LAM 490 Auto Etch Chamber PM Technique...LAM 490 CHAMBER PM PROCEDURE (CONT’D): LAM 490 Auto Etch PM 030111.docx 3 Step 4: Remove shower head and ceramic ring from chamber lid. Soak

www.foamtecintlwcc.com This Document For Reference Only

LAM 490 Auto Etch PM 030111.docx 1

VACUUM CHAMBER PM TECHNIQUE LAM 490 AUTO ETCH CHAMBER

OBJECTIVE:

TO EFFECTIVELY PM THE LAM 490 CHAMBER IN A TIMELY MANNER, WHILE IMPROVING TOOL PERFORMANCE AND REDUCING PARTICLE DEFECTS

Vacuum Chamber: LAM 490 AUTO ETCH Vacuum Chamber Process Residue: PROCESS INDUCED RESIDUE Vacuum Chamber Components: PROCESS CHAMBER AND CERAMIC RING

Old Procedure: > 4 hours with Scotch-Brite™ & DI water PROBLEMS: Not able to remove by-product in a timely

manner and particle issues due to the use of Scotch-Brite™

New Procedure: 2 hours using 280 Grit Diamond ScrubPAD, UltraSOLV® Sponge, MiraSWABS® & MiraWIPES®

BENEFITS: ABLE TO REMOVE MORE BY-PRODUCTS AND NOT LEAVE BEHIND SCOTCH-BRITE™ PARTICLES HELPING REDUCE PARTICLE DEFECTS AND IMPROVE TOOL RECOVERY

Vacuum Chamber Products: PM Kit P/N: HT4500-LAM490 • (1) HT4528D-10-1 280 Grit Diamond ScrubPAD • (1) HT4754 UltraSOLV® Sponge • (2) HT5790S-5 MiraWIPES® (10 MiraWIPES®) Not included in PM Kit • (1) HT1511FC-5 MiraSWABS® (5 MiraSWABS®) • (1) HT179028D-1 280 Grit ScrubTIP® Swab

BEFORE AFTER

www.foamtecintlwcc.com This Document For Reference Only LAM 490 CHAMBER PM PROCEDURE:


View “How to” instructional videos on http://www.foamtecintlwcc.com/flash/ Step 1: Using proper procedures and safety guidelines, remove associated parts from

LAM ETCH chamber Step 2: Stage a container of DI water next to the process tool and place the HT4528D 280

Grit Diamond ScrubPAD and HT4754 UltraSOLV® Sponge into the container (See Fig 1)

Step 3: Place clean room wipes dampened with DI water in the chamber. Let chamber soak

while taking shower head off of chamber lid, approx. 15 minutes (See Fig 2)

Fig 1: Placing UltraSOLV® Sponge and 280 Grit Diamond ScrubPAD into DI water

Fig 2: Standard fab wipes soaked with DI water


LAM 490 CHAMBER PM PROCEDURE (CONT’D):


Step 4: Remove shower head and ceramic ring from chamber lid. Soak ceramic ring in DI water (See Fig 3)

Step 5: Take the UltraSOLV® Sponge from the DI water and wring out most of the water.

Wipe the chamber down to start removing the process residue (See Fig 4)

Step 6: Take lightly dampened 280 Grit Diamond ScrubPAD and begin to scrub the process

residue from the chamber (See Fig 5)

Fig 3: Remove shower head and ceramic ring

Fig 4: Wipe chamber with UltraSOLV® Sponge

Fig 5: Start scrubbing process build up from the process chamber




Step 7: As the HT4528D 280 Grit Diamond ScrubPAD begins to load up with deposition, pull ScrubPAD across dampened UltraSOLV® Sponge to properly unload ScrubPAD (See Fig 6, 7 & 8)

Step 8: For the corners and areas with heavy build up use the HT179028D 280 Grit

ScrubTIP® Swab lightly dampened with DI water (See Fig 9)

Fig 6: Diamond ScrubPAD loaded with deposition

Fig 7: Pull ScrubPAD across UltraSOLV® Sponge

Fig 8: Unloaded Diamond ScrubPAD

Fig 9: Diamond ScrubTIP® used to scrub heavy build up




Step 9: Wipe the chamber periodically with the UltraSOLV® Sponge during the scrub process. When the sponge becomes loaded up with process residue wring it out in the DI water (See Fig 10 & 11)

Step 10: Follow steps 5 through 9 to continue scrubbing all parts of the chamber until all

process residue has been removed. Ensure port areas are cleaned well (See Fig 12) Before After

Step 11: Remove ceramic ring from the DI water it has been soaking in and scrub the

remaining process residue off of it using the HT4528D 280 Grit Diamond ScrubPAD

Fig 12: Ensure chamber port areas are cleaned

Fig 11: UltraSOLV® Sponge free of deposition after rinse in DI water

Fig 10: UltraSOLV® Sponge loaded with deposition




FINAL WIPE PROCEDURE:

IMPORTANT NOTE THE USE OF HT5790S MiraWIPES® AND HT1511FC MiraSWABS® DURING THE FINAL

WIPE PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVE PARTICLE DEFECTS FROM ETCH CHAMER

NOTE: Figure below shows how much more deposition the Foamtec International MiraWIPE® can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE® FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 13a & 13b)

Step 12: Fold the HT5790S MiraWIPE® into quarters and dampen with IPA Step 13: With the IPA dampened MiraWIPE® wipe down all areas of the chamber, ensuring to

refold the MiraWIPE® as necessary to expose a clean side of the MiraWIPE® as you are wiping the parts (See Fig 14)

Fig 13a: Current fab wiper after completely wiping chamber

Fig 13b: Particles picked up using HT5790S MiraWIPES® after completely wiping with current fab wiper

Fig 14: Use the MiraWIPE® Wiper to wipe out the process chamber

MiraWIPES® are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY




Step 14: After initial wipe down of the process chamber use the HT1511FC MiraSWABS®,

dampened with IPA, to clean out holes in the pump plate. Ensure all holes are cleaned out (See Fig 15 & 16)

Step 15: Perform final wipe down of the process chamber and any part installed back into the

Chamber using MiraWIPE® dampened with IPA

NOTE: Replace with a new dampened MiraWIPE® as necessary Step 16: Follow steps to reinstall chamber parts and bring process tool back into production

Fig 15: Use the MiraSWABS® to clean residue from holes in pump plate

Fig 16: Amount of residue left behind from the use of Scotch-Brite™ in the past the MiraSWABS® are able to clean from holes in pump l t

Documents

LAM 490 Auto Etch Chamber PM Technique...LAM 490 CHAMBER PM PROCEDURE (CONT’D): LAM 490 Auto Etch PM 030111.docx 3 Step 4: Remove shower head and ceramic ring from chamber lid. Soak