TM
Americas 1.855.426.6766 • EMEA & ROW +44 (0) 1603 788967 •
China +86 21 5459 1970 • [email protected] • www.micross.com
BGA Reballing
One Source. One Solution.
LOW-COST, QUICK-TURNLOW & HIGH VOLUME
PROCESSES
SINGLE REFLOWMINIMIZES HEAT EXPOSURE
TURNKEYPRODUCT PURCHASING
PROCESSING OF CERAMIC AND PLASTIC
BGAs AND LGAs
BALL PITCH FROM 0.4mm
BALL DIAMETER FROM 0.3mm
Pb-FREE ↔ Sn/Pb BALLS
Conversion to leaded spheresfor Hi-Rel applications.
TM
TM
Americas 1.855.426.6766 • EMEA & ROW +44 (0) 1603 788967 •
China +86 21 5459 1970 • [email protected] • www.micross.com
Automatic Inspection
XRF
LOW & HIGH VOLUME PROCESSES
For lower volume requirements, Micross offers a unique process
that does not require the use of preforms and eliminates the need
for custom tooling for most components. Benefits include: shortened
lead times, reduced total cost and no NREs.
DEBALLOur in-house wave solder deball process removes the
original solder sphere and pad finish. For an ultra-controlled,
non-contact deball process, our exclusive Micross Robotic Hot
Solder Dip equipment can also be used.
ELECTRICAL TESTINGStatic electrical testing is available
post-process to ensure there are no internal component issues or
gross/latent ESD damage. Tests include: detection of I/O diode
opens/shorts and confirmation that Power and GND consumption are
within limits.
INSPECTING/TESTING• Optical inspection for sphere condition•
Automated inspection for sphere size and placement• Ball shear•
XRF• Ionic cleanliness• Solderability
INVENTORY MANAGEMENTFully automated in-house EDI, inventory
management system with procurement and consignment
capabilities.
QUALITY• Quality System is AS9100 Rev. D and
ISO9001:2015 certified• Full ESD environment (JESD625B
compliant)• Temperature and humidity controls• Fully traceable
documentation• Integrated production control system
OTHER SERVICES• Robotic Hot Solder Dip Lead Conversion
(Pb-free Sn/Pb)• Lead attach• Lead trim & form• Lead
alignment• Tape & reel, 3D component scan• Dry-bake
ABOUT MICROSSMicross is the global one-source provider of Bare
Die & Wafers, Advanced Interconnect Technology, Custom
Packaging & Assembly, Component Modification Services,
Electrical & Environmental Testing and Hi-Rel Products to
manufacturers and users of semiconductor devices. In business for
more than 40 years, our extensive hi-reliability capabilities serve
the Aerospace & Defense, Space, Medical and Industrial markets.
Micross possesses the sourcing, packaging, assembly, engineering,
test and logistics expertise needed to support an application
throughout its entire program cycle.
May 23, 2019 • Rev is ion 2.1
TM
BGA Reballing
