Laser based micro fabrication systems for electronics ... based micro fabrication systems for electronics packaging ... Ablation Dicing/Scribing Substrate ... ESI Kinematic Transform

Electro Scientific Industries, Inc. – SEMICON Taiwan 2016

Laser based micro fabrication systems for

electronics packaging

Dr. Haibin ZhangDirector Technology Development, Electro Scientific Industries, Inc., 9/8/2016


Adv. Packaging: new processes, new materials, new challenges

2


Challenges for Semiconductor Manufacturers

3

Chasing Moore’s Law: Requires increased transistor density, cost scaling, and

performance per watt.

Processing Challenges:

• Shrinking Node Sizes

• Low K Materials

• Thin Materials

• Wafer Coatings


Laser applications in semiconductor and electronics packaging

4

Micro-via

Drilling

Marking

Ablation

Dicing/Scribing

Substrate

dielectricPCB

dielectric

Patterning

Wafer mark

TSV TMV Flex via

Hard mark Soft mark

Thin wafer Wafer + DAF Dielectric scribing

Package mark

Laser direct patterning Memory repair link blowing


Laser mark

Higher density demand smaller features and higher accuracy

5

1um 10 um 50 um 100 um 1000 um

1um

10 um

50 um

100 um

Feature size (um)

Accuracy

TSV

Link

blowing

LDI/LDA

Scribing/dicing

Routing / skiving

Substrate/PCBVIA,

TMV

*Estimates


Higher density,

lower cost

Resolution

Accuracy

Quality

Cost

<1um link

6

Route to high density, high accuracy, and low cost

<10 um via <30 um scribe

• Mechanical structure

• System Architecture

• Beam steering

• Optical design

• Calibration

• Match laser to the application

• Smart beam delivery and control

• Understand the physics

• Select platform most fit the

application

• High speed beam delivery and

high laser power to offset high

cost components

• Improved yield provide value


AccuracyStability, repeatability, error budgeting, measurement, and calibration

7

45 µm

Stage

DiagnosticsDebris Management

Calibration Metrology

Beam Steering

Power Control

Focus Control

Realtime Control

0 5 10 15 20 25-5

0

5

Po

sit

ion

(m

m)

0 5 10 15 20 25-6

-4

-2

0

2

4

6

msec

Err

or

(um

)


0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1-1

-0.5

0

0.5

1

9970 Alpha, KT2

Relative Displacement (WrkSurf - BeamSpot)

Xinput -> SingleStep, 10Hz Sine, 67kg*1.3g

[sec]

[um

]

X

Y

Z

AccuracyModeling. Example: ESI Kinematic Transform Tool (KT2)

Beam Path in KT2

Modal Analysis

Beam Deflection

Prediction

8


AccuracyRange of components provide variety of repeatability. Example: stages

Cost

Repeatability• Modal testing

• Custom chucks

• Isolation design

• Interferometry

Air Bearing

Planar XY Mechanical

10 µm

1 µm

0.1 µm

Cross-Axis Mechanical

9


AccuracyRadial accuracy data achieved, multi-head

10

Radial Error

|M| + 4σ < 6 um

Example: ESI Cornerstone micro-via drilling platform


QualityPick the right laser for the application

11


QualityThe right absorption and pulse width

Tailor laser wavelength with respect

to material stack and properties

Select the proper pulse width laser

for quality and speed

12


TMV, CO2 laser Flex, ns UV

Thin wafer, fs green Substrate dielectric, ps UV

13

QualityRight laser for the application


• Range of Z-stage solutions:

– Stepper-driven roller bearing

– Linear motor cross-roller bearing

– Linear motor air bearing

• Z surface mapping with typical metrology

– Visual focus

– Laser triangulation

– Beam to work control

• Realtime tracking

– Sub-micron to 10’s of microns

QualityFocus Control enables feature consistency resulting high yield

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QualityUnderstanding process shortens development time, improves quality, and lowers cost

Knowledge base

ExperimentsMetrology

Spec requirement

Process

Development

copper

polymer

glass fiber

2

9

copper

polymer

glass fiber

cross-section view

cross-section view

Example: FR4 via drilling with CO2 laser

Physics:

Simulation

15


Lower cost Reduce component cost and improve output

𝐶𝑜𝑠𝑡 𝑝𝑒𝑟 𝑓𝑒𝑎𝑡𝑢𝑟𝑒 =𝑜𝑣𝑒𝑟𝑎𝑙𝑙 𝑐𝑜𝑠𝑡

𝑇ℎ𝑟𝑜𝑢𝑔ℎ𝑝𝑢𝑡

Overall Cost

System cost

Laser Reduce cost per photon

Optics OTS components

Control Fast and efficient

Frame Accuracy and cost

ProductionOperation Low interruption

Yield Process stable

Maintenance Low MTTR

Service/repair Fast response high reliability

Throughput Parallel processing Multiple heads

Speed of pulses (reprate)

Use of high repetition rate lasers

Wait/move time Fast scanning mechanisms

Material response Thermal relaxation Enough time to dissipate heat

Plume/plasma Larger pulse spacing

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Fiber

DPSS

Disk

Slab

1 MHz

2 MHz

0.8 MHz

2 MHz1 MHz

High power femtosecond lasers Higher laser

average power

Reduced per

photon cost

Lower cost of

manufacturing

Increased speed

High pulse rate

introduce heat

Low pulse overlap allow

heat to dissipate

Extreme fast steering

reduces pulse overlap

Good quality features

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Lower costHigher power laser and fast steering enable higher output at lower photon cost


Lower costBeam steering components offer high speed scanning with scan range tradeoff

Range

Bandwidth

Acousto Optic

Deflector

Piezo Fast Steering

Mirror

Galvo

1 MHz

1 kHz

100 Hz

100 µm 1 mm 10 mm

Stage

100 mm

10 kHz

100 kHz

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Lower costCompound beam positioning provide ultimate efficiency: speed + range

19

535mm

20mm

20

mm

~0.15mm

~0.1

5m

m

63

3m

m

Example: ESI tertiary beam positioning

system (Third Dynamic®)

Linear Stages provide the overall range of

motion for the target panel dimension

Galvos provide fast intra-via beam positioning

AODs provide ultra-fast beam positioning for

rapid and precise tooling actions

Galvo Movement AOD Movement

= + +

Ultra-fastFastSlow

Beam Position Linear Stage Movement


The right laser tools for adv. packaging

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The right platform

The best laser for the application

Smart control for performance

Rigorous design for customer value

High accuracy

Small feature

Dense pattern

Superior value


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Processes, Technologies, Techniques and Materials

Display

Cutting, marking,

patterning of brittle

materials

Flex Circuits

Highest throughput in

via drilling and routing

Advanced

Interconnect

PCB Drilling, cutting

and routing

Stacked Die

Scribing and dicing of

wafers

Enclosure

Marking, drilling,

cutting, inspection

Circuit Trim

Wafer, circuit and

component trim

PCB

Semiconductor

Micromachining

Component


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Laser based fabrication tools in electronics packaging transfers

value to the end customer

• Functionality

• Reliability

• Build Quality

• Form Factor

• Affordability

Mobile Devices

Internet of Things

End Markets


ESI at a Glance

• Founded 1944

• Technology: Laser-based

microfabrication

• Valuable intellectual property portfolio

• Markets: Consumer Electronics,

Semiconductor, Industrial

Micromachining

• Manufacturing: Singapore, United

States, China

• Employees: ~700

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Documents

Laser based micro fabrication systems for electronics ... based micro fabrication systems for electronics packaging ... Ablation Dicing/Scribing Substrate ... ESI Kinematic Transform