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November 2010 Doc ID 15781 Rev 2 1/12
12
STP165N10F4N-channel 100 V, 4.4 mΩ, 120 A TO-220
STripFET™ DeepGATE™ Power MOSFET
Features
■ N-channel enhancement mode
■ 100% avalanche rated
■ Low gate charge
■ Very low on-resistance
ApplicationSwitching applications
DescriptionThe STP165N10F4 is an N-channel enhancement mode Power MOSFET built with STripFET™ DeepGATE™ technology with a new gate structure. The product is tailored to minimize on-resistance.
Figure 1. Internal schematic diagram
Order code VDSS RDS(on) max ID
STP165N10F4 100 V < 5.5 mΩ 120 A
12
3
TO-220
Table 1. Device summary
Order code Marking Package Packaging
STP165N10F4 165N10F4 TO-220 Tube
www.st.com
Contents STP165N10F4
2/12 Doc ID 15781 Rev 2
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
STP165N10F4 Electrical ratings
Doc ID 15781 Rev 2 3/12
1 Electrical ratings
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
VDS Drain-source voltage (VGS = 0) 100 V
VGS Gate- source voltage ± 20 V
ID Drain current (continuous) at TC = 25 °C 120 A
ID Drain current (continuous) at TC = 100 °C 110 A
IDM (1)
1. Pulse width limited by safe operating area
Drain current (pulsed) 480 A
PTOT Total dissipation at TC = 25 °C 315 W
Derating factor 2.1 W/°C
EAS (2)
2. Starting Tj = 25 °C, ID= 58 A, VDD= 50 V
Single pulse avalanche energy 500 mJ
Tstg Storage temperature - 55 to 150°C
Tj Max. operating junction temperature 150
Table 3. Thermal data
Symbol Parameter Value Unit
Rthj-case Thermal resistance junction-case max 0.48 °C/W
Rthj-a Thermal resistance junction-ambient max 62.5 °C/W
Tl Maximum lead temperature for soldering purpose 315 °C
Electrical characteristics STP165N10F4
4/12 Doc ID 15781 Rev 2
2 Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 4. On/off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
V(BR)DSSDrain-source
Breakdown voltageID = 250 µA, VGS = 0 100 V
IDSSZero gate voltage
Drain current (VGS = 0)
VDS = max rating 1 µA
VDS = max rating,TC=125 °C 100 µA
IGSSGate-body leakagecurrent (VDS = 0)
VGS = ± 20 V 100 nA
VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 2 4 V
RDS(on)Static drain-source on resistance
VGS = 10 V, ID = 60 A 4.4 5.5 mΩ
Table 5. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Ciss Input capacitance
VDS = 25 V, f = 1 MHz,
VGS = 0
10750 pF
Coss Output capacitance - 939 - pF
CrssReverse transfer capacitance
603 pF
Qg Total gate charge VDD = 50 V, ID = 120 A,VGS = 10 V
(see Figure 14)
192 nC
Qgs Gate-source charge - 48 - nC
Qgd Gate-drain charge 62 nC
STP165N10F4 Electrical characteristics
Doc ID 15781 Rev 2 5/12
Table 6. Switching times
Symbol Parameter Test conditions Min. Typ. Max. Unit
td(on)
tr
Turn-on delay time
Rise time
VDD = 50 V, ID = 60 A RG = 4.7 Ω VGS = 10 V
(see Figure 13)-
29.6
62-
ns
ns
td(off)
tf
Turn-off-delay time
Fall time
VDD = 50 V, ID = 60 A,
RG = 4.7 Ω, VGS = 10 V(see Figure 13)
-154
106-
ns
ns
Table 7. Source drain diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
ISD Source-drain current - 120 A
ISDM (1)
1. Pulse width limited by safe operating area.
Source-drain current (pulsed)
- 480 A
VSD (2)
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
Forward on voltage ISD = 120 A, VGS = 0 - 1.4 V
trrQrr
IRRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 120 A,
VDD = 80 Vdi/dt = 100 A/µs,
Tj = 150 °C (see Figure 15)
-
86.8
313
7.2
ns
nC
A
Electrical characteristics STP165N10F4
6/12 Doc ID 15781 Rev 2
2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance
Figure 4. Output characteristics Figure 5. Transfer characteristics
Figure 6. Normalized BVDSS vs temperature Figure 7. Static drain-source on resistance
ID
100
10
1
0.10.1 1 100 VDS(V)10
(A)
Opera
tion
in th
is ar
ea is
Limite
d by
max
RDS(o
n)
100µs
1ms
10ms
Tj=150°CTc=25°CSingle pulse
AM08651v1
10-5
10-4
10-3 10
-210
-1tp(s)
10-2
10-1
K
0.2
0.05
0.02
0.01
0.1
Zth=k Rthj-cδ=tp/τ
tp
τ
Single pulse
δ=0.5
280tok
ID
150
100
50
00 VDS(V)3
(A)
1 2 4
200
250
5V
6V
7VVGS=10V300
350
4V
AM08652v1ID
00 4 VGS(V)8
(A)
2 6
VDS=2V
150
100
50
200
250
300
AM08653v1
BVDSS
-75 TJ(°C)
(norm)
-25 7525 1250.90
0.95
1.00
1.05
1.10
ID=1mA
175
AM08654v1RDS(on)
4.8
4.7
4.6
4.50 40 ID(A)
(mΩ)
20 60
4.9
5.0
5.1
5.2
VGS=10V
10080 120
5.3
AM08655v1
STP165N10F4 Electrical characteristics
Doc ID 15781 Rev 2 7/12
Figure 8. Gate charge vs gate-source voltage Figure 9. Capacitance variations
Figure 10. Normalized gate threshold voltage vs temperature
Figure 11. Normalized on resistance vs temperature
Figure 12. Source-drain diode forward characteristics
VGS
6
4
2
00 50 Qg(nC)
(V)
200
8
100 150
10
VDS=50VID=120A
12
AM08656v1C
6100
4100
2100
1000 40 VDS(V)
(pF)
20
8100
60
Ciss
CossCrss
80 100
12100
10100
14100
AM08657v1
VGS(th)
0.8
0.6
0.4
0.2-75 TJ(°C)
(norm)
-25
1.0
7525 125 175
1.2
ID=250µA
AM08658v1 RDS(on)
1.7
1.2
0.7
0.2-75 TJ(°C)
(norm)
-25 7525 125
ID=60A
175
2.2VGS=10V
AM08659v1
VSD
0 40 ISD(A)
(V)
20 10060 800.5
0.6
0.7
0.8
0.9
1.0
TJ=-55°C
TJ=175°C
TJ=25°C
120
AM08660v1
Test circuits STP165N10F4
8/12 Doc ID 15781 Rev 2
3 Test circuits
Figure 13. Switching times test circuit for resistive load
Figure 14. Gate charge test circuit
Figure 15. Test circuit for inductive load switching and diode recovery times
Figure 16. Unclamped inductive load test circuit
Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform
AM01468v1
VGS
PW
VD
RG
RL
D.U.T.
2200
μF3.3μF
VDD
AM01469v1
VDD
47kΩ 1kΩ
47kΩ
2.7kΩ
1kΩ
12V
Vi=20V=VGMAX
2200μF
PW
IG=CONST100Ω
100nF
D.U.T.
VG
AM01470v1
AD
D.U.T.
SB
G
25 Ω
A A
BB
RG
G
FASTDIODE
D
S
L=100μH
μF3.3 1000
μF VDD
AM01471v1
Vi
Pw
VD
ID
D.U.T.
L
2200μF
3.3μF VDD
AM01472v1
V(BR)DSS
VDDVDD
VD
IDM
ID
AM01473v1
VDS
ton
tdon tdoff
toff
tftr
90%
10%
10%
0
0
90%
90%
10%
VGS
STP165N10F4 Package mechanical data
Doc ID 15781 Rev 2 9/12
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
Package mechanical data STP165N10F4
10/12 Doc ID 15781 Rev 2
TO-220 type A mechanical data
Dimmm
Min Typ Max
A 4.40 4.60b 0.61 0.88
b1 1.14 1.70
c 0.48 0.70D 15.25 15.75
D1 1.27
E 10 10.40e 2.40 2.70
e1 4.95 5.15
F 1.23 1.32H1 6.20 6.60
J1 2.40 2.72
L 13 14L1 3.50 3.93
L20 16.40
L30 28.90∅P 3.75 3.85
Q 2.65 2.95
0015988_Rev_S
STP165N10F4 Revision history
Doc ID 15781 Rev 2 11/12
5 Revision history
Table 8. Document revision history
Date Revision Changes
19-May-2009 1 First release
12-Nov-2010 2– Removed package H²PAK.– Document status promoted from preliminary data to datasheet.
STP165N10F4
12/12 Doc ID 15781 Rev 2
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