New Improved Direct Metallizaon Process NeoLink® E© Atotech | conﬁden3al | Results on ABS Comparison of Pd, Sn and Cu-adsorp/on* values on ABS Novodur P2MC – ac3vator: 3 min

Technologyfortomorrow'ssolu3ons

NewImprovedDirectMetalliza3onProcess

NeoLink®EJoeArnold–SUR/FIN2017

©Atotech|confiden3al|

Contents

1.  ProcessPrinciples2.  DataandExperience3.  Summary

2 SUR/FIN2017–DirectMetalliza3on

DirectMetalliza3on:NeoLink®E

Principle


NeoLink®E–DirectMetalliza3on

4

NewGenera3onofCopperLinkforDirectMetalliza3on

SUR/FIN2017–DirectMetalliza3on

�  Newdesignofcopperlink(CuLink)�  Higherdepositconduc3vitybeforeAcidCopperPla3ng

�  ImprovedefficiencyandlowercontendofPdintheworkingAc3vatorBath

�  HighlyStableprocess–withouttheuseofchemicalstabilizers

�  Costefficientprocess–highproduc3vity�  Easytouse�  SuitableforABS&ABS+PC�  Suitableforsmall&largeparts



5

ProcessSequence


NeoLink®E Func.on

Coll.Pd-Catalyst

Pre-dip

Reducer

CrO3-H2SO4Etch

Cleaner(Op3onal)UniClean®151orAlkalume141

Cleaningsteptoremovefingerprintsorotherdirt

NeoLink®Addi3veCRChangingtheABSsurfacemorphology&polarity

NeoLink®ReducerCRReducingleeoverCrVIonthesurfacetoCrIII

Condi3oningofliquidfilmonpartstolowerimpactonCatalyst

NeoLink®Ac3vatorE

Ac3va3ngofsurfacewithcolloidalPdpar3cles

NeoLink®ECrosslinkingPdpar3clesandcrea3ngconduc3vity New! CopperLink


StandardProcessSequenceforABS

6

DirectMetalliza3on–NeoLink®E


EtchingABS

Polybutadiene

Cr6+ + polybutadiene → Cr3+ + by-products

Chemical oxidation of polybutadiene

Reduc.onneutraliza.on

Reduction of Cr6+

Cr6+ + 3e- → Cr3+

Pre-dip

Sn2+ Pd0

PdCatalystAc.vator

Cr3+ Cr3+

Copperlink

Copper Multilayer nickel Chrome

! "

! Option: Cleaner, Pre-wetter, Pre-Etch Option: Conditioner "

DIRECT

NeoLink®E

Acidcopper

NeoLink®ENEW

Cu

Cu2O

DIRECT


DirectMetalliza3on

NeoLink®E�  Immersiondeposi3onCu0

�  Autocataly3cgrowthofCu2Opar3cles(200nm)

7

NeoLink®E

Mechanism


NeoLink E - 5 min at 60ºC, 10 kΩ

“Standard”CuLink

NeoLink®CuLink�  Immersiondeposi3onCu0

�  Veryfinegrainstructure

Chromosulfuric acid etch → PdSn → CuLink

Conduc.velayer–Fullcoverage


DirectMetalliza3on

8

SEMPictures


1µm

200nm


Sn-CuexchangeImmersiondeposi3onCu0

Autocataly3cgrowthofCu2Opar3cles(200nm)

DirectMetalliza3on

9

PrincipleSummary


+

“Standard”CuLink NeoLink®E

Conduc.velayer–Fullcoverage

Sn-CuexchangeImmersiondeposi3onCu0


TestResults

HighConduc3vity/HighCopperAdsorp3on


ResultsonABS

�  ComparisonofPd,SnandCu-adsorp/on*valuesonABSNovodurP2MC–ac3vator:3min(40ºC)@40ppmPdon:–  ReferenceCuLink–  NeoLink®CuLink–  NeoLink®E

11

HighCopperAdsorp3onwithNeoLink®E


NeoLinkE

NeoLink®ENEW

NeoLinkCuLink

ReferenceCuLink

NeoLink

ReferenceProcess

*Note:adsorp3onisgivenasinforma3ononlyandcannotbeusedasreference/quan3ta3veindica3on


EffectofNeoLink®E

12

Resis3vity,Tin&CopperAdsorp3onPalladiumAc3vator@5minutes44oCCuLink@5minues60oC


�  ComparisonofPd-,Sn-,Cu-adsorp/on*andresistance*onABS+PCparts(BAYERT45):

NeoLink®EAc.vator–5min@44°C,differentppmPdMiniFrontFinishers(MFF)

Pd[mg/m2]

Sn[mg/m2]

Cu[mg/m2]

aeerac3vator 36-42 33-38 0

aeerReferenceCuLink 36 6 9

aeerNeolinkE 38 8 285

aeerac3vator 45-49 44-50 0

aeerReferenceCuLink 42 7 8

aeerNeolinkE 50 10 375

12

*Note:adsorp3on/resis3vityaregivenasinforma3ononlyandcannotbeusedasreference/quan3ta3veindica3on

30ppm

Pd

50ppm

Pd

Ac3vatorparam

eter


ResultsonABS

�  Comparisonofresis/vity*oflayersdepositedonABSaeerNeoLink®EandNeoLink®-Ac3vator3min(40ºC)@40ppmPd:

13

HighConduc3vity


*Note:resis3vityisgivenasinforma3ononlyandcannotbeusedasreference/quan3ta3veindica3on



14

ProcessSequenceforABS&ABS+PC


NeoLink®E&StandardCuLink ProcessSequence,Time&Temperature

Coll.Pd-Catalyst

Pre-dip

Reducer

CrO3-H2SO4Etch68oC–10minutes

NeoLink®Addi3veCR

30oC–1minuteNeoLink®ReducerCR

25oC–1minuteHCl

40oC–5minutesNeoLink®Ac3vatorE

60oC–5minutesNeoLink®E New! CopperLink


�  Comparisonofresistance*onABS&ABS/PCaeerNeoLink®E

ABSPlas.cPlaques ABS+PCPlas.cPlaques

ResultsonABS&ABS+PC

15

LowResis3vity/HighConduc3vity


*Note:Resis3vityisgivenasinforma3ononlyandcannotbeusedasreference/quan3ta3veindica3on


Results

IncreasedCoverageatLowerPdAmounts


ResultsonABS

17

Coverage:100%FS*/95%BS*Lightflowlines

Ac3vator:5min(44ºC)@30ppmPd


*FS=FrontSide,BS=BackSide

ReferenceprocessNeoLink®E

100%FullcoverageFS/BS*Noflowlines

30ppm


ResultsonABS/PC

18

Ac3vator:5min(44ºC)@30ppmPd


ABS/PCBBT45


100%FullcoverageFS/BS Coverage:50-60%FS/20-50%BS

30ppm


ResultsonABS/PC

19

Ac3vator:5min(44ºC)@differentppmPd


30ppm

30ppm

40ppm

50ppm

100%fullcoverage 100%fullcoverage



EffectofNeoLink®E–ImmersionTime

20

Resis3vity&CopperAdsorp3on–PalladiumAc3vator@5minutes44oC


�  Resis3vityisdecreasedwithanincreasedimmersion3meinNeoLink®E�  CopperAdsorp3onisincreasedwithanincreasedimmersion3meinNeoLink®E


EffectofNeoLink®E–ImmersionTime

21

SEM5,000XMagnifica3on

ReferenceProcess

�  ABSPlas3cSubstrate�  NeoLink®Ac3vator:5min�  NeoLink®E:2,4,6,8min�  Norela3veincreasein

par3clesize,Cu2O,aeer4minutesonlyanincreaseinpar3cledensity



Results

StandardAdhesion


Adhesion

23

StandardSequencewith30–40MicronsofAcidCopperDeposi3on


ActualParts(NotPlaques) NeoLink®E ReferenceProcess

ABSCap 14.2N/cm(8.1lb/in) 14.8N/cm(8.5lb/in)

ABS/PCBMWMiniFront-Finisher 7.3N/cm(4.2lb/in) 7.2N/cm(4.1lb/in)

ComparableAdhesiontothereferenceprocess&conven3onalEN

OEMSpecifica.onsforAdhesion ABS ABS+PC

GeneralMotors–GMW14668 9.0N/cm(5.2lbs/in) 4.5N/cm(2.6lbs/in)

FORD–WSS-M1P83-E22016 9.0N/cm(5.2lbs/in) 4.5N/cm(2.6lbs/in)

Volkswagon–TL5282015 7.0N/cm(4.0lbs/in) 3.5N/cm(2.0lbs/in)

Toyota–TSH6504G2007* 9.8N/cm(5.6lbs/in) 9.8N/cm(5.6lbs/in)*Note:Toyotadoesnotmakeadis3nc3onbetweenABSorABS+PCsubstrates

DirectMetalliza3on

Summary



�  Similarcoststo“Conven3onalENProcess”�  Significantlyhighercopperdeposi3onontheplas3csurfaceascoppermetalandoxide

�  NovisiblesurfaceroughnessduetoCu2Ocuprousoxidepar3cles

�  Higherconduc3vity/lowerresistanceofthesurfacepriortoacidcopperpla3ng

�  Excellentcoverageintheacidcopper�  RequiredPdconcentra3onintheac3vatorisreducedcomparedtopreviousgenera3ons

�  Highstabilitywithoutstabilizingchemicals�  Only3replenishmentsolu3onsrequired�  Easytouse�  SuitableforABSandABS/PC,alsoforlargeparts25

MainFeatures


NeoLink®E

NeoLink®Ac3vatorEColl.Pd-Catalyst

Pre-dip

NeoLink®ReducerCR

NeoLink®Addi3veCRCrO3-Etch

UniClean®151Cleaner(op3on)

NeoLink®ECuLink



26

Inanutshell

CostsavingsinPalladiumReduc3on

EaseofOpera3on

MuchBewerCoverageonABS+PC

FewerAddi3ves

HighConduc3vity“LargeParts”

Capable

LargerWorkingWindow

NeoLink®E


Contact

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Thankyouforyourawen3on!

AtotechUSA,LLC1750OverviewDriveRockHill,SC29730

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Documents

New Improved Direct Metallizaon Process NeoLink® E© Atotech | conﬁden3al | Results on ABS Comparison of Pd, Sn and Cu-adsorp/on* values on ABS Novodur P2MC – ac3vator: 3 min