M I D for LDS MID Molded Interconnect Device MID LDS -
Laser-Direct-Structuring WAH HONG INDUSTRIAL CORP. Johnny Liu Tel.:
886-3-270-9955 ext: 63150 Mobile: 886-925-526619 E-Mail:
[email protected] Web-site: www.wahhong.com.tw
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LDS MID-(1)Full Additive Process: Selective metallization of
thermoplastic injection molded parts by Laser-Direct-Structuring in
only three Process Steps: Injection Moulding Laser Processing /
Activation Metallization
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LDS MID-(2)Flexibility by Laser ProcessingFlexible Process no
extra tool, no mask processing directly from the CAD data Fast 3-D
Structuring high dynamic laser beam deflection contactless
processing High Resolution laser spot size < 100 m3
LDS MID-(3). . . 0.1mm, 0.15mm. . &.
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MID for LDSonly three Process StepsInjection Molding Laser
Processing Plating
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Injection MoldingInjection Molding of LDS-Polymers:
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Laser ProcessingLDS MicroLine 3D Industrial
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Chemical Metallization of the Laser-activated partsPlating
Line:
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Principle Generation of a micro-rough SurfaceSketch: Laser
Activated additive by laser ablation modified polymer
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Principle Adhesive Metallizationlaser processed area partly
embedded tracks
Cu
Bild mit strukturierter Oberflche und un-processed
unstrukturierter Oberflchearea
modified polymer
Adhesive anchoring of plated Cu10
SummaryMore flexibility in product design. Only three process
steps (1Kshot molding, surface processing, metallization). Maximum
function integration in minimum space. Cost savings in
production.
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Thanks & Comments
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