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Molex HFM High-Speed FAKRA-MiniConnector/Cable Assembly Solutions

Rev June 2020HFM® is a registered trademark of Rosenberger

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Guadalajara, Mexico Clark, Philippines

Dongguan, China

Ansan, South KoreaChengdu, ChinaRochester Hills, MI

Bangalore, India

Taipei, Taiwan

Manufacturing

Headquarters Engineering

Laboratory

Automotive Facilities

G L O B A L S U P P O R T T E A M

S U P P O R T I N G O E M & T I E R S W O R L D W I D E

S H I P P I N G T O 4 1 C O U N T R I E S

L E A D E R I N H I G H S P E E D I N - V E H I C L E C A B L E S

D u p l i c a t e p r o d u c t i o n f o o t p r i n t

Molex CMS Networking: Global Presence

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Molex CMS Networking: Multi-Gig Solutions

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Molex and Rosenberger HFM Dual Sourcing Molex and Rosenberger entered a dual-

sourcing agreement for the Rosenberger developed HFM High-Speed FAKRA-Mini automotive coaxial connectors

Both companies will produce identical HFM product lines with matching mechanical and electrical performance delivering seamless backward compatibility for the automotive market

Agreement assures receipt by Molex from Rosenberger of all engineering design files as well as approval process for any design modifications or revisions

HFM connector system includes proprietary patented technologies that only Rosenberger and Molex have legal rights to utilize

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Molex HFM Technical Details

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Molex HFM Space-Optimized Design

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Molex HFM Product Family

Design Complete In-Development

Unsealed RA TH PCB Connectors

Cable AssembliesRTK044

Unsealed Vertical TH PCB Connectors

Cable AssembliesRG174 & RTK031

Unsealed Cable Connectors

High Performance Connectors

Sealed Cable Connectors

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Molex and Rosenberger HFM Competition

Indirect Path

Molex & Rosenberger HFM20 GHz Max.

Competitors’ Mini-FAKRA9 GHz Max. Grounding

Paths

Direct Path

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Molex HFM Solutions

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**According to USCAR 25 Rev 3

Molex HFM Product Specifications Electrical Data*

Impedance: 50 Ω

Frequency: DC to 9 GHz

Return Loss: ≥ 25 dB, DC to 3 GHz

≥ 20 dB, 3 to 6 GHz

≥ 12 dB, 6 to 9 GHz

Insertion Loss: ≤ 0.1 x

Insulation Resistance: ≥ 1x103 MΩ

Center Contact Resistance: ≤ 5 mΩ

Outer Contact Resistance: ≤ 5 mΩ

Test Voltage: 750 V rms

Working Voltage: 335 V rms

Power Current: ≤ 1 A DC

Crosstalk: ≤ -60 dB up to 10 GHz

Mechanical DataMating Cycles: ≤ 25

Engagement Force: ≤ 45 N**

Disengagement Force: ≥ 5 N

Retention Force Latch: ≥ 110 N

Coding Efficiency: ≥ 200 N

Operating Temperature: -40 to +105 °C

*Connector only, in application depends on PCB layout

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Molex HFM Electrical Performance

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Guadalajara #1, MexicoGuadalajara #2, Mexico

Planned

Dongguan, China Planned

Mabalacat, PhilippinesAvailable

Chengdu, China Lincoln, USA

Sulecin, Poland

Planned

Molex HFM Manufacturing Footprint

Connector PlantCable Assembly Plant

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Molex HFM Tooling Timeline

Cable Assemblies* Unsealed RA TH PCB Plug Headers

Cable Components

SOP Milestones:• DV & Parts

• Complete

SOP Milestones:• DV Parts

• Complete• PV Parts

• FOT: Q2 2021• PPAP: Q3 2021

SOP Milestones:• PV Parts

• FOT: Q3 2021• PPAP: Q4 2021

Production Plants:• DV & PV Parts – PHL• Planned – DG, GDL, Europe

Production Plants:• DV Parts – Lincoln• PV Parts – Chengdu

Production Plants:• PV Parts – Lincoln & Chengdu

Samples:• Available using Rosenberger

components until Q4 2021

Samples:• Limited availability

Samples:• Q3 2021

*Dependent on raw cable type

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Molex HFM RA TH PCB Plug Headers

For more details, refer to Molex customer datasheets

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Stability and availability•Highly automated processing•High level of process stability

Flexibility and efficiency•Adaptable double-sided wire processing

Reliable, monitored quality•Processing steps monitored in integrated process•Precise mechanical parts and reliable components•Sensor monitored, two-sided insertion of conductor

Molex HFM Cable Assembly Manufacturing Strategy

Investing In Automation

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Molex HFM Cable Assembly Process Highly automated cable assembly process: All components on a reel and fed into machine Exact reference points created so have 100% controlled parameters Simple, separate fully controllable and reproducible process steps

1. Semi-strip outer jacket

2. Crimp support sleeve & remove outer jacket

4. Strip dielectric & foil

3. Open braid shield & fold back

5. Crimp center contact

6. Vision check

7. Assemble & crimp outer contact

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Molex HFM Summary