JC-13.1 Subcommittee on Discrete Devices Minutes of ... · Micropac Industries, Inc. Chris Caletka P 972.272.3571 x 1274 [email protected] x x x x x x Micropac Industries,

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JC-13.1 Subcommittee on Discrete Devices Minutes of Meeting #139

Las Vegas, Nevada February 8, 2012

Active Members Present Company Attendee S Telephone E-Mail 750

SS IOL/ BI

Str ID

19500 App C

19500 App F

13.1 13.1/ G-12

Aeroflex/Metelics Kim Leonard A 978.683.4122 [email protected] x x x x x x x Avnet Sharron Peek A 480.643.6428 [email protected] x BAE Systems Robert Mann A 850.664.6581 [email protected] x Hi-Reliability Microelectronics

Michael Heddlesten

P 408.764.5500 [email protected] x x

International Rectifier Andy Boisvert A 978.514.6456 [email protected] x x International Rectifier Martin Enright A 978.534.5776 [email protected] x x x x x x International Rectifier Samuel Mendez A 619.285.8500 x4427 [email protected] x x x x x x International Rectifier Kelley Price A 978.514.6195 [email protected] x x x x x x Intersil Corporation Nick von Vonno A 321.724.7546 [email protected] x IsoVac Engineering George Neff P 818.552.6200 [email protected] x Micropac Industries, Inc. Chris Caletka P 972.272.3571 x 1274 [email protected] x x x x x x Micropac Industries, Inc. Bob Campanini A 972.272.3571 [email protected] x Microsemi Corporation Ray DiBugnara P 978.620.2614 [email protected] x x x x x x Microsemi Corporation Ronan Dillon A 353.65.68.69.129 [email protected] x x x x x x x Microsemi Corporation Beth Parker A 978.620.2636 [email protected] x x x x x x x Microsemi Corporation Kent Walters A 480.941.6524 [email protected] x x x x x x x Micross Components James Wolbert A 407.296.5658 [email protected] x NorCom Systems Tom Green A 610.730.3224 [email protected] x x Northrop Grumman Bob Ricco A 410.993.2537 [email protected] x x x ON Semiconductor Paul Syndergaard P 208.234.6844 [email protected] x x x x x x x ON Semiconductor Eddie Glines A 208.234.6689 [email protected] x x Oneida Research Services Carrie Buckley A 315.736.5480 [email protected] x x x STMicroelectronics Al Ouellet A 781.402.8501 [email protected] x Semicoa Corporation Bill Morrow A 714.242.3031 [email protected] x x x x x x Semtech Corporation Daniel Lopez A 956.204.0536 [email protected] x x x x x x x Semtech Corporation Chris Velador P 805.480.2185 [email protected] x x x x x x x 120230:llh:3/20/12

lorraineh

Inserted Text

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Sensitron Semiconductor Michael W. Ryan P 631.586.7600 x252 [email protected] x x x x x x Solid State Devices Inc. Allan Harrison A 562.404.1633 [email protected] x x x x x x x Solid State Devices Inc. Joe Thompson A 562.404.7855 x574 [email protected] x x x x x x x Tektronix Component Solutions

Carlton Chin A 407.678.6900 [email protected] x x

Tektronix Component Solutions

Pravin Sequeira P 407.678.6900 x343 Pravin.gregory.sequeira @tektronix.com

x x

Texas Instruments Brent Rhoton P 903.868.6451 [email protected] x US Army AMRDEC Jeff Jarvis A 256.842.0160 [email protected] x x x x x

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Active Members Absent Arrow Zeus Electronics Crane Electronics Falcon Electronics Inactive Members Agilent Technologies Amkor Technology Cisco Systems Corwil Technology Corporation

Data Device Corporation e2v aerospace and defense

Freescale Semiconductor Global Foundries, Inc.

Golden Altos Corporation Hitachi Ltd. Huawei Technologies Hynix Semiconductor IBM Corporation Infineon L-3 Cincinnati Electronics Lansdale Semiconductor Linear Technology Corporation Mini-Systems Molex

National Hybrid, Inc. Opticomp Corporation Rochester Electronics Spansion, Inc. Teledyne Cougar Transcend

Vishay Corporation VPT Inc. Xilinx

4

Others Present

Company Attendee S Telephone E-Mail 750SS IOL/ BI

Str ID 19500 App C

19500 App F

13.1 13.1/ G-12

Aerospace Corporation Mark Johnson G 505.872.6292 [email protected] x Aerospace Corporation David Meshel G 703.808.5469 [email protected] x Boeing Anduin Touw G 703.455.6865

310.503.7827 anduin.e.touw@ boeing.com x

Boeing Company Kinn Roopwah G 281.226.6749 [email protected] x Corfin Industries Dan Tyler G 603.893.9900 [email protected] x DLA Land and Maritime Kyle Carpenter G 614.692.7078 [email protected] x x x x x x x DLA Land and Maritime Jason Hochstetler G 614.692.7106 [email protected] x x x x x x x DLA Land and Maritime Zade Karadsheh G 614.692.0611 [email protected] x x x x x x x DPA Components Doug Schweitzer G 805.581.9200 [email protected] x E2v aerospace and defense Olivier Gaillard G 33.476.58.3308 [email protected] x x European Space Agency Ralf De Marino G 31.715.65.4712 [email protected] x General Dynamics Jim Flynn G 413.494.2488 [email protected] x Hi-Rel Labs. Cedric Devaney G 509.325.5800 [email protected] x Integrity Applications Reza Nejad G 614.595.8198 [email protected] x L-3 Cincinnati Electronics Nick Bjelac G 513.573.6587 [email protected] x L-3 Cincinnati Electronics Joel Hatch G 513.573.6281 [email protected] x L-3 Cincinnati Electronics Dan Lake G 513.573.6209 [email protected] x x x Lockheed Martin Dave Syfko G 651.456.2374 [email protected] x Lockheed Martin Nolan Watts G 972.603.9255 [email protected] x NASA/JSC Carlton Faller G 281.483.4790 [email protected] x NASA/LaRC Peter Majewicz G 757.864.4474 [email protected] x NASA/MSFC Benny Damron G 256.544.3351 [email protected] x x x x x x x NASA/MSFC Patrick McManus G 256.544.3383 [email protected] x NASA/MSFC Kathy Pressnell G 256.544.7329 [email protected] x x x NASAM Hiro Egawa G 650.872.1155 [email protected] x x NASAM Yoko Tsukihara G 415.606.8084 [email protected] x NEC Corporation Robin Gomi G 978.742.8104 [email protected] x Northrop Grumman Nick Andrews G 410.993.6350 [email protected] x NSWC Crane Ken Andis G 812.854.2386 [email protected] x x x x Orbital Sciences Corporation Tom Marcinko G 480.722.3270 [email protected] x Raytheon Tom Hester G 310.616.8324 [email protected] x

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Rockwell Collins John Nirschl G 319.295.3111 [email protected] x x Six Sigma Minerva Cruz G 408.956.0100 [email protected] x Six Sigma Russ Winslow G 408.956.0100 [email protected] x Textron Systems, Inc. Joe Kwong G 978.657.1415 [email protected] x United Launch Alliance George Kysela G 303.269.7171 [email protected] x United States Air Force Mark Stibitz G 478.327.3057 [email protected] x United States Air Force Calenia Franklin G 937.656.2641 [email protected] x

JC-13.1 Subcommittee on Discrete Devices - Meeting #139 Minutes of Joint Meeting with the G-12 Committee

February 8, 2012

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Chairman: Chris Velador Secretary: Daniel Lopez

For a summary of the JC-13.1 Subcommittee Meeting that was conducted on Tuesday, February 7, 2012, see Attachments 1, 1A, and 1B.

1.0 Call to Order - The joint meeting was called to order by Chris Velador, JC-13.1 Subcommittee

Chairman, followed by a round of self-introductions. In attendance were 59 individuals representing 14 active member companies. Those in attendance constituted a quorum as the minimum companies needed for quorum was 12.

2.0 Approval of Minutes – The proposed submission by DLA to clarify a segment of the

October 2011 minutes were reviewed. It was agreed that the changes submitted by Mr. Gemperline (DLA) would be granted as the submitted text would not affect the overall fabric of the minutes. motion was made by Chris Velador and seconded by Mr. Chris Caletka to approve the minutes of Meeting 138 as amended. The motion was approved with one abstention noted. (See Attachment 2)

3.0 Reports – 3.1 DLA, VAC: Mr. Jason Hochstetler

Slides (Attachment 3) depicting VAC activity for discrete devices covering the topics below were shown:

a. Assist and its helpful features

b. EP Studies • Detecting weakened wire bonds • UA Castellation Dimensions • Laser Marking • Displacement Damage Characterizations • Standard Lead Finish • Case Outline Review for U3 packages • New Technology – SiC & GaN

c. MIL-PRF-19500 Amendment 1

• IOL Bond Pull added to Group C and Group E • Clarifications on rules of submission after a Conformance Inspection

sample has been confirmed as failed • Real time radiography added into the Screening table

d. MIL-PRF-19500 R Proposals

• Appendix C (See Section 6.0 of these minutes) • Appendix F (See Section 6.0 of these minutes)


February 8, 2012

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3.2 DLA, VAC: Mr. Kyle Carpenter

A presentation was not given as MIL-STD-750 F) had just dated.

3.3 DLA, VQE: Mr. Zade Karadsheh 3.3.1 Land and Maritime Travel Policy and its effect on OCONUS surveillance audits – Mexico

As this information was previously shown at the Subcommittee Meeting and the G-12 Committee Meeting, another presentation of the material was tabled at this time. (See Attachment 1A) 3.3.2. Supplier Updates A slide presentation updating the community on the health of the military supply base indicated many sole source suppliers have been eliminated. The QSLD program now lists 26 qualified distributors and is steady. Also included was the listing by supplier of recently QML listed slash sheets. (For additional details, see Attachment 4.)

3.3.3 Common Audit Findings

The slide presentation was given as a service to the community on areas where improvements can be made. VQE has made note of poor implementation of MIL-PRF-19500 Rev P, giving examples of weak process control, lead thickness, and not informing Land & Maritime when a business interruption is occurring. Many other examples were pointed out such as confusion on interpretation of Lot Norm, poor resolution on control charts, poorly trained operators, junction temperature verification and issues with ramp rate control on temperature cycle. (See Attachment 5)

4.0 JC—22 Committee Update: Mr. Kent Walters (Kent) Mr. Walters summarized the JC-22 Committee Meeting held in November 2011. The meeting minutes have been posted on the JEDEC website. (For non-members, please refer to Attachment 6.) Following the JC-22 Committee Meeting, on behalf of JC-13, JC-13.1, JC-22 and JC-25, a plaque denoting the committees’ appreciation was presented to Mr. Carlton Mowry at his home in Jupiter Florida, for his many contributions to the community during his long service as a JEDEC member. (See Attachment 7)

5.0 G-12 Committee Update:

Anduin Touw has been elected as new G-12 Committee Chair. Many Thanks and best wishes go to Mark Porter for his service.

Boeing Space has identified paragraph D.3.9.5 Process monitor programs, sub paragraph (h) Lot norm testing as the root location for interpretation differences by the community resulting with Boeing having to allocate resources to work with suppliers to ask for “Out of Family” verification to JANS lots. During its investigation, Boeing also concluded it might be valuable to ask for D.3.9.5.h. to include IRHOT as well as define “Key Parameters” in the paragraph. Ms. Touw requested JC-13.1 consider opening a task group. Chris Velador made a motion, seconded by Chris Caletka, to open TG1201 Lot Norm Testing (Paragraph D.3.9.5.h.) The motion was approved with a vote of 6 in


February 8, 2012

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favor, none opposed and 3 abstentions. Anduin Touw and Chris Velador will work together to find a Chair.

6.0 Task Group Reports

TG0803 – 750 TMs & Slash Sheets – Chair: Chris Velador

Kyle Carpenter reviewed a power point presentation covering a few remaining items DLA had left to close. (See Attachment 8)

EP Study TM1051: Temperature cycle – Method revised to allow diffusers to produce more natural eddy currents within the chamber and therefore allow better ramp rate control. ITEM CLOSED

Future EP Studies

• Alternate PIND Test - PIEF (Particle Impact Electrical Fault) - Vibration table coupled with

bias voltage seems to be a good alternative as any particle capable of bridging will weld itself resulting in a permanently shorted device. Kent Walters performed some initial tests that yielded positive results.

• 5.1.2 Hermetic Seal - Possible New Test Methods to replace slash sheet specific tests:

1. Noise Density – reference /483 2. Saturation Time (On/Off) – reference /255 3. Effective Carrier Life – reference /444 4. Charge Storage Time – reference /317 5. Collector to base time constant – reference /391 6. Emitter to Collector On-State Resistance – reference /381

• Bond Pull for SMD - Land and Maritime will work with Semtech to determine scope as this

has been evolving.

• Digital Radiography - Land and Maritime will propose modifications to TM2076 to include “Real Time” X-ray. There will be continued gathering of information by Land and Maritime to include understanding the minimum system requirements as well as training. Ken Andis of NSWC will assist Land and Maritime.

TG1102 - IOL, Chairman: Martin Enright, Co-Chair: Beth Parker

Land & Maritime and the community have accepted the proposal of 6000 cycles in Group B for

JANS. The TX & TXV requirement is 2000 cycles at Group B, and the allowance of continuation on to Group C with an additional 4000 cycles.

A motion was made by Chris Velador, seconded by Martin Enright, to close this task group. The motion was unanimously approved.


February 8, 2012

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TG1103 - Structural ID for Stacked Die, Chair: Allen Harrison

The charter of this task group is to define criteria for a stacked junction diode. Scope: Review MIL-PRF-19500 Appendix A paragraph A.3.35 (see below), Appendix E paragraph E.3.2.a and propose additions and/or changes to define a stacked junction semiconductor and address structural identification of stacked junction device types.

(A.3.35) Proposed definition discussed: Stack junction semiconductor diode. A semiconductor device having two terminals and exhibiting a nonlinear voltage-current characteristic with two or more active and/or passive die that are Category I metallurgically bonded together in a series configuration to gain the additive effect of the reverse blocking capabilities of each individual active die.

Suggestion: replace “semiconductor” in title with “rectifier”. Suggestion: remove “Category I”.

(E.3.2.a) Proposed new sub-paragraph “e” to discuss Stack junction rectifiers and diodes with identical design rules (same doping technique, passivation, and device structure) which differ only in active die count and package size are considered structurally identical. Structurally identical stack junction rectifiers and diodes may differ in size in the X, Z and Y axis1/. Initially, group B and C shall be performed on each die size as defined by the X and Z axis. On subsequent lots, the die count/package styles that receive group B and C inspections shall be rotated on every lot maximizing Group B and C inspections for active die count and package styles.

Suggestion: capitalize the word “Group”. Suggestion: replace “style” with “size” and add further clarification regarding size differences in the X, Z and Y axis. Suggestion: include the word “each” in the last line, i.e., ….. inspections shall be rotated on every lot maximizing Group B and C inspections for each active die count and package styles. Suggestion: bookend the Group B and C tests and review language in the structurally identical Zener paragraph.

(See Attachment 9) TG1104 - MIL-PRF-19500 Appendix C, Quality Management Program, Chair: Chris Velador This meeting was to review proposed changes to paragraph C.1.1 Scope. (See Attachment 10)

A lively dialog ranging from the history of “C”, the intent of “C,” JANJ and its failure resulted with a net summary of the committee wanting to cancel “C” as well as this task group since most of the requirements have already been pushed into “D.” This task group will stay open one more session to vote on its future.


February 8, 2012

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TG1105 - MIL-PRF-19500 Appendix F, Non Hermetic Packaging Requirements for Ground Applications – Chair: Paul Syndergaard

Dialog included what non-hermetic means for this appendix, what is the application these parts will

fit into, US Army is already using automotive grade in selective applications, PPAP vs 19500 qual and will Land & Maritime accept die from Chinese foundries.

John Nirschl (Rockwell Collins) stated plastics do not belong in MIL-PRF-19500. Paul Syndergaard

defended the necessity, as some users are buying plastic, automotive grade components and treating AEC-Q101 Grade 0 as equal to JTX and then upscreening per program requirement. He also pointed out a number of slash sheets already exist.

Both NASA and Navy do not see the use for these parts in their programs but would take this back

and present this possibility back to NEPAG or similar. The outcome of this task group hinges on Land & Maritime’s feedback regarding die originating in China. At the May meeting, the subcommittee will have feedback on interest by the community and die originating in China in order to vote to continue or cancel this task group.

See Attachment 11 for task group scope, background, the US Army’s position, and a list of current

non-hermetic slash sheets.

7.0 Old Business Standard Lead Finish - Dan Lake commented on what it would take to determine what kind of solder finish plating is being used on the parts at the time of purchase. He asked Zade Karadsheh to consider it as a suffix since it is common and works well with parts under the MIL-PRF-38534 umbrella. Other members also agreed during the discussion; however, Brent Rhoton stated that it does not work so well and cited the suffix “X” denoting undefined as validation. Mr. Rhoton also stated the main reluctance by Land and Maritime is it appears that the additional suffix would cause a lot of re-numbering which could be a big task.

8.0 New Business

8.1 Discussion Board

JEDEC has upgraded its website which includes the “Discussion Board” tool. This tool allows members to move away from point-to-point email traffic between meetings with inconsistent distributions to a JEDEC-approved umbrella with distribution driven by up-to-date rosters. Chris Velador has already opened up discussion boards for all current task groups and encourages the community to make use of them. (See Attachment 12)

8.2 Counterfeit Parts – Video http://www.bloomberg.com/video/79705752/ Since the last meeting Chris Velador has helped the community identify suspect parts, and has found

a video on the subject. The video was shown and the link is for the record. 8.3 Solderability

Martin Enright addressed the issue of using an active flux to pass Steam Age in order to meet the solderability requirement for LCC packages. Some dialog ensued as to the reasons why and the

http://www.bloomberg.com/video/79705752/


February 8, 2012

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community seemed to be in agreement with the reasoning. Kyle Carpenter stated an EP Study would be sent out designated as “Fast Track.”

8.4 Nominations Committee – Daniel Lopez was appointed as Nominations Chairman. The current Chairman has two meetings left before his third term is completed. Elections for Chairman of JC-13 and all Subcommittee Chairmen will be held over the summer with results

announced at the October meeting. If you would like to be considered as a candidate for the JC-13.1 Subcommittee Chair position, please contact Mr. Daniel Lopez via email, [email protected] or by phone at 1 (956) 204-0536.

. 9.0 Adjournment There being no further business to conduct, the meeting was adjourned by common consent.

Reviewed/corrected and authorized for release: __________________________3/20/12 Chris Velador, JC-13.1 Chair __________________________3/20/12 Daniel Lopez, JC-13.1 Secretary __________________________3/20/12 Date of Legal Approval THIS MEETING WAS CONDUCTED IN ACCORDANCE WITH JEDEC LEGAL GUIDES AND THE JEDEC MANUAL OF ORGANIZATION AND PROCEDURE, JM21.

mailto:[email protected]

JC – 13.1 Subcommittee Discrete Devices Summary – Meeting # 139

February 2012 ATTACHMENT 1

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OLD BUSINESS Land & Maritime (LM) Travel Policy – Mexico The VQE Liaison, Zade Karadsheh gave a slide presentation (See Attachment 1A) outlining: a) benefits of the DoD Qualification Program, b) Scope of the program, c) Travel Policy since 14 Mar 2010 has been a restriction to perform surveillance audits and in parallel investigate any alternate path to maintain certification, and d) January 2012 - restriction lifted but VQ is determining if any/how “Force Protection” as well as which companies and in what order any audits will be performed. No plan is in place at this time. RHA Displacement Damage Update – NO REPORT - The next update will be in New Orleans in May. Red Dye Update George Neff stated red dye is available and has been shipped. However, Beth Parker indicated her company has not received any and has been waiting for over 1 month. Mr. Neff indicated escapes he found and/or reported to IsoVac are indicating a need for more training. IsoVac will offer a training session after SPWG in April. Mr. Neff took the action item to send out a training slide set. (Attachment 1B) POC: [email protected]. Martin Enright indicated small package size is also a factor, and George Neff included the need to rinse with acetone. The dialog turned to the dangers of acetone without resolution as to the impact. Standard lead finish

Chris Velador cited that work has already been completed by Carlton Mowry approximately 3 years ago, and the outcome of no change was recorded in those minutes. Members may look at those minutes in the JEDEC Members area. Dan Lake requested DLA look into adding the lead finish to the part number using the same approach practiced by the IC manufacturers. Currently any specific lead finish must be listed on the PO for discrete devices. No action was taken at this time.

NEW BUSINESS Qualification & Certification Manual

Mr. Velador requested an update from Mr. Karadsheh regarding the overdue release of the Qualification and Certification manual. Mr. Karadsheh stated the delay has been due to new updates required as a result of DLA’s change in funding for OCONUS audits. Revision C requires all offshore audits be paid for by the manufacturer. The new policy is for DLA to fund all audits.

Counterfeit Parts

After being contacted by a couple of OEM’s to help identify suspect parts, Chris Velador found a video on the subject: http://www.bloomberg.com/video/79705752/


JC – 13.1 Subcommittee Discrete Devices Summary – Meeting # 139

February 2012 ATTACHMENT 1

1

Long Term Storage of QPL Parts

Mr. Velador informed the Subcommittee of inquiries received between meetings regarding the long term storage of QPL parts and requested Mr. Jason Hochstetler, the Liaison, to reference JEP-160 and J-STD-033 in MIL-PRF-19500. Martin Enright referenced the solderability date is the best anyone can do by spec and Mr. Velador cited data retention as the final point any manufacturer would be able to support. Mr. Jeff Jarvis took the action item to send another document to Mr. Hochstetler.

NSN to JEDEC registered PN Mr. Velador has requested Land and Maritime review the NSN duplicates floating in its data base. Jason Hochstetler has this action and will provide feedback at the May meeting.

Multiple date codes in the same reel Mr. Velador received a request from a distributor to raise awareness to DLA and the community of the following items: a.) Multiple date codes in the same reel. b.) Different manufacturers same part in the same reel. Mr Enright did not believe this is the correct forum for this discussion; however, the distributors are active members and so their requests also are brought to committee.

MIL-PRF-19500 Traceability Requirements (JANS data pack to physical part traceability) Discussion on how the JANS data pack in some case does not provide the resolution to easily locate a specific serialized part on the physical reel. An example cited a lot of 10000 pieces of surface mount devices that have been tape and reeled and then spilt at the distributor. The result was 5000 pieces going to OEM 1 and the other 5000 going to OEM 2 but the data pack lists all 10000 pieces as is required. However, if either OEM wanted to specifically locate a device, the lot would have to be de-reeled. Dan Lake indicated that the premium space level product should include this feature; however, no motion was made and no committee resources assigned. Laser marking Mr. Hochstetler reminded the subcommittee of the open EP Study on Laser Marking.

Use of Active Flux for Solderability Testing Mr. Martin Enright requested Land & Maritime allow the use of an active flux for solderability testing for Leadless Ceramic Chips Carriers. A DOE will be made available to Land & Maritime, and Mr. Kyle Carpenter will launch an EP study with the expected resolution before the May meeting. No motion required.

1 1

CultureWorkforce Development

Joseph L. Gemperline

Sourcing & Qualifications Division

(VQ)

OCONUS Qualification Audits

8 February 2012

lorraineh

Text Box

ATTACHMENT 1A

2 2


• 10 U.S.C. 2319 and FAR Subpart 9.2; DOD 4120.24-M

(Defense Standardization Program) and SD-6

• Many advantages to DOD/DLA (standardization, schedule,

cost, quality and reliability)

• Qualification invoked via applicable military specification;

Used by DOD procuring activities for critical DOD weapon &

space platforms

• Provides a level playing field for suppliers and known-good

sources of supply for defense contractors/users

• For a facility to be certified or to stay certified, there is an

expectation of benefit to DOD (i.e., qualified parts are sold and

used in military space and weapons systems)

The DOD Qualification Program

3 3


• QML-38535

Microcircuits

•42 Mfr’s

•200 Facilities

•19,000 P/Ns

QML-19500

Semiconductors

33 Mfr’s

25,000 P/Ns

QPL-38999

23 Mfr’s

900,000 P/Ns

700 processes

– VQ manages 227 different QPLs/QMLs in 30 FSCs

– Over 900 facilities listed worldwide

– Plus over 120 test laboratories approved

Scope

These are 3 examples only


4

MEXICO

• 14 Mar 2010 Travel Warning issued by Department of

State followed by NORTHCOM Travel Directives for

Defense Agencies

• NORTHCOM prohibited unofficial travel to certain

areas but left it to the agencies and field-level

Commanders to approve mission essential travel

• The tough part for us has been defining the risk and

determining if QPL/QML audits and reaudits are

worth the extra risk to personnel (i.e., “are the audits

really mission essential enough”???)

5 5


MEXICO (continued)

• Meanwhile, initial audit requests from suppliers

were deferred by DLA Land and Maritime as “not

mission-essential” based on present travel warnings

and having other sources for those parts, etc.

• Q1 FY12: Due largely to the travel warnings for

MX, our Commanding General directed VQ to

contact Defense Contract Management Activity

(DCMA) for possible help with OCONUS audits

• Q1 FY12: VQ sent request package to DCMA

with required skill sets, plant listings, etc.. No

indication yet from DCMA

6 6


• Meanwhile, VQ was directed to explore Force

Protection (FP) options available for travel to

Mexico

• 24 Jan 2012: VQ met with our Commanding

General and other officials. It was agreed to

take the first step in preparing for critical

reaudits there so we can confirm what FP is

available. That’s brighter news for the

QPL/QML programs and those suppliers

• There currently are no plans to remove listings

due to travel warnings or the inability to travel

to perform a reaudit

MEXICO (continued)

7 7


• Audits are a key part of the DOD Standardization Program

• Suppliers should choose wisely when deciding where to

qualify facilities, realizing there are certain risks with

OCONUS plants. VQ typically postpones audits when there

are travel restrictions in those areas, rather than removing good

sources from our QPLs/QMLs. But there is clearly a risk that

prolonged travel restrictions could necessitate removal of

certification as a last resort to assure QPL/QML items comply

with requirements.

• The good news since the last JEDEC meeting is we now have

the green light to at least begin to plan reaudits in MX,

contingent on available Force Protection, and any plans to

remove listings due to the existing travel warnings there have

been suspended for now.

Summary

IsoVac Engineering, Inc.

Understanding

The 1071.9

Radioisotope Red Dye

Leak Testing

JEDEC

February 6, 2012

Las Vegas, NV

lorraineh

Text Box

ATTACHMENT 1B

MIL-STD-750E T/M 1071.9

4. Test Condition A

“radioisotope wet gross leak test” Application

1. To detect very large gross leaks

2. For devices smaller than 0.02 cc

3. Detect gross leaks dry gas test misses

4. Catch leaks missed by visual inspection

5. Combines visual and Kr85 detection

6. Commonly applied to < 0.05 cc parts


Equipment & Materials

Krypton85 Pressurization System

Kr85 Concentration > 100 µCi/atm cc

Pressure/vacuum container

Red-Dye Solution (Mineral oil base + red dye)

Acetone

Screen-strainer

Funnel

Erlenmeyer Flask


4.2 Testing Process

• 4 steps in the 1071.9, 4.2 procedure.

• All 4 steps must be followed in order to

assure the best success for this test.

• Proper “Red-Dye” material must be used

to assure Kr85 “Gettering” and/or visible

detection of „very-large-leaks‟.

• Experience has suggested the application

of this procedure to packages to 0.05cc

that could have missed „Visual Inspection‟


Step 1: Parts are placed in a metal container

Parts are covered with red-dye

Sufficient red-dye is added to cover the devices.


Container is placed in a pressure/vacuum

chamber.

- - The type of chamber is not critical - -

The chamber needs to have a capability of being

evacuated, (using a „Roughing-Pump‟), and then

pressurized with air to 45 psia (min).


While devices are submerged in Red-dye

Chamber is evacuated, (roughing pump) for

10 minutes, (to remove trapped air) from

leaking device, and/or cavities

Parts are then pressurized with air, (45psia

minimum) for 10 minutes.


Parts are removed from chamber and placed in a

screen strainer and red dye recovered back into

red-dye container.


Screened container is set into a large funnel.

The red-dye is then washed off of the parts

using acetone in a squirt bottle.


Parts are spread out onto a white towel and

parts that are visibly bleeding red-dye are

removed as rejects.


Step 2

Good parts are placed in a pan and run

through a Kr85 leak test -(12 min @ 45psia min)

• Parts must be measured for Kr85 within 5

minutes.

• Any device that reads 500 counts per minute

(net), is a reject.


Step 3 Parts are then spread out onto a white surface and red dye

leakers are removed.


Step 4

If any rejects are detected in steps 1-3, the

lot shall be re-run through steps 2-4.

This re-test has been found to detect rejects

as many as two times in very bad lots of

micro parts.


Step 1 of 1071.9, 4.2, is also commonly used

for failure analysis to identify the leak site.

The following pictures are examples of the

application of step one.

Leak sites are usually identified

microscopically @ 30X



TO – 18 Weld Leak


Can weld leak, (failed dry-gross)

Identified by red-dye


LED Seal leak


Weld Leak


Pin-Glass Seal Problem


Weld Leak


Dye on feed-through after “Step 1”


0.002 cc Impatt Diode


0.002 cc RF Transistor

ATTACHMENT 2

EXCERPTED FROM OCTOBER 2011 MEETING - JC-13.1 SUBCOMMITTEE MINUTES 11.0 NEW BUSINESS

11.1 Mexico Travel Q & A – Mr. Joseph Gemperline, Chief of Sourcing, gave an update on DLA’s position on foreign audits as well as the climate in which DLA operates.

• Pressure to audit with shrinking budgets and rule changes may prevent all

OCONUS audits from occurring. The main reason is a rule change requiring manufacturers with OCUNUS sites to pay auditors expenses. This rule is being deemed as not consistent with the DLA travel policy as a whole.

• Mr. Gemperline requested OEMs to voice their concerns to DLA management

so that no rash decisions will be made and possibly affect the supply of parts. DLA is not funded for this DOD Qualifications mission and therefore must pay the cost of this mission out of its normal operating budget which results from sales of items to customers.

• Of special interest is the restriction of travel to Mexico (except for mission

essential travel), where security risks for the auditors are of the highest concern.

• He stated he would meet with his commander in the next week or so and he

would want to know which sites can be deemed “mission essential.” At present, the Commander of DLA Columbus requires convincing; therefore, he requested help to not only continue with foreign audits, but also a letter to be written in favor of continued funding to the Verification Wing of Land & Maritime. “Mission essential” is not clearly defined but instead left open for a Command decision on a case by case basis. Mr. Gemperline plans to show the importance of the qualification audits (including those OCONUS) and try to convince the Commander these OCONUS audits are worth funding even though the full cost must now be borne by DLA Land and Maritime.

• This year does not look very good for conducting offshore audits. Due to

current funding constraints and the decision explained above by the Land and Maritime legal office, only a handful A couple may be done, but on a limited basis, and maybe only if mission essential can be proven.

• Land & Maritime is also looking at several alternatives:

i. Third party audits and auditors ii. User fee - Failed previously (early ‘90s), apparently because

manufacturers were not able to receive compensation, such as a tax credit. So the DLA Director (at DLA Headquarters) stopped implementation after receiving a few complaints and deciding to fund the program internally.. Mr. Gemperline maywill propose this as another option, butanddoesn’t want to go through all that again unless there is commitment higher up in DLA and OSD to follow throughu ask if it is a possibility.

iii. OEM funded - User community can also provide some funding, limited on resources

ATTACHMENT 2

iv. Removal from the qualification listings • Mr. Gemperline noted that the outcome - if we do nothing - may be more self

auditss to be performed and results supplied to DLA, and even possibly elimination of DLA’s audit wing in the not too distant future.

Dan Lake asked if there is a travel restriction to Mexico. Mr. Gemperline responded in the affirmative except for mission essential travel; however, DLA should be able to will make a final decision at to which audits in Mexico might be considered “mission essential”on its travel policy by the end of the yyear.

.

1

DEFENSE LOGISTICS AGENCY AMERICA’S COMBAT LOGISTICS SUPPORT AGENCY

WARFIGHTER SUPPORT ENHANCEMENT STEWARDSHIP EXCELLENCE WORKFORCE DEVELOPMENT

JC-13.1

Discrete Devices

Jason Hochstetler

February, 2012

lorraineh

Text Box

ATTACHMENT 3

2 2


MIL-PRF-19500 Activity

•Slash sheets: In progress 83, 5 year review 35

•Assist coordination module (1 Oct 2011)

-Custodians & Review activities

•https://assist.daps.dla.mil/online/start/

•EP studies

•MIL-PRF-19500P am1 FD comment review

POC:

https://assist.daps.dla.mil/online/start/



3 3



Data Source:

4 4



Data Source:

5 5



Data Source:

6 6



Data Source:

7 7



MIL-PRF-19500 EP Studies

•Detecting weakened wire bonds(TG1102)

•Review UA Castellation dimension

•Laser marking requirements survey

POC:

8 8



UA Castellation

POC:

9 9



POC:

10 10



MIL-PRF-19500 EP Studies

•Detecting weakened wire bonds(TG1102)

•Review UA Castellation dimension

•Laser marking requirements survey

POC:

11 11



Suggested Laser Marking Requirements:

1. A maximum allowable depth (to be determined), while

still meeting the plating thickness of table H-I of

MIL-PRF-19500.

2. No double marking.

POC:

12 12



Suggested Laser Marking Requirements: 3. No continuous font line that requires a turning angle

< 90, these shall have a break in the font line.

4. No crossing lines or connection between lines.

POC:

Reject Accept Accept

Reject Accept

13 13



New MIL-PRF-19500 EP Studies

•Displacement damage characterization

•Lead finish standard

•Case outline review(U3)

•New technology, SiC, GaN

POC:

14 14



MIL-PRF-19500 Amendment 1

•Group C/E addition of IOL and bond pull

•Resubmission rules

•Real time radiography screen

POC:

15 15


MIL-PRF-19500R

MIL-PRF-19500R Proposals

•List of proposals available on the JEDEC JC-13.1

discussion section in members area

•Appendix C taskgroup

•Appendix F taskgroup

POC:

16 16


Jason Hochstetler

DLA-VAC

[email protected]

614-692-7106

Contact Info



1



VQE Status Update

Zade Karadsheh February 2012

lorraineh

Text Box

ATTACHMENT 4

2 2


update

o Significant growth in number of suppliers. Many Sole sources eliminated.

o QSLD Program leveling off– 26 qualified distributors

oMexico update

3 3


New/current Suppliers

o Aeroflex-Metelics..CY2012 qualification plans: Diodes: /463, /533, /115, /406, /356, /477, /337

Schottky /586, /620

Diode chips: /578, /609, /117, /127, /435, /116, /144,

/231, /159

Transistors: (PNP) /379, /441, /540, /545, /561; (NPN)

/393,/394,/407,/408,/502,/504,/510,/518/,/537,/538,/539,

/544,/276…..RAD HARD: /255, /291

o Sensitron JANS,TX/TXV Qualifications

for CY2012; rectifiers, zeners and TVSs: /585, /241, /356, /420, /533, /590,/411, /424, /435, /406, /500, /586, /516

:

4 4



o ST Micro JANS certified for discrete transistors. Qualification

granted for /255, /291 in UB. CY2012 RadHard qualifications for

multiple bipolar transistors.

o ON Semiconductor small signal /290, /291 and

/391 and /255 - J/TX/TXV qualified. Diode certification

audits performed. Zener and Schottky quals next.

o Semicoa Corporation JANS MOSFET lines

certifications - Fab (JAZZ) and assembly at Costa

Mesa. Also, looking into introducing UM package as a

drop in replacement for US

5 5



o Optek: TX/TXV LEDs & Optocouplers later 2012

o SSDI: CY2012 o /575… 1,500 – 10,000V stack die rectifier

o DO-35 frit glass diodes (/sheets in editing): o 1N8020 &1N8023 series (50 - 200v, 5 - 9ns) and

1N7068 series (50 - 200v, 10A, 35ns)

o International Rectifier (IR) updates:

• JANS Schottky Diode introduction for 30V, 45V, 60V, 100V

under 17 new & 7 existing slash sheets.

• JANHC & KC Schottky diode and RAD-Hard™ Power

MOSFET introductions.

6 6


o Microsemi

• New quals continuing from Scottsdale closure, most recently:

• Glass TVS - /516, /434, /551, /552

• Potted modules - /483 and /469

• QML de-listings as Lawrence/Ireland become qualified

• MOSFET quals are continuing, most recently:

• 2N7335 (/599) – 100V P-channel

• 2N6790 (/555) – 200V N-channel

• New transistor qual: 2N2857 (/343)




1



Common audit

findings

Zade Karadsheh Feb 2012

lorraineh

Text Box

ATTACHMENT 5

2 2


MIL-PRF-19500 revision P not fully implemented.

Examples: Process Control plans, final finish thickness monitor, Business Interuption Plan,…

Control charts are improperly designed,

useless in some cases, poor resolution due to wide control limits, specification limits on charts, Mixing of two distributions into one,..

Lot Norm confusion and out of family (within lot and lot to lot variation and CT control)

Common audit findings

3 3



Operators insufficiently trained to verify compliance

with piece part drawings or device Design &

Construction info.(e.g., XRF measuement sample &

locations, sample statistics, lot-to-lot variation,..

CV plots. Tube/furnace contamination control

Improper temperature testing tolerances in A-3. Per MIL-

PRF-19500, Appendix E, Table E-V, subgroup 3 at

high (-0˚C, +10˚C) and low (+0˚C, -10˚C )

temperature.

:

4 4



Burn in/HTRB/life test oven, boards,

forcing conditions and Tj issues.

MIL-STD-750 TM non-compliances.

e.g.,Temp Cycling ramp rate, Hermeticity,..

5 5




JC-22 Committee on Diodes and Thyristors Minutes of Meeting No. 95

November 16, 2011 Lago Mar, Ft. Lauderdale, FL

jdc:110614:12/20/11

Members Present Company Telephone E-mail Kent Walters, Chair Microsemi 602-458-3212 [email protected]

Christopher Velador Semtech 528-799-5803 x99 [email protected]

Others Present Company Telephone E-mail Ronan Dillon – G Microsemi 353-65-6869129 [email protected]

Bob Fried – G Midarome 516-827-5421 [email protected]

Daniel Lopez – A Semtech 011-52899-958-0398 [email protected]

Kyle Carpenter – G DLA Land and Maritime 614-692-7078 [email protected]

Kenneth Andis – G NSWC, Crane 812-854-2386 [email protected]

Julie Carlson, Secretary JEDEC 703.907.7559 [email protected]

Members Absent

Agilent Technologies* Biz-Zone Cisco Systems* Freescale Semiconductor*

Huawei Technologies* Hynix Semiconductor* IBM Corporation* Toshiba*

Transcend Vishay General Semi.* International Rectifier Semicoa Attendance counts: 2-Representatives, 2-Alternates, 3-Guests, 12-Absent member companies

* inactive member company

lorraineh

Text Box

ATTACHMENT 6



2

1 OPENING Chairman Walters called the meeting to order on November 16, 2011 at 8:30 a.m. The sign-in sheets were distributed. Self introductions were made. 2 REVIEW OF COMMITTEE MINUTES Mr. Walters asked for corrections to the minutes of meeting #93. Mr. Walters reviewed the minutes from the last meeting, the following corrections are needed: in 22.2-014 after each number item change comma to colon, 22.2-015 last sentence before action, 3.1 should be 3.4.1, 22.2-xxx forward current derating, JESD282C-1 to Mr. DiBugnara, not JESd210, 22.2-005, last underline item JEDS should be JESD211, before item 8, action in second sentence add period after 2009 and cap Since, add period after JESD211, in reaffirmation of old standards change 13 to 14. Mr. Valedor made a MOTION to approve the minutes as corrected, second by Microsemi, all in favor. The minutes were approved as corrected. 3 CORRECTIONS CHANGES AGENDA, LETTER LOG The agenda item under new business for TM1051 was discussed in JC-25, further discussion in JC-22 is recorded in the JC-25 minutes. There are no other changes at this time. A letter log was also distributed for review by Mr. Walters. 4 BOD AND CHAIRMAN’S REPORTS Ms. Carlson reported on the activities of the BoD. The JEDEC Operating Procedures has been updated, the new JM21Q is available on the JEDEC website, the changes are in the scope and Annex D has been removed and placed in its own document, JM12, this document has not been published. Mrs. Carlson also noted that Mian Quddus of Samsung has been elected as BoD chairman for a 2 year term. 5 IEC REPORTS Mr. Walters noted that there was a ballot for Zener’s, JC-22.2-11-446 for 47E/411/CDV - IEC 60747-3 Ed.2 Semiconductor devices - Part 3: Discrete devices - Signal, switching and regulator diodes, the ballot expired 9/19/2011, he made comments but has not heard a response. Mr. Travis was not present to report on the activities of the 37A and 37B activities. 6 SUBCOMMITTEE REPORTS JC-22.1 THYRISTORS (INACTIVE)

No new business at this time. Ms. Carlson will check into the JESD397 document.



3

JC-22.2 RECTIFIER, ZENER, AND SIGNAL DIODES (K. Walters, Microsemi) Mr. Walters presented the agenda for the JC-22.2 committee; see attachment. 22.2-001 Review new draft of TM3101 (JESD282 and JESD531), Thermal Impedance

Mr. Walters gave an update on the status of this item. This item will become part of JESD282-1, clause 4.7.6. When the item was originally balloted as JC-22.2-11-09, the wrong version of the TM was used. This item will be reballoted with the correct test method. This reballot will be sent to JC-13 chairs for information only. Mr. Walters asked that the committee members watch for the ballot and vote. Ms. Carlson noted that once this item is approved by the BoD it will be published to the JEDEC website. This item will be published as JESD282-1, under clause 4.7.6.

ACTION J. CARLSON/K. WALTERS

Format material in JEDEC format (Ms. Carlson) and upload as “Mr. Walters” for committee ballot. If approved by acclamation, Ms. Carlson to submit BoD ballot as Mr. Walters.

22.2-003 Review status of Schottky dv/dt test method (DiBugnara, Microsemi/Flood, IR)

Mr. DiBugnara and Mr. Flood were not present to report. Mr. DiBugnara commented via email, that he did receive the material but it was not a complete and workable circuit. No instructions on how it works and no guidance on how to physically lay the components out. Layout is absolutely critical. He noted that it would be better off to just show a capacitor, a switch, a small inductor and a battery. Mr. DiBugnara sent a drawing via email during the meeting, the drawing was reviewed. The committee agreed this is a good generic circuit and worthy of clean-up and formal review. The committee requested that the drawing be updated and posted to the JC-22 members area for committee review and comment prior to the next meeting. This item is carried over to the next meeting.

ACTION R. DIBUGNARA

Clean up drawing and post on JC-22 members only area for committee review and comment as quickly as possible.

22.2-004 Reverse recovery time in TM4031, JESD282

Mr. DiBugnara was not present to report. Avtech submitted a schematic for trr test circuit for review at the April 2011 meeting. In April 2011 Mr. DiBugnara noted that he would pursue the drafting of a schematic that shows switches. To date this item has had no activity. The committee noted that if Microsemi does not come up with a proposal by the April 2012 meeting, the committee will go with Avtech proposal from the April 2011 meeting, this will go into JESD282-1 in clause 4.6.9. Mr. DiBugnara sent a drawing via email during the meeting, the drawing was reviewed, this drawing is a little more generic than the Avtech submittal. The committee agreed this is worthy of clean-up and formal



4

review, the committee requested that the drawing be updated and posted to the JC-22 members area for committee review and comment prior to the next meeting, This item is carried over to the next meeting.

ACTION R. DIBUGNARA

Clean up drawing and post on JC-22 members area for committee review and comment as quickly as possible. Background: At the November 2010 meeting, it was noted by Mr. Walters that a new test circuit will likely not be ready in time for the next publication of MIL-STD-750. Other changes for TM4031 have deleted reference to existing test equipment manufacturers as advised by DLA shortly after the April 2010 JC-22 meeting. That version was already provided to DLA by Mr. Walters and will be used in the next issue of MIL-STD-750. The JEDEC version will be delayed for further review of a generic test circuit from Mr. DiBugnara. Mr. DiBugnara to generate a generic test circuit with summarized waveform details to provide better definition of what is needed for Condition B. Once developed, upload material to the JC-22 member page for committee review. At the April 2009 meeting the committee approved the changes to be made in JESD282, and a MOTION to send out on limited ballot was approved as new JESD282-B4031. If approved, item will be on hold until the new test circuit information is reviewed and agreed upon.

22.2-006 Military Detail Specs and Continuing Issues

Mr. Carpenter reported on the results of the EP Study. DLA did an EP study to justify the removal of delta VF testing on rectifier detail spec. Based on the study DLA will not require delta VF testing except for those involving irradiated processing. This item is now closed. Background: At the November 2010 meeting the committee discussed the status of the removal of delta VF from slash sheets 411, 420, 427, 429. The committee is in agreement with the removal of delta VF test in screening for these 4 slash sheets.

22.2-008 Pull Test for Surface Mount End Caps, Test Method (C. Velador, Semtech)

Mr. Carpenter reported that no progress has been made in this area. Mr. Velador noted that he has made several proposals but pull test values were included and they that is not general information for test methods. This item will be carried over to the next meeting. Background: At the November 2010 Mr. Velador updated the committee on the activity in the development of a test method for Pull test. A survey ballot, JC-22.2-10-81, was distributed; and expired May 13, 2010; Mr. Velador did not report on the survey results. From previous committee discussions, Mr. Walters indicated there should be no absolute pull test limits (pounds) included and should only describe the method of pull test. Mr. Velador noted that several requests for changes were requested. He now has a revised proposed test method that he is working with DLA on. The document has become more complex and need to narrow down what is to be included in this test method. It was requested that DLA provide direction to this committee on what the focus should be on for a pull test. At the April 2011 meeting: Since this is a mechanical test for a



5

failure mode, it may need to be placed into the new proposed JESD282C-3 (User Guide) section. No mechanical tests have yet been defined in the prior historical JESD282B document.

ACTION C. VELADOR/K. CARPENTER

Mr. Velador to send the proposals to Mr. Carpenter, Mr. Carpenter to review the proposals and provide further direction.

22.2-011 General updates to JESD282-1, editorial changes (K. Walters)

New Table of Contents, Mr. Fried will make changes and send to Julie. Scope has been changed to include “Small signal” Title has also been changed to “Semiconductor Rectifier and Signal Diodes” Item 22.2-015 has been approved (JCB-11-75) for addition as 4.2.2.2, 4.2.2.3,

4.2.2.4, 4.2.2.5 and 3.4.1. Item 22.2-002 Inductive Avalanche Energy Test has been approved for addition as

3.2.2.10. Add definition from JC-10 approved ballot (JCB-03-53) that was not included in the

ballot (JCB-11-75) for Bridge rectifier diode. Add to T&D section. Under 22.2-12, once the BoD ballot is approved, can be included. All items listed under 22.2-014. This item will stay open for any editorial changes needed to the document (no letter ballot).

ACTION J. CARLSON Compile all approved items and send proof to Mr. Walters and Mr. Fried for final review.

22.2-012 New Test Method for Signal Diodes (3.2.2.9) (K. Walters, Microsemi)

Mr. Walters reported that this material is approved for BoD ballot. Once this item is approved this will be published as JESD282-1, section 3.2.2.9. From November 2010: Mr. Walters reported on the status. An extensive email was distributed on 7/8/2010 to committee members discussing this and other related matters for reformatting test methods from JESD282. The material for nonrepetitive forward rectangular surge test on signal diodes was reballoted as JC-22-09-262 (expired November 24, 2009), and approved. At the April 2010 meeting this item was approved for BoD ballot submittal as a new standard JESD282-B4066. However a BoD ballot was not issued since it involves reformatting the JESD282 document. This item will be discussed further using the JC-22 discussion board since it relates to the overall effort to separate test methods from JESD in a similar numbering format as the test methods in MIL-STD-750. Action: K.WALTERS/J. CARLSON: It has been determined the new numbering format similar to test method in MILSTD-750 will not be used. However the document will be split into three distinct parts to help make it more user friendly.

ACTION J. CARLSON

Prepare material for BoD ballot, as K. Walters.



6

22.2-014 Implications of separating TMs from JESD282 (B4064, B4065, B4066)

The committee discussed the issue of the new numbering system for Test Methods (TMs) further, after much discussion the committee has agreed on the following: The numbering system using the TM numbers causes some confusion, the material

previously approved under the new numbering system will return to the original formation and be incorporated into JESD282

JESD282 will be split into 3 separate documents, for 1) Terms, Definitions and Test Methods that will be published as JESD282-1; 2) Registration involving Procedures and RDFs (section 2 and 3) that will be published as JESD282-2; and 3) User Guide (section 6), this will be published as JESD282-3. The titles of the documents will have the main JESD282 title with the addition of the title of the section.

Addition of an Annex in JESD282-1, this annex will be a cross reference between JEDEC TMs and MIL TMs for Diodes. (Bob Fried). Received: 4/29/2011

ACTION K. WALTERS

Review cross references by Bob Fried received 4-29-11. 22.2-015 Proposed revision and addition to JESD282 sections 4.2.2.2, 4.2.2.3, 4.2.2.4, 4.2.2.5

for surge and section 3.4.1 for temperature

Mr. Walters reported on the ballot results of JCB-11-75, this ballot was approved. The material is now ready for inclusion in JESD282-1 as 4.2.2.2, 4.2.2.3, 4.2.2.4, 4.2.2.5 (for surge), and 3.4.1 (for temperature).

22.2-016 Proposed changes to RDF

Mr. Fried reported that JEDEC needs to has convert the files to word since there was no editable version available. To date Mr. Fried has only received RDF-21, Ms. Carlson will send the remaining files to Mr. Fried to make the editorial updates for RDF-22, 23, and 24. Background: Mr. Fried recommended to change “silicon” to “semiconductor” in the RDFs. He also recommended that the slot for the package number should be left blank and the applicant can enter the appropriate package outline. The following RDFs are the ones that will be changed: RDF-21, RDF-22, RDF-23, and RDF-24.

JC-22.2 OLD/NEW BUSINESS 22.2-xxx Forward current derating

There is no support to create a test at this time, however the committee felt it would be a good addition. Mr. Fried noted that the Motorola Diode handbook has a very detail description on this subject. It was requested that this material be reviewed by the



7

committee for discussion for possible inclusion in JESD282-3 (User Guide) if permission is received from Motorola. Mr. Fried will contact Joe Fulton to discuss issue. This item carried over to the next meeting. Background: Mr. Fried noted that in the current JESD282 there is no method for forward current derating. He feels one should be added. After further discussion, Ms. Carlson will send an editable copy of JESD282 to Mr. DiBugnara to try adding a new section on this topic since he has done previous modeling on forward current derating.

ACTION B. FRIED

Mr. Fried to contact Joe Fulton on the use of material from Motorola Diode Handbook and report back to the committee.

22.2-xxx PIND testing (inability to detect gold flakes)

Mr. Andis reported that an issue has been found with PIND testing (resolution), when samples come in, rejects have been found (on a JANS part), see attachment 1. The vendor noted that the part passed JANS testing, so Raytheon was contacted and they stated the same, however when Crane did the test at same frequency they found particles in the package. The particles are die attach material (lid seal). This could be a calibration issue. Crane sent rejects back and the supplier then found the reject. The question arises why they were not caught the first time. Repeatability and resolution questions arise when you get to the smaller size, found in 1, 2, 3 mil products. Mr. Walters noted that there could be a bias PIND test (vibration), Crane agreed with this concept. Mr. Walters made the proposal over 15 years ago in JC-13. The committee requested that if possible Mr. Walters find the proposal and upload it to the member area for further committee review and comment. This item may also be proposed at the JC-13 meeting if found for further review. Mr. Andis would also like to look into the transducer calibration (excelerometer sensitivity for different packages). There may also be a need to look at the output signal of the unit. This item is carried over to the next meeting.

22.2-xxx Braze Joint Inspection Requirements

Mr. Andis reported on Braze Joint Criteria, see attachment. A normal brazed joint covers 360 degrees around the post. The photo provided in the attachment details less than 270 degrees. Currently there is no Military Specification Criteria to address this where both TM2071 and TM2074 do not address this issue. It was suggested for clarification to change TM2074 from 90% circumference braze joint coverage for “lead attach” to “terminal attach”. Others agreed with this suggestion. It was indicated there is also a need to define what is considered brazed and what is eutectic in paragraphs D1.4b versus D1.4c. Also review TM2071 accordingly.

JC-22.5 TRANSIENT VOLTAGE SUPPRESSORS (B. Travis, Littelfuse) Mr. Travis was not present to report on the activities of the committee, an agenda was not provided.



8

22.5-002 Proposed Revision to JESD210, for temperature derating (B. Travis, Littelfuse)

The BoD ballot is still pending. April 2011: The committee reviewed the new drawing for Figure 7, the committee agreed with the new drawing. November 2010: It was noted that JC-22.5-09-89 passed and all comments from Mr. Walters were resolved. This item is approved for BoD submittal. April 2010: Mr. Walters indicated this method of derating TVS devices should also eventually be referenced in the applicable military detail specifications.

ACTION J. CARSLON/B. TRAVIS

Julie to send corrected file to Mr. Travis. Mr. Travis to prepare material for BoD ballot. 22.5-003 Proposed New Standard for PES (B. Travis, Littelfuse)

No report at this time. April 2011: Mr. Travis reported that this item has not been reballoted as directed at the November 2010 meeting. Mr. Travis noted that there were figures that need redrawn. Once the material has been updated this item will be reballoted as JC-22.5-09-141A.

ACTION B. TRAVIS

Prepare material for reballot. Upload to the JEDEC Voting Machine. 22.5-004 Possible new Low capacitance surge suppressor specification (K. Walters,

Microsemi)

Mr. Walters reported on the current status of this item where new JEDEC assigned part numbers need to be initially registered for low capacitance TVSs. However the RDF-12 needs to be updated to include those type TVS designs as also now identified in JESD210. Once the RDF is updated to include information for low capacitance, Mr. Walters can submit the proper information to begin process for a new low capacitance slash sheet. Mr. Walters will send Mr. Fried the information needed for Low Capacitance.

ACTION J. CARLSON

Prepare RDF-12 in editable format, send to Mr. Fried. Mr. Fried will update the RDF to include the information as needed.



9

JC-22.5 NEW/OTHER BUSINESS 22.5-005 Reference for RDFs in JESD66, JESD210, and JESD211 This was a new item at the April 2009 meeting. The following should be added to the introduction of each document: JESD210 (ABD) For the purpose of achieving, specific registration formats are available to fit particular types of avalanche breakdown diodes. These formats are subject to change as new semiconductor developments or circuit applications become practicable. At present, the following formats are available: NUMBER DESCRIPTION RDF-12 Diode, Voltage Transient Suppressor Family (note: document missing from website) JESD66 (TSPD) For the purpose of achieving, specific registration formats are available to fit particular types of thyristor surge protective devices. These formats are subject to change as new semiconductor developments or circuit applications become practicable. At present, the following formats are available: NUMBER DESCRIPTION RDF-27 Thyristor, Diode, Transient Voltage Suppressor, UNIDIRECTIONAL RDF-28 Thyristor, Diode, Transient Voltage Suppressor, BIDIRECTIONAL JESED211 (Regulator/Zener Diodes) For the purpose of achieving, specific registration formats are available to fit particular types of Zener and voltage regulator/reference diodes. These formats are subject to change as new semiconductor developments or circuit applications become practicable. At present, the following formats are available: NUMBER DESCRIPTION RDF-2 Diode, Voltage Regulator Single Unit or Family RDF-7 Diode, Voltage Reference, Single Unit ACTION J. CARLSON

Add reference to JESD66 and JESD210 when revised as prepared by Mr. Fried. It was noted that this was not added to JESD211 when it was published in December 2009, since it was approved by the committee to add it prior to publication it was agreed that this should be an editorial change to JESD211, Julie to add the text to JESD211and publish as JESD211.01. (JESD210 is currently under ballot.)

8 NEW BUSINESS As a reminder to the committee the following is included:

One committee list has been made for distribution. To send email to all JC-22 members the email address is: [email protected]



10

An item log was created for each point committee and presentations/proposals are being assigned an item number for improved communication and reference. See the JC-22 Members Area.

Files can be uploaded on the JC-22 members area page, and are automatically disseminated to the committee members. For quicker reference please incorporate the item number into the file name when uploading.

IMPORTANT: All material uploaded/distributed to JC-22 for discussion should have the word “PROPOSED” on it.

Reaffirmation of Old Standards The 5 year document review went out on ballot, 22.2-11-44 received 1 vote, the committee discussed the documents and felt at this time they are all still viable documents and the committee wished to reaffirm all the documents listed. All documents listed will be reaffirmed as of November 2011. Doc. # Pub/Reaffirm Date Doc. # Pub/Reaffirm Date JESD4 R: April 2002 JESD320A R: April 2002 JESD5 R: April 2002 JESD323 R: November 2002 JESD14 R: April 2002 JESD381A R: April 2002 JESD66 R: November 2006 JESD397 1972 JESD286B April 2005 JESD482A R: April 2002 JESD307 R: April 2002 JESD531 R: April 2002 JESD318 July 1996

9 FUTURE MEETINGS The next meeting will be April 4, 2012 in conjunction with JC-25 at the Columbus Hotel in Columbus, OH. The following are future meeting dates: November 14, 2012 Lago Mar, Ft. Lauderdale, FL 10 ADJOURNMENT There being no further business, the meeting was adjourned at 1:00 p.m. on November 16, 2011 by common consent. THIS MEETING WAS CONDUCTED IN ACCORDANCE WITH JEDEC LEGAL GUIDES AND THE LATEST REVISION OF THE JEDEC MANUAL OF ORGANIZATION AND PROCEDURE, JM21.

01/03/12 Kent Walters, Microsemi – JC-22 Chair

12/20/11 Julie D. Carlson – Secretary

01/03/12 Date of Legal Approval

In AppreciationIn Appreciation

Carl Carl MowryMowryNovember 2011November 2011

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ATTACHMENT 7

Presentation toPresentation toMr. Mr. MowryMowry for his for his

Outstanding ContributionsOutstanding Contributions

At the November 2011, JC-22/JC-25 Meetings

JC-22 Chairman Kent Walters, JC-13.1 Chairman Chris Valedor,

Daniel Lopez (Semtech), Ken Andis(Crane), and Julie Carlson of

JEDEC met with Mr. Mowry and presented him with a plaque in

appreciation of all his contributions over the past

25 years…

The plaque

Carlton Carlton MowryMowry

In appreciation of his many outstanding contributions to In appreciation of his many outstanding contributions to the JEDEC Solid State Technology Association over the the JEDEC Solid State Technology Association over the past 25 years. JEDEC has been the beneficiary of his past 25 years. JEDEC has been the beneficiary of his

leadership and technical expertise through his leadership and technical expertise through his participation in the JCparticipation in the JC--13, JC13, JC--22, and JC22, and JC--25 Committees.25 Committees.

Mr. Mr. MowryMowry’’ss leadership skills have been most evident leadership skills have been most evident during his service as a Vice Chair of the JCduring his service as a Vice Chair of the JC--13.1 13.1

Subcommittee, and his stewardship of many task groups Subcommittee, and his stewardship of many task groups from 2004 from 2004 –– 2010 was extraordinary. He is commended 2010 was extraordinary. He is commended

for his commitment to continuous improvement of the for his commitment to continuous improvement of the quality and reliability of Industry products to ensure quality and reliability of Industry products to ensure

mission success for our armed forces personnel who are mission success for our armed forces personnel who are called on to defend our freedom. called on to defend our freedom.

Also greatly appreciated has been his sense of humor and Also greatly appreciated has been his sense of humor and ability to lighten the mood during and after the meetings ability to lighten the mood during and after the meetings

whether through his great stories or his dancing feet!whether through his great stories or his dancing feet!

November 2011November 2011

A great afternoon spent in

Jupiter, FL catching up

with our long time friend.

1 1


DEFENSE LOGISTICS AGENCY

AMERICA’S COMBAT LOGISTICS SUPPORT AGENCY

DLA Land and Maritime


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ATTACHMENT 8

2 2


DLA Land and Maritime

MIL-STD-750 Discussion

Kyle Carpenter

DLA-VAC



3 3


Discussion Topics

- 750 Status

- 1051 EP Study

- Future Material



4 4


MIL-STD-750 Status

- 750 released on 1/3/2012.

- Effective date 7/3/2012. All necessary changes must be

made and documented by this date.



5 5


Future Direction of MIL-STD-750

- Address customer-specific needs/requests.

- Review Conformance Inspection Test Methods.

- Re-validate the oldest test methods.



6 6


1051 EP Study (5961-2011-091)

- Released on 26-September-2011.

- Method revised to allow for the use of diffusers to aid in

ramp rate control.

- Alternative Test Method Approval (19500 E.3.7.1)



7 7


Alternate PIND Test

- PIEF (Particle Impact Electrical Fault).

- Intended as a replacement for PIND (Method 2052).

- Vibration table coupled with a bias voltage. Any particle

which causes bridging will weld itself, resulting in a

permanently shorted device.



8 8


Future EP Study

- 1071 Condition E (Number not yet assigned).

- Initiated to create a test plan for the comparison of different zyglo

test fluids and demonstrate their capability for reliably detecting

gross leakers.

- Determine if the standard is specifying the test condition

correctly.



9 9


New Test Methods

- Creating new 750 test methods to replace slash sheet

specific tests.

- Examples: Noise Density (/483), Saturated Time (On/Off)

(/255), Effective Carrier Life (/444), Charge Storage Time

(/317), Collector to base time constant (/391), Emitter to

Collector On-State Resistance (/381).



10 10


New Bond Pull Test for SMDs

- Purpose is to simulate stresses imposed on a surface

mount device during installation, operation, removal and

rework.

- Initial visual examination (10X) and A2 electricals.

- Stress DUTs.

- Post visual examination (10X) and A2 electricals.



11 11


Digital Radiography

- Establish minimum apparatus and training requirements.



12 12


New Comments

- All new change proposals will be released as EP Studies.

- Technical work will be completed by JC.22/25.

- Next JC.22/25 meetings will be held in Columbus, OH (April 3rd-4th)



13 13


Kyle Carpenter

DLA-VAC

[email protected]

(614) 692-7078




JC-13.1

TG 11-03

Charter: Define Criteria for a Stacked Junction Diode.

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ATTACHMENT 9

TG 11-03

• Scope-

Review MIL-PRF-19500 and propose additions and/or changes to define a stacked junction semiconductor and address structural identification of stacked junction device types.

TG 11-03

2 Passive, 2 Active Die



TG 11-03 MIL-PRF-19500 Appendix A A.3 SEMICONDUCTOR COMMON DEFINITIONS A.3.35 Semiconductor diode. A semiconductor device

having two terminals and exhibiting a nonlinear voltage- current characteristic.

Proposed Stacked Junction Definition Stack junction semiconductor diode. A semiconductor device having

two terminals and exhibiting a nonlinear voltage-current characteristic with two or more active and/or passive die that are Category I metallurgically bonded together in a series configuration to gain the additive effect of the reverse blocking capabilities of each individual active die.

MIL-PRF-19500 Appendix E

E.3.2 Structurally Identical Device Types

a. Rectifiers, signal diodes, or thyristors grouped into different voltage ratings. Standard recovery, fast recovery, and ultra fast recovery rectifiers are not typically considered structurally identical. Rectifiers and diodes with identical design rules (same doping technique, passivation, and device structure) which differ only in die size and package size are considered structurally identical. Initially, group B and C shall be performed on each device construction. On subsequent lots, the die sizes/package styles, which receive group B and C inspection, shall be rotated on every lot thus assuring that all die sizes/package styles receive groups B and C inspection.

Proposed Sub-paragraph for Stacked Junction Structural Identification

e. Stack junction rectifiers and diodes with identical design rules (same doping technique, passivation, and device structure) which differ only in active die count and package size are considered structurally identical. Structurally identical stack junction rectifiers and diodes may differ in size in the X, Z and Y axis1/. Initially, group B and C shall be performed on each die size as defined by the X and Z axis. On subsequent lots, the die count/package styles that receive group B and C inspections shall be rotated on every lot maximizing Group B and C inspections for active die count and package styles.

1/ Axis orientation defined in MIL-STD-750, paragraph 4.2.

TG 11-03

MIL-PRF-19500

Appendix C

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ATTACHMENT 10

• QUALITY MANAGEMENT PROGRAM • C.1 SCOPE • C.1.1 Scope. This appendix outlines a Quality Management (QM) program and has been prepared to allow

manufacturers to produce high quality, reliable military discrete semiconductors under one quality system utilizing best commercial practices. However, manufacturers who choose to participate shall be fully complaint to appendix D and shall implement a Technical Review Board (TRB), and conduct product quality planning. Manufacturers with a certified QM program will be approved by the qualifying activity to pursue process and test optimization. This level gives unique flexibility to applicable suppliers. A qualified manufacturer is a supplier who is compliant to this appendix and who exercises a system which focuses on the manufacturing process and technology capability. The DLA Land and Maritime audit is process oriented. This appendix is a mandatory part of the specification. The information contained herein is intended for compliance.

• QUALITY MANAGEMENT PROGRAM • C.1 SCOPE • C.1.1 Scope. This appendix outlines a Quality Management (QM) program and has been prepared to allow

manufacturers to produce high reliable, JAN, and JANTX quality level military discrete semiconductors under one quality system utilizing best commercial practices. However, manufacturers who choose to participate shall be fully complaint to appendix D for JANTXV & JANS quality level product. Manufacturers with a certified QM program will be approved by the qualifying activity to pursue strategies that improve product flow and focus on manufacturing processes and technology capability. Land and Maritime audits will be process oriented and the surveillance period may be extended. This appendix is a mandatory part of the specification. The information contained herein is intended for compliance.

MIL-PRF-19500 Appendix F

Non-Hermetic Semiconductor Devices JC-13.1

8 February 2012 Paul Syndergaard

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ATTACHMENT 11

Agenda:

• Introduce/finalize team scope

• Background for request

• Presentation by Jeff Jarvis

• Current non-hermetic MIL-PRF-19500 slash sheets

• Recommendations/concerns

• General discussion

Task Group

• Title: Non-Hermetic Semiconductor Devices

• Scope: Add quality requirements, qualification, and monitoring programs for non-hermetic packages in tactical applications to MIL-PRF-19500

• New requirements to be implemented as appendix F to facilitate implementation into MIL-PRF-19500

Background

• MIL-PRF-38535 Class N is plastic encapsulated integrated circuits.

• Military programs that require semiconductor devices not available as hermetic parts currently purchase non-military spec parts

– Automotive grade or commercial grade as available

– Upscreening performed if required by the program.

• Several plastic encapsulated slash sheets exist with no suppliers.

Non-Hermetic Slash Sheets

• Existing non-hermetic slash sheets and PIN

/672 2N2222A /674 2N2484

/686 2N2907 /691 1N4148

/694 2N3700 /695 2N4033

/696 2N7537 /714 2N7558

/715 2N7563 /716 1N5629

/717 1N6072

Slash sheet issues

• Current non-hermetic slash sheets contain two different group test templates

• /696 stresses are similar to automotive AEC-Q101 and JEDEC JESD47 requirements – Uses JESD22-A113 preconditioning and JESD22-

A102 autoclave. No equivalent tests exist in MIL-STD-750

• All other non-hermetic slash sheets have non-standard test requirements.

Recommendations

• Build on existing automotive flows if in place – TS16949 with semiconductor supplement quality

system – AEC-Q101 qualification requirements with a sub-set

for ongoing monitoring

• Add only critical requirements to upgrade to military non-hermetic – Additional requirements for suppliers that are not

TS16949

• Existing PPAP information to satisfy MIL-PRF-19500 requirements as applicable/available

Concerns

• Will the part number be an existing JEDEC part number or a new number?

• How will new part number fit into DLA and DOD procurement systems?

• Will new number be a National Stock Number?

Open Discussion

ATTACHMENT 12

Documents

JC-13.1 Subcommittee on Discrete Devices Minutes of ... · Micropac Industries, Inc. Chris Caletka P 972.272.3571 x 1274 [email protected] x x x x x x Micropac Industries,