MAiA®/FABiA®/DiVA®

INLINE PECVD SYSTEM

Highest Throughput inline PECVD deposition system

Integrates several process steps in one equipment

Up to 30% lower production costs

Lowest operating costs, Highest Return on investment

Top cell efficiencies >22% in mass production

Cell equipment PERx MAiA

South Korea / Asan-siChina / Shanghai, Wuxi City

Taiwan / Zhubei CIty

MAiA®/FABiA®/DiVA®

The Meyer Burger modular deposition system consists of several processing modules joined via buffer modules. Several processes are thus carried out successively in a single piece of equipment. Each unit is configured for a specific application.

The system can be configured for various customized coating processes and is qualified for PERC and PERT cell concepts. With over 35 GW worldwide installed PERC capacities, Meyer Burger's coating system delivers the benefits of a proven industrialized solution.

Passivated Emitter and Rear ContactPERC

Sin front sideContact FingerEmitter (n)AlOx rear sideSin rear sideBack Screen Print with laser contact opening

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The Passivated Emitter and Rear Contact (PERC) technology is dedicated to the back of the solar cell and increases the output of 60 cell modules by 15 W with only two additional production steps. After phosphor glass (PSG) etch step, the back side of the cell is passivated with Aluminum-Oxide and Silicon-Nitride. Additionally, the back side will be opened through a laser process.

Meyer Burger develops and manufactures vanguard PV equipment qualified for PERC, PERx, p-type and n-type cell concepts. Our equipment is suitable for mono- and multi-crystalline wafers, for monofacial and bifacial cells.

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6

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12

5

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54

Front side SiN + Rear side AlOx + SiN

Better efficiency expected due toless handling and contamination

FABiA® 6.1PERC deposition 3in1 tool

Only 3-in1 system for front and rear AlOx and SiN deposition

Load ModuleProcess Module 1 (SiOx, AlOx)Transfer ModuleProcess Modules 2+3+4+5 (SiN, SiOx)Unload Module

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30% lower production costs

100% higher footprint utilization

Highest and fastest ROI

Highest yield in mass production

FABiA® 6.1

AlOx + SiN

Competition

SiN

AlOx

871 m²

1,495 m²

(SiN Tube)

288 m²

(ALD)

Rear side SiN + Front side SiN

FABiA® 6.1PERC deposition 3in1 tool

MAiA® 6.1Mainstream PERC deposition 2in1 tool

Massive installed base,Proven durable platform

20% lower production costs

Highest throughput in the market

Highest yield in mass production

DiVA® 6.12in1 SiN deposition tool

20% lower production costs

Highest throughput in the market

Highest yield in mass production

Compatible solution with ALD

Rear side AlOx + SiN

MAiA® 4.1 MAiA® 6.1 FABiA® 6.1 DiVA® 6.1

Application AlOx + SiN AlOx + SiN + SiN SiN + SiN

Layer thickness in nm AlOx: 5 - 20

Cap. SiN: 130AlOx: 5 - 20

Cap. SiN: 120AlOx: 5 - 20

Cap. SiN: 140

AlOx: 5 - 20Cap. SiN: 140

SiN: ~100

AlOx: 5 - 20Cap. SiN: 120

SiN: ~82

Cap. SiN: 140SiN: ~82

Plasma sources 2 + 8 2 + 10 2 + 12 2 + 12 + 10 2 + 10 + 8 12 + 10

Process module combinations 4 + 4 + 4 4 + 4 + 6 4 + 6 + 6 4 + 6 + 6 + 4 + 6 4 + 4 + 6 + 4 + 4 6 + 6 + 4 + 6

Throughput gross in wph up to 4,250 up to 6,500 up to 6,500 up to 6,500

Uptime in % 95 94 94

Yield mechanical in % ≥ 99.9% ≥ 99.9% ≥ 99.9%

Yield optical in % ≥ 99.5% ≥ 99.5% ≥ 99.5%

Wafer size compatibility M2 (156.75x156.75 mm), M4 (161.70x161.70 mm), M6 (166x166 mm)

Wafer per tray 30 (5x6) max. 42 (7x6) max. 42 (7x6) max. 42 (7x6)

Specifications

FABiA® 6.14-6-6-4-6

FABiA® 6.14-4-6-4-4

CC Module

TrayBuffer

Lift

Legth in m 21.04 19.74 1.66 1.54 1.85

Width in m 5.74 5.74 1.65 1.65 1.65

Height in m 3.17 3.17 1.39 2.01 1.44

Dimensions

MAiA® 6.14-4-6

MAiA® 6.14-6-6

CC Module

TrayBuffer

Lift

Legth in m 16.49 17.14 1.66 1.60 1.70

Width in m 5.74 5.74 1.73 1.70 1.70

Height in m 3.17 3.17 1.39 2.04 1.39

DiVA® 6.14-6-4-6

DiVA® 6.16-6-4-6

CC Module

TrayBuffer

Lift

Legth in m 14.46 15.29 1.66 1.60 1.70

Width in m 5.74 5.74 1.73 1.70 1.70

Height in m 3.17 3.17 1.39 2.04 1.39

MAiA® 4.1 MAiA® 6.1 FABiA® 6.1 DiVA® 6.1

Application AlOx + SiN AlOx + SiN + SiN SiN + SiN

Layer thickness in nm AlOx: 5 - 20

Cap. SiN: 130AlOx: 5 - 20

Cap. SiN: 120AlOx: 5 - 20

Cap. SiN: 140

AlOx: 5 - 20Cap. SiN: 140

SiN: ~100

AlOx: 5 - 20Cap. SiN: 120

SiN: ~82

Cap. SiN: 140SiN: ~82

Plasma sources 2 + 8 2 + 10 2 + 12 2 + 12 + 10 2 + 10 + 8 12 + 10

Process module combinations 4 + 4 + 4 4 + 4 + 6 4 + 6 + 6 4 + 6 + 6 + 4 + 6 4 + 4 + 6 + 4 + 4 6 + 6 + 4 + 6

Throughput gross in wph up to 4,250 up to 6,500 up to 6,500 up to 6,500

Uptime in % 95 94 94

Yield mechanical in % ≥ 99.9% ≥ 99.9% ≥ 99.9%

Yield optical in % ≥ 99.5% ≥ 99.5% ≥ 99.5%

Wafer size compatibility M2 (156.75x156.75 mm), M4 (161.70x161.70 mm), M6 (166x166 mm)

Wafer per tray 30 (5x6) max. 42 (7x6) max. 42 (7x6) max. 42 (7x6)

Meyer Burger (Switzerland) AG | Schorenstrasse 39 | 3645 Gwatt (Thun) / Switzerland+41 33 221 28 00 | sales@meyerburger.com | meyerburger.com

We reserve the right to make changes reflecting technical progress.

Service Meyer Burger, with its service centers near you, offers first-class service that only the original manufacturer can deliver. We take responsibility for the availability and productivity of your equipment today and tomorrow.

With a complete range of services, we support you from commissioning through production support and mainte-nance to life-prolonging system upgrades. All works are carried out by qualified technicians and with original service parts only – at your site or in our local service center.

Wherever you need it, our service is available in time, and of top quality.

Worldwide presence

Switzerland / Thun, NeuchâtelGermany / Hohenstein-Ernstthal, ReichelsheimUSA / Hillsboro

South Korea / Asan-siChina / Shanghai, Wuxi City

Taiwan / Zhubei CIty

Malaysia

Singapore