TECHNICAL DATA TSK05-03E/C

Material for PCB Wave-Soldering Pallet

ES－3521 （Standard type）

ES－3261A （Anti-static type）

（April 11, 2006 Revision 1）

- 1 -

Features

1）ES-3521

① Minimal deterioration under heating allows excellent in durability.

② Excellent in processing workability could allow cost reduction in processing.

③ The excellent material of Pallet. (High Temperature Glass Fiber Cloth)

2）ES-3261A

① Adding excellent anti-static property to the ES-3521 base properties.

② Effective in ESD-damage prevention of mounted electronic components.

③ The excellent material of Pallet. (High Temperature Glass Fiber Cloth)

【Features Table】

Model ES-3521 ES-3261A

Anti-Static property －－－－ ◎◎◎◎

Heat Resistance ◎◎◎◎ ◎◎◎◎

Material Costs ◎◎◎◎ ○○○○

Processing Costs ◎◎◎◎ ◎◎◎◎

Contents

Features・Contents 1

Standard Specification 2

Anti-Static Property 3

Warp in Wave-Soldering Process 4~5

Water Absorption 6

Coefficient of Thermal Expansion 7

Loss on heat at 250 ºC 8

Loss on heat at 300 ºC 9

Heat Resistance for Soldering 10

Displacement Rate in Maintenance for 60 minutes with T=325 ºC 11

Drilling Workability 12

General Properties 13

* Values in this technical data reflect typical performance of the materials and are not

guaranteed-values.

- 2 -

Standard Specification

1. Sheet size and the relative tolerance

Model Normal Size

(mm)

Original Size

(mm)

Guarantee

size

(mm)

Standard

Thickness

(mm)

ES-3521

(Standard type)

1000×1000

1200×1000

1010×1010

1210×1010

1000×1000

1200×1000

3.0~10.0

3.0~10.0

ES-3261A

(Anti-static type)

1000×1000

1200×1000

1010×1010

1210×1010

1000×1000

1200×1000

3.0~10.0

3.0~10.0

*）Warp thread direction of glass cloth is in length direction of material. The above-table

indicates the size in length × width order.

2. Thickness and the relative tolerance

Relative Tolerance（mm）

Model

Thickness

（mm） Non surface Grinding Surface Grinding

ES-3521

ES-3261A

2.0

3.0

4.0

5.0

6.0

8.0

10.0

± 10 %

3.00 ± 0.35

4.00 ± 0.40

5.00 ± 0.55

6.00 ± 0.60

8.00 ± 0.70

10.00 ± 0.80

3.00 ± 0.1

4.00 ± 0.1

5.00 ± 0.1

6.00 ± 0.1

8.00 ± 0.1

10.00 ±0.1

- 3 -

Anti-Static Properties (Surface Resistance & ESD Emission)

1. Specimen

The material was ground to have the thickness of 4.0+/-0.1mm and was used as the specimen.

2. Test Procedure

1） Surface Resistance

Measuring Equipment : HIRESTA-UP, Mitsubishi Chemical Corporation.

(Conform to JIS K-6911)

2） ESD Emission (Electro Static Discharge)

The potential difference between the specimen and polyimide film caused by separating two materials

was measured on the metal board of which was grounded.

Measuring Equipment : KSD-0103, KASUGA ELECTRIC WORKS LTD.

3. Comparison Test Results

ES-3521 C's-a type ES-3261A A's-b type B's

Surface Resistivity（Ω） 2×1014

1×1015

1×107

1×107

2×109

ESD Emission（V） 1000~10000 1000~10000 0~200 0~200 100~500

Standard Anti-Static

Surface Resisitivity （Ω

）

1000

10000

～ ～

A’s-b type B’s

500

～ ～ ～ ～

ESD Emission (V

）

C’s-a type ES-3261A ES-3521

1016

1012

108

104

- 4 -

The Warp in Wave-Soldering Process

1. Specimen

Using the ground material in 6.00+/-0.05mm thick, the soldering pallet showing in the following picture

was made. The size of the pallet is 235mm × 280mm. The pallet had a frame made of glass epoxy

laminates on its upper surface.

This was used as the specimen for measuring the warpage during the process.

*The picture shows the soldering pallet made of ES-3261A.

- 5 -

2. Test Procedure

The soldering pallet was set in the below-mentioned wave-soldering line. The soldering condition was set

as below.

Temperature and duration: at 250 ºC for 5 seconds, without pre-heater.

Using LVDT (Linear Variable Differential Transformer), the change in the center point of the pallet from

the initial level was measured during the process and after cooled-down status and was recorded as the

warpage.

3. Comparison Test Results

（Unit：mm）

During the

process

Cooled-

down status

During the

process

Cooled-

down status

During the

process

Cooled-down

status

ES-3521 1.23 -0.12 1.30 -0.05 1.34 -0.04

ES-3261A 1.02 -0.15 1.11 -0.04 1.11 0.00

A's-b type 1.16 -0.07 1.18 -0.02 1.20 -0.02

B's 0.78 -0.29 0.97 -0.05 0.96 -0.02

C's-a type 1.24 -0.11 1.29 -0.03 1.28 -0.04

1st 2nd 3rd

� In the above-table, positive figure means that the surface of the pallet was convexity and

negative figure means that the surface was concave.

-0.50

0.00

0.50

1.00

1.50

2.00

2.50

3.00

During the process Cooled-down status During the process Cooled-down status During the process Cooled-down status

1 st 2 nd 3rd

板翹

量(m

m)

ES-3521 ES-3261A A's-b type B's C's-a type

Preheater Soldering Bath Cooling Fan Control Panel

フラクサー

Fluxer

- 6 -

Water Absorption

1. Specimen

The material was ground to have the thickness of 4.00+/-0.1mm (except for NITTO SHINKO) and was cut

into a size of 50 × 50-mm. Then it was used as the specimen.

2. Test Procedure

Test procedure shall be in accordance with JIS K6911 (1995).

3. Comparison Test Results

0.050

0.040

0.030

0.071

0.023

0.013

0.00

0.02

0.04

0.06

0.08

0.10

A's-a type A's-b type C's-b type D's ES-3261A ES-3521

Water A

bsorption (%)

- 7 -

Coefficient of Thermal Expansion

1. Specimen

The material was ground to have the thickness of 4.00+/-0.1mm and was cut into a size of 4 × 10-mm. Then it

was used as the specimen.

2. Test Procedure

Coefficient of thermal expansion was calculated by measuring the amount of the expansion in the direction of

X-Y at 50-250℃.

3. Comparison Test Results

9.29

12.11

9.12 9.6410.06 10.31

16.93 16.93

6.82

10.91

6.96

13.33

0.0

5.0

10.0

15.0

20.0

25.0

X Y X Y X Y X Y X Y X Y

A's-a type A's-b type C's-b type D's ES-3261A ES-3521

50-2

50°C

CTE (×

10 -

6/K

)

- 8 -

Loss on Heat at 250℃ 1. Specimen

The material was ground to have the thickness of 6.00+/-0.05mm and was cut into a size of 50 × 50-mm.

Then it was used as the specimen.

2. Test Procedure

The specimen was left in the convection oven of which temperature was set at 250 ºC for the certain

time. The weight of the specimen before and after treatment was measured and was the changing ratio

was calculated.

3. Comparison Test Results

0hr 24hr 70hr 160hr 280hr 500hr

ES-3521 0.00 0.22 0.43 0.67 0.82 1.19

ES-3261A 0.00 0.20 0.44 0.70 0.97 1.45

A's-b type 0.00 0.26 0.56 1.06 1.73 3.05

B's 0.00 2.83 3.81 4.81 5.69 7.30

C's-b type 0.00 1.29 2.30 3.43 4.21 5.50

0.0

2.0

4.0

6.0

8.0

0 100 200 300 400 500 600

Processing time （hr.）

Weight decream

ent （%

）

（Unit：%）

B’s

C’s-a type

ES-3521

ES-3261A

A’s-a type

- 9 -

Loss on Heat at 300℃ 1. Specimen

The material was ground to have the thickness of 4.00+/-0.05mm and was cut into a size of 50 ×

50-mm. Then it was used as the specimen.

2. Test Procedure

The specimen was left in the convection oven of which temperature was set at 300 ºC for the certain

time. The weight of the specimen before and after treatment was measured and was the changing ratio

was calculated.

3. Comparison Test Results

0hr 2hr 5hr 10hr 24hr 48hr 72hr 96hr 120hr

ES-3521 0.00 0.48 0.76 1.13 1.91 2.91 3.78 4.50 5.08

ES-3261A 0.00 0.61 0.97 1.50 2.64 4.28 5.64 6.66 7.49

A's-a type 0.00 2.39 3.42 4.64 6.62 9.06 9.96 11.42 12.36

A's-b type 0.00 1.83 2.84 4.11 6.29 8.24 9.46 10.58 11.94

C's-b type 0.00 2.65 3.60 5.01 7.48 9.80 11.00 11.84 12.63

D's 0.00 16.91 20.62 23.62 26.99 29.02 30.32 31.36 32.01

0.0

5.0

10.0

15.0

20.0

25.0

30.0

35.0

0 50 100 150

Processing time （hr.）

Weight decream

ent （%）

（Unit：%）

C’s-b type A’s-a type

ES-3261A

ES-3521

D’s

- 10 -

Heat Resistance for Soldering

1. Specimen

The material was ground to have the thickness of 6.0+/-0.1mm and was cut into a size of 25 × 25-mm.

Then it was used as the specimen.

2. Test Procedure

The specimen was dipped in the solder set to 260℃ and 350℃ at the predetermined time,

and delamination , the generated gas, and the stench, etc. were examined.

3. Comparison Test Results

Solder dipping condition Specimen DelaminationGenerated

gasStench

ES-3521 ○ ◎ ◎

ES-3261A ○ ◎ ◎

A's-b type ○ ◎ ◎

B's ○ ◎ ◎

C's-a type ○ ◎ ◎

ES-3521 ○ ○ ○

ES-3261A ○ ○ ○

A's-b type ○ △ △

B's × △ △

C's-a type ○ △ △

260℃300sec.

350℃60sec.

※ Delamination ○： Non-delamination ×： Delamination

※ Generated gas ◎： Indistinct ○： A little △： Large

※ Stench ◎： Nothing ○： A few △： Large

- 11 -

Displacement rate in maintenance for 60 minutes with T=325 ºC

1. Specimen

The material was ground to have the thickness of 4.00+/-0.1mm and was cut into a size of 4 × 4-mm. Then it

was used as the specimen.

2. Test Procedure

It maintained for 60 minutes after the sample was heated up to 325 ºC at the rate of 10 ºC / minute, and the

displacement of the thickness direction at that time was measured.

3. Comparison Test Results

- 12 -

Drilling Workability

1. Specimen

The material was ground to have the thickness of 6.00+/-0.05mm and was cut into a size of 150 ×

250-mm. Then it was used as the specimen.

2. Test Procedure

The drill bit wear was measured after 500 shots, 1000 shots, and 1500 shots. The number of stack was

single and the drilling condition was as follows.

Entry board ：Al Board（0.15mm Thickness）

Back-up board ：PS-1160G（RICORITE）

Used drill bit ：φ1.0mm×8.0mm

Revolution ：54000rpm

Feed ：30µm/rev.

3. Comparison Test Results

（Unit：%）

Number of drilled hole 0 500 1000 1500

ES-3521 100 75.2 59.6 52.8

ES-3261A 100 77.0 67.1 66.9

A's-b type 100 56.9 37.0 22.7

B's 100 73.0 56.6 46.3

0

20

40

60

80

100

0 500 1000 1500

Number of drilled hole

Residual ratio of drill bit blade(%)

ES-3261A

ES-3521

A’s-b type

- 13 -

General Properties

Test Item

Unit

ES-3521 ES-3261A

Surface Resistance Ω 2×1014 1×107

ESD Emission V 1000~10000 0~200

Density - 1.95 1.95

Water Absorption % 0.016 0.015

Ignition Loss % 31.0 30.5

MD 555 553 Flexural Strength

TD MPa

473 499

MD 28562 28413 Modulus in Flexure

TD MPa

25062 26466

TMA Method 145 132 Glass Transition

Temperature (Tg) DMA Method ºC

177 165

260 ℃ 300< 300< Solder Limit

300 ℃ sec

60< 60<

Coefficient of Linear α1（50→100 ºC） 45 59

Expansion(Z direction) α2（200→250 ºC） ×10

-6/K

199 215

Coefficient of Linear X（50→100 ºC） 13 14

Expansion (X,Y direction)

Y（50→100 ºC）

×10-6/K

14

16

Thermal Conductivity W/mk 0.38 0.38

Usual state 0.00 0.00

Under Wave-Soldering 1.23 1.02

Amount of Warp under

wave-Soldering

（235×280mm） After Wave-Soldering

mm

0.00 0.00

250 ºC‐24hr. 0.22 0.20 Weight Decrement

250 ºC‐500hr. %

1.19 1.45

500 holes 75.2 77.0 Drilling Workability

1500 holes %

52.8 66.9

*Above mentioned values are not guaranteed-values but test result.

USE ELECTRONICS CO.,LTD

友 士 股 份 有 限 公 司 3 FL, No 54, SEC 1, Chung Hsiao E.RD, Taipei100 , Taiwan R.O.C.

台北市忠孝東路一段 54 號 3 樓 TEL：886-02-23934825 (REF) ext 605 FAX：886-02-23414900 業務接洽： 江順得 分機 605 Sales contact： Daniel Chiang # 605 Web site: http://www.use.com.tw E-Mail: daniel_chiang@use.com.tw