Materialsand Ceramics

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    Materials Classificationand Properties

    Metals, Ceramics, andSemiconductors

    NANO 52Foothill College

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    Properties of Materials

    Physical

    Mechanical

    Chemical Thermal

    Electrical Optical

    http://en.wikipedia.org/wiki/Image:Materials_science_tetrahedron%3Bstructure%2C_processing%2C_performance%2C_and_proprerties.JPG
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    Physical Properties

    Strength

    Ductility

    Melting point Glass transition

    Density

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    Mechanical Properties

    Stress strain behavior

    Strength

    Tensile properties Compression, shear, torsion

    Deformation

    Hardness

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    Chemical Properties

    Acid - base

    Reactivity

    Corrosion Oxidation

    Passivation

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    Thermal Properties

    Heat conductance

    Heat capacity

    Thermal expansion Annealing temperature

    (Melting point, softening point)

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    Electrical Properties

    Electrical conductivity

    Electrical resistance/impedance

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    ://www.corro

    sionsource.com/

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    Metal Structure / Bonding

    Metallic bonds

    All metals are made up of avast collection of ions that areheld together by metallic bonds.

    A metal atom has a positivenucleus with negative electronsoutside of it.

    In a solid, each atom loses theoutermost electron, which takes

    part in bonding. They form a lattice of regularly

    spaced positive ions. Each ionhas no control over its bondingelectron.

    http://www.chm.bris.ac.uk/pt/harvey/gcse/other.html

    http://www.chm.bris.ac.uk/pt/harvey/gcse/other.htmlhttp://www.chm.bris.ac.uk/pt/harvey/gcse/other.html
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    Examples of Ceramics

    Clay, Minerals, Salts and Oxides

    Technical Ceramics can also be classified

    into three distinct material categories:

    Oxides: Alumina, zirconia

    Non-oxides: Carbides, borides, nitrides

    Composites: Particulate reinforced,

    combinations of oxides and non-oxides.

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    Ionic Bonding in Ceramics

    Ceramic materials

    are formed from ionic

    bonds within theirconstituent atoms,

    oxides and salts.

    Ionic bonds are not

    nearly as ductile as

    metals, causing

    ceramics to be brittle.

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    Metallic vs. Ionic Bonding

    Much easier to deform materials with metallic than withionic bonding. Why?

    Sliding atom planes over each other (deformation) veryunfavorable energetically in ionic solids!

    metals are ductile & ceramics (ionic) are brittle

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    Semiconductors

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    Semiconductors

    http://worldwatts.com/silicon_semiconductor.html

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    Semiconductors

    In solid state physics and related applied fields, the band gap is the

    energy difference between the top of the valence band and the

    bottom of the conduction band in insulators and semiconductors.

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    Semiconductors

    The ease with which electrons in a semiconductor can be excitedfrom the valence band to the conduction band depends on the bandgap between the bands, and it is the size of this energy bandgapthat serves as an arbitrary dividing line (roughly 4 eV) betweensemiconductors and insulators.

    Electrons excited to the conduction band also leave behind electronholes, or unoccupied states in the valence band. Both theconduction band electrons and the valence band holes contribute toelectrical conductivity.

    The holes themselves don't actually move, but a neighboringelectron can move to fill the hole, leaving a hole at the place it has

    just come from, and in this way the holes appear to move, and theholes behave as if they were actual positively charged particles.