ALMIT Pb-Free Solder PasteLFM-48 TM-HP

ALMIT TECHNOLOGY LTD.

1

Concept• Long Stencil Life

– The biggest defect with Pb-Free solder paste is the short stencil life.

– This problem has already been solved by ALMIT TM flux.

– However, there are improvements that can be made to improve first time pass rates.

– ALMIT TM-TS Flux has the combination of long stencil life and excellent printability.

– ALMIT TM-HP Flux has the same characteristics as TM-TS, and can be used at high preheat temperatures(200 degree C).

2

Printability –1

5.0mm/sec Constant speed

1.0mm/sec Constant speed

0.1mm/sec Constant speed

11th Print3rd PrintClogging Level (After 11th)

Snap off Speed

Printed ShapeMask Aperture

Squeegee Speed 15mm/sec

Each snap off speed

Printing Machine:

Kyusyu Matsushita SP10P

Terms:

Mask / 125μm

Pressure / 1.0~1.8kg/cm2

Clearance / -0.5mm

No Clogging. Excellent Printability.

3

Printability -2

120mm/sec

90mm/sec

30mm/sec

11th print3rd print Clogging LevelSqueegee speed

Printed ShapeMask Aperture

Snap off speed 1.0mm/sec

Each squeegee speed

Terms:

Mask / 125μm

Pressure / 1.0~1.8kg/cm2

Clearance / -0.5mm

Printing Machine:

Kyusyu Matsushita SP10P

No Clogging. Excellent Printability.

4

Tack ForceTack For ce

0

50

100

150

200

0 4 8 12 16 20 24

Leaving period （hr）

（gf

）

TM-HP

Used machine: Malcom TK-1

Leaving term: Leave the solder paste on the laboratory table after printing, then refit lid to paste jar.

Measuring method: JIS Z 3284 compliant

Stable Tack Force

5

Stencil LifeStencil Life

0

50

100

150

200

250

0 2 4 6 8

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

（hr）

（P

a･s）

TM-HP

Used machine: Malcom PCU-2

Atmosphere: 25℃, 85%RH

Stable Stencil Life

6

Spreadability

77.1%

CuO Plate

Ni Plate69.4%

Test Method: JIS Z 3197 (1986)

: Put 0.3g solder paste on each test board.

: Put on 240℃ hot platefor 30sec.

7

Slump Test at Heating

No Slumping

8

0.2mm 0.2mm

Test Method :

JIS Z 3284

Printed thickness 200 μm

Put on 190℃ hot plate for 1min.

TM-HP

Solder Ball Test

Rank 1 Rank 1

Rank 1 Rank 1

0 hr

24 hr

Test Method:

JIS Z 3284

Storage condition is room temp and room humidity.

190℃, 1minPH →240℃, 30sec

9

Wetting on ChipSn100 coated 2125C

Sn100 coated 1608C

Test Method: Print thickness 150μm →Mount→AirReflow

Reflow Temp→Preheat 150~170℃,2min Reflow upper 220℃, 40sec

Peak 238℃

10

High Temp Preheat Test 1 11

Reflow term

Reflow oven: Eitec tectron

ARS 330WN

Air 4 zone

90

35

234

172

190

Term(1) PH170~190/90sec

Upper 220/ 35sec

Peak 234

Term(2) PH180~190/120sec

Upper 220/51sec

Peak 240

120

51

240

180

190

High Temp Preheat 212

Term(3) PH constant 200/120sec

Upper 220/ 54sec

Peak 237

Term(4) PH constant 200/180sec

Upper 220/75sec

Peak 237

Reflow term

Reflow oven: Eitec tectron

ARS 330WN

Air 4 zone

120

54

237

200

180

75

237

200

○○○○○

Dot spreadabilitySurface FinishCoalescenceSolder ballMelt

1 dotFlat patternJIS-2JIS-1Φ0.3mm

Term(1) PH 170~190/90sec

Φ0.3 JIS-1 JIS-2

Flat pattern Overall view of JIS-1 1 dot

LFM-48 W TM-HP 13

○○○○○

Dot spreadabilitySurface FinishCoalescenceSolder ballMelt

1 dotFlat patternJIS-2JIS-1Φ0.3mm

Φ0.3 JIS-1 JIS-2

Flat pattern Overall view of JIS-1 1 dot

Term(2) PH 180~190/120sec LFM-48 W TM-HP 14

○○○○○

Dot spreadabilitySurface FinishCoalescenceSolder ballMelt

1 dotFlat patternJIS-2JIS-1Φ0.3mm

Φ0.3 JIS-1 JIS-2

Flat pattern Overall view of JIS-1 1 dot

Term(3) PH constant 200/120sec LFM-48 W TM-HP 15

○○△○○

Dot spreadabilitySurface FinishCoalescenceSolder ballMelt

1 dotFlat patternJIS-2JIS-1Φ0.3mm

Φ0.3 JIS-1 JIS-2

Flat pattern Overall view of JIS-1 1 dot

Term(4) PH constant 200/180sec LFM-48 W TM-HP 16

○○○○○

Dot spreadabilitySurface FinishCoalescenceSolder ballMelt

1 dotFlat patternJIS-2JIS-1Φ0.3mm

Φ0.3 JIS-1 JIS-2

Flat pattern Overall view of JIS-1 1 dot

Term(1) PH170~190/90sec Competitor17

○○○×○×

Dot spreadabilitySurface FinishCoalescenceSolder ballMelt

1 dotFlat patternJIS-2JIS-1Φ0.3mm

Φ0.3 JIS-1 JIS-2

Flat pattern Overall view of JIS-1 1 dot

Term(2)PH180~190/120sec Competitor18

○×○×△

Dot spreadabilitySurface FinishCoalescenceSolder ballMelt

1 dotFlat patternJIS-2JIS-1Φ0.3mm

Φ0.3 JIS-1 JIS-2

Flat pattern Overall view of JIS-1 1 dot

Term(3) PH constant 200/120sec Competitor 19

○×○××

Dot spreadabilitySurface FinishCoalescenceSolder ballMelt

1 dotFlat patternJIS-2JIS-1Φ0.3mm

Φ0.3 JIS-1 JIS-2

Flat pattern Overall view of JIS-1 1 dot

Term(4) PH constant 200/180sec Competitor20

Component Self-AlignmentSn62V14L LFM-48 X TM-HPCompetitor Sn62

½ off set of pad width

10 Degree tilt

2125 Chip

21

Sn62V14L LFM-48 X TM-HPCompetitor Sn62

30 Degree tilt

20 Degree tilt

2125 Chip

22

Sn62V14L LFM-48 X TM-HPCompetitor Sn62

½ off set of pad width

10 Degree tilt

1608 Chip

23

Sn62V14L LFM-48 X TM-HPCompetitor Sn62

30 Degree tilt

20 Degree tilt

1608 Chip

24

Conclusion• Based on the results of these test, ALMIT TM-HP

flux has excellent wettability and printability.• The great printed shape helps prevent solder balls

by eliminating slumping, and bridges by reducing bleeding.

• TM-HP flux is ideal for high preheat temperatures.

• TM-HP flux makes Pb-Free SMT easier by reducing print defects & opening the reflow process window

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Thank you

For more information please check our web site at

www.almit.com