PCM Modems, Local Microwave

Distribution Service, Digital

Satellite Services. DSL

Technology: ADSL, Cable

Modem, Traditional Cable

Networks, HFC Networks,

Sharing, CM & CMTS and

DOCSIS. SONET: Devices,

Frame, Frame Transmission,

Synchronous Transport Signals,

J. Bellamy,

John Wiley

496-513

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 30

STS I, Virtual Tributaries and

Higher rate of service

J. Bellamy,

John Wiley

SUBJECT: DIGITAL

COMMUNICATION

CODE: TEC 604

Topic

Lecture.

No.

Books

Page

Number

Coverd

on

Unit-I

ELEMENTS OF DIGITAL

COMMUNICATION AND

INFORMATION THEORY:

Model of a Digital

Communication,

System, Probability Theory,

Entropy and Information

Rate, Conditional Entropy

and Redundancy,

Source Coding,

Fixed and Variable Length

Code

Words, Source Coding

L1

L2

L3

L4

L5

L6

L7

L8

L9

L10

Haykin, Simon /

“Communication

Systems” / John

Wiley / 5th Ed.,

2010.

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 31

Theorem,

Prefix free code

Kraft Inequality

Shannon-Fano coding

Huffman Coding

L11

L12

UNIT 2

DIGITAL BASE BAND

TRANSMISSION

PCM Coding,

DM, DPCM, ADCM,

Data Transfer Rate,

Line Coding and Its

Properties, NRZ &RZ Types,

Signalling Format For

Unipolar,

Polar, Bipolar(AMI)

Manchester Coding Matched

Filter Receiver,

Derivation of Its Impulse

Response and Peak Pulse

Signal to noise ratio,

ISI, Rectangular,

Raised cosine pulse

comparison

L13

L14

L15

L16

L17

L18

L19

L20

.

Communication

System, B P

Lathi, BSP,

Hyderabad

UNIT 3

DIGITAL MODULATION

TECHNIQUES

Gram-Schmidt

Orthogonalization

Procedure,

Hilbert transform,

Types of Digital Modulation,

correlation receiver,

Waveforms for Amplitude,

Frequency and Phase Shift

Keying,

Method of Generation and

L21

L22

L23

L24

Taub & Schilling

/ “Principles of

Communication

Systems” / Tata

McGraw-Hill /

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 32

Detection of Coherent

Non-Coherent Binary ASK,

FSK & PSK & PSD derivation

for Coherent & Non-Coherent

Binary ASK, FSK & PSK.

Differential Phase Shift

Keying, Bit error rate

comparison of Digital

modulation techniques

L25

L26

L27

UNIT 4

ADVANCED MODULATION

TECHNIQUES

Introduction to M-ary

modulation techniques 16

PSK, QPSK , QAM ,

Continuous phase shift

keying , MSK, GMSK.

Direct sequence spread

spectrum,

Processing gain Frequency

hop Spread spectrum.

L28

L29

L30

L31

Charkrabarti, P.

/ “Analog

Communication

Systems” /

Dhanpat Rai &

Co.

UNIT 5

ERROR CONTROL CODING

Error Free Communication

Over a Noise Channel,

Hamming code,

Relation Between Minimum

Distance and Minimum

Distance Error Correcting

detection Capability,

Linear Block Codes,

Encoding and Syndrome

Decoding,

L32

L33

L34

L35

L36

Haykin, Simon /

“Communication

Systems” / John

Wiley / 5th Ed.,

2010

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 33

Cyclic Codes, , Encoder and

Decoder

Cyclic Codes,

Convolution Coding

Viterbi decoding,

Introduction to burst error

correction codes

L37

L38

L39

L40

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 34

SUBJECT: PRINCIPLES OF

MANAGEMENT

CODE: THU-608

Unit Topic Lecture

No

Book Page No

1 INTRODUCTION TO MANAGEMENT:

Theories of management: Traditional

behavioral

contingency and systems approach

Organization as a system.

L1

L2-L3

L4-L5

L6-L7

LM Parsad

LM Parsad

2 MANAGEMENT INFORMATION:

Interaction with external environment

Managerial decision,making

and MIS.

L8-L9

L10-L11

L10-L12

L13-L14

LM Parsad

LM Parsad

3 PLANNING APPROACH TO

ORGANIZATIONAL ANALYSIS:

design of organization structure;

job design

and enrichment

L15-L16

L17-L20

L21

L22-L24

Dr. Neeru

Vasishth

Dr. Neeru

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 35

job evaluation

and merit rating.

L25-L27

L28-L29

Vasishth

LM Parsad

4 MOTIVATION AND PRODUCTIVITY:

Theories of motivation

leadership styles

managerial grid

Co-ordination

Monitoring

control in organizations

Techniques of control

Japanese management techniques.

L30-L32

L34

L35-L38

L39-L40

L-41

L-42

L-43

L-44

L-45

Dr. Neeru

Vasishth

LM Parsad

LM Parsad

LM Parsad

LM Parsad

Question bank of Microwave

Q1 Compare the multi-cavity klystron, reflex klystron, magnetron and Traveling wave tube

on

the basis of their

a) Basic construction

b) Operation

c) Applications

Q2 Explain how the oscillations are sustained in cavity magnetron with suitable sketches

assuming that the _ mode oscillations already exist.

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 36

Q3 What are the various UHF limitations of vacuum tubes which limit their use at high

frequencies? Describe each of these in detail and suggest remedial measures.

Q4 Distinguish between velocity modulation and current modulation.

Q5 what is Hull cut off field?

Q6 What is phase focusing effect in magnetron?

Q7 What is a slow wave structure and why is it required?

Q8 What are reentrant cavities?

Q9 What is the purpose of strapping in magnetron?

Q10 What is electron bunching? How does it occur? Why is it also called intensity

modulation?

Q11 Explain the construction and working of a multicavity klystron.

Q12 Describe the _-mode of operation of magnetron. Discuss bunching phenomenon as

well.

Draw neat diagrams wherever required.

Q13 Elaborate the concept of velocity modulation, current modulation and bunching with

reference to klystron (two cavity)

Q14 What is Hull-voltage in a magnetron?

Q15 In what type of application reflex klystron is preferred & why?

Q16 List two discriminations between conventional tube and microwave tube

.

Q17 What do you understand by self-consistent modes?

Q18 What is repeller protection & why is it required?

Q19 What is the need of slow wave structure in TWT?

Q20 Justify the names-control grid, screen grid, suppressor grid.

Q21 what is transit time? Why it becomes a limiting factor at lug her frequencies?

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JBIT-Dehradun:: Handbook of B.Tech-ECE_VIth Sem Page 37

Q22 Discuss different types of vacuum tubes in lieu of their strengths and weakness.

Q23 What can be the possible solutions to the limitations of conventional tubes at high

frequencies? Which one is the best?

Q24 Elaborate the principle of working of Klystron.

Q25 Why are multicavity klystron and reflex klystron used for entirely different

application?

Q26 A two cavity klystron amplifier has the following parameters:

V0=1000V, R0=40Kohm, I0=25mA, Freq=3GHz,

Gap-spacing (d) =1mm, cavities-spacing=4cm, Effective shunt impedance, excluding beam

loading=30K ohm.

a) Find the input gap voltage to give maximum voltageV2.

b) Find the voltage gain and efficiency of the amplifier neglecting the beam loading.

Q27 Why a microwave is called” Microwave”?

Q28 What is the frequency range of microwave? What limits the frequency of microwaves?

Q29 Write down the different bands in microwave range along with corresponding

frequencies.

Q30 Enlist the advantages of microwave frequencies over lower frequency waves.

Q31 Make a list of important applications and the corresponding characteristics of

microwave.

Q32 In which case the wavelength of the propagating microwave is greater, when it is

moving through a medium having dielectric constant=2.0 or when moving through air?

Calculate the difference of wavelength.

Q33 If a microwave having frequency 10GHz is moving out with speed of light, calculate the

corresponding wavelength.

Q34 Write a brief history of development of microwave technology.

Q36 What is frequency pulling in case of magnetrons?

Q37 List various methods of beam focusing in TWT’S

Q38 What is Velocity Modulation?

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Q39 Describe the excitation of cavities.

Q40 What is microwave transition?

Q41 Ordinary low frequency circuit analysis is not adequate to describe the electrical

phenomenon-taking place at microwave frequencies, why?

Q42 Discuss the problem of transit time effect in tubes at microwave frequencies?

Q43 Why are semiconductors preferred over vacuum tubes in most applications?

Q44 Derive an expression for maximum possible theoretical efficiency of a two cavity

klystron.

Q45 Explain the significance of Hull voltage in a magnetron.

Q46 Explain the principle of working of Travelling wave tube.

Q47 Find out the expression for efficiency of two cavity Klystron amplifier.

Q48 Explain with neat diagrams the following in a Magnetron:

a) Resonant Modes and their separation

b) Mechanism of Oscillation.

Q49 What do you understand by current modulation

Q50 In what type of applications reflex klystron is preferred & why?

Q51 List at least two discriminations between Klystron & TWT’s.

Q52 Discuss problem of inter electrode capacitance & lead inductance of wave frequencies.

Q53 Discuss principle of TWT along with neat sketch?

Q54 Derive an expression for maximum possible theoretical efficiency of a reflex Klystron.

Q55 List two advantages of using Microwave frequency over low frequency?

Q56 Define Transit time effect.

Q57 What is the basic difference between TWT and Magnetron?

Q58 Why at microwave frequency we talk of traveling waves with associated powers

instead of

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voltages and currents?

Q59 What is velocity modulation? How is it different from normal modulation? Explain how

velocity modulation is utilized in klystron amplifier.

Q60 What are slow wave structures? Explain how a helical TWT achieve amplification.

MICROWAVE SEMICONDUCTOR DEVICES

Q1. State square law of diode. Which diode exhibits this law?

Q2. Although PIN diode doesn’t exhibit negative resistance effect yet it is a very important

device at microwave frequencies. Justify.

Q3 Give the construction, working and applications of PIN diode.

Q4 Compare the main features of PIN diode and Tunnel diode.

Q5 What is Gunn effect? Explain this phenomenon using two-valley theory.

Q6 How IMPATT diode is different from all other active diodes?

Q7 Explain the operation of IMPATT diode aided by various diagrams.

Q8 Explain the basic requirements of tunneling phenomenon in Tunnel diode.

Q9 Describe briefly the quenched and delayed modes of oscillation in Gunn diode. Which

mode is more suitable and why?

Q10 What is tunneling effect? Explain the construction & working of the device, which uses

this effect, with the help of sketches. Discuss its V-I characteristics also.

Q11 Explain several modes of operation of Gunn diode with the keep of sketches.

Q12 How negative resistance is achieved in IMPATT?

Q13 What’s Gunn effect?

Q14 Compare transistors and Transfer Electron Devices (TED’S).

Q15 How depletion layer is formed in PIN diode at zero bias?

Q16 Give advantages and disadvantages of IMPATT diode.

Q17 Write down basic requirements for two-valley theory of Gunn diode.

Q18 Why FETs are preferred over Bipolar transistors at highest frequencies?

Q19 Describe the construction and operation of a PIN diode as a switch.

Q20 Explain the V-I characteristics of a Gunn diode.

Q21 Explain the use of PIN diode as a modulator.

Q22 Why FET’s are preferred over bipolar transistors at high frequencies?

Q23 What is the main advantage of using Gunn diode over IMPATT diode?

Q24 Discuss applications of PIN diode as a phase shifter.

Q25 Explain Gunn effect using two-valley theory? Also explain several modes of operation

&

applications of Gunn diodes.

Q26 What is Avalanche transit time Devices?

Q27 List advantages of using Gunn diodes over IMPATT diodes.

Q28 What is the basic difference between IMPATT and TRAPATT diodes?

Q29 Describe how a tunnel diode can be used as an amplifier and as an oscillator with the

necessary circuit diagrams?

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Q30 What are the applications of Tunnel diode?

Q31 Explain the physical description of read diode and the avalanche multiplication

process.

Q32 Discuss the principle of negative resistances in IMPATT diode.

Q33 Explain power output and efficiency of IMPATT diode.

Q34 How is TRATATT diode different from IMPATT diode?

Q35 What are PIN Diodes? Where are they after used? Why?

Q36 Explain the use of Pin diode as a transmit/receive switch.

Q37 What are BARITT diodes?

Q38 What is the principle of operation of BARITT diode?

Q39 How is negative resistance effect of tunnel diode used in oscillators?

Q40 What do you understand by mode jumping in a magnetron?

Q41 Differentiate between a strapped and unstrapped magnetron.

Q42 Explain frequency pushing and pulling in context of magnetron.

Q43 Explain domain formation in Gunn effect devices.

Q44 What are the various frequency modes in which Gunn effect oscillator can be made to

oscillate? Explain each mode in detail.

Q45 Which microwave diode is suitable at low frequencies and why?

Q46 What happens to the performance of PIN diode above 100 MHz?

MICROWAVE MEASUREMENTS AND COMPONENTS

Q1 Describe briefly the equipment to measure impedance using slotted line.

Q2 What are non-reciprocal phase shifters? How do they differ from reciprocal phase

shifters?

Q3 What is a directional coupler? Give the construction of 2-hole directional coupler.

Q4. Give the relationship between reflection coefficient and VSWR.

Q5. What are the values of reflection coefficient and VSWR in the following cases?

ii) Termination is perfectly matched

iii) Termination is a short circuit

iv) Termination is an open circuit

Q6. What are ferrites?

Q7 What is Faradays rotation? Give the construction and working of devices based on this

phenomenon.

Q8 What are the various methods of impedance matching?

Q9 Why is hybrid Tee also called magic Tee?

Q10 Why is it named magic tee also? Give construction and working in detail.

Q11 Why are resonators of irregular shape?

Q12 Write the principle of attenuator.

Q13 Differentiate reciprocal & nonreciprocal phase shifter.

Q14 What is a phase shifter? Explain its construction and principle of operation.

Q15 Differentiate E-plane Tee & H-plane Tee.

Q16 Give principle of working of resonator.

Q17 Differentiate Transmission line from wave-guides.

Q18 What is Smith chart? What is its application?

Q19 A (200+j75) Ohm load is to be matched to a 300 ohm line to give SWR=1. Calculate the

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reactance of the stub and the characteristic impedance of the quarter wave transformer,

both connected to the load.

Q20 Calculate the length of a short-circuited line required to tune out the susceptance of a

load

whose Y=(0.004-j0.002) S, placed on an air-dielectric transmission line of characteristic

admittance Y=00.0033S,at a frequency of 150 MHz.

Q21 A load ZL=(100-j50) ohm is connected to a line whose Z0=75ohm.Calculate

a) The point nearest to the load, at which a quarter wave transformer may be inserted

to provide correct matching.

b) The ZO of the transmission line to be used for the transformer.

Q22 A series combination having an impedances = (450+j600) ohm at 10 MHz is connected

to

a 300ohm line. Calculate the position and length of a short-circuited stub designed to

match this load to the line.

Q23 A quarter wave transformer is connected directly to a 50ohm load, to match this load

to a

transmission line who’s Z0=75ohm.What must be the characteristic impedance of the

matching transformer?

Q24 Calculate the length of a piece of 50ohm open-circuited line if its input admittance to

be

j80x10-3 S.

Q25 With the aid of a smith chart, calculate the position and length of a short-circuited stub

matching a (180+j120) ohm load to a 300ohm transmission line. Assuming that the load

impedance remains constant, find the SWR on the mainline when the frequency is (a)

increased by 10% (b) doubled.

Q26 What is Directional coupler? Give construction of 2-hole directional coupler.

Q27 The input power in a two hole directional coupler is 1mW. The coupler has a coupling

factor of 15 db and a directivity of 30 db. Calculate the power in all the ports.

Q28 A symmetric directional coupler with infinite directivity and a forward attenuation of

20db

is used to monitor the power delivered to a load. Bolometer 1 introduces a VSWR of 2on

arm 4and bolometer 2 is matched to arm3. If bolometer1 reads 8mwand bolometer2reads

2mW, find (a) the amount of power dissipated in ZL (B) VSWR on arm2.

Q29 List the properties of ferrites that make them useful in construction of isolator’s and

circulators.

Q30 Why TEM waves cannot be propagated in wave-guides?

Q31 Why rectangular waveguides are preferred over circular waveguides in some

applications?

Q32 What is magic Tee and why E-H plane is named as magic Tee?

Q33 Calculate the ratio of crossection of circular waveguide to that of a rectangular one if

each

is to have same cutoff wavelength for its dominant mode.

Q34 Discuss the behaviour of ferrites in isolators and circulators.

Q35 Explain the working of H-plane Tee.

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Q36 Explain the parameters of Smith Chart.

Q37 Explain Double stub matching.

Q38 Explain the principle of working of probes and loops.

Q39 A 5 dB waveguide attenuator is specified as having VSWR of 1.4. Assuming that it is

reciprocal, calculate the scattering parameters.

Q40 Define coupling factor& Directivity in case of a directional coupler.

Q41 Explain the principle of working of a Rectangular waveguide resonator.

Q42 Explain the principle of working of the following:

(a) Microwave Switch

(b) Microwave Phase Shifter.

Q43 Calculate the coupling factor and transmission factor of a 30 dB directional coupler.

Q44 List various Electronic & mechanical techniques used for measurements at microwave

frequencies?

Q45 Why TEM waves cannot be propagated in wave-guides?

Q46 List various methods that are used to carry out measurement of Low. Medium & high

microwave power.

Q47 What is the main use of coupling probes & coupling loops in wave-guides?

Q48 Calculate ratio of cross-section of circular wave-guides to that of rectangular one of

each

is to have same cut off wavelength for its dominant mode?

Q49 What is VSWR & reflection Coefficient? Discuss the measurement of low, medium &

high VSWR?

Q50 Define Faraday’s rotation and also tell any device based on faraday’s rotation.

Q51 What is a Rat-race junction?

Q52 Explain how impedance can be measured using slotted line method.

Q53 Discuss methods for measurement of low and high microwave power.

Q54 Compare practical advantages and disadvantages of circular wave-guides with those of

rectangular wave-guides.

Q55 What are cavity resonators? What applications do they have? Why do they normally

have

odd shapes?

Q56 Write notes on the following:

a) Probes and loops

b) Circulators and Isolators.

Q57 Discuss the quality factor& cavity resonators.

Q58 Discuss microwave bends, twists and corners.

Q59 What is matched load?

Q60 What is an E-Plane Tee?

Q61 Explain hybrid ring.

Q62 Why are attenuators needed? Why they are not a trivial part of the test setup?

Q63 Differentiate b/w fixed and variable attenuators.

Q64 Discuss insertion loss and attenuation measurement.

Q65 Show that theoretical efficiency of reflex Klystron is 27.78%.

Q66 What is a BWO? Explain its performance characteristics.

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Q67 What are the applications of BWO?

Q68 Explain the function of magic Tee as a duplexer.

Q69 Explain the function of magic Tee as a mixer.

Q70 Differentiate between primary and secondary waveguides.

Q71 Explain the following terms in context of directional couplers:

a) Coupling factor

b) Directivity

c) Isolation

Question bank of VLSI

Unit-1

1.(a) What is body affect? Discuss different parameters on which threshold voltage

depends?

(b) Determine Zpu to Zpd ratio for nMOS inverter driven through one or more pass

transistor?

2.(a) Discuss the gate source and gate drain capacitance of an nFET.

(b) Calculate the gate capacitance of an nFET with following parameter. W=8μm, L=0.5μm,

Cox = 3.45 × 10−7F/cm2.

3.(a) Clearly explain the body effect of a MOS FET.

(b) Clearly explain channel length modulation of a MOS FET.

4.(a) With neat sketches, explain the transfer characteristic of a CMOS inverter.

(b) Derive an equation for Ids of an n-channel enhancement MOSFET operating in

saturation region.

5.(a) Explain the operation of BiCMOS inverter? Clearly specify its characteristics.

(b) Explain how the BiCMOS inverter performance can be improved.

6.(a) A CMOS inverter is built in a process where k’n=100μA/V2, Vtn=+0.7V, k'p =42 μA/V2

, Vtp=-0.8V, and a power supply of VDD =3.33V is used .Find mid point voltage VM if

(W/L)n =10 and (W/L)p= 14.

(b) Discuss the CMOS invertors transfer characteristics

7.(a) Find gm for an n-channel transistor with Vgs=1.2V: Vtn =0.8V; (W/L) = 10; μnCox =

92μA/V2.

(b) Define the term threshold voltage of MOSFET and explain its significance

8. (a) Derive an equation for Transconductance of an n channel enhancement MOS-FET

operating in active region.

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(b) A PMOS transistor is operated in triode region with the following parameters. VGS= -

4.5V, Vtp= -1V; VDS=-2.2 V, (W/L) =95,

μnCox =95μA/V2. Find its drain current and drain source resistance.

9.(a) Derive an equation for Ids of an n channel enhancement MOSFET operating in

saturation region.

UNIT-2 ,3

1. Design a stick diagram for two input n-MOS NAND and NOR gates.

2. What is a stick diagram and explain about different symbols used for components in stick

diagram. 3. Draw the stick diagram and layout for

(a) NMOS inverter.

(b) P-Well CMOS inverter.

4. Draw the stick diagram and layout for

(a) NMOS inverter.

(b) P-Well CMOS inverter.

5.(a) Draw the following transistors using lambda based design rules

i. NMOS enhancement

ii. NMOS depletion

iii. PMOS enhancement.

(b) Discuss the design rules for wires (both NMOS and CMOS) using lambda based design

rules. 6. Design a stick diagram and layout diagram for the CMOS logic shown below

___________

Y = (A + B) (C + D).

7. (a) what is a stick diagram? Draw the stick diagram and layout for a CMOS inverter.

(b) What are the effects of scaling on Vt?

(c) What are design rules? Why is metal- metal spacing larger than poly -poly spacing.

8.(a) what is a stick diagram? Draw the stick diagram and layout for a CMOS inverter.

(b) What are the effects of scaling on Vt?

(c) What are design rules? Why is metal- metal spacing larger than poly –poly spacing. 9.

Explain the following

(a) Double metal MOS process rules.

(b) Design rules for P- well CMOS process

10. (a) Discuss the rule for n well and VDD and Vss contacts (2μm CMOS).

(b) Discuss the rule for pad and over glass geometry (2μm CMOS).

UNIT - 4

1. (a) Explain the methods of programming of PAL CMOS device.

(b) Draw and explain the architecture of an FPGA

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2. (a) What are different classes of Programmable CMOS devices? Explain them briefly.

(b) What is the basis for standard-cell? What are basic classes of circuits for Library cells?

3. (a) What are the advantages and disadvantages of the reconfiguration.

(b) Mention different advantages of Anti fuse Technology.

4. Using PLA Implement Full-adder circuit.

5. (a) Compare the Antifuse and Vialink programmable interconnections for PAL devices.

(b) What are different typically available SSI Standard-cell types and compare them.

6. (a) Draw the diagram of programmed I/O pad and explain how the antifuses are used in

this.

(b) Draw and explain the AND/OR representation of PLA.

7(a) what are the differences between a gate array chip and standard-cell chip? What

benefits does each implementation style have?

(b) Write the equations for a full adder in SOP form. Sketch a 3-input, 2- output PLA

implementing this logic

8. (a) Draw the typical architecture of PAL and explain the operation of it.

(b) What is CPLD? Draw its basic structure and give its applications.

9. (a) Draw and explain the Antifuse Structure for programming the PAL device.

(b) Explain how the I/O pad is programmed in FPGA.

10. (a) What are different classes of Programmable CMOS devices? Explain them briefly.

(b) What is the basis for standard-cell? What are basic classes of circuits for Library cells?

11.(a) Draw the typical standard-cell structure showing regular-power cell and explain it.

(b) Draw and explain the pseudo-nMOS PLA schematic for full adder and what are the

advantages and disadvantages of it.

12. (a) What are the characteristics of 22V10 PAL CMOS device and draw its I/O structure.

(b)Explain any one chip architecture that used the antifuse and give its advantages

13. (a) Draw a self timed dynamic PLA and what are the advantages of it compared to

footed dynamic PLA.

(b) Explain the tradeoffs between using a transmission gate or a tristate buffer to

implement an FPGA routing block.

14. Draw the structure, explain the function and write the applications characteristics of

the following programmable CMOS devices:

(a) PLA

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(b) PAL

(c) FPGA

(d) CPLD

15.(a) Draw the typical standard-cell structure showing low-power cell and explain it.

(b) Sketch a diagram for two input XOR using PLA and explain its operation with the help of

truth table.

UNIT-5

1 .(a) Mention the properties of the twin oxide.

(b) Clearly explain about ION implantation step in IC fabrication.

2. Explain about the following two oxidation methods.

(a) High pressure oxidation.

(b) Plasma oxidation.

3. With neat sketches explain Atmospheric-pressure chemical vapor deposition method

4. Explain about the following Die bandings.

(a) Eutectic die bonding

5. (a) Explain different fault models in detail.

6. (a) Explain how function of system can be tested.

(b) Explain any one of the method of testing bridge faults.

(c) What type of faults can be reduced by improving layout design?

7. (a) Why the chip testing is needed? At what levels testing a chip can occur?

(b) What is the drawback of serial scan ? How to overcome this?

(c) What is the percentage fault coverage? How it is calculated

8. (a) Explain the gate level and function level of testing.

(b) A sequential circuit with in? inputs and ‘m’ storage devices. To test this circuit how

many test vectors are required.

(c) What is sequential fault grading? Explain how it is analyzed.

9. Explain the following with respect to CMOS testing:

(a) ATPG

(b) Fault simulation

(c) Statistical Fault Analysis

(d) Fault Sampling.

10.(a) Explain how the cost of chip can effect with the testing levels,

(b) Explain how observability is used to test the output of a gate within a larger circuit.

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(c) How the Iterative Logic Array Testing can be reduced number of tests

12.(a) What type of defects are tested in manufacturing testing methods?

(b) What is the Design for Autonomous Test and what is the basic device used in this?

(c) What type of tests are used to check the noise margin for CMOS gates?

13.(a) Explain the manufacturing test of a chip with suitable examples.

(b) Explain how an Ad-hoc test technique used to test long counters. November 2008 set4

14.(a) Explain the gate level and function level of testing.

(b) A sequential circuit with n inputs and ‘m’ storage devices. To test this circuit how many

test vectors are required?

(c) What is sequential fault grading? Explain how it is analyzed.

15.(a) Why stuck-at faults occur in CMOS circuits? Explain with suitable logical diagram

and layout.

(b) Draw a schematic for a CMOS edge-sensitive scan-register and also draw some circuit

level diagrams of its implementation.

16.(a) Explain how function of system can be tested.

(b) Explain any one of the method of testing bridge faults.

(c) What type of faults can be reduced by improving layout design?

17.(a) Explain the functionality test of a chip with suitable examples.

(b) What are the categories of Design for testability? Explain them briefly

18.(a) Explain the gate level and function level of testing.

(b) A sequential circuit with ?n? inputs and ‘m’ storage devices. To test this circuit how

many test vectors are required.

(c) What is sequential fault grading? Explain how it is analyzed

19.(a) Explain the gate level and function level of testing.

(b) A sequential circuit with ?n? inputs and ‘m’ storage devices. To test this circuit how

many test vectors are required.

(c) What is sequential fault grading? Explain how it is analyzed

20.(a) Explain how the cost of chip can effect with the testing levels,

(b) Explain how observability is used to test the output of a gate within a larger circuit.

(c) How the Iterative Logic Array Testing can be reduced number of tests.

21.(a) Explain how the cost of chip can effect with the testing levels,

(b) Explain how observability is used to test the output of a gate within a larger circuit.

(c) How the Iterative Logic Array Testing can be reduced number of tests.

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Question Bank of Telecommunication switching system

Unit-1

1. Give the classifications of switching systems. Compare manual exchange and

automatic exchange.

2. In what way is stored program control superior to hard-wired control?

3. Draw the elements of a switching system and trunking diagram and explain its

function.

4. In Strowger exchanges a call may be blocked even though an appropriate path

through the Switch Exists, Explain how can this happen?

5. With the help of suitable diagram describe the working of a Crossbar Exchange.

6. Describe the working of a rotary switch. Differentiate between forward and reverse

acting.

7. State the design parameters for designing strowger switching system.

8. Draw the trunking diagram of 1000-line exchange.

9. Draw the block diagram showing the organization of crossbar exchange and briefly

explain the operation.

10. Why is Electronic Exchange alone suitable for digital Telephony? Explain.

11. Compare the switching Technique used in PSTN.

12. List six events that may occur in a telephone system and the corresponding actions

that may have to be taken by the common control system.

13. A busy tone does not imply that the called party is actually engaged in a

conversation .Explain.

14. Show that the harmonic frequencies of any two adjacent base frequencies in DTMF

telephone cannot match within the first 15 harmonics.

15. If the transmitted power of low band frequency signal from a DTMF Telephone is 1

mW, what should be power in mW of the high band frequencies?

16. What do you understand by blocking and non-blocking model of telephone traffic?

Draw N X N three stage switching network.

17. Find the delay in sending an X bit massage over a K hop path in a circuit switched

network. The circuit setup is ‘S’ second, the propagation delay is D sec. per hop, the

packet size is P bits and the data rate is B bps.

18. A crossbar exchange is required to set-up 5000 calls in the busy hour. The marker

holding times may be assumed to be exponentially distributed with an average

holding time of 0.5 sec. find the number of markers required. UTU(2009-10)

19. For local calls , a telephone exchange operates the calling customer’s meter

once,when the called customer answers. There is fee of one unit (u) for all local calls.

The average duration h of a local call is 3 minutes. It can be assumed that the

probability of duration of a call. T exceeding time t is given by P(T≥t)=e^-t/h. if

auto-ticketing is introduced then call charges are proportional to its duration. What

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should be the fee per minute to get the same local call revenue as with periodic–

pulse metering? . UTU(2009-10)

20. Write about the synchronous digital transmission in detail. . UTU(2009-10)

Unit -2

1. With the help of neat diagram explain the operation of TSI.Compare TSI with

space Switching.

2. Consider 3 stage crossbar switch system with 1000 input and 1000 output lines.

It is nonblocking. For an optimum design, what is the total number of cross

points required? How many array are needed for each stage?

3. For a TST switch with a single stage space switch determine the number of cross

points and the total number of memory bits required if the number of lines is 32,

number of channel per frame is 30 and time expansion is 2.

4. How many times slot interchange modules are need for an STS switch with 128

primary TDM signals of 30 voice channels per input? Assume blocking to be less

than .002and the loading is .2 Erlang per channel and determine the complexity

of the switch.

5. What are Re-arrangeable networks ? Explain partial connection multi-stage

networks?

6. Draw and explain the full connection multistage network.

7. Design a 2-stage network .using switch modules of size 10×10,suitable for

connecting 200 incoming trunks to 200 outgoing trunks . the outgoing trunks

serve ten routes with 20 trunks on each route. How many switch modules are

needed?

8. Since bit of storage are much cheaper then cross points , an approximate

measure that has been proposed for comparing the relative costs of networks is

the complexity defined as :

Complexity= Nc+Nb/100

When Nc = no. of space stages cross points.

Nb= No. of bits of memory.

Compare the complaxities of the S-T-S network with T-S-T network

Unit -3

1. A group of 20 trunks was found to have ten trunks engaged at 10 am, 15 at

10.10 am and 16 at 10.20 am and 11 at 10.30 am. Calculate the average traffic

intensity during this period.

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UTU( 2009-10)

2. 10 E of traffic is offered to switches that hunt sequentially over a group of

trunks . estimate the traffic carried by each of the first three trunks.

UTU( 2009-10)

3. Sketch a fully inter-connected 3 stage network for the same number of

incoming and outgoing Trunks , using 3×4 switches in the primary stage and

4×4 switches in the tertiary stage. How many cross points are needed?

UTU( 2009-10)

4. What do you understand by blocking and non blocking model of a telephone

traffic?

In a group of 100 poisson sources, each one generates message at the rate of

one in every 20 second to a single line. If the line rate is 1200bits/second

and average message length is 200bits. find the probability of message entering

the queue.

5. A PABX provides queuing and automatic call back facility for outgoing calls.If

these are 20 outgoing calls request per hour and if average call duration is 3

minutes, how many trunks are needed to ensure delay less than 30 minutes for

90% of request.

6. During a 2 hour busy period,2400 calls arrive at an exchange. Average holding

time per call is two minutes. What is the traffic load in erlangs and in CCS?

7. Compare Lost Calls Held System (LCHS), against delay systems. A Time

Assigned Speech Interpolation (TASI) System has 10 channels and 20 sources

connect to it . What is the clipping probability if the activity factor for each

source is .4?

8. An exchange serves 2000 subscribers. If the average BHCA is 10,000 and the

CCR is 60%, calculate the busy hour calling rate?

9. A PABX which is designed to be nonblocking internally serves 100 extensions

and has four trunk lines. Busy hour calling rate is two. Thirty per cent of the

total traffic is external. Average call duration is three minutes, how many trunks

are needed to ensure delays less than 30 minutes for 90 percent of the

requests?

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10. A public call office is installed in a busy part of a town .150 persons use the

booth everyday.

The average holding time for a call is 1.5 minutes. There is a suggestion from

the public that another PCO is required in the same locality as the wait times

are unduly long . Analyse the situation using M/M/1 queue and determined if

the suggestion deserves serious consideration.

Unit -4

NETWORK SYNCHRONIZATION CONTROL AND MANAGEMENT

1. List out the main sources of clock instability in a network.

2. Why LPF not used in PLL?

3. What are the elements and advantages of elastic store?

4. How to produce systematic jitter?

5. Define slips.

6. How to control the uncontrolled slips?

7. Define pulse stuffing.

8. Define the term asynchronous.

9. List out the features of pulse stuffing.

10. Draw the diagram of M12 multiplexer?

11. What is meant by waiting time jitter?

12. List out the six basic approaches of synchronizing digital network.

13. What is meant by master-slave synchronization?

14. Explain main purpose of state transition diagram?

15. Define protocol.

16. Explain the following:

a. Time Recovery

b. Clock instability

17. Explain the concepts of Elastic stores.

18. Explain the concepts of Slips.

19. Explain in detail about Asynchronous multiplexing.

20. Write short notes on network Synchronization?

21. Explain the concepts of network control?

22. Explain the concepts of network management.

Unit -5

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DIGITAL SUBSCRIBER ACCESS

1. How to standardize the ISDN network?

2. List out the features of ISDN B channel.

3. List out the features of ISDN D channel.

4. Define NT1.

5. Define NT2.

6. What is meant by ping-pong transmission?

7. List out advantage and disadvantage of TCM transmission.

8. Define D channel protocol.

9. Give short notes on PRS source.

10. Write short notes on clock recovery.

11. What are the disadvantages of LMDS?

12. Draw the diagram of down stream V.90 modem concept.

13. Explain main attraction of PCM modems.

14. Write short notes on digital satellite services.

15. Explain the concepts of Integrated Services Digital Network.

16. Describe the conceptual view of high data rate digital subscriber loops.

17. Explain the concepts of digital loop carrier system.

18. Describe the conceptual view of hybrid fiber coax systems.

19. Explain the concepts of PCM modems.

20. Write notes on a) Address structure of ISDN . b) ISDN service characterization

21. A telephone company is required to give connections to a few subscribers located at a

distance of 15 km from its nearest exchange. Discuss the various design options .

22. In a TS switch M=128,N=16 and the number of subscribers connected to the system in

0.1MN. Determine the blocking probability of the switch if all the subscribers are active at

the same time.

QUESTION BANK

DIGITAL COMM

1-Define Information?what are the various information resources?

2-Explain information content of a symbol?what are the properties of I(xi)?

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3-Calculate the amount of information if binary digits(binits) occur with equally li4-

kelihood in a binary PCM system?

4-If there are M equally likely and independent symbols ,then prove that amount of

information carried by each symbol will be I(xi) = N bits.

5-If I(xi) is the information carried by symbols (x1) and I(x2) is the information carried by

message x2.then prove that the amount of information carried compositely due to x1 & x2

is I(x1,x2) = I(x1)+ I(x2).

6-What do you mean by entropy? What are the assumptions related to it? Express it in

mathematical form.

7-Define :- 1)entropy for binary source. 2)lower & upper bounds on entropy H(x).

Define information rate? Verify the following expression:- I(xi,xj)= I(xi)+I(xj) . if xi & xj are

independent.

8-A DMS has four symbols x1,x2,x3,x4 with probabilities

p(xi)=0.4,p(x3)=0.3,p(x3)=0.2,p(x4)=0.1, calculate H(x) also find the amount of information

contained in the messages x1x2x3x4 & x4x3x3x2 & compare with the H(x) obtained

earlier?

9-An analog signal is bandlimited to fm Hz and sampled at nyquist rate,the samples are

quantized into 4 levels .each level represent one symbol.thus there are 4 symbols .the

probabilities of occurrence of these 4 levels (symbols) are p(x1=p(x4) =1/8 &

p(x2)=p(x3)=3/8. obtained information rate of the sources.

10-The probabilities of five possible outcomes of an experiment are given as p(x1)=

½,p(x2)=1/4, p(x3)=1/8 ,p(x4)=p(x5)=1/16, determine the entropy and information rate if

there are 16 outcomes per seconds.

11-An analog signal bandlimitted to 10 khz is quantized in 8 levels of pcm system with

probabilities of ¼,1/5,1/5 1/10,1/10,1/20,1/20,1/20 respectively, find the entropy and

the rate of information?

12-Express channel matrix of DMC ,explain the types of channels in DMC.

13-Define conditional and joint entropies ,with their mathematical representation?

14-What do you mean by mutual information define its properties?

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15-What do you mean by channel capacity per symbol and channel capacity per second

also explain capacities of special channels.

16-Define: 1)AWGN 2)uncertainity in the transmission process.3) code efficiency 4) code

redundancy.

17-Explain source coding(definition)

code word length

average code word length

kraft inequality

Shannon-fano algorithm.

UNIT-2 &3:

1- Define companding .What is A law companding and µ law companding?

2-. What is differential pulse code modulation ?Explain.

3- What is Pulse Code Modulation? . what are the most common methods of pulse

modulation.

4-With a near block diagram explain about delta modulation?

5.With a neat block diagram explain about DPCM?

6. Explain with a neat diagram, the different blocks of adaptive differential pulse code

modulation.

7.With a block diagram explain about Adaptive sub band coding.

8.Write short notes on : a) Quantization noise b) Digital multiplexers.

9.Derive an expression for SNR in delta modulation.

10. Compare PCM, DPCM and DM.

11- Draw the following data format for the given bit stream-1100010 a) Polar NRZ b)

Unipolar RZ c) Mnchester d)

12-How TDMA system is used in satellite communication?

13-Distinguish between DPSK, BPSK and QPSK

14-Compare of Various Digital Modulation Techniques.

UNIT-4

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1-What is the difference between analog and digital communication?

2-What are the different digital modulation techniques.?

3-What do you understand by waveform coding .?

4-Explain with diagram generation of coherent ASK,FSK and PSK.

5-Explain the generation of non coherent ASK,FSK and PSK.

6-Compare different types of digital techniques.

7-Draw and explain electronic commutator.

8-What is bit interleaving in digital communication?

9-Explain T1 carrier system with neat diagram.

10-What do you understand by synchronization and signaling of T1 system.

11-What is frequency shift keying ? Explain in detail about FSK transmitter and receiver.

12). With a neat schematic diagram, explain the Balanced ring modulator of BPSK.

13) What is TDM and PCM hierarchy

UNIT 5

1. Draw the code tree of a Convolutional code of code rate r=1/2 and Constraint

length of K=3 starting from the state table and state diagram for an encoder which is

commonly used.

2. Draw the trellis diagram of a Convolutional code of code rate r=1/2 and Constraint

length of K=3 starting from the state table and state diagram for an encoder which is

commonly used.

3. Decode the given sequence 11 01 01 10 01 of a convolutional code with a code rate

of r=1/2 and constraint length K=3, using viterbi decoding algorithm.

4. Explain the construction of Block Code and how the error syndrome is calculated.

5. Explain in detail about Orthogonal Codes, Biorthogonal Codes and Transorthogonal

Codes.

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6. Define the following terms:

a. code word

b. block length

c. code rate

d. channel data rate

e. code vectors

f. hamming distance

7. What are hamming codes ? Write the properties of hamming codes.

8. Explain the advantages of coding in communication system.

9. What is the use of syndromes? Explain syndrome decoding.

10. Write the advantages and disadvantages of convolution codes.

11. Compare linear block codes, cyclic code and convolution codes by giving their

advantages and disadvantages.

12. What are code tree, code trellis and state diagrams for convolution encoders.

13. Explain about error detection and correction capabilities of hamming codes.

14. Explain FEC and ARQ systems of error control.

15. Explain how generator and parity matrices are obtained for cyclic codes.

Question Bank of Principles of Management

Unit - 1

1) Define Management.

2) Is management – an art or science?

3) Give some features of management.

4) What are the essential skills of a manager?

5) Define scientific management.

6) List the principles of scientific management.

8) State the contributions of Fayol towards management.

9) What do you mean by ‘Scalar chain’?

10) What do you mean by ‘Esprit de corps’?

11) What are the various levels of management?

12) What are the roles played by a manager?

13) What are the functions of management?

14) What are the classifications of business organization?.

15) Trace the evolution of management with reference to the contributions made by

management thinkers.

16) What is the role of scientific management in the modern era?

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17) Explain the contributions of F.W.Taylor to Management.

18) Explain the contributions of Henri Fayol.

19) Explain the contributions of Abraham Maslow and McGregor.

20) Discuss the nature, purpose, merits and demerits of management.

21) Differentiate between Management and Administration with suitable examples.

22 )Discuss the merits and demerits of various types of organization.

23) Explain the recent developments in modern management theory.

Unit-2 &3

1) Trace the steps involved in the decision-making process.

2) Explain in detail the classification of decisions.

3) Discuss the various quantitative techniques for decision-making

1) Define ‘Planning’.

2) What are the types of planning? .

3) Define the ‘mission’ and ‘vision’ of an organization?

4) What do you mean by MBO?

5) What are policies?

6) What are the various types of plans?

7) Define the term ‘Strategy’.

8) State the features of Policies. .

9) What do you understand by the term ‘Planning premises’?

10) What are the main factors to considered for implementation of a

strategy?

11) Differentiate objectives and goals.

12) Distinguish between strategy and tactics.

13) State the hierarchy of objectives.

14) Differentiate policies and procedures.

15) What are the different types of policies?

16) What do you mean by SWOT analysis

17) State the levels of strategy.

18) What are the main objectives of a project?

19) Mention the features of MBO.

20) What is Forecasting? .

21) Define planning. Discuss the steps involved in planning.

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22) “Planning is all pervasive.”- Discuss with reference to its nature,

merits and demerits.

23) Explain the various characteristics identified in planning.

24) Discuss in detail the planning of premises.

25) What are objectives? State the characteristic features and requirements of a sound

objective.

26) Discuss in detail the features and process of MBO. (or) Discuss the

contributions of Peter.F.Drucker to management.

27) Differentiate between Objectives & Goals with examples.

28) Differentiate between Strategy & Policy.

29) Discuss about the effective implementation of a strategy.

30) Explain in detail the strategic planning process.

31)Discuss the steps involved in formulation of a Policy.

32)Classify and explain policies. Give the requisites of a sound. 13) Discuss the merits and

demerits of different types of plans

35) Discuss the different types of planning.

36) What is job design?

37) What are the benefits of specialization?

38) What are the limitations of specialization?

39) What is job rotation?

40) What is job enlargement?

41) What is job enrichment?

Unit-4

1) Define Motivation.

2) Name the steps involved in motivation process.

3) What are the types of motivation?

4) What are the different Motivational theories?

5) List out the basic needs in hierarchy.

6) Who is a leader?

7) Define Leadership.

8) List the few leadership theories.

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9) State house path goal approach.

10) Name the various leadership styles.

11) Explain the importance of leadership.

12) Explain the motivation process.

13) Explain the Maslow’s need hierarchy theory.

14) Explain the special motivational techniques.

15) Explain the different styles of leadership.

16) What are the four basic ingredients of leadership skill?

17) Explain the McClelland’s needs theory.

18) Explain the special motivational techniques.

19)Explain the trait approaches to leadership theories.

20) What is Control?

21) Define control.

22) What are the characteristics of control?

23) Why need of control in the organization?

24) What are the importances of controlling?

25) What are the disadvantages of control?

26) What are the interrelationship between planning and control?

27) Give some critical point standards of control

28) What are the types of control?

29) What is feedback control?

30) What is concurrent control?

31) What is feed forward control?

32) List the differences between feedback control and feed forward

33) What are the requirements for effective control?

34) Explain briefly the control techniques.

35) Discuss the control process and types of control.

36) What are the characteristics of control? Explain its need for management.

37) Explain the characteristic of an ideal control system.

38) Define control. Describe the features of a good control system.

39) What are the various good qualities of efficient controlling system?

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PEC-651 DIGITAL COMMUNICATION LAB

To perform following experiments based on Digital communication Trainer and Using

Communication Simulink:

1. To study sampling and reconstruction of the sampled signal

2. To study Delta Modulation and Adaptive Delta Modulation.

3 To study ASK, PSK,FSK, -modulation system.

4. To Study TDM/PCM Transmitter /Receiver.

5. To Study DHSS, FHSS.

6. To Study Error Control Coding using Simulink.

7. To Study different Line Coding Techniques.

PCS-604 DATA STRUCTURE LAB.

Problems in " C / C++/JAVA" using Data Structures involving arrays, stacks, queues,

strings,

linked lists, trees, graphs.

1) Using STACK to check matching left and right characters such as parantheses, curly

braces

and square brackets in a given string.

2) Single server queuing system and gathering statistics.

3) Operations on Stacks.

4) Sparse Matrices

5) Linear linked list implementation

6) Operations on Doubly Linked List and Circular List with a test application

7) Operations on Ordered Binary Trees.

8) Graph Traversal Techniques

9) Implementation of Quicksort, Mergesort and Heapsort

10) Operations on Binary Trees

11) Shortest Path Problem

PEC-652 MICROWAVE LAB.

1. Study of various microwave components and instruments like frequency meter,

attenuator,

detector & VSWR meter.

2. Draw V-I characteristics of microwave source like Gunn diode/ Reflex Klystron.

3. Measurement of frequency and wavelength in a rectangular waveguide.

4. Measurement of VSWR (small as well as large values) & reflection coefficient.

5. Measure unknown impedance with smith chart.

6. Draw the following characteristics of Gunn Diode

(i) Output power and frequency as a function of voltage

(ii) Square wave modulation by PIN diode.

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7. Drawing polar pattern of Horn antenna.

8. To observe the action of directional coupler and its use in separating incident & reflected

wave.

PREVIOUS YEAR QUESTION

PAPERS

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MICROWAVE

TECHNIQUES

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VLSI

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Telecomm. Switching System

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Digital

Communication

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Data Structure Using C++

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Principal of

Management

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