1Effective Date: 01SEP2009 PPT-INFN-01-001-0909-00

Large-Scale Photonic Integrated Circuits

Fred Kish

2

Telecom ApplicationsMetrics that truly matter ….

Cost/bit Power/bit

Capacity per chip

Spectral Efficiency

Direct CapEx and OpEx implications

Maximum fiber capacity

Operational ease, density and

reliability

3

Why PICs?Providing Value to Network Solutions

• PIC disruption

–Space

–Reliability

–Power

–Cost

• “Digital experience” Disruption

–Speed

–Intelligence

–Bandwidth Virtualization

4

Large-Scale 100 Gb/s Commercial PICsEnable Scaling of the Network

10 x 10Gb/s

Electrical Input

Optical

Output

1... 10

10 x 10Gb/sA

WG

Mult

iple

xer

CH1

CH10

DC

Ele

ctri

cal

Bia

s an

d C

ontr

ol

VO

A A

rray

EA

M A

rray

OP

M A

rray

Tunab

le D

FB

Arr

ay

Optical

Input

CH1

CH10

PIN

Photo

dio

de

Arr

ay

AW

G D

e-M

ult

iple

xer

10 x

10G

b/s

Ele

ctri

cal

Outp

ut

10 x 10Gb/s

Electrical Input

Optical

Output

1... 10

10 x 10Gb/sA

WG

Mult

iple

xer

CH1

CH10

DC

Ele

ctri

cal

Bia

s an

d C

ontr

ol

VO

A A

rray

EA

M A

rray

OP

M A

rray

Tunab

le D

FB

Arr

ay

Optical

Input

CH1

CH10

PIN

Photo

dio

de

Arr

ay

AW

G D

e-M

ult

iple

xer

10 x

10G

b/s

Ele

ctri

cal

Outp

ut

10 x 10Gb/s

Electrical Input

Optical

Output

1... 10

10 x 10Gb/s

AW

G M

ult

iple

xer

CH1

CH10

DC

Ele

ctri

cal

Bia

s an

d C

on

tro

l

VO

A A

rray

EA

M A

rray

OP

M A

rray

Tu

nab

le D

FB

Arr

ay

Optical

Input

CH1

CH10

PIN

Ph

oto

dio

de

Arr

ay

AW

G D

e-M

ult

iple

xer

10

x 1

0G

b/s

Ele

ctri

cal

Ou

tput

10 x 10Gb/s

Electrical Input

Optical

Output

1... 10

10 x 10Gb/s

AW

G M

ult

iple

xer

CH1

CH10

DC

Ele

ctri

cal

Bia

s an

d C

on

tro

l

VO

A A

rray

EA

M A

rray

OP

M A

rray

Tu

nab

le D

FB

Arr

ay

Optical

Input

CH1

CH10

PIN

Ph

oto

dio

de

Arr

ay

AW

G D

e-M

ult

iple

xer

10

x 1

0G

b/s

Ele

ctri

cal

Ou

tput

-80

-70

-60

-50

-40

-30

-20

-10

0

10

1526 1530 1534 1538 1542

Wavelength (nm)

No

rma

lize

d P

ow

er (

dB

)

-35

-30

-25

-20

-15

-10

-5

0

5

1528 1533 1538 1543 1548Wavelength (nm)

No

rma

lize

d P

ho

tore

spo

nse

(d

B)

200 Million Field Hours Without Failure

1

10

100

1,000

0

50

100

150

200

FIT

Fie

ld h

ou

rs (

Mil

lio

n-h

ou

rs)

5

0

1

2

3

4

5

6

7

8

1970 1980 1990 2000 2010

Kil

ler

Defe

ct

Den

sit

y (

cm

-2)

Si Integrated

Circuits

Infinera

Photonic ICs

Large-Scale Photonic IC Defect Density

Killer defect density of

Infinera PICs comparable to

Si circa 1993

YD =

-

1 + D1/

Random defect density reduction most important for higher

capacity / complexity PICs

0.1

1

10

100 1000 10000Cumulative Volume

Kille

r D

efe

dct

Den

sit

y (

cm

-2)

Large-Scale PIC

Defect “Learning Curve”

Volume Manufacturing

Enables Defect “Learning Curve”

6

Transmitter PIC with Integrated SOAs

SOA used for both gain (increased launch power), power flatness and/or pre-emphasis control

Optical

Output

1... N

Ch 1

Ch 10

DC ElectricalBias and

Control

RF Input

10 Gb/s

... Mult

iple

xer

Ch 2Ch 3

• •

•

•

• •

• •

•

• •

•

• •

•

• •

••

• •

• •

•

• •

•

• •

•

7

100Gb/s PICs in ULH ApplicationsSubmarine Networks

• 25 GHz and high density• > 6,000 km links• >50,000 km of routes deployed• Operational simplicity

-30

-25

-20

-15

-10

-5

191.9 192.4 192.9 193.4

Po

we

r (d

B)

9

10

11

12

13

14

15

191.9 192.4 192.9 193.4

Q (d

B)

FEC LIMIT

>6100km Trans-Atlantic System

31 channels @ 25 GHz spacing

8

PICs & SOA Enable Use of The Entire Fiber Bandwidth

• S, C and L band PICs demonstrated.

2 3 4

SOA SOA SOA SOA AW

G

S-Band

Tx PIC

S-Band

Rx PIC

1

-30

-25

-20

-15

-10

-5

0

1480 1485 1490 1495 1500

Inte

ns

ity

(a

rb u

nit

s)

Wavelength (nm)

Ch 1Ch 10

NF ~ 6.5 dB4 x 80 = 320 km spans of LEAF

No external dispersion

compensation

Xu et al., OFC 2009 JThA49

9

~300 SOAs

High Gain

Receiver PIC with Integrated SOA

Low Noise Figure

10

PIC Platform Scalable to 40 Channels

-60

-50

-40

-30

-20

-10

0

No

rma

lize

d O

utp

ut

Po

we

r (d

B)

1.5651.5601.5551.550

Wavelength (µm)

-35

-30

-25

-20

-15

-10

-5

0

No

rma

lize

d R

es

po

nsiv

ity

[d

B]

15641560155615521548

Wavelength [nm]

40-Channel Tx PIC 40-Channel Rx PIC

11

Unit Share for 10G Waves

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

1998 2000 2002 2004 2006 2008

Shar

e o

f W

ave

s Sh

ipp

ed

Infinera

First Mover in 10G

Source: Infinera and analyst estimates

12

Worldwide Wavelength Shipments

0

50

100

150

200

250

300

350

1995 2000 2005 2010(E)

Tho

usa

nd

s o

f W

ave

len

gth

s

2.5G

10G

40G

Source: Ovum and Infinera analysis

Infinera market entry

13

1

10

100

1000

10000

1990 2000 2010 2020

Year

Dat

a C

apac

ity

Per

Ch

ip (

Gb

/s)

1

10

100

1000

10000

Scaling of InP-Based Transmitter

Photonic Integrated Circuits

in Telecommunications Networks

EML

Large-Scale DWDM Tx PICs

10 x 10 Gb/s (OOK)

10 x 40 Gb/s (DQPSK)

PIC Roadmap

(Projected)

100

400

1000

2000

4000

10

1

100

400

1000

2000

4000

10

1

Photonic Integrated Circuit Capacity Scaling History and Roadmap

Large-Scale DWDM TxPICs

PM-DQPSK (10 x 40G)

10GBaud x 4 /

1.6 bits/Hz

DQPSK (10 x 40G)

20GBaud x 2 /

0.8 Bits/Hz

14

400 Gb/s Transmitter Architecture

PBC

TE

(to become TM)

DFB

DFB

DFB

DFB

DFB

DFB

DFB

DFB

DFB

MUX

PM

PM

PM

PM

PM

PM

PM

PM

PM

PM

DFB

DFB

DFB

DFB

DFB

DFB

DFB

DFB

DFB

DFB

DFB

MUX

Rot

SOA

SOA

15

DFB linewidth

= 1.0MHz

10-8

10-7

10-6

10-5

10-4

10-3

10-2

Po

we

r (

a.u

.)

194.7550194.7545194.7540194.7535194.7530

Frequency (THz)

Raw Data Linewidth = 1MHz

(Lorentzian Curve Fit)

OSA resolution = 15MHz

400 Gb/s PIC: 10-Channel DFB L-I and Spectra

-60

-50

-40

-30

-20

-10

0

Norm

aliz

ed P

ow

er

(dB

)

1.5451.5401.5351.5301.525

Wavelength (µm)

20

15

10

5

DF

B P

ow

er

(a.u

.)

14012010080604020

DFB Current (mA)

SMSR

> 48dB

16

400 Gb/s Tx PIC: MZM Performance

Vπ (material) = 2Vπ (switching)

-50

-40

-30

-20

-10

0

10

Po

wer

(dB

)

-2 -1 0 1 2

Voltage (V)

Overlay Plot

Y

01-tm-I1-I2-initialPA1

01-tm-Q1-Q2-init ialPA1

ER

> 4

0d

BV = 2.5V

TM to be

I

Q

TE

I

Q

17

400 Gb/s PIC: MZM Bandwidth Characterization

Small-signal BW = 15GHz-12

-9

-6

-3

0

3E

/O r

esponse (

dB

e)

20151050

Frequency (GHz)

18

-15

-10

-5

0

Po

wer

(dB

m)

1535.4 1535.6 1535.8 1536

Wavel ength (nm)

Overlay Plot

-1

0

1

Q

-1 0 1

I

Overlay Plot

400 Gb/sTx PIC

VOAEDFA

ASE

Source

Bandpass

Filter

From

PIC

OSA

Pol.

Scr

VOA

3dB Coupler

Scope

OPM

19

Wrap-up

Now …….

PIC Scaling

Going Forward…….

100G + 400G PICs

• Match discretes in performance

• Unmatched space, power and reliability

• Deliver lowest cost/bit with high spectral efficiency

• Double capacity per chip every three years

• Ability to support advanced modulation schemes and receiver designs

• Expansion to other bands - L-band, S-band