Upload
others
View
3
Download
0
Embed Size (px)
Citation preview
ELECTRONICS MANUFACTURING SERVICES
© 2009 Sanmina-SCI Corporation. Sanmina-SCI is a trademark of Sanmina-SCI Corporation. All trademarks and registered trademarks are the property of their respective owners.
Market, Technology, Collaboration: EMS Perspective
Dr. Michael StephanVP Account [email protected]
Sanmina-SCI Confidential
Agenda
� iNEMI Mission and Sanmina-SCI Business� Sanmina-SCI Today� Medical Division� Technology & Capabilities
� PCB� Assembly� Optical
� Technology Roadmap� Development Projects� Summary
Sanmina-SCI Confidential
3
Software Solutions
Marketing Design Manufacturing OrderFulfillment
Supply Chain ManagementInformation Technology
LogisticsCommunications
Business Practices
Build toOrder
Materials
Components
Customer
Equipment
MaterialsTransformation
Collaborative Design Lifecycle
SolutionsSoftware Solutions
Identify and close technology gaps, which includes the development and integration of the electronics industry supply infr astructure.
iNEMI Mission and Sanmina-SCI Business
Sanmina-SCI Confidential
Meeting Background� iNEMI is sponsoring this workshop to identify areas of potential collaborative
R&D that will reduce risk and speed up synchronized technology adoptionacross the supply chain. The workshop will:� Feature speakers from OEMS, suppliers, regulatory and research institutions� Identify challenges and gaps that benefit from a collaborative approach
Meeting Objectives� Evaluate opportunities that would benefit from industry collaboration� Form action groups to define and execute the required industrial
collaborative programs
iNEMI Mission and Sanmina-SCI Business
Sanmina-SCI Confidential
Medical – What does it mean?� Our customers (OEMs) are very conservative� Most products have long life cycle (active & service)� Subject to strict regulations� People‘s life often depends on devices
Medical Operations Objectives� Traceability – Key� Quality – Must
iNEMI Mission and Sanmina-SCI Business
Sanmina-SCI Confidential
Delivering the highest-level quality, technology and services to our customers.
� 30 years of operation
� $5.2 billion in annualized revenue (2009)
� 70+ plants in 18 countries
� 13M ft of manufacturing capacity
� 38,000 employees
� Total EMS solution
Sanmina-SCI Today
Sanmina-SCI Confidential
Repair & LogisticsDesign and Engineering
World-class Infrastructure Support Services: Supply Chain Management
Systems Design and Manufacturing
Dedicated End MarketsComponent Manufacturing
PCB Fabrication Plastic Injection Molding
Backplanes Cables
Memory Module Solutions Optical Solutions
Enclosures
Communications Industrial & Semiconductor
Enterprise Computing & Storage Defense & Aerospace Systems
Multimedia Medical Systems
Automotive Emerging MarketsPrecision Machining
End-to-End Manufacturing Services
Sanmina-SCI Confidential
San Jose, CA
Guadalajara, Mexico
Huntsville, AL
Örnsköldsvik, Sweden
Fermoy, Ireland
Ma’alot, Israel
Shenzhen, China
Singapore/Batam
Medical Division – Strategy & Footprint
� Medical Electronic Product Manufacturing: 18 Years
� Focused, Separate Medical Division – 8 Years
� Dedicated Medical Facilities – Complete Global Footp rint
� Largest Medical Electronic Product Revenues: $800M + / year
� Separate, Medical Quality System
� One I.T. System for All Sanmina-SCI & Medical Facil ities
� Greatest Number of Finished Medical Systems in Prod uction
Kunshan, China
Chennai, India
Penang, Malaysia
Tatabanya, Hungary
Lod, Israel
Sanmina-SCI Confidential
Ultrasound
Blood Glucose Meters
Anesthesia Metering
DermatologicalLaser Systems
Blood SeparatorsCT & Nuclear Medicine
Catheter Guidance
Middle EarInfections
In HomeMonitoring
Blood PressureTesting
RespirationSystems
CancerTreatment
Mobile / Portable “Core” Medical Large Systems Medical Devices
Orthopedics
Catheters
Pacemakers, Neuromodulation
Sanmina-SCI Medical – 4 Product Segments
Sanmina-SCI Confidential
We have a lot of high speed interconnect capabilities & technology…� Advanced PCB technology� Cable� Advanced high speed backplanes� Multi chip modules
… but usually don‘t apply these in medical products� Medical PCBs often have 4 - 8 layers only� Medical backplanes usually do not include our high speed technolgy� Sanmina-SCI‘s multichip technology is more often applied in telecom,
computer and storage products than in medical
Current Reality
Sanmina-SCI Confidential
Medical Appliance Technology Drivers
� High density component packages
� Form factor reduction
� Faster signal speed
� Improved Signal Integrity noise margins
� Weight reduction
� Cost/Performance
Sanmina-SCI Confidential
PCB Technologies for Medical Electronics
� Embedded Passives� HDI and Microvias� Flex and Rigid Flex� Form to Fit Flex� Embedded ESD Protection
Sanmina-SCI Confidential
ZBC Capacitor/Embedded resistor
ASIC / Processor
Embedded DiscreteCapacitor/ ABR
SMT DiscreteCapacitor/ Resistor
SMT DiscreteCapacitor/ Resistor
As Densities and Frequencies Increase Embedded Component Solutions will continue to offer Improved Cost/Performance Ratios over Conventional Designs and Solutions
Embedded Passive Design Strategies
Sanmina-SCI Confidential
� Decreased Plane Inductances & PDS
Impedance at High Frequencies� Reduced EMI
� Lower Inductance
� Reduced Size or IncreasedFunctionality at Same Size
� Replace or Supplement Discrete Caps
� Lower Assembly Costs & HigherReliability� Fewer Components = Less Solder Joints
� Telcordia GR78 Approved Thin Dielectrics� 500V Breakdown
� Lead Free Compatible
� Market Proven Technology
Active Component
Gnd
PwrI & Z C
No BC®
Active Device
Decoupling Capacitors
Active Device
Decoupling Capacitors
With BC®
Buried Capacitance™ Drivers
Sanmina-SCI Confidential
Plane C
apac
itance
pf/i
n2
(pf/c
m2 )
BC12, BC16, BC8, BC16T, BC12T are all trademarks of Oak Mitsui TechnologiesHK-04 is a trademark of DuPont Electronic Materials
1000 (155) BC24™ & ZBC1000™1.0 mil (25µ)
1600 (233) BC16™0.6 mil (16 µ)
1900 (310) BC12™0.5 mil (12 µ)
3100 (481) BC8™0.3 mil (8 µ)
11,000 (1,705) BC16T™0.6 mil (16 µ)
500 (78) ZBC2000®2.0 mil (50µ)
4500 (698) BC12TM™0.5 mil (12 µ)
800 (124) HK-04™1.0 mil (25µ)
Buried Capacitance Licensed Materials
Sanmina-SCI Confidential
FaradFlex™ BC-16T andFaradFlex™ BC-12TM� Ceramic filled/ modified FR-4
epoxy dielectric
FaradFlex™ BC-24, BC-16, BC-12 and BC-8� Modified FR-4 epoxy
dielectric
HK-4� Polyimide dielectric
ZBC-2000® and ZBC-1000™� FR-4 epoxy dielectric
with fiberglass reinforcement
BC® Material Cross Sections
Sanmina-SCI Confidential
Buried Capacitance™ (ZBC®)
Product Highlights� License patent to PCB fabricator & laminator
� Improved EMI
� Improved reliability
� Improved manufacturability
� Improved power distribution
� Reduction of high-frequency discrete bypass capacitors
� Reduction of undesired discrete capacitor resonance
� Low-plane inductance at high frequencies
� Worldwide network of licensed laminators and fabricators
� Guaranteed quality and consistency of material through common standard
Non-ZBC® ZBC2000®
BC24TM BC12TMTM
Noisy
Quiet
TechDream Simulation of Plane Resonance
77%10BC848
75%11BC1248
74%12BC1648
72%13BC24/HK0448
64%17ZBC2000®48
0%484 mil core48
%Eliminated
# CapsAfter
Product# Caps Before
Buried Capacitance® - Laminate Impedance
Eliminate Costly Bypass Capacitors Using ZBC® Products
Sanmina-SCI Confidential
Embedded Resistors
Sanmina-SCI Confidential
Embedded Resistor Applications
� Tight surface areas
� BGA terminations
� Thevenin terminations� Pull-up or Pull-down resistors� Discrete
� Network
� Series� Weight sensitive� Embedded resistors are lighter weight than chip resistors
� RF and microwave� Power splitters
Sanmina-SCI Confidential
Embedded Resistor Technologies
� Multiple available technologies & configurations� Tailored to specific design requirements� Over 10 years of PTF manufacturing experience� Improved PTF Materials� Cost Effective Laser Trimming
TICER Ohmega-Ply ® Thin Film
Sanmina-SCI Polymer Thick Film (PTF)
Sanmina-SCI Confidential
ABR™ Annular Buried Resistor
� Three generic physical configurations� Space Saving� No routing required
Via to Plane
Via to Signal
Via to Via
Sanmina-SCI Confidential
Sanmina-SCI’s Patented Planar Trimming Can Be Adapted to Any PCB Fabricator At Minimum Capital Cost FAST….2000 resistors 2 minutes
Standard J Cut Laser Trim SSCI Patented Planar Laser Trim
� Specialized Laser Trim Tool� Point-to-Point Test & Trim – very slow� Large Reduction to Current Cross-section� Localized Current Crowding� Very Precise Resistor Values DC and� Low Frequencies� Poor High Frequency Response
� Leverage Existing Laser Drill Tools� and Test Equipment� Predictive Trim Formulation – very fast� Uniform Reduction to Current Cross-section� Uniform Current Densities� Maintain 1 – 5% Resistance Tolerance� Uniform Frequency Response DC to VHF
Predictive Laser Trimming Process PLT™
Sanmina-SCI Confidential
0.002”
1st Test A D Tool# 47 46 36 35 25 24 14 13 12 11 10 Over Flow
Image 1 1 2 36 63 50 20 15 4 5 3 1 1
Image 2 1 8 61 55 37 14 11 8 3 1 1 1
Image 3 1 7 31 48 67 37 6 2 2
Image 4 1 1 1 18 39 65 53 15 5 3
Image 5 7 52 39 19 17 17 14 16 9 4 4 1 1
Image 6 1 1 22 42 62 37 22 9 2 2 1
Image 7
Image 8
Image 9
Pass >> Bin .15 .20 .25 .30 .35 .40 .45 .50 .55 .60 .65 .70 .75 .80 .85 .90 .95 1.0 1.05 1.10 1.15 >Sum 1 26 220 286 300 178 86 42 29 17 6 7 1 1
Sum Total Tool Set Trim Sum
XFactor
Tool Dispersion
Mean: Stdev: Small: Large: 3*CV:
AQ320_05a.csv AQ320_05b.csv Tool#
10
Images Per Core: 6 Resistors Per Image:
57%
200
0.28 0.920.47 0.09
0.111200 1168
2 nd TestSave
RecordsDrill
Format
0.0
0.2
0.4
0.6
0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15
ClearSort B 1st TestTool
Dispersion
LoadLoad
2nd Test A D Tool# 47 46 36 35 25 24 14 13 12 11 10 Over Flow
Image 1 1 1 1 3 1 13 67 82 25 4 1 2 1
Image 2 1 1 2 23 78 59 26 10 1 1
Image 3 1 1 2 1 33 95 51 11 5 2
Image 4 1 1 1 8 49 88 49 4 1
Image 5 1 1 1 14 72 61 32 10 3 5 1 1
Image 6 1 1 1 12 38 52 56 27 8 5 1
Image 7
Image 8
Image 9
Pass >> Bin .15 .20 .25 .30 .35 .40 .45 .50 .55 .60 .65 .70 .75 .80 .85 .90 .95 1.0 1.05 1.10 1.15 >Sum 1 1 21 85 297 426 267 68 19 10 3 2
Sum Total Tool Set Trim Sum
XFactor
Tool Dispersion
Mean: Stdev: Small: Large: 3*CV:
AQ320_05a.csv AQ320_05b.csv Tool#
10
Images Per Core: 6 Resistors Per Image:
27%
200
0.41 1.020.67 0.06
6
0.111200 831
2 nd TestSave
RecordsDrill
Format
0.0
0.2
0.4
0.6
0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15
ClearSort B 1st TestTool
Dispersion
LoadLoad
1st Electrical Core Test 2nd Electrical Core Test
Licensing Available� Predictive Trim Algorithm� 2000 resistors in 2 minutes� Uses existing flying probe and laser drill
Patented ABR and Planar Laser Trimming
ABR™ and Planar Laser Trimming
Sanmina-SCI Confidential
HDI and MicroVia
Sanmina-SCI Confidential
Thermal Shock500x: -65°C > 125°C
Thermal Cycling5x: -65°C > 125°C +288°C 10 sec
Thermal Stress5x: 288°C 10 sec
RELIABILITY TEST
VIA STRUCTURE
3+3, 4+4, 5+5, 7+7, 9+92+2+2, 2+6+21+2+1, 1+4+1, 1+6+1, 1+10+1, 1+12+1
SequentialHDI Type IIIHDI Type I & IIHDI TYPE
Mechanical Drill
Controlled Depth Drill
Laser Drill(Conformal
Mask)Sequential
Prepreg 1x10802x10802x106
Resin Coated Copper (RCC)
HOLE FORMATIONBUILD-UP
TECHNOLOGY
DETAILITEM
1-Deep Via Stacked Via
Staggered Via
Controlled Depth Via
Blind ViaBuried Via
HDI and MicroVia
Sanmina-SCI Confidential
Flex and Rigid Flex
Sanmina-SCI Confidential
� Rigid-flex PCB’s� Polyimide/Kapton� FR-4 based HVRFlex� LCP Liquid Crystal Polymer� Up to 12 flex layers
� Very high density� Flexible PCB’s� High speed materials� Line/space < 3/3 mils
HDI Flex and Rigid Flex
Advantages� Size reduction� Weight reduction� Thickness reduction� Bend � Fold to fit � Ultra Fine Line and Density
Sanmina-SCI Confidential
� Reduce space and weight of the overall assembly.
� Simplify internal assembly configuration and improve its overall packaging.
� Improve reliability as compared to conventional wiring.
� Improve complexity of PCB.
� Facilitates easy installation as well as maintenance.
� Flex arms can be fanned out to connect different platform under same or different orientation.
� With the absence of connector, the signal output across rigid sections is not interrupted from one rigid section (point A) to the other rigid section (point B).
A B A B
DESIGN WITH RIBBON CABLE.
DESIGN WITH RIGID FLEX BOARD.
HDI Flex and Rigid Flex
Sanmina-SCI Confidential
core
pre-pregCu foil
pre-pregCu
Cu
Cu
Flexible mask
Flexible mask
pre-pregCu
pre-pregCu foil
Flexible mask
Flexible maskcore
coreCu
Cu
Rigid (laminates) C-stage laminate or Film for flex R igid (laminates)
Rigid Flex 8 layer, 2 flexible cores construction
� Rigid Flex Example Cross Section
HDI Flex and Rigid Flex
Sanmina-SCI Confidential
Palletized for automated component placement
Separated and configured
During Assembly
Fold to Fit
� Fold to Fit Applications
HDI Flex and Rigid Flex
Sanmina-SCI Confidential
HVRFlex Technology
� HVRFlexTM (High Volume Rigid Flex) is a technology that incorporates the flexibility for
bend to fit applications� Utilizes advanced design concepts that incorporates all the performance characteristics
of conventional multilayer PCB’s with the flexibility of rigid-flex interconnects
� Utilizes FR-4 or other reinforced materials for transition layers instead of expensive
Kapton Polyimide� Limited to 50 – 80 bend cycles
� Lower Cost
HDI Flex and Rigid Flex
Sanmina-SCI Confidential
eESD ™Embedded ESD Protection
Sanmina-SCI Confidential
eESD™: Embedded ESD Technology
Product Highlights
� Eliminates discrete surge suppressors
� Provides 100% protection of all components providing superior reliability
� Cost effective
� Low Capacitance, Low Leakage
� Adjustable Trigger & Clamp Voltages
� No routing to discrete products
� Reduces Board Size
� Reduces design respins
� Easy to implement
� Protects other embedded devices
Applications
� Cellular phones, PDAs and hand held equipments
� Memory cards and modules
� Semiconductor substrates
� USB devices
Active Device
Power Plane
Ground Plane
Active Device
Path of Normal Current
Path of ESD Event
Signal Layer
Patented / Patent Pending
Sanmina-SCI Confidential
Figure 1� Very low leakage current picoamps
at 6 volts� Very high off-state resistance
XStatic Across 5 mil gap
1.0E-12
1.0E-11
1.0E-10
1.0E-09
1.0E-08
1.0E-07
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
0 20 40 60 80 100
Applied Voltage
Leakag
e Current (am
ps)
eESDTM: Embedded ESD Technology-Low “turn on” voltage -Excellent Durability over
- 100 V/mil multiple high voltage pulses-Very fast trigger (<1 ns) -Passes >8kV contact ESD
Transmission Line Pulse (TLP) Test DataFigure 2: 200 to 1600 Volt Step Figure 3: 1495-1500 Volt input, 200 ns pulse width
eESD™: Embedded ESD Technology
Sanmina-SCI Confidential
F
G
SMD
connectors
E
D
C
B
A
Em
bedded ICs
Em
bedded Passives
Com
pliant Pins
Ribbon D
irect Attach / H
ot Bar
Flex on B
oard
Wire B
ond Ball
Wire B
ond Wedge
Direct D
IE A
ttach
DIE
Stack
Chip on F
lex with under-fill
Chip on B
oard with under-fill
BG
A S
ockets
Micro B
GA
with under-fill
Micro B
GA
SM
D S
witch
QF
N H
igh Pin count
QF
N
SO
IC/ S
SO
P
TS
OP
QF
P/T
QF
P
Passives 0201 / 0402
Passives 01005 Product
�Technology supports known product designs for next 3 to 5 years.
Yellow = Capable Green = Current
PCBA Technology Example Medical products
Sanmina-SCI Confidential
Trends in product technology 2005 – 2015 as share of production volume
Share of production valueCurrent & Emerging technologies
� System integration or SiP (System in Package) / Sub-modules
� PoP (Package on Package)
� Direct Chip Attach (active Semiconductors)
� FC (Flip Chip)
� COB (Chip on Board)
� Embedded Components
� Chip in Polymer (placed on inner layers)
� Requires increased accuracy
� Optical modules� Standard P&P with increased accuracy
� Polymer electronics
Value of Electronics Production
Source: A&D EA Team Restructuring / Sales / EA and Gartner studies, 2006
SMT Assembly Trends
Sanmina-SCI Confidential
Quality: “Mistake Proofing” SMT
Start
Laser Marking
“Pick & Place” of SMT Components
Reflow
A.O.I.
X-Ray
Screen Print
3D Paste Inspection
Laser Marking� 2D Matrix� Unique PCB Label� Duplication Protection
3D Solder Paste Insp.� 100% Pad Inspection� Individual Pad Volumes
Optical Inspection (AOI)� 100% Inspection� Presence / Absence� Orientation� Solder Joint Quality
X-Ray InspectionBGA and die-void measurements � Real-time digital X-ray inspection � Enhanced resolution 1.3M pixels � Rotating live oblique views 360°
IQC
PTSdatabase
SMT loading
ORACLE•BOM•Receipts•Work orders•Item data
FujiCam/FujiFlexa•picklists
•Lot code•Date code•MSD cat.•Unit qty
PTS
Parts Traceability System
Sanmina-SCI Confidential
� Standard 2D provides pad coverage� 2D does not provide volume
� 3D provides coverage and volume� Valuable for product’s Micro BGA’s� Rework is not cost effective
� process indicating tool� provide real time feedback to the manufacturing team.
3-D Paste Inspection
Sanmina-SCI Confidential
New Technology� In-line X-Ray� Verification of solder joints� Hidden joints (BGA)
Result� allows complex process without visibility of leads� allows us to build high volume products� high confidence level in quality
In-Line X-Ray
Sanmina-SCI Confidential
� There are many technologies available today, which can be easily applied in medical products.
� With an increasing number of medical devices adding wireless data transmission capabilities, internal and external signal transmission speed is getting more and more important as is signal integrity.
� There is no need for medical OEMs to reinvent the wheel. By partnering with companies like Sanmina-SCI, which have the relevant technologies ready to use due to their involvement in other market segments (consumer, computer, telco etc.), medical OEMs can benefit from these technologies and expertise.
� Sanmina-SCI (Contract Manufacturer) can be the single source for different technologies used in one product.
Summary
Sanmina-SCI Confidential
Thank You
“ Supporting the Need for Speed ” TM