NEES and the NEES Geotechnical Centrifuge at Davis

Dan WilsonManager, Center for Geotechnical Modeling

NEES Equipment Sites

SiteCouncil

NEES Collaboratory

NE

ES

gri

d

System Integrator

EarthquakeResearchers

Educators &Students

ProfessionalEngineers

OtherPractitioners

NEES Consortium

Site B

Site C

Site A

Othersite 1

Othersite 2

NEES Consortium

Development

Sim

ula

tion

/Exp

erim

enta

l Fac

ilitie

s

Slide courtesy of

Bob Rietherman

7.1 x 18.8 mm

3.6 x 6.4 x 9.1 mm

5.6 x 8.9 mm

25 x 25 x 7.6 mm

8.9 x 8.9 x 2.5 mm

ICP

•Miniature

•Efficient package

•Mature design

•High frequency / wide bandwidth

MEMS

•Cheap sensors

•Cheap conditioning

•Micro?

as low as 10 mmwant DC response, too

Modular Design – dense packets of sensors eases installation, management.Miniature sensing element

3.8 cm

2.5

cm

5.6 cm

Sensor ManagerCommunication M

odule

PVC housing•glued or clamped•dimples for routing wires to sensors

Sensor Manager, Communication Module, and batteries shown in single waterproof housing

Good performance / sizeBut over budget

Design as of early 2002

Proposal 9/21/02

Incorporate new open-source OTS wireless modules to reduce development costs

fiducial markers on container (only at 1g)

fiducial markers on sand ground (only at 1g ??)

transducers

Building a Digital Model(Metadata)

Thanks for your attention

Acknowledgement:

NSF-CMS 0086566 from the

George E. Brown,Jr. Network for Earthquake Engineering Simulation program of NSF, and matching funds from UCD.