20044ISO140002010""
7.
17.
18.
19.
21.
22.
23.
24.
25.
32.
33.
34.
46.
64.
65.
3. 3,
4. 80,,,,,,,,
5. 5,
6. 2,
[email protected]
3. 3,
4. 80,,,,,,,,
5. 5
6. 2,
[email protected]
1. 101. CET-42. CC++1. 2. BIOS//3. Debug/
2. 31. CET-42. 1. 2. //3. 4. 5.
3. 21. CET-42. MS OFFICE1. 2. 3. ,4. 5. 6. 7.
4. 3CET-41.2.PCB3.
5. 2CET-41. 2.3.
6. 11. CET-62. 1. 2. 3.
7. 31.CET-42. 1.2.3.4.
8. Web61. CET-42. Java.NetC/C++shellweb3. SQLoracleMySQL1. ASUS2.
ASUS3. ASUSCMS4. ASUS
9. 10CET-41.2.3.4.CPU IC 5.
10. Android 101. CET-42. CC++JAVA1. Bring up2. HAL3. 4. bug
11. 51. CET-42. CC++1. ASUS INTEL/AMD2. ASUS Chromebook3.
12. 1CET-41./2.3.PCB 4.,5.
[email protected]
2000390030 /!!!!
1. 40
2. 15
3. 8UGCATIA AutoCAD pro/E3D
4. 10,,
5. 6
6. 3,
7. 2
[email protected]
2. SOFTWARE QA ENGINEER / 4RESPONSIBILITES / QUALIFICATION /
:CET4(425)TOEFL(80)QAWindows OSQA
[email protected]
1.10123123Windows.NET,C#ASP.NETXMLWebService4SQLSERVERSQL5RS232RS485IICPS2PLC6PCB7
2.21234512345
3.3123451234
4.51234512RS232RS485IICPS2PLC3PCB45
5.512345123Windows.NET,C#ASP.NETXMLWebServiceADO.Net4JavaScript/AJAXHTMLDHTMLCSSXMLWEBVisualStudio.NET20085SQLSERVERSQL678910
[email protected]
[email protected]
1. 4 123FPGA4DSP56Cadence
2. 10 12345HFSSADSAuto cad6
3. 4 1234Auto CADOfficeSolidworks567
4. 2 123ISO9001IATF16949ISO140004
[email protected]
1. 2 120192345
2. 3 120192345
3. 4 120192345
4. 2 120192345
5. 2 120192345
6. 3 120192345
[email protected]
1. 1012Windows C/C++MFCATL34LinuxGUIGTKQTSDL
5(win32/linux/unix)6Android NDKJNI
2. 10 1/////2C3CPU456
3. IC10 1////2/IC34VerilogCEDA56IC7
[email protected]
1. 5EDACC++EMCSONIXHOLTEKPIC51
2. 5,VCC++STC 51STM32
3. IC5/verilogEDAcmos
4. 5,STM3251KEILCIIC,SPI,UART,USB
[email protected]
1. 101.2.()3.asp.NETJava4.,OracleSQL Server5.,6.
2. 51.62.3.4.5.6.
3. 101.62.3.4.5.6.
4. 40 1. 2. ()3. asp.NETJava4. ,OracleSQL Server5. ,6.
[email protected]
1. 1htmlcssjavascript Vue React
2. 1
3. 1
4. 12
5. 1
6. 1
7. 1
8. 12
9. 1
10. 12
11. 1
12. 1
13. 1
14. 1
[email protected]
1. 21. 2. 3. 1. 2. 3.
2. 21. 2. 1. 2. 3.
3. 21. DOE2. 3. 1. 2. 3.
4. 21. 2. 3. 4. 1. /2. 3. 4. ARM+Linux5. OpenCVHalcon6.
Matlab/C/C++7.
5. 21. 2. 3. 4. 1. /2. 3. 4. 5. 6. Matlab/C/C++7.
6. LabVIEW8 1.2.3.LabVIEW4.5.6.
7. PLC8 1. 2.3.PLC4.5. 6.
8. 41.2.3.4.1.2.3.
9. 81.2.3.1.2.C++C#3.4.
10. 81.2.3.1.2.C++C#3.
11. 151.2. 3DBOM3.1.2solidworksautocad3.4.
12. TPM81.DOE2.3.4.1. 2. 3. 4. ,
13. TPM81.2.3.4.1.2.3.4.5%
14. TPM51.DOE2.3.4.1. 2. 3. 4. ,
[email protected]
2. MEMS2,MEMS
3. ASIC2,ASICASIC
4. 2,/
5. 3,
6. EMCCD2,,EMCCD
7. CMOS2,,EMCCD CMOS
8. Soc2,SOC
9. 2,
10. 2,
11. 9,,
12. 2
13. 4
14. MEMS3,,MEMS
15. 2,,
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
1. |PM10 12SolidWorksAutoCAD3
2. ||10 1 2solidworksAutoCAD C/C++/C#/LabviewSiemensPLC3 4
[email protected]
1. 5
2. 5
3. 5
4. 5
5. 5
[email protected]
1. 151234PROE5
2. 101 2PLC3 45
3. 51 ,2 3 4 C++VCopencvHalcon
4. 31 C++, MFCQT 2 3 SVN 4 Windows5
5. 51 /2 3
6. 101 23
7. 10123, , 4
8. 312C/C++/345- - DSP- ARM
RAMROM(E)EPROMA/DD/A6UARTI2CI2SSPIUSB789/FFT10
[email protected]
[email protected]
1. 10
[email protected]
1. 31.2. 3.
2. 3:12345:12C/C++3Linux GCC 45JSQT
3. 3,:1.linux2.armC3.:123Linux4C/C++
4. 2,,:1234:12C/C++OpenCVMATLAB3ROSOPENSLAM45RobotCupROS MRPT
openslam
[email protected]
“”“”2006CNC150“”
1. 2123
2. PMC2123
3. 2123
4. QE5
5. 1219852112CAD34
6. 512CAD3
7. 7123
8. PM8123
9. /312
10. 212
11. 212
12. EHS112
13. 41
[email protected]
1. 3,1.2.3.4.5.6.7. 1.2.3.
2. 8,1.2.BOM3.EMC4.1.2.3.ProtelADPCBlayout4.saber
3. 2,1.2.1.Cproteus2.MCU/DSP3.SPIIICAD
4. 11.SOP2.3.4.5.1.IPC-6102.3.
5. 21.2.CADProESolidWorks
6. 11.2.3.AICoreDrawPS
7. 11.LED2.pcb3.4.1.2.
8. 51.2.EMC3.BOM4.1.2.3.Tektronix4.Protel99Altium Designer
9. 11.2.3.1.2.3.
10. 11.2.3.1.2.3.
11. 11.2.3.4.1.PSAICDR2.3.
[email protected]
[email protected]
1. 11.2.C++ Linux3., 4.
2. C/C++11.2.C/C++QTLinux3.4.5.
3. 11.SLAM,GPS2.C/C++,OPenCV,MATLAB3.ROS ,SlAM4.,5.
4. 11.,GPS2.C/C++OPENCV/VisonProMATLAB3.ROS ,SlAM4.,5.
[email protected]
()
80050
3. 1
4. 1
5. 1
[email protected]
2.301////2DOESPCFEMA30
3.301//2SolidEdgeAutoCADPro-ECAE/
4.3012343030
5.301///2C/C++30
6.3012345123456
7.2123“”12345
8.30,,,,1///2MMX/SSE
9.AOI301AOI2AOI3123
10.3011//2CC++3WINDOWS30
11.301.2.1//23
12.301/2Zemax/CodeV/SOD88AutoCAD/ProE/SolidWork/SolidEdgeCAE/30
[email protected]
[email protected]
1. 112CAD/PRO/UG/SOLIDWORK34
2. 112345
3. 11//2CAD,3DMAX,PS,SKETCHUP34
4. 112CAD/PRO/UG/SOLIDWORK34
5. 11234
[email protected]
()
1. Engineering Graduate10A minimum 2:1/ GPA 3.5 in an Engineering
degree Excellent science and maths academic background Have
graduated in the past two years. Strong interest in engineering as
a career with ambitions to continually learn Committed and able to
work in a changing environment Self-starter and self-sufficient -
will hit the ground running Strong desire to work across a global
business Innovative thinker and problem solving attributes
[email protected]
Virtually Every Electronic Device in the World Is Produced Using
Orbotech Systems The world of high-tech is a demanding one. The
speed of change is rapid - the uncertainty substantial. Its players
face relentless pressure in delivering innovative technological
solutions, while ensuring the highest quality and providing the
fastest turnaround at the most competitive price. Against this
backdrop – Orbotech excels and is the sure choice for those
aspiring to minimize risk and achieve stability, while moving
forward. Orbotech's proven track record and our passion for
technology enable manufacturers to meet their most demanding goals
– time after time. What We Do For over 30 years, Orbotech designs,
develops, manufactures, markets and services automated optical
inspection (AOI) systems for bare PCBs, FPDs, and imaging solutions
for PCB production. Our innovative AOI, imaging and computer-aided
manufacturing (CAM and Engineering) technologies enable electronic
manufacturers to achieve the increased yields and throughput
essential for retaining their leading positions at the forefront of
electronics production. Our subsidiary, Orbograph Ltd., develops
and markets automatic check reading software to banks and other
financial institutions. How and Where We Do It More than a quarter
of Orbotech's 1,700 employees are scientists and engineers.
Our expert, multidisciplinary teams possess the advanced know-how
necessary for developing and providing advanced solutions and
technologies designed to meet electronic manufacturers'
long-term needs for achieving competitive success in their specific
markets. We maintain our corporate headquarters, executive and
registered offices and principal research and development,
engineering and manufacturing facilities in Israel and a strong
global organizational infrastructure, which includes local
management, research and development, logistics, customer service
and support, sales, operations and engineering activities. Our
Company’s extensive network of marketing, sales and customer
support teams, located in over 40 offices throughout North America,
Europe, the Pacific Rim, China and Japan, delivers its knowledge
and expertise directly to our customers the world over. - – PCBFPD
PCB (AOI) AOI (CAM) Orbograph Ltd. 1,700 35
3. 2
[email protected]
1. 51.2.
2. 51.2.PLC 3.
3. 51. 2.AutocadCatiaUG 3.
[email protected]
1. 201. 2. 3. 4. 5.
2. 201. 2. 3. 4.
3. 301. 2. 3. 4. 5.
[email protected]
[email protected]
8. 4 1. 2. 3. 4. 5. 6. 7.
9. 21 2 345 6 7
10. 2 1 23
11. /5 1. 2. 3. 4. 5. 6.
12. 5 1 2
13. Java5
14. 5
15. 5
()
1. 21211/985 2
2. 31211/985 2
3. 11211/985 2
4. 11211/985 2
5. 11211/985 2
6. 21211/985 2
7. 11211/985 2
8. 21211/985/ 2
9. 21211/985/ 2
10. 31985/ 2
11. 21211/985/AI 2
12. 41211/985 2
13. 21211/985 2
14. 31211/985 2
15. 11211/985 2
16. 11211/985 2
17. 11211/985 2
18. APP11211/985 2
19. 41211/985 2
20. 21.211/985 2.
21. 11211/985 2
22. 21985 2
23. 21211/985 2
24. 21211/985 2
[email protected]
1. 10
2. 101 2 3
[email protected]
1. 21 2 3 4cuda opencl python 5
2. 21C/C++ 2 3TCP/UDP 4DirectShowGstreamerFFMPEGLive555
5RTMPRTSPRTP/RTCP 6 7 8 9
3. 21C/C++/Java/go 2 3 4 5
[email protected]
1. 20 1 2 3 4
2. 20 1 2 3 4 5
[email protected]
()
Prodrive Technologies group is a private owned company which
contributes to meaningful innovation that tackles major challenges
in society. The company creates technologies that are essential
links in the systems which form the basis for today’s and
tomorrow’s world. Nowadays Prodrive already employs over 1.200
highly educated professionals, which are creating (developing and
manufacturing) meaningful technologies that make the world work
almost 50% of employees are R&D. Prodrive Technologies
serves an international customer base of leading technology
companies. To serve these companies in the most optimal way, they
have implemented a local for local strategy worldwide. Wherever
their customers are, they follow. Up to now this has led to an
international install base of 5 locations worldwide, which is
continuously expanding. At present, these locations are: 1.China,
Suzhou. Although present with supply chain management already for a
long time, Prodrive has opened its first factory in Asia in 2016.
2.Netherlands, Son (Eindhoven). The home base of Philips since 1891
has since expanded to the innovation and manufacturing hub of
Europe. Hosting a multitude of internationally leading technology
companies, Eindhoven is developed to a breeding ground for the best
R&D engineers available in Europe. This is also where it
began for Prodrive 25 years ago, ever since growing autonomously to
the company it is today. Their Son headquarters has deep roots into
the Eindhoven high-tech ecosystem. 3.USA, Boston. Close to MIT
University, a copy exact factory is being constructed with the aim
to serve their customers on the North American continent.
4.Germany, Stuttgart. In the middle of Germany’s automotive heart,
Prodrive Technologies is present. Serving their customers locally,
optimal response times and attention are provided. 5.Tel Aviv,
Israel. Prodrive Technologies has moved into the Israeli ecosystem
which consist out of high-tech international companies.
1. Electrical engineering10Are you the eager, ambitious and
promising Electrical Engineer with a focus on digital electronics
that we are looking for? Do you want to work in a young and dynamic
environment? Do you want to work on challenging, multi-disciplinary
projects in a high-tech environment? As Electrical Engineer you are
responsible for the development of digital electronics and will
work with: ?DSPs (Multicore, ARM, High Speed Interconnects)
?Microcontrollers (32-bit) ?FPGAs (Xilinx en Altera) ?Memories
(DDR, FLASH) ?Communication protocols (RapidIO, GigE, CANopen,
PCIe) ?Supercomputers, High-performance computing ?Displays You
will be involved in the entire design process. This includes
responsibilities such as writing specifications, discussions with
our customers, designing, qualification and finally preparing the
product for in-house production. During this entire process you
will have to take the wishes of the customer into account and have
a constant focus on quality. Hands-on mentalityPragmatic attitude
team work. 211/985//
2. Mechanical engineering10Category: Mechanical Engineering jobs
(M) Education Level: BSc / MSc Position Are you the eager,
ambitious and promising Mechanical Engineer that we are looking
for? Do you want to work in a young and dynamic environment? Do you
want to work on challenging, multi-disciplinary projects in a
high-tech environment? As a Mechanical Engineer you will work on
systems involving robotics, cabinets, precision mechanics, and/or
optomechanics. Where you need to consider kinematics, dynamics and
structural analysis. You will be involved in the entire design
process. This includes responsibilities such as writing
specifications, discussions with our customers, designing, generate
detail CAD designs, qualification, support system integrations and
finally releasing for production. Within Prodrive almost all
qualification assets and means of production are available. For
example, climate chambers, dust chambers, electro-dynamic shakers,
IP chambers, (high speed) milling equipment, molding equipment,
etc. Profile ? BSc or MSc Mechanical Engineering ? Familiar with 3D
mechanical design software ? Knowledge of constructional systems
and structural analysis ? Affinity with design for
manufacturability (DFM) ? The desire and drive to excel in your
field of work ? 3-5 years working experience is preferred, passion
for technology certainly is ? Responsible for design the connectors
and also the robotics solution ? Responsible to set up an entire
new competence/process, fully automated connector assembly Your
benefits When you are able to prove that you are the perfect fit
for our job, you will be rewarded in many ways: you will get the
chance to develop yourself as a person, gain extensive knowledge
and develop your career in multiple directions. Besides that, you
will – naturally – be offered a market competitive salary and
outstanding secondary conditions. Your salary growth is in line
with your own professional development so it can grow fast and you
will even get the opportunity to become a shareholder. All this at
an employer that has achieved an average annual growth of 25% over
the last 20 years! Hands-on mentalityPragmatic attitude team work.
211/985//
3. Software engineering:10 1. PC 2. 0-3 3. 4. 5. 6. Hands-on
mentalityPragmatic attitude team work. 211/985//
[email protected]
IC
1. 1122D3D3
2. 112PLC3
3. 111,2
4. 1/,C++JAVA,WindowsIOT
[email protected]
1. AI11 2
2. 11 2C/C++ARM Cotex-M/A 3linuxU-BootKernel
3. 51 2 3PLC
4. 51 2C++/.NET C#TCP/IP 3ORACLE/MS SQL/MYSQL
5. 51 2SLAMVSLAMC++Opencv,eigen
6. 51 2Matlab, C++C# 3
7. 51 2 3
[email protected]
1. 10· Proficiency in Bash and Python; Great interpersonal
skills: capable of collaborating and brainstorming with technical
staff and management to create an overall collaborative working
relationship; Fluency with distributed source code management
tools; Debugging, profiling, idioms and best practices for JVM
languages; Automation via shell scripting; Understanding of
microservices; Java, Scala, and Groovy experience a plus
2. 5Bachelor's degree or equivalent (Computer
Science/Engineering/English are preferred) Industry experience in
quality assurance is a plus Experience writing and executing test
cases is a plus Experience with cloud software or Saas testing is a
plus Strong problem solving skills Excellent communication skills
and ability to work well in a team CET6 certification is a
plus
[email protected]
2004“”5 87 HUB 808 500 500500 (500)(500)GGB500 500ROSTI(500) 3020%
10“+”8 -------
1. 101 2 3 4
[email protected]
1. 61 2 3 4
2. 1 1 2 3
3. 1 1. 2. 3 3. 4. AutoCADProESolidWorksANSYS 5. 6. Office
4. 21 2 3 1 2 3 4
5. 2 1EMC 2 3 1 2 3 4/packBMS 5 6 7
6. BMS21BMSBMS 2BMS 3BMSBMS 4BMS 1 2BMSBMSCAN 3 4BMSOffice 5
[email protected]
1. 10,
2. 10(
3. 10
4. 10
5. 10
6. 10
7. 10()
[email protected]
2. 21. 2. 3.solidworkspro/eoffice 4.3 5.
3. MEMS41. mem2 2. PVDCVDMEMS 3. solidworkAutoCADL-edit1-2MEMS 4.
5.
4. MEMS51. mem 2. PVDCVDMEMS 3. solidworkAutoCADL-edit1-2MEMS 4.
5.
5. 41. 2. 3. 4.MEMS 5.sci 6.
6. 51.2 2. 3. 4. 5.CET 6. 7.
[email protected]
1. 51 2 3 4
2. C++21 24 3VC 4 5ARXCAD
3. c++61 24 3C++C++ 4VC++VC++ 5/CAD 6MFC 7
[email protected]
1. 11. 2. 3.
2. 21. 2.PLC 3
3. 21 2 3 4 5
4. web21.HTML/XHTMLCSSDIV+CSSHTML5CSS3JavaScriptWeb
2.JavaScriptDOMBOMAjaxJSON
3.JSjQueryBootstrapBackboneAngularVUEReact 4.
5. Java21java 2spring 3JDBC 4
6. 3NI labview NI test stand RFC
7. 31. 2. 3.
8. IT11. 2.PC 3.
9. 31., 2. / 3.
10. 51. 2. 4.ProE,UG,Solidwork
11. 21. 2.PCIEEIM 3. I2CSPIUSBLCDDDR 4.bootkernel
12. C#31. 2. .NETVisual Studio.Net 3. ,TCP/IP, Xml
13. C++51. 2. Visual Studio 3. , , Xml 4.
14. Labview21. 2.NI 3.C/C++/.Nettest stand 4.PWMFFTFIR
15. 101. 2. 3.
16. 21.., 2.PL,C 3.
17. 51. 2. 3.CARM 4.
18. 11. 2. 3. Mat labOpen CVHalcon
19. FPGA51. 2.FPGA 3.VHDL/Verilog 4.IP
[email protected]
1. () - 11 1JavaC/C++ 2windows/Android 3windows/AndroidAndroid SDK
4
2. ) - 22: 1 2C/C++Java 351ARMMSP 4WIFI 5Linux
3. () - 22 1 2(candence,AD,PADS)PCB 3 5IICUARTSPI 6RF 7EMC
4. - 11 1 2 3feature extractionmultivariate temporal time-series
analysismultivariate regression analysis 4 5RPythonMatlabJavaC 6APP
7
[email protected]
1. 11 2 3 4
2. 31 23
3. 51 2 3 4 5
4. 31 23
5. 31 2JAVAJAVA 3EclipseideaIU 4SQL ServerOracleSQL
6. 21 2C/C++ 3 4ROSOpenCVSLAM,
7. 41 2 3 4
8. 41 2PCB 3CadencePCB 4
[email protected]
1. 51. 2. 3.
2. 51. 2. 3.
3. 21. 2. 3.
4. 21. 2. 3.
5. 101. 2. 3.
6. /31. 2. 3.
7. 51. 2. 3.
8. 101. 2. 3.
9. 101. 2. 3.
[email protected]
1. 3 - RTL - Verilog/System Verilog - - - - - C/C++ -
Perl/Python
2. IC3 - - RTL - - - - - Perl/Python
[email protected]
1. 51 2CMOS 3 4Datasheet 5
[email protected]
1. /40 - windowsoffice - .NETC#Oracle - -
2. 15 “”“” SQL ServerSQL visual studio
[email protected]
1. 20 1 2 3 4
[email protected]
1. 11, 2 3 c 4 5EDA 6 7BLE, TI/CSR 8I2C, SPI 9 10
2. 11 2 3pcb layou 4 5, 6
3. 11 2IC 3PCB 4 C 5LabVIEW
4. 113DSolidworksAutoCADUG 2FEAANSYS, Solidworks 3/ 4 5 6
5. 11 2 3pcb layou 4 5, 6
6. 11 2IC 3PCB 4C 5LabVIEW
7. MEMS11L-EditAutoCAD 2FEAANSYS- 3 4SEM 5MEMS 6
8. FAE5
9. 5
10. 11.3DSolidworksAutoCADUG 2.FEAANSYS, Solidworks 3./ 4. 5.
6.
11. 5
12. 5
13. 5
14. FPGA5
15. 1
16. 11, 2 3c 4EDA
17. 5
18. FA5
[email protected]
1. linux31 2 3C/C++ 4 5Linux uboot/kernel/rootfs 6LinuxLinux
7
2. 21 2 MCU DSP/FPGA 3 C/C++/Matlab Matlab 4 5 RTOS RTOS 6
Robocon/Robocup// 7 FatFs/YAFFS2SQliteuIP/LwIPMQTTJson 8 9
3. 21 2 3 Linux C/C++/Python/CUDA C/Matlab 4 OpenCV 5
Caffe/TensorFlow/MXNet 6 Robocon/Robocup//ACM 7 8
4. 51JAVASQLJAVA 2SpringSpringBootSpringCloudSpringSecurity
3DockerJ2EE 4JavaScriptHtmlCSSHtml5 5gitmaven 6 7
5. 51JAVASQLJAVA 2SpringSpringBootSpringCloudSpringSecurity
3DockerJ2EE 4JavaScriptHtmlCSSHtml5 5gitmaven 6 7
6. 51 211/985 2 3
7. 51 211/985 2 3
8. 51 211/985 2 3
9. 21. 2.Java RESTful API 3.SQL RDBMSMySQL(Transaction 4. 5. 6. 7.
8.
10. 21. 2. Web 3.Web 4.HTMLCSSJavascript Web
5.AngularJSNode.jsBackbone JS 6. 7. 8.
[email protected]
1. 1123
2. 11.2.
3. 11.2.3.
[email protected]
2. 1 1 2 spec 3 4 CoreSpec 5 PCB 6
3. 1 1 2 3C 4 5SPI/I2C/UART/USB 6PCB 7linux 8MJPEGH.264
4. 2 1 2PIXHAWK/PX4,APM 3C/C++/matlab 4 5PIDPID 6PCB 7
5. 2 1 SOC tape out 2makefileperlTCL or csh/tcsh 3Preme Time
4Synopsys/Cadenceflow IC-Compiler/ Astro / SOC-Encounter/
Milky-way/ Star-RCX 512PerlTCLshell 6designRTL 7
6. 3 1 2 System-VerilogVerilogC/C++ 3 UVMVVMEDA 4 Perl,Shell,TCL 5
TapeoutFPGA 6
7. SOC5 1 2 Verilog/VHDL,C/C++EDA 3 4 TapeoutFPGA 5
USBDMACacheI2CSPIUARTIPSOC
8. 5 1 2 3 verilog/VHDLMatlabSimulinkC 4 BLEWIFIGPS/BDS. 5
TapeoutFPGA
9. 3 1IC Layout 2 3
10. 3 1.RFIC 2. 3. 4.CMOSBICMOS// 5.IC
11. /RFIC Designer3 1 2 3 4 VCOPLLLNAPAMIXERVGARF 5 6 EDA,Cadence
SpectreADSHFSS 7 TSMCSMICHHGrace55nm110nm180nmMixed-Signal 8
[email protected]
1. 2 1. 2.CNC 3.UGAutoCADproe 4.
2. STM32 2 1.STM32ARM 2./PCB 3. 4. 5.
3. 2
4. 2
5. 51. 3./ 4. 5. 6. 7. 8.
6. 3
7. 5
8. 3
9. 2 / ZEmax
10. 2 webAPP
11. 2 1.FECRSLDPC 2.
12. 2 1. 10Gbps/25Gbps/100Gbps 2./PCB
13. 2 /FPGA
14. FPGA2 1.FPGAFPGA 2./ 3. 4./PCB
15. ARMSTM322 1./PCB 2.STM32ARM 3. 4.
16. ATP2 1. -
17. 2 1. 2.- 3. 4. 5. 6. 7.
[email protected]
2. DSP5a) b)DSP c)CMatlab d)DSPTI66786455 e)
3. 101. 2. 3.PCB 4.FPGADSP 5. 6.
4. 101 2C++ 3QtQt CreatorQt 4MFCMFCWindows34 5SocketTCP/IPUDP
6
[email protected]
1. 31CET4Office 2
2. Linux31 2linuxlinuxlinux 3
3. 31.CET4Office 2. 3. 4.
4. 51.CET4Office 2. 3.
[email protected]
1. 3: :
2. 31., 2.BOM 3. 4.
3. 31. (BOM) 2. 3. 1. 2.ORCAD, ALLEGRO 3. 4. datasheetdesign guide
5. ,
4. 51. 2. 3. BUG 4.
[email protected]
1. 5 , 1. 2. CAD,SolidworksSolidedge 3. 4. 5. 6.
2. 51. 2.cadence 3.H6096I2CSPICAN 4. 5.51ARMFPGA
3. 5 1. 2. 3. 4. 5.
[email protected]
1. 2 c
2. BT21. 2. 3AndroidLinux 3. AndroidLinux 4. C/C++ 5. shellgcc
Makefile 6. AndroidHALFrameworkAndroid 7. LinuxLinux 8.
BLEfirmwareBT Profile 9.
3. 21. 2. WindowsLinux 3. C/C++ 4. shellgcc Makefile 5. LinuxLinux
6. IEEE802.11USB/PCIe/SDIO 7. 8. WLANWLANAP 1. 2. 3. 4. 5. 6.
4. WIFI213 2WindowsLinux 3C/C++ 4shellgccMakefile 5LinuxLinux
6IEEE802.11USB/PCIe/SDIO 7 8WLANWLANAP
5. 21. 2. C 3. ARMI/O 4. FSMC/SDIOSPI/IIS/UARTUSB OTGMAC 5. RTOS 6.
TCP/IP(Lwip/uIP) 7. ARMMIPSLinuxbootloader 8. WLANWLANAP 1. 2. 3.
4. 5. 6.
[email protected]
1. 51. 2. 3. 4.
2. 201. 3 2. , 3.
3. 201. 2. 3.
[email protected]
1. 21. 2. 3. 4.Word, Excel, PDF
2. /21. 2. 3. 4. 5. 6. 7.office
3. 21. 2. 3. 4.
4. 101. 2. 3.C/C++ linuxLinuxCgdb 4.
5. ASIC101. 2. 3./Verilog
6. ASIC101. 2. 3./Verilog
[email protected]
1. 5 1 2 3PCB 4 5c 62-5 7 1MEMS 2 3+++++ 4 5
2. 2 1. 2. 3. 4. 5. 6. 7. 1.4000-10000 2. 3. 4. 5. 6. 7. 8.
9.8:30-5:45 10.
3. MEMS5 1MEMS 2MEMS 3MEMS 4 5 1MEMS 2. 3.+++++ 4. 5.
4. MEMS5 1MEMS 2MEMS 3MEMS 4 5
[email protected]
1. 5 1 2Cadence 4CMOS 5 6 7 8 9
2. /5 1. 2. 3.1-3PCBPCBPCB/ 4.ISO9001TS16949 FMEAControl
PlanSPCQCDOE 5.
3. Flip-Chip/SMT5 1. 2. 3.1-3Flip-chipSMTFlip-chipSMTreflow
4.ISO9001TS16949 FMEAControl PlanSPCQCDOE 5.
4. 5 1. 2. 3.1-3RDLPCB HDI 4.ISO9001TS16949 FMEAControl
PlanSPCQCDOE 5.
5. Grinding/Sawing5 1. 2. 3.1-3 4.ISO9001TS16949 FMEAControl
PlanSPCQCDOE 5.
6. BGA5 1. 2. 3.1-3BGASMT 4.ISO9001TS16949 FMEAControl PlanSPCQCDOE
5.
7. AOI5 1 2 31-3PCBAOI 4ISO9001TS16949 FMEAControl PlanSPCQCDOE
5
8. 5 1. 2. 3. 2/PCB 4. / 5. /PCB 6.
9. PCB Layout2 1. 2. Candance ,Mentor CAM350PCB 3.
,4LayoutRFPOWERPCB 4. EMI/EMC/ESD 5. 6. 7. 8. 3PCB Layout
10. 2 1 2 3 4 5
11. 5 1. 2. 3.1-3Metallization/EMI 4.ISO9001TS16949 FMEAControl
PlanSPCQCDOE
12. 3D X-RayAXI5 1. 2. 3.1-3BGA X-ray 4.ISO9001TS16949 FMEAControl
PlanSPCQCDOE
13. FT/Handler5 1. 2. 3.1-3FT 4.ISO9001TS16949 FMEAControl
PlanSPCQCDOE
[email protected]
()
1. 2,
2. 4
3. 4
4. 2
5. 2
6. 2
[email protected]
()
1. 21// 2 3
2. 21// 2
3. 31// 2 32 412
4. 11// 2 3
5. 11// 2
6. 41 2 3 4/3//3
7. //61.//// 2.
[email protected]
()
1. IC51. 2 3EDA 4
2. IC51. 2.SRAM/ROM/TCAM 3.memory compiler 4.circuit
design&verification
3. 51. 2. 3.IC 4. 5.
4. ASIC51. 2. 3.EDA,Prime Time,Debussy,Verilog-XL,Design
Compiler,and formal verification tools 4.DFT 5., 6.,, 7.
5. 51. 2. Unix/LinuxCadenceHspiceMATLABVerilog-A 3.
LDO,PWM,VDT,Bandgap 4.
[email protected]
2018
ËÕÖÝÊÐУ԰Òý²Å¼Æ»®Î÷°²½»Í¨´óѧУ԰ÕÐƸÆ󹫸æ
ÕÐƸ»áʱ¼ä£º
2018
Äê
11
ÔÂ
10
ÈÕ
14:30-17:00
ËÕÖݸßÐÂÇøÊÇËÕÖÝÊÐί¡¢ÊÐÕþ¸®°´ÕÕ¹úÎñÔº
"
"
25
52.06
£¬
ËÕÖÝÐÂÇøÐγÉÁ¼ºÃµÄͶ×Ê»·¾³£¬Í¬Ê±Ò²Ò»Ö±×¢ÖØ»·¾³±£»¤¹¤×÷¡£
1992
Äê
11
¹ú¼Ò¸ßм¼
Êõ²úÒµ¿ª·¢Çø
£¬
¡¢
52.0
6
ƽ·½¹«Àï½øÐл·¾³Ó°ÏìÆÀ¼Û¼°»·¾³±£»¤¹æ»®µÄ±àÖÆ¡£
1997
Äê
3
Ô£¬¡¶ËÕÖÝÐÂÇø»·¾³Ó°ÏìÆÀ¼ÛÓë»·¾³±£»¤
¹æ»®¡·Í¨¹ý½ËÕÊ¡»·±£¾ÖÉóÅúÕýʽʵʩ¡£
1997
¡£
£¬
ËÕÖݸßÐÂÇø±»¹ú¼Ò»·±£×ܾÖÅú׼Ϊȫ¹úÊ×¼Ò
ISO14000
1999
Äê
7
Ô£¬ËÕÖݸßÐÂÇøͨ¹ýÁ˹ú¼Ò»·±£×ֻܾ·¾³¹ÜÀíÌåϵÉóºËÖÐÐĵÄÈÏÖ¤£¬Í¬Äê
9
±£×ܾÖÅú׼Ϊȫ¹úÊ×¼Ò
ISO14000
1999
Äê±»¹ú¼Ò»·±£×ܾÖÈ϶¨Îª¹úÄÚÊ×¼Ò
"ISO14000
"
£¬
Ϊ
¹ú¼Ò¸ßм¼Êõ²úÒµ¿ª·¢Çø¸ßм¼Êõ²úÆ·³ö¿Ú»ùµØ
(
)
ÓÚ
2001
Äê
2
Ô±»¹ú¼Ò»·±£×ܾÖÅú׼Ϊȫ¹úÊ×Åú¹ú¼Ò¼¶»·±£¸ßм¼Êõ²úÒµÔ°¡£
2003
Äê
3
£¬
2003
Äê
6
Ô£¬ËÕÖݸßÐÂÇøίÍнËÕÊ¡»·¾³¿ÆѧÑо¿Ôº
¸ºÔð±àÖÆÍê³É
"
¡¶
¡·
¡£
ËÕÖÝ
¡·
¡£
Ô±»¹ú¼Ò»·±£×ܾÖÅú×¼½¨Éè
¡£
2004
Äê
4
Ô±»¹ú¼Ò»·±£×ܾÖÅú׼ͬÒ⽨Éè¹ú¼ÒÉú̬¹¤ÒµÊ¾·¶Ô°Çø¡£²¢±»Åú׼Ϊȫ¹úÊ×¼Ò
ISO1400
0
£¬
¡·
¡¢
¡¶
¡·
£¬
2005
¡£
"
"
"
"
¡£
2007
¡£
ISO14001
2007
¡£
¡¢
2007
Äê
4
Ô£¬¸ßÐÂÇøͨ¹ýÁËÊ¡»·±£Ìü×éÖ¯µÄÉú̬¹¤ÒµÔ°ÇøÊ¡¼¶¿¼ºËÑéÊÕ¡£
2008
Äê
3
![2012校园招聘大礼包 - dajie.com · 中国南方电网广东分公司2012 校园招聘简介： 中国南方电网有限责任公司是根据国务院《电力体制改革方案》（国发[2002]5](https://img.pdfslide.net/doc/110x75/5ed9c53cc6a95d2b51674a31/2012ecoe-dajiecom-ccoe2012-eci.jpg)
