Large Area ProcessingResearch Programme

National Science Foundation

Manufacturing Energy Workshop

24 – 25 March 2009

A large area processing research centre for research, prototyping and pilot production for printed electronics, energy devices, functional films and microfluidics devices.

Objective

Motivation

Rigid &IntegratedDevices

Complex Lithography

High-PerformanceElectronics

Assembly & Packaging

Conventional Silicon Electronics Manufacturing

Paradigm Shift

Flexible &Conformal Large Area

Manufacturing

Ambient Intelligence

SensorsLighting

Direct-Write “On-Demand”

Large Area Flexible Substrates

Roll-to-Roll Spatially Selective Patterning

Roll-to-Roll Embedding

Hybrid Rigid- Elastic

Substrates

Research Areas Industry DriversTechnology Drivers

Direct-Write Manufacturing

Large Area

LightweightEmbedded Channels & Structures

Large Area Additive

Patterning

Drivers & Research Areas

Low-Temperature Processing

Green Mfg

Conformal

Multi-Functional

Manufacturing Processes

System Integration

Functional Substrates &

Materials

Energy

Functional Films

Printed Electronics

Microfluidics

High Volume

ManufacturingDevices & Systems

EquipmentMaterials

Scope

Manufacturing ProcessesWeb width: 1 mPattern Resolution < 1 m Roll-to-Roll patterning: printing, etc.Roll-to-Roll structuring: embossing, etc.

MaterialsFlexible & transparent thermoplastic substrates: eg LCP, etc.Metal & composite substratesOrganic and inorganic conductors, dielectrics & semiconductors

Technology Platforms Energy devicesPrinted electronicsFunctional filmsMicrofluidics devices

Scope

Manufacturing Processes• Resolution, throughput, yield and substrate technologies• Large area format manufacturing • In-situ inspection and reliability characterization• Low temperature additive and direct-write patterning• Conformal and stretchable substrates

Materials• Performance, processability and stability• Synthesis and characterization of nanoparticle, inorganic and organic based semiconductors, conductors and dielectrics

Devices• Performance, density and reliability• Analysis of device structures, interconnects and system-level architectures• TFT, PV, OLED, supercapacitors and batteries

Research ChallengesManufacturing Processes• Resolution, throughput, yield and substrate technologies

Materials• Performance, processability and stability

Devices• Performance, density and reliability