LM960 Thermal Design Guide

LM960

Thermal Design Guide

1VV0301620 Rev. 2 – 2021-09-09

Telit Technical Documentation

LM960 Thermal Design Guide

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APPLICABILITY TABLE

PRODUCTS

LM960

LM960A18


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CONTENTS

APPLICABILITY TABLE 2

CONTENTS 3

1. INTRODUCTION 5

Scope 5

Audience 5

Contact Information, Support 5

Symbol Conventions 6

Related Documents 6

2. THERMAL MODEL 7

Temperature Sensor and Hotspot 7

2.1.1. Temperature Reading and Monitoring 7

Thermal Mitigation Algorithm 9

2.2.1. Thermal Mitigation Level Reading 10

2.2.2. How to Change Thermal Mitigation Level Range 11

Thermal Model -TBD 13

Temperature Range 14

Current Consumption in Each Mode 14

3. THERMAL DESIGN 16

Thermal Design Guidelines 16

Thermal Design Solution 16

4. PRODUCT AND SAFETY INFORMATION 20

Copyrights and Other Notices 20

4.1.1. Copyrights 20

4.1.2. Computer Software Copyrights 20

Usage and Disclosure Restrictions 21

4.2.1. License Agreements 21

4.2.2. Copyrighted Materials 21


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4.2.3. High Risk Materials 21

4.2.4. Trademarks 22

4.2.5. Third Party Rights 22

4.2.6. Waiver of Liability 22

Safety Recommendations 23

5. GLOSSARY 24

6. DOCUMENT HISTORY 25


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1. INTRODUCTION

Scope

This document provides thermal model and design guidelines useful for developing a

product with the Telit LM960.

Note: Proper thermal protection design protects against human or

component damage under the worst-case conditions.

And it reduces the probability of failure and does not adversely affect

the use of the module, and greatly extends the operation time with

maximum performance.

Audience

This document is intended system integrators that are using the Telit LM960 module in

their products.

Contact Information, Support

For technical support and general questions please e-mail:

• [email protected] • [email protected] • [email protected] • [email protected] • [email protected]

Alternatively, use:

https://www.telit.com/contact-us/

Product information and technical documents are accessible 24/7 on our web site:

https://www.telit.com

mailto:[email protected]




https://www.telit.com/contact-us/

https://www.telit.com/


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Symbol Conventions

Danger: This information MUST be followed or catastrophic

equipment failure or personal injury may occur.

Warning: Alerts the user on important steps about the module

integration.

Note/Tip: Provides advice and suggestions that may be useful when

integrating the module.

Electro-static Discharge: Notifies the user to take proper grounding

precautions before handling the product.

Table 1: Symbol Conventions

All dates are in ISO 8601 format, that is YYYY-MM-DD.

Related Documents

• LM960 HW User Guide, 1VV0301485

• LM960 SW User Guide, 1VV0301477


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2. THERMAL MODEL

Temperature Sensor and Hotspot

LM960 has three thermistors inside the module. The internal temperature can be

monitored by the AT command.

Figure 1: LM960 Temp Sensor & Hotspot

As you can see in the figure above, inside the LM960 there are three temperature sensors

(TSENS2, PA_THERM0, PA_THERM1). And it can be read from internal temperatures

using the AT#TEMPSENS command.

2.1.1. Temperature Reading and Monitoring

AT#TEMPSENS command provides several methods to read the internal temperature as

instant or periodic reports and to monitor the internal temperature using URC and GPIO.


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#TEMPSENS – Temperature monitor

AT#TEMPSENS=

<mod>[,<interval>

[,<action>

,<low_temp>

,<high_temp>

[,<gpio>]]]

Set command sets the operation of the internal temperature monitor.

Parameters:

<mod>

0 – disables the periodic reporting (factory default)

1 – enables the periodic reporting

2 – instantaneous reporting of the Temperature

Note: the module cannot enter sleep when <mod>=1.

<interval> - duration in seconds of the interval between next measurement. It has

meaning only if <mod> is 1.

The unsolicited message is in the format:

#TEMPSENS: <sensor>,<value>

where:

<sensor> - temperature sensor name

<value> - actual temperature expressed in Celsius degrees

<action>

1 - (01) - it enables the presentation of the temperature monitor

URC periodically. If <action> is not specified, this is

default.

2 - (10) - it enables the presentation of the temperature notification

URC, whenever the module internal temperature

reaches either <low_temp> or <high_temp> levels.

4 - (100) - output pin <gpio> is tied HIGH when set temperature

bounds are reached; when the temperature is back to

normal the output pin <gpio> is tied LOW. It is

mandatory to set the <gpio> parameter too to set this

<action>.

The notification message is in the format:

#TEMPNOTI: <level>,<value>

where:

<level> - threshold level

-1 - <low_temp> set temperature lower bound

0 - normal temperature

1 - <high_temp> set temperature upper bound

Note: Possible values for the parameter <action> are form 1 to 7 (001, 010, 011, 100, 101,

110 and 111)

<low_temp> - Temperature Lower Bound

(-40 – 0, Celsius Degrees)

<high_temp> - Temperature Upper Bound

(0 – 100, Celsius Degrees)


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#TEMPSENS – Temperature monitor

<gpio> - GPIO number. Valid range is any GPIO pin as described in

#GPIO command. This parameter is needed and required

only if <action>=4, 5, 6 or 7 are enabled.

AT#TEMPSENS? Read command reports the current parameter settings in the format:

#TEMPSENS: <mod>,<interval>[,<action>,<low_temp>,<high_temp>,[<gpio>]]

AT#TEMPSENS=? Test command reports supported range of values for parameters

<mod>,<interval>,<action>,<low_temp>,<high_temp> and <gpio>.

Example AT#TEMPSENS=2

#TEMPSENS: TSENS2,29

#TEMPSENS: PA_THERM0,30

#TEMPSENS: PA_THERM1,30

OK

Table 2: AT Command for Temperature Monitoring

Thermal Mitigation Algorithm

LM960 has a built-in thermal mitigation algorithm to reduce the probability of failure and

extend the operation time with maximum performance. The thermal mitigation algorithm

operates according to the internal temperature value read through the three

temperature sensors. The Thermal mitigation algorithm limits the performance(DL/UL

throttling, Tx power back off, call drop.. etc) when the temperature is above a defined

certain level.

Thermal Mitigation Level

Temperature sensors have several levels of thermal mitigation. Each level has

predefined actions as in the table below and works individually in the sensor. Performs

the following actions based on the mitigation level to reduce/control the temperature.

Sensor Level Action Comment

PA_THERM 0 - Normal

1 Enable UL data throttling Start throttling the uplink data rate by reporting

a smaller buffer status report.

2 Enable MTPL back-off Limit maximum Tx power (23dBm)

3 Lmitied service mode Call released.

TSENS 0 - Normal

1 Start DL data throttling #3DL CA drops to 1DL (PCC only)

3 Limited service mode Call released.

Table 3: Thermal Mitigation Level and Action


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After entering mitigation level 3, the limited service mode is released after the

PA_THERM and TSENS sensor reaches mitigation level 0. In other words, the sensor

reading falls below the level 1 clearing thresholds.

2.2.1. Thermal Mitigation Level Reading

AT#TMLVL command used for read current thermal mitigation level of each temperature

sensors.

#TMLVL – Thermal Mitigation Level

AT#TMLVL=<device_id> Set command reports a current thermal mitigation level of specific <device_id>.

Parameters:

<device_id> - which device to get mitigation level

1 – TSENS2

2 – PA_THERM

The report message is in the format:

#TMLVL: <level>

Where:

<level> - thermal mitigation level

0 – normal

1 – level1

2 – level2

3 – level3

Note : level2 is shown only with PA_THERM device.

AT#TMLVL? Read command reports a current thermal mitigation level of all devices in the format:

#TMLVL: TSENS2,<level>

#TMLVL: PA_THERM,<level>

AT#TMLVL=? Test command returns the supported range of values for parameter <device_id>.

Example AT#TMLVL?

#TMLVL: TSENS2,1

#TMLVL: PA_THERM,1

OK

AT#TMLVL=2

#TMLVL: 1

OK

Table 4: AT Command for Thermal Mitigation Level Reading


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2.2.2. How to Change Thermal Mitigation Level Range

The range of the Thermal mitigation level could be modified through thermal engine

configuration file.

For using ADB on Windows OS

Download the ADB tool through google (Can be skipped if you already have it).

https://adbshell.com/downloads

Check ADB device detection.

• Connect USB to Windows Laptop.

• Run Command Prompt or PowerShell of Windows in downloaded ADB tool

directory.

adb devices

• If ADB detection success, you can see the specific device id. In case of detection

failed, please do next step.

Register Telit USB VID to ADB tool (This step needs only once at one Laptop.

• If ADB detection filed, please do following commands.

echo 0x1BC7 >> %HOMEPATH%\.android\adb_usb.ini

adb kill-server

adb devices

https://adbshell.com/downloads


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• After do commands, you can see ADB device that attached on Laptop.

Change thermal engine configuration file

Current thermal engine configuration file can be got from LM960 through ADB command.

• adb pull /etc/thermal-engine.conf

• Open and edit the thermal-engine.conf file.

• Put the modified thermal-engine.conf file to LM960.

adb push thermal-engine /etc

• Please do reboot LM960 to apply your changes.


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Thermal Model -TBD

Thermal Model is evaluated by thermal simulation and RF test with thermal chamber.

Figure 2: Equivalent thermal resistance model

The two-resistor compact model is calculated according to JEDEC standard.

ƟJT is the thermal resistance from junction to the top side: 9 °C/W

ƟJA is the thermal resistance from the top side to the air side: 22 °C/W

ƟJB is the thermal resistance from junction to the bottom side: 7 °C/W

ƟBA is the thermal resistance from the bottom to the air side: 19 °C/W

**Measure condition:

- Thermal resistances were measured in 100mm * 90mm * 1mm FR4 Evaluation

board

- Network condition

Downlink 4*4MIMO 1.2Gbps throughput (B2, B66C)

Uplink QPSK and maximum power status


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Note: And we also provide the FloTHERM detail modeling file for help

customers to design and simulate their design easily.

Thermal simulation was performed with Flotherm V12.1

If you want to get the thermal simulation file, please contact Telit

Technical Support at

• [email protected]




Temperature Range

The maximum operating temperature allowed is +105°C which can be read by

AT#TEMPSENS. It is not recommended to operature the LM960 above the allowable

maximum operating temperature.

Operating Condition

Condition Min Typ Max

The Temperature read by AT#TEMPSENS - - +105°C

Table 5: Operating Condition

Current Consumption in Each Mode

LM960 Current Consumption

Mode Average [Typ.] Mode Description

IDLE Mode

CFUN=1 20mA No call connection

USB3.0 is connected to a host

Power Saving Mode (PSMWDISACFG=1, W_DISABLE_N:Low)

CFUN=4 2.5mA Tx and Rx are disabled; module is not registered on the

network (Flight mode)

WCDMA 3mA DRx7 (1.28 sec DRx cycle)

LTE 3.3mA Paging cycle #128 frames (1.28 sec DRx cycle)

Operative Mode (LTE)

Non-CA mode (1DL / 1UL) 600mA Non-CA, Band 2, Single carrier, BW 5MHz, 23dBm, 1RB





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Mode Average [Typ.] Mode Description

2DL CA with 2x2 MIMO / 2UL CA 900mA CA_2A-5A, 2x2 MIMO, Full RB, 256QAM DL / 64QAM UL

(FDD 300Mbps DL / 150Mbps UL)

5DL CA with 2x2 MIMO / 1UL 1000mA CA_2A-5B-66A-66A, 2x2 MIMO, Full RB, 256QAM DL /

64QAM UL (FDD 1Gbps DL / 75Mbps UL)

3DL CA with 4x4 MIMO / 1UL 1200mA CA_2A-66C, 4x4 MIMO, Full RB, 256QAM DL / 64QAM UL

(FDD 1.2Gbps DL / 75Mbps UL)

Operative Mode (WCDMA)

WCDMA Voice 750 mA WCDMA voice call (Tx = 23 dBm)

WCDMA HSPA (22 dBm) 650 mA WCDMA data call (DC-HSDPA up to 42 Mbps, Max

Throughput)

Table 6: Current Consumption

* Worst/best case current values depend on network configuration ** Loop-back mode in call equipment *** 3.3 voltage / room temperature

Note: The electrical design for the power supply must ensure a peak

current output of at least 2A.


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3. THERMAL DESIGN

This chapter provides thermal design guidance to assist the customer in thermal design.

Thermal Design Guidelines

To enhance heat dissipation:

• Make sure there is sufficient air flow around the LM960 . (Spread the heat)

- Balance the heat flow between front and back of the PCB

- Insulate hot spots on the device skin from hot areas below

• Separate the hottest components (Spread the heat)

• Optimize the ground plane and connections. (Spread the heat)

- Use a larger copper weight for a solid ground plane layer

- Connect each ground pad of LM960 directly.

• Use Thermal Interface Material. (Spread the heat)

- Eliminate the air gaps between the top/bottom of LM960 and the heat

spreaders; use TIM under compression and thermal grease for better

thermal conduction

- Use large surface areas with high thermal conductivity

• Use phase change material or heat pipes. (Absorb the heat)

• Keep the TCXO or any XO away from heat sources/gradients near the LM960.

• If the thermal conductive material is attached between LM960 and the customer

board, the heat dissipation is better for multilayer PCB.

• Attach the conductive material and heat sink at top and bottom side of module for

the heat dissipation.

Thermal Design Solution

There are the 1.2 W/m-k thermal conductive materials between the main chipset and the

shield cover of the LM960 for the better heat dissipation.


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Figure 3: LM960 Side View

Warning: RF and Baseband areas must be dissipated from heat

Figure 4: LM960 Shield Cover with TIM (Bottom View)

Figure 5: Copper Pad Location on Bottom of LM960


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On the back of LM960 there is the large resist opening area for soldering for better heat

dissipation to the heat sinks found on the customer’s application board.

This chapter defines the heat sink or TIM for application as the basic element of the heat

sink design. LM960 is capable of getting et very hot when operating at the upper limit of

its range.

A heat sink or TIM is a component that is attached to a module to transfer heat from the

device to its surrounding environment. This environment is most commonly air, but it can

also be other fluids. Heat sinks are typically made of aluminum or copper. It expedites

the heat transfer to the surrounding fluid.

Figure 6: Thermal Solution on Both sides

The best method is to connect a heat sink on the top and a TIM on the bottom side.

Inevitable environment where heat sink or TIM cannot be attached on both sides, a heat

sink or TIM can only be connected on one side, but this is not the best option.

It is recommended to connect a TIM pad to the bottom side of customer PCB.

Please refer to the figure as below.

Figure 7: Heat Sink on Top Side


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Figure 8: TIM on Bottom Side

Note: If you ignore the above contents, the network connection may

be terminated due to overheating. When the temperature drops, the

network connection will be restarted


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4. PRODUCT AND SAFETY INFORMATION

Copyrights and Other Notices

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

Although reasonable efforts have been made to ensure the accuracy of this document,

Telit assumes no liability resulting from any inaccuracies or omissions in this document,

or from the use of the information contained herein. The information contained in this

document has been carefully checked and is believed to be reliable. Telit reserves the

right to make changes to any of the products described herein, to revise it and to make

changes from time to time without any obligation to notify anyone of such revisions or

changes. Telit does not assume any liability arising from the application or use of any

product, software, or circuit described herein; neither does it convey license under its

patent rights or the rights of others.

This document may contain references or information about Telit’s products (machines

and programs), or services that are not announced in your country. Such references or

information do not necessarily mean that Telit intends to announce such Telit products,

programming, or services in your country.

4.1.1. Copyrights

This instruction manual and the Telit products described herein may include or describe

Telit copyrighted material, such as computer programs stored in semiconductor

memories or other media. The laws in Italy and in other countries reserve to Telit and its

licensors certain exclusive rights for copyrighted material, including the exclusive righ to

copy, reproduce in any form, distribute and make derivative works of the copyrighted

material. Accordingly, any of Telit’s or its licensors’ copyrighted material contained

herein or described in this instruction manual, shall not be copied, reproduced,

distributed, merged or modified in any way without the express written permission of the

owner. Furthermore, the purchase of Telit products shall not be deemed to grant in any

way, neither directly nor by implication, or estoppel, any license.

4.1.2. Computer Software Copyrights

Telit and the Third Party supplied Software (SW) products, described in this instruction

manual may include Telit’s and other Third Party’s copyrighted computer programs

stored in semiconductor memories or other media. The laws in Italy and in other

countries reserve to Telit and other Third Party, SW exclusive rights for copyrighted


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computer programs, including – but not limited to - the exclusive right to copy or

reproduce in any form the copyrighted products. Accordingly, any copyrighted computer

programs contained in Telit’s products described in this instruction manual shall not be

copied (reverse engineered) or reproduced in any manner without the express written

permission of the copyright owner, being Telit or the Third Party software supplier.

Furthermore, the purchase of Telit products shall not be deemed to grant either directly

or by implication, estoppel, or in any other way, any license under the copyrights, patents

or patent applications of Telit or other Third Party supplied SW, except for the normal

non-exclusive, royalty free license to use arising by operation of law in the sale of a

product.

Usage and Disclosure Restrictions

4.2.1. License Agreements

The software described in this document is owned by Telit and its licensors. It is furnished

by express license agreement only and shall be used exclusively in accordance with the

terms of such agreement.

4.2.2. Copyrighted Materials

The Software and the documentation are copyrighted materials. Making unauthorized

copies is prohibited by the law. The software or the documentation shall not be

reproduced, transmitted, transcribed, even partially, nor stored in a retrieval system, nor

translated into any language or computer language, in any form or by any means, without

prior written permission of Telit.

4.2.3. High Risk Materials

Components, units, or third-party goods used in the making of the product described

herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use

as on-line control equipment in the following hazardous environments requiring fail-safe

controls: operations of Nuclear Facilities, Aircraft Navigation or Aircraft Communication

Systems, Air Traffic Control, Life Support, or Weapons Systems (“High Risk Activities").

Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness

eligibility for such High Risk Activities.


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4.2.4. Trademarks

TELIT and the Stylized T-Logo are registered in the Trademark Office. All other product

or service names are property of their respective owners.

4.2.5. Third Party Rights

The software may include Third Party’s software Rights. In this case the user agrees to

comply with all terms and conditions imposed in respect of such separate software

rights. In addition to Third Party Terms, the disclaimer of warranty and limitation of

liability provisions in this License, shall apply to the Third Party Rights software as well.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESSED OR IMPLIED FROM

ANY THIRD PARTY REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS

INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE

SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODES”), AND THE USE OF ANY OR ALL

OTHER CODES IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT

LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A

PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODES MUST BE LIABLE FOR ANY DIRECT,

INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES

(INCLUDING WITHOUT LIMITATION LOST OF PROFITS), HOWEVER CAUSED AND

WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY

WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODES OR THE EXERCISE OF

ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS

APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH

DAMAGES.

4.2.6. Waiver of Liability

IN NO EVENT WILL TELIT AND ITS AFFILIATES BE LIABLE FOR AY DIRECT, INDIRECT,

SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY

INDIRECT DAMAGE OF ANY KIND WHATSOEVER, INCLUDING BUT NOT LIMITED TO

REIMBURSEMENT OF COSTS, COMPENSATION OF ANY DAMAGE, LOSS OF

PRODUCTION, LOSS OF PROFIT, LOSS OF USE, LOSS OF BUSINESS, LOSS OF DATA OR

REVENUE, WHETHER OR NOT THE POSSIBILITY OF SUCH DAMAGES COULD HAVE BEEN

REASONABLY FORESEEN, CONNECTD IN ANY WAY TO THE USE OF THE PRODUCT/S OR

TO THE INFORMATION CONTAINED IN THE PRESENT DOCUMENTATION, EVEN IF TELIT

AND/OR ITS AFFILIATES HAVE BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES

OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.


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Safety Recommendations

Make sure the use of this product is allowed in your country and in the environment

required. The use of this product may be dangerous and has to be avoided in areas where:

• it can interfere with other electronic devices, particularly in environments such as

hospitals, airports, aircrafts, etc.

• there is a risk of explosion such as gasoline stations, oil refineries, etc. It is the

responsibility of the user to enforce the country regulation and the specific

environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty

validity. We recommend following the instructions of the hardware user guides for

correct wiring of the product. The product has to be supplied with a stabilized voltage

source and the wiring has to be conformed to the security and fire prevention regulations.

The product has to be handled with care, avoiding any contact with the pins because

electrostatic discharges may damage the product itself. Same cautions have to be taken

for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM

when the product is in power saving mode.

The system integrator is responsible for the functioning of the final product. Therefore,

the external components of the module, as well as any project or installation issue, have

to be handled with care. Any interference may cause the risk of disturbing the GSM

network or external devices or having an impact on the security system. Should there be

any doubt, please refer to the technical documentation and the regulations in force. Every

module has to be equipped with a proper antenna with specific characteristics. The

antenna has to be installed carefully in order to avoid any interference with other

electronic devices and has to guarantee a minimum distance from the body (20 cm). In

case this requirement cannot be satisfied, the system integrator has to assess the final

product against the SAR regulation.

The equipment is intended to be installed in a restricted area location.

The equipment must be supplied by an external specific limited power source in

compliance with the standard EN 62368-1:2014.

The European Community provides some Directives for the electronic equipment

introduced on the market. All of the relevant information is available on the European

Community website:

https://ec.europa.eu/growth/sectors/electrical-engineering_en

https://ec.europa.eu/growth/sectors/electrical-engineering_en


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5. GLOSSARY

ADB Android Debug Bridge

BW Bandwidth

CA Carrier Aggregation

DL Downlink

FDD Frequency Division Duplex

GPIO General Purpose Input Output

LTE Long Term Evolution

GPIO General Purpose Input Output

MIMO Multiple Input Multiple Output

PA Power Amplifier

PCB Printed Circuit Board

PCC Primary Component Carrier

QAM Quadrature Amplitude Modulation

QPSK Quadrature Phase Shift Keying

RB Resource Block

RF Radio Frequency

RX Receive

SISO Single Input Single Output

TCXO Temperature Compensated Crystal Oscillator

TIM Thermal Interface Material

TX Transmit

UL Uplink

URC Unsolicited Result Code

WCDMA Wideband Code Division Multiple Access


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6. DOCUMENT HISTORY

Revision Date Changes

2 2021-09-09 Minor changes on the language and on the layout

Legal Notices updated

Glossary added

1 2019-11-11 Applicability table – Added LM960A18

0 2019-08-02 Initial Release

From Mod.0818 rev.4