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Lab4MEMS “LAB FAB for smart sensors and actuators MEMS”
ENIAC KET Pilot Line 2012
Alberto Corigliano
Politecnico di Milano
Lab4MEMS: an ENIAC KET Pilot Line 2
Project Coordinator:
Roberto Zafalon, STMicroelectronics s.r.l. Italy
Duration: 30 months
Start: January 2013
End: June 2015
Budget: 28 M Euro (about 38 M $)
21 partners belonging to 10 Countries
Lab4MEMS: Consortium
• Italy, France, Malta, The Netherlands, Finland, Belgium, Romania, Poland,
Norway, Austria.
3
Lead 1 STMicroelectronics srl (Coordinator) ST-I Italy Ind
2 ST-POLITO s.c.a.r.l. STP Italy Ind-Res
3 Politecnico di Torino PoliTO Italy Uni
4 Istituto Italiano di Tecnologia IIT Italy Res
5 Politecnico di Milano PoliMI Italy Uni
6 Consorzio Nazionale Interuniversitario per la
Nanoelettronica IUNET Italy Uni
7 Commissariat Energie Atomique Et Aux Energies
Alternatives CEA France Res
8 SERMA Technologies SA SERMA France Ind
9 STMicroelectronics Ltd. ST-M Malta Ind
10 University of Malta UoM Malta Uni
11 SolMateS BV SOL The Netherlands Ind
12 Cavendish KINETICS BV CK The Netherlands Ind
13 Okmetic OYJ OKM Finland Ind
14 VTT Technical Research Centre of Finland VTT Finland Res
15 PICOSUN OY Picosun Finland Ind
16 KLA-Tencor KLA Belgium Ind
17 University POLITEHNICA of Bucharest, CSSNT UPB Romania Uni
18 Instytut Technologii Elektronowej, Warsaw ITE Poland Res
19 Stiftelsen SINTEF SINTEF Norway Res
20 Sonitor Technologies AS SON Norway Ind
21 Datacon Technology GmbH DCON Austria Ind
Lab4MEMS: STMicroelectronics & MEMS
• ST is ideally placed to lead the Lab4MEMS research into next-generation
devices.
Over 800 MEMS-related patents, more than 3 billion devices shipped, extensive
in-house production capabilities currently producing more than 4 million MEMS
devices per day.
• ST is working with universities, research institutions and technology
businesses across ten European countries.
The project benefits from ST’s MEMS facilities in France, Italy and Malta to
establish a complete set of manufacturing competencies for next-generation
devices, spanning design and fabrication to test and packaging.
• The project will develop advanced packaging technologies and vertical
interconnections using flip-chip, through-silicon vias and through-mold vias,
enabling 3D-integrated devices for applications such as body area sensors and
remote monitoring. A key target is to perfect a PZT deposition process
compatible with mass production, enabling innovative actuators and sensors
on System-On-Chip.
4
Lab4MEMS’s vision: key-enabling technologies and new
application areas 5
-
Established
MEMS
technology
Application
areas
Sensing:
Mech.: Accelerometer,
gyro, pressure, flow, tactile
Therm.: flow, temperature
Actuation:
Fluid.: Ink-jet, micropumps
Acoustic: ultrasound trans.
Optics: tunable filters, lenses
RF: Switches
Piezoelectric
thin-films
(PZT)
+Sensing & Energy
harvesting:
Low noise, low power
sensors: microphones,
accelerometers
Vibration energy
harvesters
Anisotropic
magneto resistive
materials
(permalloy)
+
Sensing:
Magnetic field: electronic
compass
3D
heterogenous
packaging
+ System aspects:
Miniaturisation, compact
elements
New functionalities
Wireless sensor nodes
Lab4MEMS: Scope & Mission
• Lab4MEMS will feature the Pilot Line for innovative technologies on
advanced piezoelectric and magnetic materials, including advanced
Packaging, expected to fuel the next generation’s smart sensors and
actuators based on MEMS.
• Micro-actuators, micro-pumps, sensors and electrical power generators,
integrated on silicon-based piezoelectric materials (PZT)
• for use in Data Storage, Ink Jet, Health Care, Automotive and Energy Scavenging
• Magnetic field sensors integrated on silicon-based Anisotropic Magneto
Resistance (AMR) materials.
• for use in consumer applications such as GPS platforms and mobile phones
• Advanced packaging technologies and vertical interconnections (flip chip,
Through Silicon Vias or Through Mold Vias) for full 3D integration.
• For use in CONSUMER and HEALTHCARE applications such as body area sensors and remote monitoring
6
Lab4MEMS: Relevance with ENIAC Grand Challenges Lab4MEMS KET Pilot Line
Relevance with MASP Grand Challenge and priority research areas
Technological
development
Expected Achievements/
Applications
7. S
emic
on
du
cto
r
Pro
cess
In
teg
rati
on
7.3.3 Opportunities in System in Package
Focus on Advanced packaging technologies and vertical
interconnections (flip chip, Through Silicon Vias or
Through Mold Vias) for full 3D integration. This is to
add value and flexibility to a wide range of new smart
sensors which will combine different sensing/actuation
features with an extensive analog and digital processing
on the single package.
Advanced substrates,
wafer and module level
integration. TSV and
innovative assembly
technology.
Highest automatization
and yield. Quality
inspection, failure
analysis,
characterization and
modeling. Innovative
and EU centric Front-
End vs. Back-End value
chain.
8. E
qu
ipm
ent,
ma
teri
als
an
d m
an
ufa
ctu
rin
g
8.3.2 More than Moore
The over-arching goal of Lab4MEMS in this Grand
Challenge is to enable European E&M companies to
keep the leadership on MEMS sensors.
Piezoelectric and
magnetic materials at
the nanoscale and
associated enabling
compounds, for a new
class of integrated
MEMS sensors.
3D heterogeneous
integration and
packaging.
Agile line production,
mainly driven by
Consumer and
Automotive markets.
8.3.3 Manufacturing
Focus on highly flexible, high quality and cost
competitive, manufacturing line of MEMS sensors and
smart heterogeneous integrated products.
Manufacturing proven
quality and process
robustness, handling of
new material under
high yield/low
defectivity constraints.
Fab process control
flow, equipment and
tools for PZT epi
deposition and AMR
sputtering, metrology,
quality assurance and
defect inspection,
device characterization
and modeling.
7
Lab4MEMS: Innovation
• Despite the presence of research centers in EU at the forefront of adv. material
research, there is still little industrial investment ready to push through.
• It is of paramount importance to increase the scientific know-how on those key
materials, but also the fast transferring of knowledge to production, by setting the
advanced infrastructure and R&D manufacturing Pilot Line.
• Lab4MEMS will be promoted as an add-on to the current facilities in Agrate and
Malta, aiming to implement and optimize the industrial processes and to validate
the demonstrators suitable to penetrate the market.
• 3D package integration for MEMS products will allow to integrate the ASIC die &
the MEMS sensors in a stacked configuration, thus
enhancing performance and reliability
while reducing size and cost.
8
Lab4MEMS: Expected Impact
• The MEMS PL will be based in Agrate (IT), on 200 mm wafer scale and,
once in operation, it will process more than 600 wafers/week.
• ST-I will fit a new set of R&D equipments for PZT and AMR, as part of a larger manufacturing facility already in place for high volume (i.e. >100M devices/month) 3-axis MEMS accelerometers and gyroscope. This strategy will allow increasing and maintaining the know-how on those very strategic enabling technologies, combining scientific skills with the ability to design and manufacture a wide range of smart systems on silicon.
• The Packaging PL will be based in Kirkop (Malta)
• ST-M will integrate a new set of R&D equipment for flip chip, vertical interconnections (Through Silicon Vias and/or Through Mold Vias) and Wafer Level Package, as part of a larger manufacturing facility already in place for high volume MEMS products.
• Kirkop has a vast experience of BE technologies and assembly of 3 million MEMS devices per day (Motion sensors, Microphones and Pressure Sensors).
9
1. proof-of-concept : a suite of intermediate demonstration vehicles will
be delivered and assessed at midterm (i.e. D5.2 at M18), to prove the
actual feasibility of initial device solutions, wafer substrates, process
steps, tools or equipments.
2. Final Technology Demonstrators : from the "proof-of-concept", the
work-flow will then converge and optimize a set of four Tech
Demonstrators intended to become the main flagship vehicles to
demonstrate the KET Pilot Lines.
Technology Demonstrators:
a. Print-head for industrial printers, piezo actuated
b. Micro-electric scavenger, powered by mechanical/vibration energy
c. AMR magnetic sensor
d. 3D MEMS packaging
10 Lab4MEMS: demonstration strategy
- Bridge/Building Vibration Monitoring
Low frequencies, large displacements
- Human motion Power generation for sensors
Low frequencies, high accelerations (shoes inserts)
- Tires monitoring
- Vehicle vibration monitoring and power generation for sensors
High frequencies
- ….
11
Basic concept
convert kinetic energy (e.g. from ambient vibration) into electric energy
Possible applications
Focus on: micro energy scavenger 11
Paradiso et al., 2006, Design
Automation Conference
Focus on: micro energy scavenger 12
From Mechanical to Electric Energy
• Large seismic Mass • Low frequency energy
KINETIC ENERGY
ELASTIC ENERGY
ELECTRIC POTENTIAL
ELECTRIC ENERGY
• Transduction at MEMS scale • High frequency energy
• Electric Circuit
Contrasting needs
Seismic Mass:
large mass vs. size reduction
Frequency mismatch:
high MEMS natural frequencies vs. low frequency of external signals
Focus on: micro energy scavenger 13
ELECTROSTATIC: Mobile plate capacitors
Easy integration in silicon MEMS, low power generation, need to pre-charge the plates
MAGNETIC: Induction in coils
High power generation, need for big magnets and difficult integration in MEMS
PIEZOELECTRIC: Material strain
High power density, possible integration in MEMS.
Functional Requirements:
- Power density, size, operational frequency, bandwidth
Goals:
- small scale (< < 0.5 cm3)
- power generation ~100 μW continuous
14 Cantilever beam with piezoelectric layer
piezoelectric layer
e.g. Pb(Zr,Ti)O3 (PZT)
• inertial force on the tip mass
• flexural vibration of the composite beam
• non-zero strain rate in the PZT layer
• generation of electric potential on the electrodes
Remarks
• mass-proportional power generation
• importance of piezoelectric coupling coefficient
• possible optimization of the mechanical scheme for maximum energy generation
• optimal behavior at resonance
Focus on: micro energy scavenger 14
Roundy et al., 2005, IEEE Pervasive Computing
L = 1000 µm b = 200 µm Mass = 400x200x200 µm3
Acc. = 10 g Q = 1000
P = 7.11 µW u = 510 µm u/L = 0.51 Ropt = 11 kΩ f0 = 1562 Hz
Possible MEMS design for optimal power generation
Problems:
• vibrations e.g. from human movements are in the range 2-10 Hz
• power generation is negligible for such a low excitation frequency!
• small bandwidth
power obtained for
resonance driven device
Question 1: how can we harvest energy with high mismatch between
source and MEMS frequency?
FREQUENCY UP CONVERSION
15
Focus on: micro energy scavenger
Question 2: how can we increase the bandwidth?
NONLINEAR RESONANCE
Impulsive
phenomenon
Free
oscillation
Forced
vibration
Frequency-up conversion
17
Frequency-up conversion
Bistable beams - Easy MEMS integration
- In-plane mechanism
- Complex compatibility with piezoelectricity Piezo works out of plane (process constraints)
- Electrostatic transduction
- Low power generations
Magnetic loading - Difficult MEMS integration
- Reliability issues
- Compatible with piezoelectric transduction
- Need for high acceleration
Impact loading
- Easy MEMS integration
- Reliability issues
- Compatible with piezoelectric
transduction
- Need for high acceleration
17
Cottone et al., 2013, Proc. IEEE MEMS
Zorlu et al., 2011, IEEE Sensors Journal
Kulah et al., 2008, IEEE Sensors Journal
fEXT = 2 Hz
- Sine Excitation - Impulsive Excitation
Big Mass motion (to “capture” kinetic energy)
CONTACT
(Transfer of energy)
Small Beam motion
(to convert elastic energy into electric energy)
Big Mass Small Beam
18
Frequency-up conversion
fmems = 52 kHz Peak Power generation = 43.18µW Size = 1x1x1 mm3
ST-Polimi Patent pending
19
Geometric non linearity: Hard spring effect, Duffing oscillator
Micro/Nano systems laboratory
3rd gen. UWB-PMPG
Non linear resonance helps increasing the bandwidth
- Bridge shape beam
- Only 33- mode
- Still too high natural frequency
- Need for a technique to avoid
jump-down phenomenon
Nonlinear resonance
MIT-Polimi collaboration
Hajati and Kim, 2008, Proceedings of SPIE - The
International Society for Optical Engineering
fmems = 359 Hz Peak Power generation = 21.95 µW Size = 1x1x1 mm3
Closing remarks 20
- Piezoelectric energy harvesters
- Resonant harvesters: for specific frequency and accelerations
- Frequency up conversion: to overcome the frequency mismatch
- Nonlinear harvesters: to increase the bandwidth
- Introduce new heavy materials to increase the weight of the seismic mass
- Find new mechanical schemes to optimize the conversion of energy
Energy scavengers
Lab4MEMS
- Large ENIAC Pilot Line project focusing on KET
- Enabling technology for terrific exploitation of MEMS in the short future
- Major Technology demonstrators
21
Thank you for your attention!