micro QUAD SMALL FORM-FACTOR PLUGGABLE FOUR CHANNEL …microqsfp.com/files/2114/7369/5564/microQSFP_MSA... · micro QUAD SMALL FORM-FACTOR PLUGGABLE FOUR CHANNEL PLUGGABLE TRANSCEIVER,

microQSFP Specification Rev 2.3

microQSFP FOUR CHANNEL PLUGGABLE TRANSCEIVER, HOST CONNECTOR, & CAGE ASSEMBLY FORM FACTOR

Page 1

Specification

for

micro QUAD SMALL FORM-FACTOR PLUGGABLE FOUR CHANNEL PLUGGABLE TRANSCEIVER, HOST

CONNECTOR, & CAGE ASSEMBLY FORM FACTOR

Rev 2.3 September 09, 2016

Abstract: The micro QUAD SMALL FORM-FACTOR PLUGGABLE (microQSFP) specification defines

requirements for a form factor supporting up to four electrical channels, high system

density, and a high performance thermal solution. Support for 28 Gb/s signal rates on

each channel enables many applications including 10 Gigabit Ethernet, 25 Gigabit

Ethernet, 50 Gigabit Ethernet, 100 Gigabit Ethernet, 16GFC, 32GFC, and 128GFC, where

higher densities are required than are possible with existing form factors. Included are

definitions of electrical, mechanical, and management interfaces, electrical connector,

guide rail (cage), front panel and host PCB layout, and optical connector options. By

addressing the thermal, signal integrity, electromagnetic, and electrostatic challenges

of a high density solution, the microQSFP Specification enables higher density networking

solutions that are critical to support the continuing network demand.

This document provides a common specification for systems manufacturers, system

integrators, and suppliers of modules.

POINTS OF CONTACT:

Nathan Tracy Joshua Sechrist

Chairman Technical Editor

TE Connectivity TE Connectivity

3101 Fulling Mill Road 3101 Fulling Mill Road

Middletown, PA 17057 Middletown, PA 17057

Ph: 717-986-7546 Ph: 717-986-7243

ntracy at te dot com Joshua dot Sechrist at te dot com

Limitation on use of Information:

This specification is provided “as is” with no warranties whatsoever, including any

warranty of merchantability, non-infringement, fitness for any particular purpose, or any

warranty otherwise arising out of any proposal, specification or sample. The microQSFP

promoters disclaim all liability, including liability for infringement of any proprietary

rights, relating to use of information in this specification. In no event shall the

microQSFP promoters, contributors or adopters be liable for any direct, indirect,

special, exemplary, punitive, or consequential damages, including, without limitation,

lost profits, even if advised of the possibility of such damages.

This specification may contain, and sometimes even require the use of intellectual

property owned by others. No license, express or implied, by estoppel or otherwise, to

any intellectual property rights is granted herein, except that a license is hereby

granted to copy and reproduce this specification for internal use only.

Permissions:

You are authorized to download, reproduce and distribute this document. All other rights

are reserved. The provision of this document should not be construed as the granting of

any right to practice, make, use or otherwise develop products that are based on the

document. Any and all IP rights related to this document and the designs disclosed

within, except for the rights expressly mentioned above, are reserved by the respective

owners of those IP rights.



Page 2

EXPRESSION OF SUPPORT BY MANUFACTURERS

As of the publication date, the following are promoter member companies of the microQSFP

MSA.

Broadcom

Brocade

Cisco

Dell

Foxconn Interconnect Technology

Huawei

Intel

Lumentum

Juniper Networks

Microsoft

Molex

TE Connectivity

As of the publication date, the following are contributor member companies of the

microQSFP MSA.

Amphenol

Applied Optoelectronics Inc

Finisar

Lorom

MACOM

MultiLane SAL

Oclaro, Inc.

Rosenberger

Semtech



Page 3

Change History:

Revision Date Changes

1.0 January 14, 2016 -First Public Release, released as Draft Mechanical Only

Specification.

2.0 March 17, 2016 -Second Public Release, released as Complete MSA

Specification

-Various editorial changes to text, figures, and tables.

-Contributor members added, Amphenol, Finisar, Lorom,

MulitLane SAL, Oclaro, Inc, Rosenberger, and Semtec.

-Table of contents updated.

-Content of Clause 4 content moved to Subclause 4.1.

-Content added in Subclause 4.1, including text prior to

figure 1, and table 1, figure 2a, figure 2b and content

after figure 1.

-Contact 31 changed from TBA* to VccMgmt in figure 1.

Contact defined in detail in Subclauses in Clause 4.

-Subclauses 4.2, 4.3, 4.4, 4.5, and 4.6 created. Includes

all text, items, table 2, table 3, & Figure 3

-Table 2 is now Table 4. Listed figures in table 4 updated

to reference new figure numbers.

-Figures 3, 4, 5, 6, 7, 8, 9, 10, 11, & 12, are now figures

5, 6, 7, 8, 9, 10, 11, 12, 13, & 14 respectively.

-RFS Symbol removed from all feature control frames found

in the figures 6, 7, 8, 9, 12, & 13.

-Contact numbers identified in figures 6, 7, 9, & 12.

-In figure 8, 2X 40.84 BASIC added, Keepout zones

identified.

-In figure 9, LMC changed to MMC on feature control frame

associated with 1.05 hole identifying datum J.

-In figure 12, rear of connector enlarged, dim 11.75 from

datum L was 9.95, and dim 6.75

-Content from clause 6 moved to Subclause 6.2, and content

of Subclause 6.1 created including table 6.

-Clause 7 (Management Interface) content created.



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2.1 May 26, 2016 -Various editorial changes to text, figures, and tables.

-Contributor member added, MACOM.

-Table of contents updated.

-Subclause 4.3.2 updated with reference to Subclause

7.3.10.

-Extended Identifier Table 8 created, placed in Subclause

7.2.1. Table numbers re-ordered after Table 8. Subclauses

7.2.2 and 7.2.3 continue after inserted Subclause 7.2.1.

-DataPathInit duration clarified in Subclause 7.3.3.

-TX_TurnOn duration clarified in Subclause 7.3.5.

-2 Second Timeout Removed from Figures 15 & 16, all timing

placed in new Table 12 in Subclause 7.3.10

2.2 June 03, 2016 -Third public release.

-Various editorial changes.

-Replaced Page 03h Byte 252 with Lower Memory Byte 114 in

all instances.

2.3 September 09,

2016

-Fourth public release.

-Figure 6 dimension changes as follows: 44.1 MAX internal

depth of note 6 was 44 MAX, 9.2 distance from latch to cage

stop was 9.1, 15.9 MAX distance from cage stop to front of

module was 16 MAX.

-Figure 7 dimension changes as follows: (2.6) contact point

distance was (2.5), 3.1 distance front edge of module card

to edge of pad was 3.



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TABLE OF CONTENTS

1. Scope 7 1.1 Description of Clauses ........................................................... 7

2. References 7 2.1 Industry Documents ............................................................... 7 2.2 SFF Specifications ............................................................... 7 2.3 Sources .......................................................................... 7 2.4 Conventions ...................................................................... 7

3. Introduction 8 4. Electrical Specification 8

4.1 Electrical Interface ........................................................... 8 4.2 Low Speed Signal Descriptions ................................................. 12 4.2.1 ModSelL ..................................................................... 12 4.2.2 ResetL ...................................................................... 12 4.2.3 ModPrsL ..................................................................... 12 4.2.4 IntL ........................................................................ 12

4.3 Low Speed Signal Electrical Specifications ...................................... 13 4.3.1 Low Speed Signaling ......................................................... 13 4.3.2 Low Speed Signal Timing ..................................................... 13

4.4 High Speed Signal Electrical Specifications ..................................... 13 4.4.1 Compliance Testing .......................................................... 13

4.5 Power Requirements .............................................................. 14 4.5.1 Power Classes and Maximum Power Consumption ................................. 14 4.5.2 Module Power Supply Specification ........................................... 14 4.5.3 Host Board Power Supply Noise Output ........................................ 15 4.5.4 Module Power Supply Noise Output ............................................ 15 4.5.5 Module Power Supply Noise Tolerance ......................................... 15

4.6 ESD ............................................................................. 15 5. Mechanical and Board Definition 15

5.1 Introduction .................................................................... 15 5.2 microQSFP Reference Datums and Component Alignment .............................. 16 5.3 microQSFP Module Mechanical Package Dimensions .................................. 18

5.3.1 Mating of microQSFP Module PCB to microQSFP Electrical Connector ............ 19 5.4 Host PCB Layout ................................................................. 20

5.4.1 Insertion, Extraction and Retention Forces for microQSFP Modules ............ 22 5.5 Color Coding and Labeling of microQSFP Modules .................................. 22 5.6 Bezel for Systems using microQSFP Modules ....................................... 23

5.6.1 Bezel for the Thru Bezel Cage Assembly ...................................... 23 5.7 microQSFP Electrical Connector Mechanical ....................................... 24 5.8 Individual microQSFP Cage Assembly .............................................. 25 5.9 EMI Cover ....................................................................... 26 5.10 Optical Interface .............................................................. 26

6. Thermal 28 6.1 Thermal Requirements ............................................................ 28 6.2 Thermal Management Considerations ............................................... 28

7. Management Interface 29 7.1 Introduction .................................................................... 29 7.2 microQSFP Memory Map ............................................................ 29

7.2.1 Extended Identifier ......................................................... 30 7.2.2 Module_State Register Encodings ............................................. 30 7.2.3 Transient State Duration Encodings .......................................... 31

7.3 microQSFP State Machine ......................................................... 31 7.3.1 MgmtInit State (Transient) .................................................. 34 7.3.2 Configure State (Parked) .................................................... 34 7.3.3 DataPathInit State (Transient) .............................................. 35 7.3.4 TX_Off State (Parked) ....................................................... 35 7.3.5 TX_TurnOn State (Transient) ................................................. 35 7.3.6 MissionMode State (Parked) .................................................. 36 7.3.7 RevertLowPower State (Transient) ............................................ 36 7.3.8 Reset State (Parked) ........................................................ 37



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7.3.9 Interrupt Flag Applicability Per State ...................................... 37 7.3.10 Timing Requirements ........................................................ 37



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1. Scope

This specification defines the electrical, management, and optical interfaces, the

mechanical form factor, thermal requirements, EMI, and ESD requirements for a 1, 2, or 4-

channel (such as 28 GBd per channel) transmit/receive hot-pluggable module, connector,

and cage. Clause 3 defines these items in more detail.

1.1 Description of Clauses

Clause 1 contains the Scope and Purpose

Clause 2 contains Referenced and Related Standards and Specifications

Clause 3 begins the specification

Clause 4 contains electrical specifications

Clause 5 contains mechanical specifications and printed circuit board recommendations

Clause 6 contains thermal considerations

Clause 7 is a description of the management interface and management register contents.

2. References

The microQSFP MSA activities support the requirements of the networking, computing, and

storage industries.

2.1 Industry Documents

The following interface standards and specifications are relevant to this Specification.

- GR-253-CORE

- IEEE Std 802.3-2015

- IEEE Std 802.3by 25 Gb/s Ethernet, draft amendment to 802.3-2015

- InfiniBand Architecture Specifications FDR and EDR

- FC-PI-5, FC-PI-6, FC-PI-6P

- FC-PI-7 64GFC/256GFC Project

- SAS 4.0

- Optical Connectors: MPO: IEC 61754-7, Dual LC: IEC 61754-20

- Aligned key (Type B) MPO patch cords: TIA-568

- Dual LC optical patch cord: NEBS GR-63

- SFF-8665 QSFP+ 28 Gb/s 4X Pluggable Transceiver Solution (QSFP28)

- SFF-8636 Management Interface for Cabled Environment (Revision 2.7)

- SFF-8679 QSFP28 4X Base Electrical Specification (Revision 1.7)

2.2 SFF Specifications

A possible action of the MSA is to create appropriate SFF specifications based on this

MSA.

2.3 Sources

This document can be obtained via the www.microqsfp.com web site

2.4 Conventions

The ISO convention of numbering is used i.e., the thousands and higher multiples are

separated by a space and a period is used as the decimal point. This is equivalent to the

English/American convention of a comma and a period.

English French ISO

0.6 0,6 0.6

1,000 1 000 1 000

1,323,462.9 1 323 462,9 1 323 462.9



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3. Introduction

This Specification covers the following items:

a) Electrical interfaces (including contact assignments for data, control, status,

configuration and test signals) and the electrical Connector and recommended host PCB

layout.

b) Management interfaces encompassing features from the current QSFP28 SFF documents and

includes support for multiple physical media (copper, optics etc), specific multi-data

rate and multi-protocol implementations.

c) Optical interfaces including the optical Connector receptacle and mating fiber optic

Connector plug and recommended breakout cable assembly. The optical specifications are

left to the applicable standards for each protocol.

d) Mechanical definitions including package outline with latching detail and optical

Connector receptacle detail, electrical Connector mechanical details for both the Module

and host PCB halves, front panel cut-out recommended dimensions.

e) Thermal requirements and considerations.

f) Electromagnetic interference (EMI) recommendations, including necessary shielding

features to seal the OEM chassis front panel output with and without the microQSFP Module

installed in the Cage.

g) Electrostatic discharge (ESD) requirements solely to the extent disclosed in the

Specification where the sole purpose of such disclosure is to enable products to operate,

connect or communicate as defined within the Specifications.

The Specifications will provide a common solution for combined four-channel ports that

support OTN and/or Ethernet and/or InfiniBand and/or Fibre Channel specifications. This

specification encompasses design(s) capable of supporting multimode, single-mode Modules,

passive copper, active copper, and active optical cables. Electrical and optical

specifications may be compatible with standards under development.

4. Electrical Specification

This microQSFP Specification adopts the compliance electrical and timing requirements

found in Clauses 4, 5, and 8 of SFF-8679 except as noted here in Clause 4. The scope of

SFF-8679 includes: electrical contacts for the host Connector, fiber positions for

optical interfaces, power supply requirements, ESD, and thermal characteristics of

pluggable modules and direct attach cables. Any exceptions to SFF-8679 will be defined in

this specification.

4.1 Electrical Interface

Electrical Interface and connector definitions of SFF-8679 Rev 1.7 Subclause 5.1 are

replaced by this Subclause 4.1. Figure 1 shows the signal symbols and contact numbering

for the microQSFP Module edge Connector. The diagram shows the Module PCB edge as a top

and bottom view. There are 38 contacts intended for high speed signals, low speed

signals, power, and ground connections.

The module contains a printed circuit board that mates with the electrical connector. The

pads are designed for a sequenced mating:

First mate - ground contacts

Second mate - power contacts

Third mate - signal contacts

For EMI protection the signals to the connector should be shut off when the module is

removed. Standard board layout practices such as connections to Vcc and GND with Vias,

use of short and equal-length differential signal lines, use of microstrip-lines and 50



Page 9

Ohm terminations are recommended. The chassis ground (case common) of the module should

be isolated from the module's circuit ground, GND, to provide the equipment designer

flexibility regarding connections between external electromagnetic interference shields

and circuit ground, GND, of the module.

Figure 1 microQSFP Module Pad Layout



Page 10

Table 1: microQSFP Module Electrical Interface Map

# Logic Symbol Name Plug

Sequence Notes

1 GND Signal Ground 1 1

2 CML-I Tx2n Transmitter Inverted Data Input 3

3 CML-I Tx2p Transmitter Non-Inverted Data Input 3





8 LVTTL-I ModSelL Module Select 3

9 LVTTL-I ResetL Module Reset 3

10 VccTxRx +3.3V Power Supply for high-speed data path ICs 2 2

11 LVCMOS-

I/O

SCL 2-wire serial interface clock 3

12 LVCMOS-

I/O

SDA 2-wire serial interface data 3


14 CML-O Rx3p Receiver Non-Inverted Data Output 3

15 CML-O Rx3n Receiver Inverted Data Output 3












27 LVTTL-O ModPrsL Module Present 3

28 LVTTL-O IntL Interrupt 3



31 VccMgmt Management Interface Power Supply 2 2








Note 1: GND is the symbol for signal and supply (power) common for the microQSFP Module.

All are common within the microQSFP Module and all Module voltages are referenced to

this potential unless otherwise noted. Connect these directly to the host board signal-

common ground plane.

Note 2: Each Vcc contact is limited to maximum of 1 A. The Host shall apply power to all

Vcc contacts (VccTxRx and VccMgmt) concurrently. All VccTxRx contacts may lead to a

common 3.3 V Power Supply in the module. This 3.3 V Power Supply shall be electrically

isolated from the VccMgmt Power Supply in the module.

Figure 2 shows an example block diagram of the connectivity between the host PCB and the

microQSFP module.



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Figure 2a: Example microQSFP Host Board and Optical Module Block Diagram

microQSFP Card

Host ASIC

TX 4 p

TX 4 n

TX 1 p

T X 1 n

RX 1 p

R X1 n

RX 4 p

RX 4 n

SDA SCL

RESETL INTL

MODPRSL

VccMgmt

MDI

GND ( 12 )

Controller

Medium Dependent Receivers

( 4 )

microQSFP Outputs

( 4 )

Medium Dependent

Transmitters ( 4 )

microQSFP Inputs

( 4 )

Power Distribution

Host Outputs

( 4 )

: Host

Inputs ( 4 )

HOST PSU

POWER FILTER

NETWORK

VccTxRx VccTxRx VccTxRx

:

: :

High Speed Traffic

MODSELL



Page 12

Figure 2b Example microQSFP Host Board and Copper Cable Module Block Diagram

4.2 Low Speed Signal Descriptions

Low Speed Signals are as defined in Subclause 5.2 of SFF-8679 except as follows. The

signal, LPMode, has been deleted. In addition to the 2-wire serial interface the module

has the following low speed pins for control and status:

ModSelL

ResetL

ModPrsL

IntL

4.2.1 ModSelL

For ModSelL see Subclause 5.2.1 in SFF-8679.

4.2.2 ResetL

For ResetL see Subclause 5.2.2 in SFF-8679.

4.2.3 ModPrsL

For ModPrsL see Subclause 5.2.4 in SFF-8679 except that in the module, ModPrsL is

connected to module Signal Ground through no more than 150 Ohm.

4.2.4 IntL

IntL is as described in SFF-8679 Subclause 5.2.5

microQSFP Card

Host ASIC

TX 4 p

TX 4 n

TX 1 p

T X 1 n

RX 1 p

R X1 n

RX 4 p

RX 4 n

SDA SCL

RESETL INTL

MODPRSL

Controller or EEPROM

Power Distribution

Host Outputs

( 4 )

: Host

Inputs ( 4 )

HOST PSU

POWER FILTER

NETWORK

:

: :

High Speed Traffic

MODSELL

VccTxRx VccTxRx

VccTxRx

VccMgmt

GND (12)



Page 13

4.3 Low Speed Signal Electrical Specifications

Low speed signal electrical specifications are as defined in SFF-8679 except Subclause

4.3.1 below replaces Subclause 5.3.1 of SFF-8679.

4.3.1 Low Speed Signaling

Low speed signaling shall utilize the VccMgmt rail for all pull-ups or actively driven

high signals. Hosts shall use a pull-up resistor connected to VccMgmt on each of the 2-

wire interface SCL (clock), SDA (data), and all low speed status outputs. Module pullups

on SCL and SDA signals are not required. If the Module implementation uses pullups on

these signals, each pullup shall be at least 47k Ohms.

The SCL and SDA comprise a hot plug interface that may support a bus topology. During

module insertion or removal, the module may implement a pre-charge circuit which

prevents corrupting data transfers from other modules that are already using the bus.

When active modules are in low power mode, the module receiver high speed signal outputs

shall be quiescent and the transmitter optical outputs shall be disabled.

Compliance with Table 2 provides compatibility between host bus masters and the 2-wire

interface.

Table 2: Low Speed Signals Electrical Specification

Parameter Symbol Min Max Unit Condition

SCL and SDA VOL 0 0.4 V IOL(max)=3.0mA

VOH VccMgmt-0.5 VccMgmt+0.3 V

SCL and SDA VIL -0.3 VccMgmt*0.3 V

VIH VccMgmt*0.7 VccMgmt + 0.5 V

Capacitance for

SCL and SDA I/O

contacts

Ci 14 pF

Total bus

capacitive load

for SCL and SDA

Cb 100 pF 3.0 k Ohms pullup

resistor, max

200 pF 1.6 k Ohms pullup

resistor max

Reset and

ModSelL

VIL -0.3 0.8 V |Iin|<=125 uA for

0V<Vin, VccMgmt

VIH 2 VccMgmt+0.3 V

ModPrsL and

IntL

VOL 0 0.4 V IOL=2.0mA

VOH VccMgmt-0.5 VccMgmt+0.3 V

4.3.2 Low Speed Signal Timing

For exceptions and additions to Subclause 8.1 of SFF-8679, s ee Table 12 in

Subclause 7.3.10.

All other Low Speed Signal Timing requirements are defined in SFF-8679 Subclause 5.3.2.

4.4 High Speed Signal Electrical Specifications

High Speed Signal Electrical Specifications are defined in SFF-8679 Subclause 5.4.

4.4.1 Compliance Testing



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Compliance Testing requirements are as defined in SFF-8679 Clause 4 with the following

exception. In Table 4-1, add to the description of TP1A, "Used to calibrate module test

inputs at TP1."

4.5 Power Requirements

The following is in replacement of Subclause 5.5 in SFF-8679.

The electrical connector has three contacts labeled VccTxRx and one contact labeled

VccMgmt. Each contact can concurrently support up to 1 Ampere current. The three VccTxRx

contacts are in parallel and may connect to a common 3.3 V Power Supply in the module

associated with the high speed signal path. The VccMgmt contact connects to a 3.3 V

VccMgmt supply associated with the low speed (control) signal interface and memory. The

VccTxRx supply is electrically isolated in the module from the VccMgmt supply.

The host system controls whether the module is in the low-power or high-power state via

the management interface. Details of the initialization sequence are provided in Clause

7.

4.5.1 Power Classes and Maximum Power Consumption

For Power Classes and Maximum Power Consumption see Subclause 7.2.1.

4.5.2 Module Power Supply Specification

The following is exceptions and additions to Subclause 5.5.2 of SFF-8679.

Table 5-5 of SFF-8679 no longer applies. In addition the Power_Override bit and the

High_Power_Class_Enable bit do not apply to microQSFP and shall be ignored by the module.

In Figure 5-5 of Subclause 5.5.2 of SFF-8679, inrush current timing is defined. The

following Figure 3 is to replace SFF-8679 Figure 5-5.

Instantaneous peak, max

Sustained peak, max

Steady state, max

80 mA, max

70 mA, max

58 mA, max

HIGH POWER MODETransmitters ON

I1 (mA)

t (ms)

Hot PlugInstant

Host Enables High Power Mode

50 us, max

Host Enables Transmitters

HIGH POWER MODETransmitters OFF

500 ms, max

50 us, max

500 ms, max

MgmtInit Configure DataPathInit TxOff TxTurnOn MissionMode

Current waveform at I1 in SFF-8679 Fig 5-4

From SFF-8679 Table 5-6

Figure 3: microQSFP Inrush Current Timing

Table 3 below is an addendum to existing Table 5-6 in SFF-8679, to define Low Power Mode

operation. Additionally, the 1.5W entry for Table 5-6 shall refer only to Power Class 1



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modules, not Low Power Mode operation. The host power supply voltages including ripple,

droop and noise below 100 kHz for VccTxRx and VccMgmt are 3.135 V Minimum, 3.3 V Nominal,

and 3.465 V Maximum.

Table 3: Low Power Mode Operation

Parameter Symbol Min Nom Max Unit

Power Consumption P_0 - - 0.5 W

Instantaneous peak current at hot plug Icc_ip_0 - - 80 mA

Sustained peak current at hot plug Icc_sp_0 - - 70 mA

Steady state current Icc_0 - - 58 mA

4.5.3 Host Board Power Supply Noise Output

For Host Board Power Supply Noise Output see Subclause 5.5.3 in SFF-8679

4.5.4 Module Power Supply Noise Output

For Module Power Supply Noise Output see Subclause 5.5.4 in SFF-8679

4.5.5 Module Power Supply Noise Tolerance

For Module Power Supply Noise Tolerance see Subclause 5.5.5 in SFF-8679

4.6 ESD

The following is an exception to the second paragraph of Subclause 5.6 in SFF-8679. All

microQSFP Module and host contacts shall withstand 1 000 V electrostatic discharge based

on Human Body Model per JEDEC JESD22-A114-B.

5. Mechanical and Board Definition

5.1 Introduction

The Module defined in this clause is illustrated in Figure 4. All Pluggable Modules and

direct attach cables are designed to mate to the Connector and Cage design defined in

this specification. Several Cage to bezel options are allowed. Both metal spring finger

and elastomeric EMI solutions are permitted. The microQSFP optical interface shall meet

one of the Optical Interfaces defined in Subclause 5.10, and shall mate and unmate with

the plug on the optical fiber cabling. Latching mechanism pull tabs are not defined and

are not shown.

The overall package dimension shall conform to the indicated dimensions and tolerances

indicated in clause 5. The mounting features shall be located such that the products are

mechanically interchangeable with the Cage and Connector system. In addition, the overall

dimensions and mounting requirements for the Cage and Connector system on a circuit board

shall be configured such that the products are mechanically, electrically, and thermally

interchangeable and the overall dimensions and insertion requirements for the optical

Connector and corresponding fiber optic cable plug shall be such that the products are

mechanically and optically interchangeable.

Note: All dimensions are in mm.



Page 16

Figure 4 — microQSFP Pluggable Module and Direct Attach Cable Rendering

5.2 microQSFP Reference Datums and Component Alignment

A listing of the reference datums for the various components is contained in Table 4.

The alignments of some of the datums are noted. The relationship of the Module, Cage, and

Connector relative to the Host Board and Bezel is illustrated in Figure 5 by the location

of the key datums of each of the components. In order to reduce the complexity of the

drawings, all dimensions are considered centered unless otherwise specified.



Page 17

Table 4– Definition of Reference Datums

Datum Description Figure Location

A Bottom surface of Module Figure 6

B Latching surface of Module Figure 6

C Width of Module Figure 6

D Pad surface of Module pc board Figure 7

E Front leading surface of Module pc board Figure 7

F Width of Module pc board Figure 7

G Top surface of host pc board Figure 8 & 9

H *Host board thru hole #1 to accept Connector guide post Figure 8 & 9

J Host board thru hole #2 to accept Connector guide post Figure 8 & 9

K Seating surface of Electrical Connector Figure 12

L Rear surface of Electrical Connector Figure 12

M Connector slot width Figure 12

N *Electrical Connector alignment pin Figure 12

P Top Surface of Electrical Connector Figure 12

R Seating plane of Cage on host pc board Figure 13

S Front surface of Cage Figure 13

T Width of inside of Cage Figure 13

U **Host board thru hole #1 to accept Cage Pin Figure 8

V **Cage Pin #1 Figure 13

* Datums H & N are aligned when assembled (see Figure 5)

** Datums U & V are aligned when assembled (see Figure 5)



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Figure 5 — microQSFP Datum Alignment, Depth

5.3 microQSFP Module Mechanical Package Dimensions

A common mechanical outline is used for all microQSFP Modules and direct attach cables.

The Module shall provide a means to self-lock with the Cage upon insertion; means to

accomplish self-locking is open to vendor implementation, provided it meets the



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dimensions in Figure 6. The package dimensions for the microQSFP Module are defined in

Figure 6 and Figure 7.

Figure 6 — Drawing of microQSFP Module

5.3.1 Mating of microQSFP Module PCB to microQSFP Electrical Connector

The microQSFP Module contains a printed circuit board that mates with the microQSFP

electrical Connector. The pads are designed for a sequenced mating:

First mate – ground contacts

Second mate – power contacts

Third mate – signal contacts

The pattern layout for the microQSFP Printed Circuit Board is shown in Figure 7.



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Figure 7 — Pattern Layout for microQSFP Printed Circuit Board

5.4 Host PCB Layout

A typical host board mechanical layout for attaching the microQSFP Connector and Cage

System is shown in Figure 8 and Figure 9. Location of the pattern on the host board is

application specific. See Subclause 5.6 for details on the location of the pattern

relative to the bezel.

To achieve 28Gb/s performance pad dimensions and associated tolerances shall be adhered

to and attention paid to the host board layout.



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Figure 8 — microQSFP Host PCB Mechanical Layout



Page 22

Figure 9 — microQSFP Host PCB Mechanical Layout

5.4.1 Insertion, Extraction and Retention Forces for microQSFP Modules

The requirements for insertion forces, extraction forces and retention forces are

specified in Table 5. The microQSFP Cage and Module design combinations shall ensure

excessive force applied to a cable does not damage the microQSFP Cage or host Connector.

If any part is damaged by excessive force, it should be the cable or media Module and not

the Cage or host Connector which is part of the host system. Cable to microQSFP Module

retention shall be appropriate to the application, performance can be verified by

following industry test methods such as EIA-364-36B or other appropriate specifications.

Table 5 — Insertion, Extraction and Retention Forces

Measurement Min Max Units Comments

microQSFP Module

insertion

0 60 N Module insertion into host

Connector & Cage.

microQSFP Module

extraction

0 30 N Module extraction from host

Connector & Cage

microQSFP Module

retention with latch

engaged

90 N/A N No damage to Module below 90N

Cage retention in

Host Board

90 N/A N Force to be applied in a

direction normal to host board

top surface, no damage to Cage

Insertion / removal

cycles, Connector /

Cage

100 N/A Cyc. Number of cycles for the

Connector and Cage with

multiple Modules.

Insertion / removal

cycles, microQSFP

Module

50 N/A Cyc. Number of cycles for an

individual Module.

5.5 Color Coding and Labeling of microQSFP Modules

Color coding may be defined by vendor specific requirements or by industry agreements. In

the absence of such definition, the colors below may be used.

An exposed feature of the microQSFP Module (a feature or surface extending outside of the

bezel) are color coded as follows:



Page 23

Beige for 850nm

Blue for 1310nm

White for 1550nm

Each microQSFP Module shall be clearly labeled. The complete labeling need not be visible

when the microQSFP Module is installed and the bottom of the device is the recommended

location for the label. Labeling shall include:

Appropriate manufacturing and part number identification

Appropriate regulatory compliance labeling

A manufacturing traceability code

The label should also include clear specification of the external port characteristics

such as:

Optical wavelength

Required fiber characteristics

Operating data rate

Interface standards supported

Link length supported

The labeling shall not interfere with the mechanical, thermal or EMI features.

5.6 Bezel for Systems using microQSFP Modules

Host enclosures that use microQSFP devices should provide appropriate clearances between

the microQSFP Modules to allow insertion and extraction without the use of special tools

and a bezel enclosure with sufficient mechanical strength. The microQSFP Module insertion

slot should be clear of nearby moldings and covers that might block convenient access to

the latching mechanisms, the microQSFP Module, or the cables that plug directly into the

Cage.

5.6.1 Bezel for the Thru Bezel Cage Assembly

The front surface of the Cage assembly passes through the bezel.

Two EMI solutions may be implemented for the thru bezel Cage. If EMI spring fingers are

used, they make contact to the inside of the bezel cutouts. If an EMI gasket is used, it

makes contact to the inside surface of the bezel. To accept all Cage designs, both bezel

surfaces shall be conductive and connected to chassis ground.

The minimum recommended host board thickness for belly to belly mounting of the Connector

and Cage assemblies is 2.2 mm.

Figure 10 — Recommended Bezel Design for Cages that extend into or thru Bezel



Page 24

5.7 microQSFP Electrical Connector Mechanical

The microQSFP Connector is a 38-contact, right angle surface mount Connector and is shown

in Figure 11. The mechanical specifications for the Connector are listed in Table 5 and

shown in Figure 12.

Figure 11 — microQSFP Module Electrical Connector Illustration



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Figure 12 — microQSFP Electrical Connector Specification

5.8 Individual microQSFP Cage Assembly

For microQSFP a Cage Assembly is utilized that passes through the bezel. The detailed

drawings for the Cage assembly options are shown in Figure 13. The purpose of the

blocking tab is to prevent damage to the Connector should a Module be inserted in an

incorrect orientation.



Page 26

Figure 13 — 1-by-1 Thru Bezel Cage Design

5.9 EMI Cover

In order to prevent contamination of the internal components and to optimize EMI

performance, it is recommended that an EMI Cover be inserted into the Cage assembly when

no Module is present. The conductivity of the materials should be chosen for the EMI

Cover to block EMI emissions. The EMI cover shall be designed such that is can be

inserted into a Cage and Connector as defined in this specification.

5.10 Optical Interface

The microQSFP optical interface port shall be either a male MPO connector as specified in

IEC 61754-7 (see Figure 14a) or a dual LC as specified in IEC 61754-20 (see Figure 14b).

The four fiber positions on the left as shown in Fig. 14a, with the key slot up, are used

for the optical transmit signals (Channel 1 through 4). The fiber positions on the right

are used for the optical receive signals (Channel 4 through 1).



Page 27

The central four fibers may be physically present.

Two alignment pins are present.

Figure 14a — microQSFP Optical Receptacle and Channel Orientation for MPO Connector

(Viewed from Front of Module)

Figure 14b — QSFP+ Optical Receptacle and Channel Orientation for dual LC Connector

(Viewed from Front of Module)

5.11 MPO Optical Cable connection

Aligned key (Type B) MPO patchcords should be used to ensure alignment of the signals

between the Modules. The aligned key patchcord is defined in TIA-568 and shown in Figure

14c. The optical Connector is orientated such that the keying feature of the MPO

receptacle is on the top.



Page 28

Figure 14b — microQSFP MPO Optical Patchcord

6. Thermal

6.1 Thermal Requirements

The microQSFP Module shall operate within one or more of the case temperatures ranges

defined in Table 6. The temperature ranges are applicable between 60m below sea level and

1800m above sea level, (Ref. NEBS GR-63) utilizing the host systems designed airflow.

Case temperature measurement location shall be vendor specific similar to the current

situation with SFP, QSFP, etc. form factors.

Table 6 Temperature Range Class of operation

Class Case Temperature Range

Standard 0 through 70C

Extended -5 through 85C

Industrial -40 through 85C

microQSFP is designed to allow for up to 24 adjacent Modules in a single row, ganged,

and/or belly-to-belly, with the appropriate thermal design for cooling / airflow (Ref.

NEBS GR-63). Airflow around the module and through the Cage is not filtered by design nor

is it a requirement of this specification.

6.2 Thermal Management Considerations

For microQSFP cooling is typically achieved by allowing front to back airflow to pass

through the Module. Ambient air outside the chassis is intended to enter the chassis

around the microQSFP Module and through Cage instead of only through other openings in

the chassis bezel. This ambient air shall pass around cooling features of the Module,

pass into the Cage assembly, and then exit the Cage assembly into the chassis. This

design intent allows for increased port density within a chassis rack, while allowing

ambient air to not only cool the Module but also allow that air to pass through into the

chassis to cool components deeper inside the chassis.



Page 29

Additionally, the microQSFP Cage should have ventilation holes as allowed in Figure 13.

The dimensions of these vent holes are determined by the Cage manufacturers within the

bounds set forth in Figure 13. Care should be taken to ensure adequate ventilation

through the Cage is attained and that EMI is prevented from penetrating the Cage.

7. Management Interface

7.1 Introduction

A management interface, as defined in SFF-8636, is specified in order to enable flexible

use of the Module by the user.

7.2 microQSFP Memory Map

This microQSFP Specification adopts the management interface and memory map requirements

found in Clauses 4, 5, and 6 of SFF-8636 except as noted here in Clause 7. This exception

list was generated from SFF-8636 rev 2.7. Fields previously used in SFF-8636 Rev 2.7 that

are no longer used are now reserved in microQSFP.

Table 7 microQSFP Exceptions to SFF-8636 Memory Map Definition

Location Disposition Register Name Description

Lower Memory

Byte 0 & Byte

128

Identifier

value for

microQSFP

added to SFF-

8024 Table 4-1

Identifier Additional module type for

microQSFP Identifier Value

17h.

Lower Memory

Byte 2

bits[7:4]

Changed from

Reserved to

Current Module

state, see

Table 9 for

encoding.

Module_State Current module state,

encoded (see Table 9 for

encoding.)

Lower Memory

Byte 2 bit 0

Change from

Data_Not_Ready

flag to

Reserved

Data_Not_Ready flag Functionality replaced by

State_changed flag, this

register bit is reserved

for future use.

Lower Memory

Byte 6 bit 0

Change from

Initialization

Complete flag

to

State_changed

flag

State_changed flag Flag to indicate state

transition from a

transient state to a

parked state. Setting this

flag shall result in the

module asserting IntL.

This flag shall be cleared

upon read.

Lower Memory

Byte 93 bit 0

Change from

Power override

to Reserved

Power override microQSFP does not have a

dedicated LPMODE contact,

this register bit is

reserved for future use

Lower Memory

Byte 93 bit 1

Change Power

Set

Description

Power_Set Power set to Low Power

Mode Default 1

Lower Memory

Byte 93 bit 2

Change from

High Power

Class Enable

to Reserved

High Power Class

Enable

This bit is no longer

needed, because the host

can read all power classes

and determine support, so

clearing the Power set bit

will enable power classes

1-7. This register bit is

reserved for future use.



Page 30

Lower Memory

Byte 103 bit 0

Changed from

Reserved to M-

Module State

Change

M-Module State

Change

Masking Bit for Module

State Change Flag.

Lower Memory

Byte 129 bits

[7:5]

Change power

classes for

bits [7:6],

change bit 5

from Reserved

to power class

use.

Extended Identifier

Values

microQSFP needs additional

power classes not

designated in SFF-8636.

See Table 8 for encodings.

Lower Memory

Byte 129 bits

[1:0]

Change from

Unused and

Power Classes

to Reserved.

Extended Identifier

Values

These bits are no longer

needed to define power

classes, all power classes

are defined in bits [7:5].

See Table 8 for encodings.

Lower Memory

Byte 114 bits

[3:0]

Changed from

Reserved to

Max_DataPathIn

it_Duration

Max_DataPathInit_Du

ration

Max duration of

DataPathInit state. See

Table 10 for encodings.

Lower Memory

Byte 114 bits

[7:4]

Changed from

Reserved to

Max_TX_TurnOn_

Duration

Max_TX_TurnOn_Durat

ion

Max duration of TX_TurnOn

state. See Table 10 for

encodings.

The reader should also note that microQSFP adds a VccMgmt supply that does not exist in

SFF-8636. Therefore, all references to Vcc in SFF-8636 are applicable to the VccTxRx rail

and not the VccMgmt rail.

7.2.1 Extended Identifier

The extended identifier provides additional information about the free side device. For

example, the identifier indicates if the free side device contains a CDR function and

identifies the power consumption class it belongs to.

The power class identifiers specify maximum power consumption over operating conditions

and lifetime with all supported settings set to worst case values.

Table 8 Extended Identifier Values (Lower Memory Byte 129 bits 7:0)

Bit Device Type

7,6,5 000: Power Class 1 (0.5 W max.)

001: Power Class 2 (1.5 W max.)






111: Power Class 8 (>9.0 W) *

4 0: No CLEI code present in Page 02h

1: CLEI code present in Page 02h

3 0: No CDR in TX

1: CDR Present in TX

2 0: No CDR in RX

1: CDR Present in RX

1-0 Reserved

* See vendor documentation for specific power requirements.

7.2.2 Module_State Register Encodings



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Encodings for the Module_State register are shown in Table 9. Passive copper cables

implemented with static EEPROMs shall utilize encoding 0000b.

Table 9 Module_State Encodings (Lower Memory Byte 2 bits 7:4)

Encoding Bit

order (7,6,5,4)

State

0000b Module does not support state machine

0001b MgmtInit

0010b Configure

0011b DataPathInit

0100b TX_Off

0101b TX_TurnOn

0110b MissionMode

0111b RevertLowPwr

1000b-1111b Reserved

7.2.3 Transient State Duration Encodings

The Max_DataPathInit_Duration (Lower Memory Byte 114 bits 3:0) and Max_TX_TurnOn_Duration

(Lower Memory Byte 114 bits 7:4) registers are used to allow the module to inform the

host of the maximum duration of transient states. Note that the module may interrupt the

host at any time before the maximum duration reported, to report that the state is

complete. Table 10 defines the encodings used for both registers.

Table 10 Transient State Duration Encodings (Lower Memory Byte 114 bits 7:4 & bits 3:0)

Encoding Bit order

(7,6,5,4) & (3,2,1,0)

Maximum State Duration

0000b Maximum state duration is less than 1 ms. This state is not

reported in the Module_State register, and no interrupt is

generated upon entry into next parked state

0001b 1 ms <= maximum state duration < 5 ms





0110b 500 ms <= maximum state duration < 1 s

0111b 5 s <= maximum state duration < 10 s

1000b 10 s <= maximum state duration < 1 min

1001b 1 min <= maximum state duration < 5 min



1100b Maximum state duration >= 50 min

1101b Reserved

1110b Reserved

1111b Reserved

7.3 microQSFP State Machine

The module behaviors and available interfaces to the host are defined using the state

machines shown in Figure 15 and Figure 16 below. The Figure 15 state machine is

applicable to modules that contain active electronics in the high-speed data path. The

Figure 16 state machine is applicable to passive copper cable assemblies.

States with dashed boxes are transient states with a variable duration, depending on the

module implementation. The module reports the maximum duration of the DataPathInit and

TX_TurnOn states in the Max_DataPathInit_Duration and Max_TX_TurnOn_Duration registers in

the memory map. In general, host interactions with the module should be minimized during

these transient states, with memory map accesses limited to read-only static register

content. Dynamic register content is unreliable during transient states.



Page 32

States with solid boxes are parked states, which require host interaction. The duration

of these states is completely controlled by the host, with exit from the state only

occurring after the module receives the applicable trigger from the host. The trigger for

each state is defined in the state diagrams and detailed descriptions below.

The memory map contains a Module_State register to report the current state of the

module. Some transient states may be so short that the Module_State register is not

updated. Refer to Subclause 7.2.2 for the definition of the Module_State register

encodings and Subclause 7.2.3 for transient state duration encodings.

All modules shall power up in Low Power Mode upon insertion or assertion or deassertion

of ResetL. When active modules are in low power mode, the module receiver high speed

signal outputs shall be quiescent and the transmitter optical outputs shall be disabled.

All passive copper cable assemblies shall be fully functional immediately upon insertion.

When the host software has configured the active module and is ready to activate the

high-speed data path, the host software shall put the module into High Power Mode, using

the control bits in Lower Memory Page Byte 93 control bits 0 and 1.

In Table 5-4 of Subclause 5.5.2 of SFF-8679, the default value for the Power_Set bit is

1. Both bits 1 and 0 shall be set to move the module to High Power Mode.

The host shall apply power to both the VccMgmt and VccTxRx rails upon module insertion.



Page 33

State = MgmtInitPwrMode = Low Power

TX = Disabled

State = ConfigurePwrMode = Low Power

TX = Disabled

State = DataPathInitPwrMode = High Power

TX = Disabled

State = TX_OffPwrMode = High Power

TX = Disabled

Module management interface ready & (IntL asserted)

Host clears Power_set bit

Data path power-up and initialization complete & IntL asserted

State = RevertLowPwrPwrMode = High Power

TX = Disabled

Module insertion & power applied

Host disables TX output

State = ResetPwrMode = Low Power

TX = Disabled

ResetL asserted (any state)

ResetL deasserted

State = TX_TurnOnPwrMode = High Power

TX = Enabled

State = MissionModePwrMode = High Power

TX = Enabled

TX output enabled and fully operational& IntL asserted

Host enables TX output

Host sets Power_Set bit

Host sets Power_set bit

ResetL is asserted ResetL is deasserted

Figure 15 – microQSFP Active Module State Machine



Page 34

State = MgmtInitPwrMode = Low Power

Module management interface ready & (IntL asserted)

State = ResetPwrMode = Low Power

ResetL asserted

ResetL deasserted

State = MissionModePwrMode = Low Power

Module insertion & power applied

ResetL is asserted ResetL is deassertedResetL asserted (any state)

Figure 16 – microQSFP Passive Copper Cable State Machine

7.3.1 MgmtInit State (Transient)

The MgmtInit state is a transient state that is entered any time the module is brought

out of Reset, due to deassertion of the ResetL signal or upon initial insertion and

application of power to the VccMgmt and VccTxRx contacts. For implementations supporting

only passive copper cables, the host may or may not apply VccTxRx. The MgmtInit state is

applicable to both active modules and passive copper cable assemblies.

During this state, the module shall initialize the management interface and configure the

memory map for access by the host. The module may perform limited power-up of the high-

speed data path circuitry, however the module shall remain in Low Power mode throughout

this state. The module may ignore all 2-wire serial interface transactions while in this

state.

The module shall not assert IntL during MgmtInit. If catastrophic faults occur, the

module shall transition immediately to the Configure state to report the fault. The

module shall report all non-catastrophic faults and warnings that are valid after

transitioning to the Configure state.

Before the module exits this state, all memory map register locations shall be set to

their power-on defaults. The module shall have completed MgmtInit in accordance with

Mgmtinit_Duration as defined in Table 12. The duration of the MgmtInit state,

MgmtInit_Duration, is the time from power on (defined as the instant when supply voltages

reach and remain at or above the minimum level specified in SFF-8679 Table 5-6), hot plug

or rising edge of reset until the module has configured the memory map to default

conditions and activated the management interface.

7.3.2 Configure State (Parked)

The Configure state is a parked state only applicable to active microQSFP modules. During

this state, the host may configure the module using the management interface and memory

map. Some example configuration activities include reading the ID and device property

fields, setting CDR and other channel attributes and configuration of monitor masks.

Details of host-module interactions in the Configure State are implementation dependent

and are outside the scope of this specification.

Upon entry into the Configure state, the module shall set the Module_State register to

the Configure state, set the State_Changed flag and any applicable fault and warning

flags that are valid after transitioning to the Configure state, and assert the IntL



Page 35

signal. The host shall read the State_Changed flag along with all other fault and warning

flags to deassert the IntL signal.

Throughout the Configure state, the module shall remain in Low Power Mode and the TX

output shall be disabled. The module shall ignore host requests to enable the module TX

while in this state.

Prior to exit from this state, the host shall enable all applicable host transmitters and

provide compliant signals, so that the module can configure TX electrical input circuitry

while in the DataPathInit state.

When the host has completed module configuration, the host may enable full power up of

the module by writing a 0 in the Power_Set bit (Lower Memory Page Byte 93 bit 1) in the

memory map.

7.3.3 DataPathInit State (Transient)

The DataPathInit state is a transient state where the module powers up the TX and RX high

speed data path electronics and applies module configuration settings defined in the

module memory map. This state is applicable only to active modules. Example activities

during this state include adaptation of module CTLE, TX CDR lock, and RX equalization

enable, etc. The duration of the DataPathInit state, DataPathInit_Duration, is the time

from the falling clock edge after the Stop bit of the Power_Set bit write transaction to

the assertion of the initialization completed IntL (IntL Vout = Vol), both times are

observed at the module. The maximum duration of the DataPathInit state shall be

identified by the module vendor in the Max_DataPathInit_Duration register, Lower Memory

Byte 114 bits [3:0]. Encodings for Max_DataPathInit_Duration are defined in Table 10.

Upon entry into the DataPathInit state, the module shall enter High Power mode and set

the Module_State register to the DataPathInit state.

Throughout the DataPathInit state, the TX output shall be disabled. The module shall

ignore host requests to enable the module TX while in this state. The host shall minimize

2-wire serial transactions while in this state. Dynamic memory map content may be

unreliable while in this state and should not be read or written.

The module shall not assert IntL during DataPathInit. If catastrophic faults occur, the

module shall transition immediately to the TX_Off state to report the fault. The module

shall report all non-catastrophic faults and warnings that are valid after transitioning

to the Tx_Off state.

When the module has completed power-up and initialization of the TX and RX high-speed

data path circuitry, the module shall transition to the TX_Off state.

7.3.4 TX_Off State (Parked)

The TX_Off state is a holding state where the module TX and RX electronics has been fully

powered and configured but is waiting for the host to enable the module TX output. This

state is only applicable to active modules.

Upon entry into the TX_Off state, the module shall set the Module_State register to the

TX_Off state, set the State_Changed flag and any valid fault and warning flags, and

assert the IntL signal. The host shall read the State_Changed flag along with all other

fault and warning flags to deassert the IntL signal.

Throughout the TX_Off state, the module shall remain in High Power Mode and the TX output

shall be disabled.

A Host enables the transition to the TX_TurnOn state TX by writing a 0 in each and every

TX Disable bit (Lower Memory Byte 86 bits 3:0).

7.3.5 TX_TurnOn State (Transient)



Page 36

The TX_TurnOn state is a transient state where the module enables its TX output. This

state is applicable only to active modules. The duration of the TX_TurnOn state,

TX_TurnOn_Duration, is the time from the falling clock edge after the Stop bit of the

last TX Disable bit write transaction to until the optical output rises above 90% of

nominal, both times are observed at the module. The maximum duration of the TX_TurnOn

state shall be identified by the module vendor in the Max_TX_TurnOn_Duration register,

Lower Memory Byte 114 bits [7:4]. Encodings for Max_TX_TurnOn_Duration are defined in

Table 10.

Upon entry into the TX_TurnOn state, the module shall set the Module_State register to

the TX_TurnOn state.

The host shall minimize 2-wire serial transactions while in this state. Dynamic memory

map content may be unreliable while in this state and should not be read or written.

For modules whose TX output turn-on time is less than 1 ms, the TX_TurnOn state shall be

bypassed by the module, with no assertion of the IntL signal.

The module shall not assert IntL during TX_TurnOn. If catastrophic faults occur, the

module shall transition immediately to the MissionMode state to report the fault. For

warnings and non-catastrophic faults, the module shall report all valid faults and

warnings only after transitioning to MissionMode.

When the module TX output is fully operational, the module shall transition to the

MissionMode state.

7.3.6 MissionMode State (Parked)

The module is fully operational while in the MissionMode state. The MissionMode state is

applicable to both active and passive modules.

Upon entry into the MissionMode state, the module shall set the Module_State register to

the MissionMode state, set the State_Changed flag and any valid fault and warning flags.

The host shall read the State_Changed flag along with all other fault and warning flags

to deassert the IntL signal.

For active modules, the module shall be in High Power Mode throughout the MissionMode

State. Host TX outputs shall be enabled and fully operational in this state. Host

requests to disable the TX output shall result in disablement of TX outputs and a

transition to the TX_Off state. The module transitions to the RevertLowPower state when

the host writes a 1 in the Power_Set bit (Lower Memory Byte 93 bit 1).

For passive modules, the module shall remain in Low Power Mode throughout the MissionMode

State.

7.3.7 RevertLowPower State (Transient)

The RevertLowPower state is a transient state where the module power returns to the Low

Power Mode. This state is applicable only to active modules.

Upon entry into the RevertLowPower state, the module shall set the Module_State register

to the RevertLowPower state, disable the TX output, and set the TX Disabled bits in the

memory map. The TX output shall remain disabled throughout the RevertLowPower state.

The host shall minimize 2-wire serial transactions while in this state. Dynamic memory

map content may be unreliable while in this state and should not be read or written.

The module shall remain in the RevertLowPower state until the module is in Low Power

Mode. Any faults or warnings that occur during the RevertLowPower state shall be ignored.

When the module reached a power level consistent with Low Power Mode, the module shall

transition to the Configure state.



Page 37

7.3.8 Reset State (Parked)

The Reset state can be entered from any state by assertion of the ResetL signal. Module

behavior when ResetL is asserted is defined in SFF-8679 5.2.2. Deviations from and

clarifications to SFF-8679 are defined as follows. For passive copper cables, holding the

EEPROM in reset is optional. The TX output for active modules shall be disabled

throughout the Reset state. Management interface transactions initiated by the host

during the Reset state may be ignored by the module. The Reset state can only be exited

by deassertion of the ResetL signal. Upon exit from the Reset state, the module shall

enter the MgmtInit state.

7.3.9 Interrupt Flag Applicability Per State

Some module interrupt flags are generated by the state machine, but the majority of the

flags are triggered by other sources. The host may choose to mask any flag by setting the

appropriate mask bits during the Configure state. Flags that are masked by set mask bits

do not generate IntL assertion in all states.

Table 11 shows the interrupts that are available in each state. All interrupts not listed

shall be inhibited by the module in the applicable state.

Table 11 Available Interrupts Per State

State Interrupts available

Reset None

MgmtInit None

Configure State_Changed

DataPathInit All interrupts shall be held until

transition to TX_Off

TX_Off All

TX_TurnOn All interrupts shall be held until

transition to MissionMode

MissionMode All

RevertLowPwr None

7.3.10 Timing Requirements

The following are exceptions and additions to Subclause 8.1 of SFF-8679.

Table 12 Timing Requirements

Parameter Symbol Max Unit Conditions

Management

Initialization

Time

MgmtInit 2000 ms The time from power on (defined as the

instant when supply voltages reach and

remain at or above the minimum level

specified in SFF-8679 Table 5-6), hot

plug or rising edge of reset until the

module has configured the memory map to

default conditions and activated the

management interface.

Data Path

Initialization

Time

DataPathInit See

7.3.3

- The time from the falling clock edge

after the Stop bit of the Power_Set bit

write transaction to the assertion of the

initialization completed IntL (IntL Vout

= Vol), both times are observed at the

module.

TX Turn On

Time

TX_TurnOn See

7.3.5

- The time from the falling clock edge

after the Stop bit of the last TX Disable

bit write transaction to until the

optical output rises above 90% of

nominal, both times are observed at the

module.