unloading the parts located in the electro- plating drum; and means for cleansing the parts that have been electroplated after they have been loaded and processed and there- after unloaded from the drum.

the workpiece in an electrolyte to an AC treatment of a voltage and an alternating current end voltage having a frequency of 0.1 to 25 Hz, wherein an anodic potential is imposed on the workpiece during the AC treatment, the surface of the workpiece has

Electrochemical Graining Method U.S. Patent 5755,949. May 26, 1998 ME Amor, assignor to AGFA-Gevaeri AG, Leverkusen, Germany

previously been coarsely grained, and the alternating current results in a total charge input of anodic charge input and cathodic charge input of from-10 tb h0 Kc/m>.

A method of electrochemically graining Tin and Tin-Lead Stripping a surface of a plate-, foil- or web-shaped U.S. Patent 5,7.55,950. May 26, 1998 workpiece of aluminum or an aluminum N.J. Bell, assignor 10 Win Metals Co., Schlller alloy, which method comprises subjecting Park. 111.

ELECTROCOAGULATION Advanced Wastewater Treatment

Technology for the Next Millennium

Specific Needs

I-StWKASELCO (l-888-527-3526) FAX 512-594-3311 www.kwire.com Call for a no-obligation bench-scale test of your waewater sample using the Kaselco Process

P.O. Box 667 Shiner, Texas 77984

Circle 053 on reader information card

I l COBRE-NON-CYANIDE COPPER SUITABLE FOR ALL SUBSTRATES I

I .* YIRO-BRASS-NON-CYANDIDE BRASS FOR RACK, BARREL, OR REEL TO REEL

l ZEROCHROME-NON-HAZARDOUS DECORATIVE CHROMEREPLACEMENT I

Mibus also offers a complete line of brightener technology including additives for: . Nickel- bright and semi-bright featuring l Zinc-acid and alkaline

the finest in leveler technology l Tin-bright acid, matte, high-speed and alloy l Zinc-Cobalt-acid and alkaline l Tin -Zinc - acid and alkaline l Acid Copper

In addition, we offer a complete line of wastewater treatment additives, including: l Cationic polymers l Metal Precipitants l Cleaner waste - l Flocculants l Demulsifying Agents treatment additives

Bus, INC. 1635 Janet St., Downers Grove, IL Go515 630-852-8038 l Fax: KWl52-8054

Circle 069 on reader information card

An integrated process for removing plat- ing materials from a plated substrate com- prising a copper-based alloy with a tin-based or tin-lead-based surface plated layer. com- prising treating at 50 to 150’F with an aque- ous etchant solution consisting essentially of I to 50% by weight of an acid and 0.1 to 5%

nitric acid, the surface plated layer metals being removed by, and dissolved in. the aque- ous etchanr solution and an intermetallic layer containing tin or tin-lead remaining on the treated surface; separating the treated xub- strate from the aqueous etchant solution and recovering the aqueous etchant solution: rins- ing the separated substrate with water: treat- ing the rinsed substrate at 70 to 2 IO”F with an aqueous immersion solution consisting es- sentially of 1 to 50% by weight of an acid and 1 to 150 g/L of copper cation in the form of

a copper (II) salt, the tin or tin-lead in the intermetallic layer being removed from the substrate and the substrate being rendered essentially free of tin or tin-lead from the surface plated layer; and separating the sub- strate from the aqueous immersion solution and recovering the aqueous immersion solu- tion, wherein the recovered aqueous etchant solution and the recovered aqueous immei-- sion solution are sep2u-ately treated to recover at least a portion of the tin or tin-lead con- tained therein and to regenerate aqueous etchant solution or aqueous immersion solu- tion; and wherein the etchant acid and the immersion acid are independently selected from the group consisting of sulfuric acid and alkane sulfonic acids.

Method of Monitoring Constituents in Electroless Plating Baths U.S. Patent 5,755,954. May 26, 1998 EA. Ludw/g et al., assignors to Technrc Inc., Cranston, RI.

A method for monitoring the concentra- tions of constituents present in a solution used in an electroless plating process wherein the constituents affect plating de- posit properties, said method comprising applying a selected DC potential to a work- ing electrode; superimposing a constant AC voltage on the DC potential havng a rool mean square potential and a frequency and producing an AC current; varying the DC potential at a chosen sweep rate over a chosen range; and measuring at one 01 more reference phase angels as the DC potential i< varied over the range. the DC and/or AC (current in relation to varying DC potential hcing expressed as current spec- tra, which are used to determine and mon- itor the constituents in the solution.

Inspecting Copper or Molybdenum Lines on a Substrate U.S. Patent 5.756.146. May 26, 1998

104 METAL FINISHING l NOVEMBER 1998