MEMS and Sensors Update, Russel Shumway, Mar 5 2015

7/23/2019 MEMS and Sensors Update, Russel Shumway, Mar 5 2015

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MEMS and Sensor Packaging UpMarch 2015



MEMS and Sensor Experience

1980s 1990s 2000 2002 2005 2008 2009 2011

CCD

Sensor

Ceramic/

Hermetic

PackageCABGA, MLF,

Fingerprint, SOIC, DLP

Cavity MEMS, In-Frame

MLF, Cavity SOIC

Laminate to

Laminate

F

S



Growth and Adoption of Automotive MEMS SThe role of government regulations in the MEMS market

1970’s 1980’s 1990’s 2000’s 2010’s

Fuel Economy

Improvements

Airbags

Tire Pressure

Monitoring

Electronic

Stability

Control



Rapid Growth in Consumer MEMS

<2004 2004 2007 2009 2010 2012 2013 2

Color Inkjet

Nintendo Wii

iPhone

iPhone 3GS

iPhone 4 Samsung S4/iPhone 5S

Samsung S3 Samsu



MEMS Packaging Challenge

Controlling stresses to theMEMS structure

Allowing the stimuli to

reach the MEMS structure

Protecting the MEMS and

ASIC devices

More stringent devicepackage protection

Customized requirements

Quick turn

Highly reu

packaging

Miniaturiza

Automotive Market ConsumGeneral Requirements



MEMS and Sensor Packaging Requirem

A c c e l / G y r o

M a g n e t i c

M i c r o p h o n e

T e m p e r a t u r e

/ H u m i d i t y

P r e s s u r e /

A l t i m e t e r

G a s

G e s t u r e

I R

Wafer Handling Capped Wafer Handling √ √

Stealth Dicing √ √

Stimulus Delivery

Package Port Hole (Top) √ √ √ √ √ √

Package Port Hole

(Bottom) √

Die Attach Options

Low Modulus DA √ √ √ √

Thermal DA √

Low CTE Substrates √ √ √ √ √ √

Multi Die-Stacked √ √ √ √ √ √ √ √

Multi Die-SBS √ √ √ √ √ √ √ √

Flipstack √ √ √ √ √ √ √ √

Multi Sensor √ √ √ √ √ √ √ √

Interconnect Options

Wirebond √ √ √ √ √ √ √ √

Au Stud Bump √

Flip chip √

TSV * √ √ √ √ √ √ √ √

Copper Pillar + COW √ √ √ √ √ √ √

*TSV, TGV is at foundry level.



MEMS and Sensor Packaging Requirem

A c c e l / G y r o

M a g n e t i c

M i c r o p h o n e

T

e m p e r a t u r e

H u m i d i t y

P r e s s u r e /

A l t i m e t e r

G a s

G e s t u r e

I R

Package Protection

Overmolded Leadframe √ √

Overmolded Laminate √ √

Lidded Package √ √ √ √ √ √

Lidded + Molded

Package √ √ √ √ √ √

Bio-compatible Lid

Exposed Die √ √ √

Non-Ferromagnetic √

Port Hole Filter √ √ √

EMI Shielding √

Cavity Fill / Die Coat

Black Die Coating √

Clear Die Mold √

Gel Fill √ √ √



MEMS Packaging Complexity

Overmolded or Cavity Package?

Wirebond or f

Die attach material?

E

Laminate or leadframe?

Wire type, loop radius

and gauge?

Molded-in stress?

Leaded or not?

Stacked die or

How/what



MEMS/Sensor

PerformancePackage Type

Molded MLF ®

Molded

ChipArray ® LGA

Cavity MLF ®

Cavity Ceramic/Hermetic

Good

Better

Best

Packaging Technology is a Differentiator

Cavity MLF ®



Materials Help Manage Die Stress

From material datasheets From simulation results

0

500

1000

1500

2000

2500

Epoxy - C Film Epoxy - NC Silicone1 Silicone2

M o d u l u s - M P a

Die Attach Adhesives

0

0.001

0.002

0.003

0.004

0.005

0.006

0.007

FR5 Ceramic FR5

S

1 P r i n c i p a l S t r e s s - M P a

Substrate Thickness/Mat

Thin

Thick



Focusing on Cavity Package

Standard on the outside,custom on the inside

Sensor fusion ready, multiple

MEMS/sensor dice

Multiple stimuli opening/ports

Low stress bill of materials

Applicable to leadframes and

laminates



MEMS Package Variants by Platform

Overmolded Exposed Die Surface CavitySOIC

MLF®/QFN

ChipArray®

LGA/BGA



MEMS and Sensor Standard Platforms

*Not compatible

Accelerometers

GyroscopesMagnetometers

OvermoldedPackaging

ChipArray® BGAMLF®

Dual

Cavity

PackagingHermetic/CeramicCavityLaminate/LF Cavity

Wafer LevelPackage

MicrophonePressure Sensors

OvermoldedPackaging

ChipArray ® BGAMLF ®

Dual

Cavity

PackagingCeramic CavityLaminate Cavity

Wafer LevelPackage

Temperature &Humidity Sensors

OvermoldedPackaging


Dual

Cavity

PackagingCeramic CavityLaminate CavityExposed Die Surface

Wafer LevelPackage

Bio-metricBio-medical

OvermoldedPackaging


Dual

Cavity

PackagingLaminate or LF CavityCeramic CavityExposed Die Surface

Wafer LevelPackage

MicrobolometersDisplays

OvermoldedPackaging


Dual

Cavity

PackagingLaminate or LF CavityCeramic CavityExposed Die Surface

Wafer LevelPackage



Amkor Technology P3 Site for Cavity ME

In High Volume since 2008

Utilizes Amkor’s Strip based AssemblyTechnology and Infrastructure

Provides a platform for near stress freedevice environment

Leverages over 20 years of Amkor MEMSProduction Experience

Dedicated Area for Particle Control

(MEMS Microphones) Wide Customer Base supporting both

Consumer and Automotive

Over 500M units shipped since 2008

Full Turnkey Assembly + Test Capability



MEMS Microphone – “Listening / Sound Se

Strong growth in MEMS

microphones driven by

new applications – Noise cancellation

– Audio and video

conferencing

– High quality recording

– Gesture Control

Introduced FlipChip

Microphones

Bottom Port – W/B

Top Port Rev

Botto



Typical Cavity MEMS Process Flow

Lid Attach Cure

Laser marking

PKG Saw

ASIC Die Attach

ASIC WBG / SAW

Cure

MEMS Die Attach

Cure

Wire Bond

MEMS Wafer Saw

Lid Attach

Die Coat (Optional)



Reversible Top Port Process Flow

Lid Attach Cure

Laser marking

PKG Saw

ASIC Die Attach

ASIC WBG / SAW

Cure

MEMS Die Attach

Cure

Wire Bond

MEMS

Wafer

Saw

Lid Attach

Die Coat (Optional)

Cavity Wall +Cover Attach



Multi-Die Integration – Sensor FusionCavity packages allow integration opportunities



MEMS Environmental sensors are

driving new applications

– Weather measurement

– Altitude navigation

– Personal navigation

Gas sensor integration is indevelopment

Sensor Fusion – Environmental Sensors



Temperature, Humidity, FingerPrint, Opti

Fingerprint sensor for biometric recognition

– An open cavity is created using film assistmolding technology

– In high volume since the early 2000’s

Extending film assist molding technology to

other sensors – temperature, humidity and

optical – Optical / IR sensors

Gesture recognition

Ambient light sensor



MEMS and Sensor Material/Process Roa2013 2014 2015

Wafer Handling

• Stealth Dicing HVM

• Capped Wafer Backgrinding DEV HVM

Substrate/LF

• Low Modulus Substrate DEV HVM

• Embedded Component DEV HVM

• Embedded ASIC Die DEV HVM

• Pre-Mold LeadFrame DEV HVM

• Pre-Mold Laminate DEV HVM

Die Attach

• Low Modulus Die Attach Film DEV HVM

• Printable/B-Stage Epoxy DEV

• Port Hole Filter DEV



MEMS and Sensor Material/Process Roa2013 2014 2015

Die Coat/Gel Fill

• Clear Mold DEV HVM

Lid Material

• Polymer Lid DEV HVM

• Plated Polymer Lid DEV HVM

• Flangeless Metal Lid DEV HVM

• Transparent Lid DEV

Lid Attach Material

• Solder Printing/Dispensing DEV DEV HVM

• Metal Paste DEV HVM

• B-Stage Epoxy DEV HVM

Singulation

• Laser Singulation DEV HVM



Material Development

Polymer Lid Status

– Cost effective material solution for existing metal lid – Chemical surface activation for polymer plating

– MEMS microphone and Optical MEMS Lid material

Waterproof Membrane

– IPx7 waterproof requirement (1meter/30min)

– Acceptable level acoustic sensitivity compared withexisting u-Phone

– Flexible membrane between MEMS die & substrate



Cavity MEMS Products

MEMS Package Thickness Trend

< 2013

N o m

i n a l P a c k a g e T h i c k n e s s

> 1.0 mm

> 0.8 mm

> 0.6 mm

> 0.5 mm

20152014

> 1.2 mm

*Highly Dependent o

Sensor Type and Per

Molded MLF and CABGA

Wafer Level

Ceramic or Low CTE Subst

MEMS P k Pl tf R d



MEMS Package Platform Roadmap

Die Level StressHigh

Low

P a c k a g e C o s t

High

Overmolded Dual,

MLF and CABGA

Platforms

Exposed Die Film

Assisted Dual,

MLF and CABGA

Platforms

Pre-Mold Cavity and

Lidded Dual, MLF and

CABGA Platforms

Strategic Platforms



MEMS Package – Next Generation

Cavity Package Hybrid Cavity Pack

MLF®/QFN

ChipArray®

BGA



MEMS Next Generation Package – Lead



MEMS Next Generation Package - Lami



MEMS Next Generation Package – Silicon In



Intelligently combine data from several sensors for the pu

improving application or system performance

Expected to fan-out across all types applications

Next Challenge

Sensor Fusion = Test Confusion?

In Summary



In Summary

MEMS Sensor Market is Growing… – Wide array of consumer application driven by “smart devices

– The automotive MEMS sensor market continues to grow withmandates on safety, efficiency, and driver assistance

Standard Platforms = Faster development / introduction oMEMS / sensors

Amkor offers differentiating Package Technology

– Dedicated MEMS Team – Constantly updating the MEMS Toolbox with investments on

equipment and materials and leveraging other core technoloTSV, Cu Pillar



Thank You for your continued Bus

Documents

MEMS and Sensors Update, Russel Shumway, Mar 5 2015