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THERMAL AND FLUIDFLOW ANALYSIS OF A
PIN FIN
HEAT SINK Agnihothra Sarma O(M.Tech)
THERMAL ENGINEERINGB.V.C.ENGG COLLEGEODALAREVU
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AgendaIntroductionLiterature Survey
Objective
Software approach
Simulation
References
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Literature Survey Plate fin heat sinks are commonly used devices
for enhancing
heat transfer in electronics components..
The choice of an optimal heat sink depends on a number of
geometric parameters such as fin height, fin length, finthickness,
number of fins, base plate thickness, space betweenfins, fin shape
or profile, material etc
Optimizing the above parameters to achieve low thermal
resistance and low pressure drop is very difficult.
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Contd..
In order to select the optimal geometric parameters of a heat
sink for a particular application, a designer requires more
designtools to predict heat sink performance.
PLATE FIN HEAT SINK
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PINFIN HEAT SINK Pin fin heat sinks, (seeFigure 1), which
containan array of vertically
oriented round pinsmade of copper oraluminum,
deliversubstantially greaterperformance thanstandard heat sinks
withflat fins.
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ObjectiveIn this research work the
thermal model of the pin fin
heat sink is designed by
varying the pin fin angles
and the fluid flow, thermal
flow characteristics of heat
sinks have been studied. And
compared with simulation
results that can be obtained
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Software approachTo select an optimal heat sink design,
preliminary studies on the fluid flow and heat transfer
characteristics of a pin fin heat sink have been carried through
CFD modelling andsimulations.
The simulation is carried out with acommercial CFD package
provided by Fluent Inc.
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MODELING ANDSIMULATIONIn CFD calculations, there are three main
steps.
1) PRE-PROCESSING
2) SOLVER EXECUTION
3) POST-PROCESSING
Pre-Processing is the step where the modellinggoals are
determined and computational grid is
created.
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ReferencesArularasan R. and Velraj R. CFD Analysis In a Heat
Sink for Cooling of
Electronic Devices International Journal of The Computer, the
Internet
and Management Vol. 16.No.3 (September-December, 2008) pp
1-11.
R. Mohan1, and Dr.P. Govindarajan Experimental and CFD analysis
of heat sinks with base plate for CPU cooling
Seri Lee Optimum Design and Selection of Heat Sinks Aavid
Engineering Inc. Laconia, New Hampshire, Eleventh IEEE
SEM1-THERMm
Symposium .
R. Mohan1, and Dr.P. Govindarajan Thermal Analysis of CPU
with
Composite Pin Fin Heat Sinks International Journal of
Engineering
Science and TechnologyVol. 2(9), 2010, 4051-4062
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